AFCT-5765xxZ [AVAGO]

Single-Mode SFP Optical Transceivers;


型号：	AFCT-5765xxZ
厂家：	AVAGO TECHNOLOGIES LIMITED
描述：	Single-Mode SFP Optical Transceivers
文件：	总2页 (文件大小：70K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

AFCT-5701xxZ, AFCT-5705xxZ, AFCT-5710xxZ,

AFCT-5715xxZ, AFCT-5765xxZ

Single-Mode SFP Optical Transceivers

with Optional DMI for Gigabit Ethernet and Fibre Channel

Reliability Data Sheet

Introduction

FIT Rate Summary

Avago Technologies Quality System includes an ongoing The mean and standard deviation of the AFCT-5701xxZ,

Reliability Monitoring program to generate a database AFCT-5705xxZ, AFCT-5710xxZ, and AFCT-5715xxZ families

from which this reliability datasheet is published.

of SFP Optical Transceiver steady-state failure rate is calcu-

lated as 118.4 FIT and 66.6 FIT at 40 °C, respectively.

Description

Conclusion

This reliability data sheet addresses reliability parameters

for the single-mode AFCT-5701xxZ, AFCT-5705xxZ, AFCT- Avago Technologies AFCT-5701xxZ, AFCT-5705xxZ, AFCT-

5710xxZ, AFCT-5715xxZ, and AFCT-5765xxZ families of 5710xxZ, AFCT-5715xxZ, and AFCT-5765xxZ families of

SFP optical transceivers.

SFP Optical Transceivers have completed and passed the

reliability qualiﬁcation criteria deﬁned by Avago Technol-

ogies’Quality & Reliability requirements.

These transceivers are primarily targeted at serving

Gigabit Ethernet or Fibre Channel links interconnecting

optical networking and storage equipment.

Random Failure Rate (FIT) Calculation

Reliability Qualiﬁcation

Failure in time rate, or FIT, is deﬁned as the number of

failures per billion device hours. In the product useful life

region, the random failure rate is considered as a constant

failure rate. In this region MTTF, Mean Time to Failure, is

deﬁned as MTTF = 1/FIT.

The Optical Transceivers have been qualiﬁed in accor-

dance with the requirements of Telcordia Document

GR-468-CORE. Reliability predictions follow the method of

Telcordia SR-332 Issue 3.

FITs Prediction Based on Telcordia SR-332 Parts Count

Procedure

Avago internal test speciﬁcations have also been applied.

Testing was carried out under the supervision of Avago

Technologies Quality & Reliability Department.

The Telcordia Parts Count Method assumes that the

module failure rate is equal to the sum of the device

component failure rates. Modiﬁers are included to take

into consideration variations in module operation envi-

ronments, device quality requirements, temperature, and

stress. Table 1a shows the FITs for the components used in

the module and the total FITs that has been calculated for

a case temperature of 40 °C.

Stress Test Pass Criteria

Product failure has occurred when the units fails to

respond properly to a functional test condition. The func-

tional test condition should not exceed the absolute

maximum data sheet limits for the product.

Table 1a.

Temperature Factor @ 40 °C

Stress Factor at 50%

Reliability Prediction Based On

Telcordia SR-332 Issue 3 – Parts Count Method

Environmental Factor

Component

Component Standard

Failure Rate Deviation Quality Failure Rate Deviation

Total

Total Component

Component Standard

Telcordia

Information

Laser

Telcordia (Photodiode)

Telcordia: (91-170 transistor) 3

Telcordia: (91-170 transistor) 1

Fixed Ceramic

Thick Film

Component

1G FP Laser Diode

Photodiode

Quantity (FITs)

(FITs)

5.5

Factor (FITs)

(FITs)

64.8

4.4

100

7.7

0.1

0.18

3.8

0.8

6.16

18.48

6.16

0.3

5.5

13.2

4.4

Capacitors

Resistor

0.01

0.13

3.9

0.03

0.65

3.9

0.9

3.8

IC 8-BIT MCU W/8K FLASH CMOS Technology

256B RAM 36-LFBGA

Connector

PCB, Edge / Multi-Pin

0.13

0.088

2.6

1.76

118.4

8.45E+06

66.6

Module Failure @ 40 °C (Total FITs)

MTTF @ 40 °C (Hours)

1.50E+07

FITs at other temperatures can be derived following The limitations of the FIT prediction based on the Parts

the procedure of Telcordia SR-332, assuming activation Count Method include the fact that the piece part failure

energy, Ea, of 0.35 eV to determine the component tem- rates are obtained from Telcordia database, which may

perature factor π_T. Table 1b shows the FITs at diﬀerent not be exhaustive for state-of-the-art piece parts, and that

temperatures for the transceiver.

the results are independent of true module environmen-

tal stress tests. Nevertheless, the information obtained

from the Parts Count Method is a useful reference during

design-in and evaluation. Whenever possible, Avago sub-

stitutes internal data for the FIT rates of individual com-

ponents, and predictions will be updated as more current

data becomes available.

FITs between 60% and 90% Upper Conﬁdence Levels

(UCLs) can be derived following the procedure ofTelcordia

SR-332 to determine the shape κ and scale θ of the gamma

distribution. Table 1c shows the FITs at the UCLs.

Table 1b. FIT rates at diﬀerent operating case temperatures, Table 1c. FIT rates at 40 °C at 60% and 90% Upper Conﬁdence

following the Telcordia Parts Count Method

Level, following the Telcordia Parts Count Method

case

(° C)

FITs

UCL

FITs

61.6

60%

122.8

118.4

177.6

260.5

90%

207.7

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-3018EN - November 22, 2013

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