AFBR-5103ATZ [AVAGO]
FIBER OPTIC TRANSCEIVER, 1270-1380nm, 125Mbps(Tx), 125Mbps(Rx), BOARD/PANEL MOUNT, SIP, ST CONNECTOR, ROHS COMPLIANT, SIP-9;型号: | AFBR-5103ATZ |
厂家: | AVAGO TECHNOLOGIES LIMITED |
描述: | FIBER OPTIC TRANSCEIVER, 1270-1380nm, 125Mbps(Tx), 125Mbps(Rx), BOARD/PANEL MOUNT, SIP, ST CONNECTOR, ROHS COMPLIANT, SIP-9 光纤 |
文件: | 总20页 (文件大小:242K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
AFBR-5103Z/-5103TZ 1300 nm 2000 m AFBR-5103AZ/-
5103ATZ/-5103PZ/-5103PEZ
FDDI, 100 Mbps ATM, and Fast Ethernet Transceivers in
Low Cost 1x9 Package Style
Data Sheet
Description
Features
The AFBR-5100Z family of transeivers from Avago Teh-
nologies provide the system designer with produts to
implementarangeofFDDIandATM(AsynhronousTrans-
fer Mode) designs at the 100 Mbps/125 MBd rate.
•
FullComplianewiththeOptialPerformaneRequire-
ments of the FDDI PMD Standard
•
•
Full Compliane with the FDDI LCF-PMD Standard
FullComplianewiththeOptialPerformaneRequire-
ments of the ATM 100 Mbps Physial Layer
The transeivers are all supplied in the new industry
standard 1x9 SIP pakage style with either a duplex SC or
a duplex ST* onnetor interfae.
•
•
FullComplianewiththeOptialPerformaneRequire-
ments of 100 Base-FX Version of IEEE802.3u
FDDI PMD, ATM and Fast Ethernet 2000 m Bakbone
Links
Multisoured 1x9 Pakage Style with Choie of Duplex
SC or Duplex ST* Reeptale
The AFBR-5103Z/-5103TZare 1300 nm produts with
optial performane ompliant with the FDDI PMD
standard. The FDDI PMD standard is ISO/IEC 9314-3:
1990 and ANSI X3.166 - 1990.
•
•
Wave Solder and Aqueous Wash Proess Compatible
RoHS Compliane
Applications
These transeivers for 2000 meter multimode fiber bak-
bones are supplied in the small 1x9 duplex SC or ST pak-
age style for those designers who want to avoid the larger
MIC/R (Media Interfae Connetor/Reeptale) defined in
the FDDI PMD standard.
•
•
•
Multimode Fiber Bakbone Links
Multimode Fiber Wiring Closet to Desktop Links
Multimode Fiber Media Converter
Note: The “T” in the produt numbers indiates a transeiver with a
duplex ST onnetor reeptale. Produt numbers without a “T” indiate
AvagoTehnologiesalsoprovidesseveralotherFDDIprod-
utsompliantwiththePMDandSM-PMDstandards.These
produts are available with MIC/R, ST and FC onnetor
transeivers with a duplex SC onnetor reeptale.
©
styles. They are available in the 1x13 and 2x11 transeiver
and 16 pin transmitter/reeiver pakage styles for those
designs that require these alternate onfigurations.
The AFBR-5103Z/-5103TZ is also useful for both ATM 100
Mbps interfaes and Fast Ethernet 100 Base-FX interfaes.
TheATMForumUser-NetworkInterfae(UNI)Standard,Ver-
sion3.0,definesthePhysialLayerfor100MbpsMultimode
Fiber Interfae for ATM in Setion 2.3 to be the FDDI PMD
Standard. Likewise, the Fast Ethernet Alliane defines the
Physial Layer for 100 Base-FX for Fast Ethernet to be the
FDDI PMD Standard.
*ST is a registered trademark of AT&T Lightguide Cable Connetors.
ATM appliations for physial layers other than 100 Mbps
Multimode Fiber Interfae are supported by Avago Teh-
nologies. Produts are available for both the single mode
and the multimode fiber SONET-OC-3C (STS-3C) ATM
interfae and the 155 Mbps ATM 94 MBd multimode fiber
ATM interfae as speified in the ATM Forum UNI.
Figure 2b shows the outline drawing for options that
inlude mezzanine height with extended shield.
The pakage outline drawing and pin out are shown in
Figures 2, 2a and 3. The details of this pakage outline
and pin out are ompliant with the multisoure definition
of the 1x9 SIP. The low profile of the Avago Tehnologies
transeiver design omplies with the maximum height al-
lowed for the duplex SC onnetor over the entire length
of the pakage.
Transmitter Sections
The transmitter setions of the AFBR-5103Z series utilize
1300 nm Surfae Emitting InGaAsP LEDs. These LEDs
are pakaged in the optial subassembly portion of the
transmitter setion. They are driven by a ustom silion
IC whih onverts differential PECL logi signals, ECL ref-
erened (shifted) to a +5 Volt supply, into an analog LED
drive urrent.
The optialsubassemblies utilize a high volume assembly
proesstogetherwithlowostlenselementswhihresult
in a ost effetive building blok.
The eletrial subassembly onsists of a high volume
multilayer printed iruit board on whih the IC hips
and various surfae-mounted passive iruit elements
are attahed.
Receiver Sections
The reeiver setions of the AFBR-5103Z series utilize
InGaAs PIN photodiodes oupled to a ustom silion
transimpedane preamplifier IC. These are pakaged in
the optial subassembly portion of the reeiver.
The pakage inludes internal shields for the eletrial
and optial subassemblies to ensure low EMI emissions
and high immunity to external EMI fields.
The outer housing inluding the duplex SC onnetor
reeptale or the duplex ST ports is molded of filled
non-ondutive plasti to provide mehanial strength
and eletrial isolation. The solder posts of the Avago
Tehnologies’ design are isolated from the iruit design
of the transeiver and do not require onnetion to a
ground plane on the iruit board.
These PIN/preamplifier ombinations are oupled to a
ustom quantizer IC whih provides the final pulse shap-
ing for the logi output and the Signal Detet funtion.
The data output is differential. The signal detet output
is single-ended. Both data and signal detet outputs are
PECL ompatible, ECL referened (shifted) to a +5 Volt
power supply.
The transeiver is attahed to a printed iruit board with
the nine signal pins and the two solder posts whih exit
the bottom of the housing. The two solder posts provide
the primary mehanial strength to withstand the loads
imposed on the transeiver by mating with duplex or
simplex SC or ST onnetored fiber ables.
Package
The overall pakage onept for the Avago Tehnologies
transeivers onsists of the following basi elements; two
optial subassemblies, an eletrial subassembly and the
housing as illustrated in Figure1 and Figure 1a.
ELECTRICAL SUBASSEMBLY
DUPLEX SC
RECEPTACLE
DIFFERENTIAL
DATA OUT
PIN PHOTODIODE
SINGLE-ENDED
SIGNAL
DETECT OUT
QUANTIZER IC
PREAMP IC
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
LED
DRIVER IC
TOP VIEW
Figure 1. SC Block Diagram
ꢀ
ELECTRICAL SUBASSEMBLY
DUPLEX ST
RECEPTACLE
DIFFERENTIAL
DATA OUT
PIN PHOTODIODE
SINGLE-ENDED
SIGNAL
DETECT OUT
QUANTIZER IC
PREAMP IC
OPTICAL
SUBASSEMBLIES
DIFFERENTIAL
DATA IN
LED
DRIVER IC
TOP VIEW
Figure 1a. ST Block Diagram.
39.12
(1.540)
12.70
(0.500)
6.35
(0.250)
MAX.
AREA
RESERVED
FOR
PROCESS
PLUG
25.40
(1.000)
12.70
(0.500)
MAX.
AFBR-5XXXZ
DATE CODE (YYWW)
SINGAPORE
A
5.93 0.1
(0.233 0.004)
+ 0.0ꢀ
0.75
- 0.05
3.30 0.3ꢀ
+ 0.003
- 0.002
10.35
(0.407)
)
(0.030
(0.130 0.015)
MAX.
2.92
(0.115)
1ꢀ.52
(0.729)
+ 0.25
- 0.05
1.27
0.46
(0.01ꢀ)
NOTE 1
+ 0.010
- 0.002
4.14
(0.163)
)
∅�
(9x)
(0.050
NOTE 1
23.55
(0.927)
20.32
(0.ꢀ00)
16.70
(0.657)
17.32
20.32
23.32
[ꢀx(2.54/.100)]
(0.6ꢀ2) (0.ꢀ00) (0.91ꢀ)
0.ꢀ7
(0.034)
23.24
(0.915)
15.ꢀꢀ
(0.625)
Figure 2. Package Outline Drawing with Standard Height.
ꢁ
42
(1.654)
MAX.
5.99
(0.236)
24.ꢀ
(0.976)
12.7
(0.500)
25.4
(1.000)
MAX.
AFBR-5103TZ
DATE CODE (YYWW)
SINGAPORE
+ 0.0ꢀ
- 0.05
+ 0.003
0.5
(0.020)
(
(
- 0.002
12.0
(0.471)
MAX.
2.6 0.4
(0.102 0.016)
0.46
3.3 0.3ꢀ
(0.130) ( 0.015)
0.3ꢀ
0.015)
20.32
(
∅�
(0.01ꢀ)
NOTE 1
2.6
∅�
+ 0.25
- 0.05
1.27
(0.102)
+ 0.010
- 0.002
0.050
(
(
20.32
(0.ꢀ00)
17.4
(0.6ꢀ5)
[(ꢀx (2.54/0.100)]
20.32
(0.ꢀ00)
22.ꢀ6
21.4
(0.900)
(0.ꢀ43)
3.6
(0.142)
1.3
(0.051)
23.3ꢀ
(0.921)
1ꢀ.62
(0.733)
NOTE 1: PHOSPHOR BRONZE IS THE BASE MATERIAL FOR THE POSTS AND PINS. FOR LEAD-FREE SOLDERING,
THE SOLDER POSTS HAVE TIN COPPER OVER NICKEL PLATING AND THE ELECTRICAL PINS HAVE PURE TIN
OVER NICKEL PLATING.
DIMENSIONS IN MILLIMETERS (INCHES).
Figure 2a. ST Package Outline Drawing with Standard Height.
ꢂ
29.6
(1.16)
UNCOMPRESSED
39.6
(1.56)
12.70
(0.50)
4.7
(0.1ꢀ5)
MAX.
AREA
RESERVED
FOR
PROCESS
PLUG
25.4
(1.00)
12.7
(0.50)
MAX.
2.0 0.1
(0.079 0.004)
0.51
(0.02)
SLOT WIDTH
SLOT DEPTH
+0.1
-0.05
+0.004
-0.002
0.25
2.09
UNCOMPRESSED
10.2
(0.40)
9.ꢀ
(0.3ꢀ6)
MAX.
MAX.
(0.0ꢀ)
(
0.010
)
1.3
(0.05)
3.3 0.3ꢀ
(0.130 0.015)
20.32
(0.ꢀ0)
15.ꢀ 0.15
(0.622 0.006)
+0.25
-0.05
0.46
+0.25
1.27
9X ∅�
+0.010
-0.002
-0.05
2X ∅�
(
0.01ꢀ
)
+0.010
(
0.050
)
-0.002
2.54
(0.100)
ꢀX
20.32
(0.ꢀ00)
23.ꢀ
(0.937)
20.32
(0.ꢀ00)
1.3
(0.051)
2X ∅�
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE 0.025 ꢁꢁ UNLESS OTHERWISE SPECIFIED.
Figure 2b. Package Outline Drawing – Mezzanine Height with Extended Shield.
1 = V
EE
N/C
2 = RD
Rx
Tx
3 = RD
4 = SD
5 = V
CC
6 = V
CC
7 = TD
ꢀ = TD
9 = V
N/C
EE
TOP VIEW
Figure 3. Pin Out Diagram.
ꢃ
Application Information
14
12
10
ꢀ
The Appliations Engineering group in the Avago Teh-
nologies Optial Communiation Division is available to
assist you with the tehnial understanding and design
trade-offs assoiated with these transeivers. You an
ontat them through your Avago Tehnologies sales
representative.
AFBR-5103Z, 62.5/125 µꢁ
6
The following information is provided to answer some
of the most ommon questions about the use of these
parts.
AFBR-5103Z,
50/125 µꢁ
4
Transceiver Optical Power Budget versus Link
Length
2
0
0.15 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Optial Power Budget (OPB) is the available optial power
forafiberoptilinktoaommodatefiberablelossesplus
losses due to in-line onnetors, splies, optial swithes,
andtoprovidemarginforlinkagingandunplannedlosses
due to able plant reonfiguration or repair.
FIBER OPTIC CABLE LENGTH (kꢁ)
Figure 4. Optical Power Budget at BOL versus Fiber
Optic Cable Length.
Figure 4 illustrates the predited OPB assoiated with the
transeiver series speified in this data sheet at the Begin-
ning of Life (BOL).These urves represent the attenuation
and hromati plus modal dispersion losses assoiated
with the 62.5/125 µm and 50/125 µm fiber ables only.
The area under the urves represents the remaining OPB
at any link length, whih is available for overoming non-
fiber able related losses.
Transceiver Signaling Operating Rate Range and BER
Performance
For purposes of definition, the symbol (Baud) rate, also
alledsignalingrate,isthereiproaloftheshortestsymbol
time. Data rate (bits/se) is the symbol rate divided by the
enoding fator used to enode the data (symbols/bit).
When used in FDDI and ATM 100 Mbps appliations the
performane of the 1300 nm transeivers is guaranteed
overthesignalingrateof10MBdto125MBdtothefullon-
ditions listed in individual produt speifiation tables.
Avago tehnologies’LED tehnology has produed 1300
nmLEDdevieswithloweragingharaterististhannor-
mally assoiated with these tehnologies in the industry.
The industry onvention is 1.5 dB aging for 1300 nm LEDs.
TheAvagoTehnologies1300nmLEDswillexperieneless
than 1dB of aging over normal ommerial equipment
mission life periods. Contat your Avago Tehnologies
sales representative for additional details.
The transeivers may be used for other appliations at
signaling rates outside of the 10 MBd to 125 MBd range
with some penalty in the link optial power budget pri-
marily aused by a redution of reeiver sensitivity. Figure
5 gives an indiation of the typial performane of these
1300 nm produts at different rates.
Figure 4 was generated with an Avago Tehnologies’
fiber opti link model ontaining the urrent industry
onventions for fiber able speifiations and the FDDI
PMD and LCF-PMD optial parameters. These parameters
are refleted in the guaranteed performane of the trans-
eiver speifiations in this data sheet. This same model
has been used extensively in the ANSI and IEEE ommit-
tees, inluding the ANSI X3T9.5 ommittee, to establish
the optial performane requirements for various fiber
opti interfae standards. The able parameters used
ome from the ISO/IEC JTC1/SC 25/WG3 Generi Cabling
for Customer Premises per DIS 11801 doument and the
EIA/TIA-568-A Commerial Building Teleommuniations
Cabling Standard per SP-2840.
Thesetranseiversanalsobeusedforappliationswhih
requiredifferentBitErrorRate(BER)performane. Figure6
illustrates the typial trade-off between link BER and the
reeivers input optial power level.
ꢄ
Transceiver Jitter Performance
Recommended Handling Precautions
The Avago Tehnologies 1300 nm transeivers are de- Avago Tehnologies reommends that normal stati pre-
signed to operate per the system jitter alloations stated autions be taken in the handling and assembly of these
in Tables E1 of Annexes E of the FDDI PMD and LCF-PMD transeivers to prevent damage whih may be indued
standards.
by eletrostati disharge (ESD). The AFBR-5100Z series
of transeivers meet MIL-STD-883C Method 3015.4 Class
2 produts.
TheAvagoTehnologies1300nmtransmitterswilltolerate
theworstaseinputeletrialjitterallowedinthesetables
withoutviolatingtheworstaseoutputjitterrequirements Care should be used to avoid shorting the reeiver data or
of Setions 8.1 Ative Output Interfae of the FDDI PMD signal detet outputs diretly to ground without proper
and LCF-PMD standards.
urrent limiting impedane.
TheAvagoTehnologies1300nmreeiverswilltoleratethe
worstaseinputoptialjitterallowedinSetions8.2Ative
Input Interfae of the FDDI PMD and LCF-PMD standards
without violating the worst ase output eletrial jitter
allowed in the Tables E1 of the Annexes E.
The jitter speifiations stated in the following 1300 nm
transeiverspeifiationtablesarederivedfromthevalues
in Tables E1 of Annexes E. They represent the worst ase
jitterontributionthatthetranseiversareallowedtomake
to the overall system jitter without violating the Annex E
alloation example. In pratie the typial ontribution of
the Avago Tehnologies transeivers is well below these
maximum allowed amounts.
3.0
2.5
2.0
-2
1 x 10
-3
1 x 10
AFBR-5103Z/5103TZ SERIES
-4
1 x 10
1.5
1.0
0.5
0
-5
-6
1 x 10
CENTER OF SYMBOL
1 x 10
-7
-ꢀ
1 x 10
1 x 10
-10
2.5 x 10
1 x 10
1 x 10
-11
-12
0
25 50 75 100 125 150 175 200
SIGNAL RATE (MBd)
-6
-4
-2
0
2
4
RELATIVE INPUT OPTICAL POWER - dB
CONDITIONS:
1. PRBS 2 -1
CONDITIONS:
1. 125 MBd
2. PRBS 2 -1
7
7
2. DATA SAMPLED AT CENTER OF DATA SYMBOL.
-6
3. BER = 10
3. CENTER OF SYMBOL SAMPLING.
4. T = 25˚ C
Figure 5. Transceiver Relative Optical Power Budget at Con-
stant BER vs. Signaling Rate.
Figure 6. Bit Error Rate vs. Relative Receiver Input Optical Power.
ꢅ
Solder and Wash Process Compatibility
Board Layout - Decoupling Circuit and Ground
Planes
The transeivers are delivered with protetive proess
plugs inserted into the duplex SC or duplex ST onnetor Itisimportanttotakeareinthelayoutofyouriruitboard
reeptale.
toahieveoptimumperformanefromthesetranseivers.
Figure 7 provides a good example of a shemati for a
powersupplydeouplingiruitthatworkswellwiththese
parts.Itisfurtherreommendedthataontiguousground
plane be provided in the iruit board diretly under the
This proess plug protets the optial subassemblies dur-
ing wave solder and aqueous wash proessing and ats as
a dust over during shipping.
These transeivers are ompatible with either industry transeiver to provide a low indutane ground for signal
standard wave or hand solder proesses.
return urrent. This reommendation is in keeping with
good high frequeny board layout praties.
Shipping Container
Board Layout - Hole Pattern
The transeiver is pakaged in a shipping ontainer de-
signed to protet it from mehanial and ESD damage The Avago Tehnologies transeiver omplies with the
during shipment or storage.
iruitboard“CommonTranseiverFootprint”holepattern
defined in the original multisoure announement whih
defined the 1x9 pakage style.This drawing is reprodued
in Figure 8 with the addition of ANSI Y14.5M ompliant
dimensioning to be used as a guide in the mehanial
layout of your iruit board.
Rx
Tx
Board Layout - Mechanical
NO INTERNAL CONNECTION
NO INTERNAL CONNECTION
ForappliationsprovidingahoieofeitheraduplexSCor
a duplex ST onnetor interfae, while utilizing the same
pinout on the printed iruit board, the ST port needs to
protrude from the hassis panel a minimum of 9.53 mm
for suffiient learane to install the ST onnetor.
AFBR-510XZ
TOP VIEW
Rx
Rx
Tx
Tx
V
RD
2
RD
3
SD
4
V
V
TD
7
TD
ꢀ
V
EE
1
CC
CC
EE
5
6
9
Please refer to Figure 8A for a mehanial layout detailing
thereommendedloationoftheduplexSCandduplexST
transeiver pakages in relation to the hassis panel.
C1
C2
V
Forbothshieldeddesignoptions,Figure8bidentifiesfront
panel aperture dimensions.
CC
R2
R3
C5
L1
L2
TERMINATION
AT PHY
R1
R4
DEVICE
INPUTS
V
C3
C4
CC
R5
R7
V
FILTER
CC
CC
AT V PINS
TRANSCEIVER
TERMINATION
AT TRANSCEIVER
INPUTS
C6
R9
R6
Rꢀ
R10
RD
RD
SD
V
TD
TD
CC
NOTES:
THE SPLIT-LOAD TERMINATIONS FOR ECL SIGNALS NEED TO BE LOCATED AT THE INPUT
OF DEVICES RECEIVING THOSE ECL SIGNALS. RECOMMEND 4-LAYER PRINTED CIRCUIT
BOARD WITH 50 OHM MICROSTRIP SIGNAL PATHS BE USED.
R1 = R4 = R6 = Rꢀ = R10 = 130 OHMS.
R2 = R3 = R5 = R7 = R9 = ꢀ2 OHMS.
C1 = C2 = C3 = C5 = C6 = 0.1 µF.
C4 = 10 µF.
Figure 7. Recommended Decoupling and Termination Circuits
ꢆ
Regulatory Compliance
Electromagnetic Interference (EMI)
These transeiver produts are intended to enable om- Most equipment designs utilizing these highspeed trans-
merialsystemdesignerstodevelopequipmentthatom- eivers from AvagoTehnologies will be required to meet
plies with the various international regulations governing the requirements of FCC in the United States, CENELEC
ertifiation of Information Tehnology Equipment. See EN55022 (CISPR 22) in Europe and VCCI in Japan.
the Regulatory Compliane Table for details. Additional
These produts are suitable for use in designs ranging
information is available from your Avago Tehnologies
from a desktop omputer with a single transeiver to a
sales representative.
onentrator or swith produt with a large number of
transeivers.
Electrostatic Discharge (ESD)
In all well-designed hassis, two 0.5”holes for ST onne-
tors to protrude through will provide 4.6dB more shield-
ing than one 1.2” duplex SC retangular utout. Thus, in
a well-designed hassis, the duplex ST 1x9 transeiver
emissionswillbeidentialtotheduplexSC1x9transeiver
emissions.
There are two design ases in whih immunity to ESD
damage is important.
The first ase is during handling of the transeiver prior
to mounting it on the iruit board. It is important to use
normalESDhandlingpreautionsforESDsensitivedevies.
These preautions inlude using grounded wrist straps,
work benhes, and floor mats in ESD ontrolled areas.
The seond ase to onsider is stati disharges to the
exterior of the equipment hassis ontaining the trans-
eiver parts. To the extent that the duplex SC onnetor
is exposed to the outside of the equipment hassis it may
be subjet to whatever ESD system level test riteria that
the equipment is intended to meet.
1.9 0.1
.075 .004
∅�
(2X)
-A-
20.32
.ꢀ00
¯0.000
M A
0.ꢀ 0.1
.032 .004
∅�
(9X)
20.32
.ꢀ00
¯0.000
M A
2.54
.100
(ꢀX)
TOP VIEW
Figure 8. Recommended Board Layout Hole Pattern
ꢇ
42.0
24.ꢀ
9.53
12.0
(NOTE 1)
0.51
12.09
25.4
39.12
11.1
6.79
0.75
25.4
NOTE 1: MINIMUM DISTANCE FROM FRONT
OF CONNECTOR TO THE PANEL FACE.
Figure 8a. Recommended Common Mechanical Layout for SC and ST 1x9 Connectored Transceivers.
10
0.ꢀ
(0.032)
2x
0.ꢀ
(0.032)
2x
+ 0.5
Ð 0.25
10.9
0.43
+ 0.02
Ð 0.01
(
)
6.35
(0.25)
MODULE
27.4 0.50
(1.0ꢀ 0.02)
9.4
(0.374)
PROTRUSION
PCB BOTTOM VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES).
ALL DIMENSIONS ARE 0.025 ꢁꢁ UNLESS OTHERWISE SPECIFIED.
Figure 8b. Dimensions Shown for Mounting Module with Extended Shield to Panel.
11
Regulatory Compliance Table
Feature
Test Method
Performance
Eletrostati Disharge (ESD) to MIL-STD-883C
the Eletrial Pins Method 3015.4
Meets Class 2 (2000 to 3999 Volts)
Withstand up to 2200V applied between
eletrial pins
Eletrostati Disharge (ESD) to Variation of IEC 801-2
the Duplex SC Reeptale
Typially withstand at least 25 kV without
damage when the Duplex SC Connetor
Reeptale is ontated by a Human Body
Model probe.
Eletromagneti
Interferene (EMC)
FCC CLass B
Typially provide a 13 dB margin to the
noted standards, however, it should be
noted that final margin depends on the
ustomer’s board and hasis design.
CENELEC CEN55022
Class B (CISPR 22B)
VCCI Class 2
Immunity
Variation of IEC
61000-4-3
Typially show no measurable effet from a
10 V/m field swept from 10 to 450 MHz ap-
plied to the transeiver when mounted to
a iruit ard without a hassis enlosure.
200
3.0
3.5
1ꢀ0
1.5
160
2.0
140
120
100
2.5
3.0
3.5
t
- TRANSMITTER
r/f
OUTPUT OPTICAL
RISE/FALL TIMES - ns
1200 1300 1320 1340 1360 13ꢀ0
l
- TRANSMITTER OUTPUT OPTICAL
CENTER WAVELENGTH -nꢁ
C
AFBR-5103Z FDDI TRANSMITTER TEST RESULTS
OF l , Dl AND t ARE CORRELATED AND
C
r/f
COMPLY WITH THE ALLOWED SPECTRAL WIDTH
AS A FUNCTION OF CENTER WAVELENGTH FOR
VARIOUS RISE AND FALL TIMES.
Figure 9. Transmitter Output Optical Spectral Width (FWHM) vs.
Transmitter Output Optical Center Wavelength and Rise/Fall
Times.
1ꢀ
Transceiver Reliability and Performance Qualification
Data
Immunity
Equipment utilizing these transeivers will be subjet to
radio-frequeny eletromagneti fields in some environ-
ments. These transeivers have a high immunity to suh
fields.
The 1x9 transeivers have passed Avago Tehnologies’
reliability and performane qualifiation testing and are
undergoing ongoing quality monitoring. Details are avail-
able from your Avago Tehnologies’sales representative.
For additional information regarding EMI, suseptibility,
ESD and onduted noise testing proedures and results
on the 1x9 Transeiver family, please refer to Applia-
tions Note 1075, Testing and Measuring Eletromagneti
Compatibility Performane of the AFBR-510X/-520X Fiber
Opti Transeivers.
4.40
1.975
1.25
4.ꢀ50
1.525
0.525
10.0
5.6
1.025
0.075
1.00
0.975
0.90
100% TIME
INTERVAL
40 0.7
0.50
0.10
0.725
0.725
0% TIME
INTERVAL
0.025
0.0
0.075
-0.025
-0.05
1.525
0.525
5.6
1.975
4.40
10.0
4.ꢀ50
ꢀ0 500 ꢂꢂꢁ
TIME - ns
THE AFBR-5103Z OUTPUT OPTICAL PULSE SHAPE SHALL FIT WITHIN THE BOUNDARIES
OF THE PULSE ENVELOPE FOR RISE AND FALL TIME MEASUREMENTS.
Figure 10. Output Optical Pulse Envelope.
1ꢁ
Accessory Duplex SC Connectored Cable Assemblies
Applications Support Materials
AvagoTehnologiesreommendsforoptimalouplingthe
use of flexible-body duplex SC onnetored able.
Contat your loal AvagoTehnologies Component Field
SalesOffieforinformationonhowtoobtainPCBlayouts,
test boards and demo boards for the 1x9 transeivers.
Accessory Duplex ST Connectored Cable Assemblies
Evaluation Kits
AvagoTehnologiesreommendstheuseofDuplexPush-
AvsgoTehnologies has available three evaluation kits for Pull onnetored able for the most repeatable optial
the1x9transeivers.Thepurposeofthesekitsistoprovide power oupling performane.
theneessarymaterialstoevaluatetheperformaneofthe
AFBR-510XZ family in a pre-existing 1x13 or 2x11 pinout
systemdesignonfigurationorwhenonnetoredtovari-
ous test equipment.
1. HFBR-0319 Evaluation Test Fixture Board
This test fixture onverts +5 V ECL 1x9 transeivers to –5
V ECL BNC oax onnetions so that diret onnetions
to industry standard fiber opti test equipment an be
aomplished.
5
AFBR-5103Z SERIES
4
3
-10
2.5 x 10 BER
2
-12
1.0 x 10 BER
1
0
-4 -3 -2 -1
EYE SAMPLING TIME POSITION (ns)
CONDITIONS:
0
1
2
3
4
1.T = 25˚ C
A
2. V = 5 Vdc
CC
3. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
4. INPUT OPTICAL POWER IS NORMALIZED TO
CENTER OF DATA SYMBOL.
5. NOTE 20 AND 21 APPLY.
Figure 11. Relative Input Optical Power vs. Eye Sampling Time
Position.
1ꢂ
-31.0 dBꢁ
MIN (P + 4.0 dB OR -31.0 dBꢁ)
O
P (P + 1.5 dB
A
O
< P < -31.0 dBꢁ)
P
= MAX (P OR -45.0 dBꢁ)
S
S
A
O
2
(P = INPUT POWER FOR BER < 10 )
INPUT OPTICAL POWER
INPUT OPTICAL POWER
(
>
>
4.0 dB STEP DECREASE)
(
1.5 dB STEP INCREASE)
-45.0 dBꢁ
ANS MAX
-
AS MAX
-
SIGNAL DETECT
-
(ON)
SIGNAL DETECT
-
(OFF)
TIME
AS MAX - MAXIMUM ACQUISITION TIME (SIGNAL).
-
AS MAX IS THE MAXIMUM SIGNAL DETECT ASSERTION TIME FOR THE STATION.
-
-
AS MAX SHALL NOT EXCEED 100.0 µs (130 µs FOR -40˚C to 0˚C).
-
THE DEFAULT VALUE OF AS MAX IS 100.0 µs.
-
ANS MAX - MAXIMUM ACQUISITION TIME (NO SIGNAL).
-
ANS MAX IS THE MAXIMUM SIGNAL DETECT DEASSERTION TIME FOR THE STATION.
-
-
ANS MAX SHALL NOT EXCEED 350 µs (130 µs FOR -40˚C to 0˚C).
-
THE DEFAULT VALUE OF AS MAX IS 350 µs.
-
Figure 12. Signal Detect Thresholds and Timing.
AFBR-5103Z Series
Absolute Maximum Ratings
Parameter
Symbol
Min.
Typ.
Max.
100
260
10
Unit
°C
Reference
Storage Temperature
Lead Soldering Temperature
Lead Soldering Time
Supply Voltage
T
S
-40
T
°C
SOLD
SOLD
t
se.
V
V
CC
-0.5
-0.5
7.0
Data Input Voltage
Differential Input Voltage
Output Current
V
I
V
CC
V
V
D
1.4
50
V
Note 1
I
mA
O
1ꢃ
AFBR-5103Z Series
Recommended Operating Conditions*
Parameter
Symbol
Min.
0
Typ.
Max.
70
Unit
°C
V
Reference
Ambient Operating Temperature
Supply Voltage
T
A
V
CC
4.75
-1.810
-1.165
5.25
Data Input Voltage - Low
Data Input Voltage - High
Data and Signal Detet Output Load
V - V
IL CC
-1.475
-0.880
V
V
- V
V
IH CC
R
L
50
ý
Note 2
*Applies to AFBR-5103Z & AFBR-5103TZ & AFBR-5103PZ/-5103PEZ Series exept for AFBR-5103AZ/-5103ATZ. T for
A
AFBR-5103AZ/-5103ATZ is -40°C and 85°C.
Transꢁitter Electrical Characteristics*
(T = 0°C to ꢅ0°C, V = ꢂ.ꢅꢃ V to ꢃ.ꢀꢃ V)
A
CC
Parameter
Symbol
Min.
Typ.
145
0.76
0
Max.
185
Unit
mA
W
Reference
Supply Current
I
Note 3
CC
Power Dissipation
P
DISS
0.97
Data Input Current - Low
Data Input Current - High
I
I
-350
µA
IL
IH
14
350
µA
*Applies to AFBR-5103Z & AFBR 5103TZ & AFBR-5103PZ/-5103PEZ Series exept for AFBR-5103AZ/-5103ATZ. T for
A
AFBR-5103AZ/-5103ATZ is -40°C and 85°C..
Receiver Electrical Characteristics
(T = 0°C to 70°C, V = 4.75 V to 5.25 V)*
A
CC
Parameter
Symbol Min.
Typ.
82
Max.
145
0.5
Unit
mA
W
Reference
Note 4
Note 5
Note 6
Note 6
Note 7
Note 7
Note 6
Note 6
Note 7
Note 7
Supply Current
I
CC
Power Dissipation
P
DISS
0.3
Data Output Voltage - Low
Data Output Voltage - High
Data Output Rise Time
V
- V
-1.83
-1.085
0.35
-1.55
-0.88
2.2
V
OL
CC
V
OH
- V
V
CC
t
t
ns
ns
V
r
Data Output Fall Time
0.35
2.2
f
Signal Detet Output Voltage - Low
Signal Detet Output Voltage - High
Signal Detet Output Rise Time
Signal Detet Output Fall Time
V
- V
-1.83
-1.085
0.35
-1.55
-0.88
2.2
OL
CC
V
OH
- V
V
CC
t
t
ns
ns
r
0.35
2.2
f
*Applies to AFBR-5103Z & AFBR 5103TZ & AFBR-5103PZ and 5103PEZ Series exept for AFBR-5103AZ/-5103ATZ. T for AFBR-5103AZ/-5103ATZ is
A
-40°C and 85°C.
1ꢄ
AFBR-5103Z/-5103TZ
Transmitter Optical Characteristics
(T = 0°C to 70°C, V = 4.75 V to 5.25 V)
A
CC
Parameter
Symbol Min.
Typ.
Max.
Unit
Reference
Output Optial Power
62.5/125 µm, NA = 0.275 Fiber EOL
BOL
P
O
-19
-20
-16.8
-14
dBm avg.
Note 11
Output Optial Power
50/125 µm, NA = 0.20 Fiber
BOL
EOL
P
-22.5
-23.5
-20.3
-14
dBm avg.
Note 11
Note 12
Note 13
O
Optial Extintion Ratio
10
-10
%
dB
Output Optial Power at Logi “0”State
Center Wavelength
P
O
(“0”)
-45
1380
200
3.0
dBm avg.
l
C
1270
1308
137
1.0
nm
Note 14
Figure 9
Spetral Width - FWHM
Optial Rise Time
Ðl
nm
Note 14
Figure 9
t
t
0.6
0.6
ns
Note 14, 15
Figure 9, 10
r
f
Optial Fall Time
2.1
3.0
ns
Note 14, 15
Figure 9, 10
Duty Cyle Distortion
Contributed by the
Transmitter
DCD
DDJ
0.02
0.6
ns p-p
Note 16
Data Dependent Jitter
Contributed by the
Transmitter
0.02
0.6
ns p-p
Note 17
1ꢅ
AFBR-5103Z/-5103TZ
Receiver Optical and Electrical Characteristics
(T = 0°C to 70°C, V = 4.75 V to 5.25 V)
A
CC
Parameter
Symbol
Min.
Typ. Max.
Unit
dBm avg.
Reference
Input Optial Power Minimum at
Window Edge
P
P
(W)
-33.5 -31
Note 19
Figure 11
IN Min.
IN Min.
IN Max.
Input Optial Power Minimum at
Eye Center
(C)
-34.5 -31.8 dBm avg.
Note 20
Figure 11
Input Optial Power Maximum
Operating Wavelength
P
l
-14
-11.8
dBm avg.
Note 19
1270
1380 nm
Duty Cyle Distortion Contributed DCD
by the Reeiver
0.02 0.4
ns p-p
Note 8
Note 9
Note 10
Data Dependent Jitter Contributed DDJ
by the Reeiver
0.35 1.0
ns p-p
Random Jitter Contributed by the RJ
Reeiver
1.0
2.14 ns p-p
Signal Detet - Asserted
Signal Detet - Deasserted
Signal Detet - Hysteresis
P
P + 1.5 dB
-33
dBm avg.
dBm avg.
Note 21, 22
Figure 12
A
D
P
-45
Note 23, 24
Figure 12
D
P - P
A
1.5
0
2.4
55
dB
µs
Figure 12
D
Signal Detet Assert Time (off to
on)
AS_Max
100
130
350
Note 21,
Figure 12
SignalDetetAssert Time (off to on) AS_Max
for -40°C to 0°C
0
0
55
µs
µs
Note 21,
Figure 12
Signal Detet Deassert Time (on
to off)
ANS_Max
110
Note 23, 24
Figure 12
Notes:
1. This is the maximum voltage that an be applied aross the Differen-
tial Transmitter Data Inputs to prevent damage to the input ESD
protetion iruit.
9. Data Dependent Jitter ontributed by the reeiver is speified with
the FDDI DDJ test pattern desribed in the FDDI PMD Annex A.5. The
inputoptialpowerlevelis-20dBmaverage.SeeAppliationInforma-
tion - Transeiver Jitter Setion for further information.
2. The outputs are terminated with 50ý onneted to V -2 V.
CC
3. The power supply urrent needed to operate the transmitter is
provided to differential ECL iruitry.This iruitry maintains a nearly
onstanturrentflowfromthepowersupply.Constanturrentopera-
tionhelpstopreventunwantedeletrialnoisefrombeinggenerated
and onduted or emitted to neighboring iruitry.
10. Random Jitter ontributed by the reeiver is speified with an IDLE
Line State, 125 MBd (62.5 MHz square-wave), input signal. The input
optial power level is at maximum “P
(W)”. See Appliation
IN Min.
Information - Transeiver Jitter Setion for further information.
11. These optial power values are measured with the following
onditions:
• The Beginning of Life (BOL) to the End of Life (EOL) optial power
degradation is typially 1.5 dB per the industry onvention for
long wavelength LEDs. The atual degradation observed in Avago
Tehnologies’ 1300 nm LED produts is < 1 dB, as speified in this
data sheet.
• Over the speified operating voltage and temperature ranges.
• With HALT Line State, (12.5 MHz square-wave), input signal.
• At the end of one meter of noted optial fiber with ladding modes
removed.Theaveragepowervalueanbeonvertedtoapeakpower
value by adding 3 dB. Higher output optial power transmitters are
available on speial request.
12. The Extintion Ratio is a measure of the modulation depth of the
optial signal. The data“0”output optial power is ompared to the
data “1” peak output optial power and expressed as a perentage.
With the transmitter driven by a HALT Line State (12.5 MHz square-
wave) signal, the average optial power is measured. The data “1”
4. This value is measured with the outputs terminated into 50 ý on-
neted to V - 2 V and an Input Optial Power level of -14 dBm
CC
average.
5. The power dissipation value is the power dissipated in the reeiver
itself. Power dissipation is alulated as the sum of the produts of
supply voltage and urrents, minus the sum of the produts of the
output voltages and urrents.
6. These values are measured with respet to V with the output
CC
terminated into 50 ý onneted to V - 2 V.
CC
7. The output rise and fall times are measured between 20% and 80%
levels with the output onneted to V -2 V through 50 ý.
CC
8. Duty Cyle Distortion ontributed by the reeiver is measured at
the 50% threshold using an IDLE Line State, 125 MBd (62.5 MHz
square-wave), input signal. The input optial power level is -20 dBm
average. See Appliation Information - Transeiver Jitter Setion for
further information.
1ꢆ
peak power is then alulated by adding 3 dB to the measured
average optial power. The data “0” output optial power is found
by measuring the optial power when the transmitter is driven by a
logi“0”input. The extintion ratio is the ratio of the optial power at
the“0”level ompared to the optial power at the“1”level expressed
as a perentage or in deibels.
ns), DDJ (1.2 ns) and RJ (0.76 ns) presented to the reeiver.
To test a reeiver with the worst ase FDDI PMD Ative Input jitter
onditionrequiresexatingontroloverDCD,DDJandRJjitterompo-
nents that is diffiult to implement with prodution test equipment.
The reeiver an be equivalently tested to the worst ase FDDI PMD
input jitter onditions and meet the minimum output data window
time-width of 2.13 ns. This is aomplished by using a nearly ideal
inputoptialsignal(noDCD,insignifiantDDJandRJ)andmeasuring
for a wider window time-width of 4.6 ns. This is possible due to the
umulative effet of jitter omponents through their superposition
(DCD and DDJ are diretly additive and RJ omponents are rms ad-
ditive). Speifially, when a nearly ideal input optial test signal is
used and the maximum reeiver peak-to-peak jitter ontributions
of DCD (0.4 ns), DDJ (1.0 ns), and RJ (2.14 ns) exist, the minimum
window time-width beomes 8.0 ns -0.4 ns - 1.0 ns - 2.14 ns = 4.46
ns, or onservatively 4.6ns. This wider window time-width of 4.6 ns
guarantees the FDDI PMD Annex E minimum window time-width
of 2.13 ns under worst ase input jitter onditions to the Avago
Tehnologies reeiver.
13. ThetransmitterprovidesomplianewiththeneedforTransmit_Dis-
able ommands from the FDDI SMT layer by providing an Output
Optial Power level of <-45 dBm average in response to a logi “0”
input. This speifiation applies to either 62.5/125 µm or 50/125 µm
fiber ables.
14. This parameter omplies with the FDDI PMD requirements for the
tradeoffs between enter wave-length, spetral width, and rise/fall
times shown in Figure 9.
15. ThisparameteromplieswiththeoptialpulseenvelopefromtheFDDI
PMD shown in Figure 10. The optial rise and fall times are measured
from 10% to 90% when the transmitter is driven by the FDDI HALT
Line State (12.5 MHz square-wave) input signal.
16. Duty Cyle Distortion ontributed by the transmitter is measured at
a 50% threshold using an IDLE Line State, 125 MBd (62.5 MHz square-
wave), input signal. See Appliation Information - Transeiver Jitter
Performane Setion of this data sheet for further details.
17. Data Dependent Jitter ontributed by the transmitter is speified
with the FDDI test pattern desribed in FDDI PMD Annex A.5. See
Appliation Information - Transeiver Jitter Performane Setion of
this data sheet for further details.
• Transmitter operating with an IDLE Line State pattern, 125 MBd (62.5
MHz square-wave), input signal to simulate any ross-talk present
between the transmitter and reeiver setions of the transeiver.
20. AllonditionsofNote19applyexeptthatthemeasurementismade
at the enter of the symbol with no window time-width.
21. This value is measured during the transition from low to high levels
of input optial power.
18. Random Jitter ontributed by the transmitter is speified with an
IDLE Line State, 125 MBd (62.5 MHz square-wave), input signal. See
Appliation Information - Transeiver Jitter Performane Setion of
this data sheet for further details.
19. This speifiation is intended to indiate the performane of the
reeiver setion of the transeiver when Input Optial Power signal
harateristis are present per the following definitions. The Input
Optial Power dynami range from the minimum level (with a win-
dow time-width) to the maximum level is the range over whih the
22. The Signal Detet output shall be asserted within 100 µs (130 µs for
—40°C to 0°C) after a step inrease of the Input Optial Power. The
step will be from a low Input Optial Power, —45 dBm, into the range
between greater than P , and —14 dBm.The BER of the reeiver out-
A
-2
put will be 10 or better during the time, LS_Max (15 µs) after Signal
Detet has been asserted. See Figure 12 for more information.
23. This value is measured during the transition from high to low levels
ofinputoptialpower.Themaximumvaluewillourwhentheinput
optial power is either -45 dBm average or when the input optial
-2
reeiver is guaranteed to provide output data with a Bit Error Ratio
power yields a BER of 10 or better, whihever power is higher.
-10
(BER) better than or equal to 2.5 x 10
• At the Beginning of Life (BOL)
.
24. Signal detet output shall be de-asserted within 350 µs after a step
derease in the Input Optial Power from a level whih is the lower
• Over the speified operating temperature and voltage ranges
• Input symbol pattern is the FDDI test pattern defined in FDDI PMD
Annex A.5 with 4B/5B NRZI enoded data that ontains a duty yle
base-line wander effet of 50kHz. This sequene auses a near worst
ase ondition for inter-symbol interferene.
• Reeiver data window time-width is 2.13 ns or greater and entered
at mid-symbol. This worst ase window time-width is the minimum
allowedeye-openingpresentedtotheFDDIPHYPM._Dataindiation
input(PHYinput)pertheexampleinFDDIPMDAnnexE.Thisminimum
windowtime-widthof2.13nsisbasedupontheworstaseFDDIPMD
Ative Input Interfae optial onditions for peak-to-peak DCD (1.0
of; -31 dBm or P + 4 dB (P is the power level at whih signal detet
D
D
wasdeasserted),toapowerlevelof-45dBmorless.Thisstepderease
will have ourred in less than 8 ns. The reeiver output will have a
-2
BER of 10 or better for a period of 12 µs or until signal detet is
deasserted.The input data stream is the Quiet Line State. Also, signal
detet will be deasserted within a maximum of 350µs after the BER
-2
of the reeiver output degrades above 10 for an input optial data
stream that deays with a negative ramp funtion instead of a step
funtion. See Figure 12 for more information.
1ꢇ
Ordering Information:
1300nm LED, 125 MBd, FDDI, 100 Mbps ATM and
Fast Eternet
temperature range 0°C to +70°C
AFBR-5103Z Duplex SC Connetor 1X9, Standard Height
AFBR-5103TZ Duplex ST Connetor 1X9
AFBR-5103PZ Duplex SC Connetor 1x9, Mezzanine
Height
AFBR-5103PEZ Duplex SC Connetor 1x9, Mezzanine
Height with Extended Shield
1300nm LED, 125 MBd, FDDI, 100 Mbps ATM and
Fast Ethernet
temperature range –40°C to +85°C
AFBR-5103AZ Duplex SC Connetor 1X9
AFBR-5103ATZ Duplex ST Connetor 1X9
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
5989-2292EN - April 4, 2006
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