AFCT-57J5ANPZ [AVAGO]

Family of Singlemode SFP Transceivers for Long Reach SONET OC-48;


型号：	AFCT-57J5ANPZ
厂家：	AVAGO TECHNOLOGIES LIMITED
描述：	Family of Singlemode SFP Transceivers for Long Reach SONET OC-48
文件：	总4页 (文件大小：196K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

AFCT-5745NPZ/ANPZ, AFCT-57J5ANPZ

& AFCT-5745UPZ/AUPZ

Family of Singlemode SFP Transceivers for Long Reach SONET OC-48

and SDH/STM-16 with Digital Diagnostic Monitoring (DMI) Interface

Reliability Data Sheet

Introduction

FIT Rate Summary

Avago Technologies Quality system includes an ongoing

FIT rate for AFCT-5745NPZ/ANPZ & AFCT-57J5ANPZ is cal-

Reliability Monitoring program to generate a database culated as 252.14; FIT rate for AFCT-5745UPZ/AUPZ is cal-

from which this reliability datasheet is published.

culated as 252.14.

The details of this calculation are included in this report.

Description

The AFCT-5745xxxZ is high performance, eﬀective mod- Conclusion

ules for serial optical data communications applications

AFCT-5745NPZ/ANPZ

& AFCT-57J5ANPZ and AFCT-

that range from 125 Mb/s to 2.7 Gb/s. They are designed

to provide SONET/SDH compliant links at 2488 Mb/s for

both short and intermediate reach links.

5745UPZ/AUPZ have completed and passed the reliability

qualiﬁcation criteria deﬁned by Avago Technologies’Qual-

ity and Reliability requirements.

The transmitter section of the AFCT-5745NPZ/ANPZ & AF-

CT-57J5ANPZ incorporates a 1300 nm Distributed Feed-

back (DFB) laser. The transmitter in the AFCT-5745UPZ/

AUPZ uses a 1550 nm Distributed Feedback (DFB) Laser.

Random Failure Rate (FIT) Calculation

Failure in time rate, or FIT, is deﬁned as the number of

failures per billion device hours. In the product useful life

region, the random failure rate is considered as a constant

failure rate. In this region MTTF, Mean Time to Failure, is

deﬁned as MTTF = 1/FIT.

For each device the receiver section uses an Avalanche

Photodiode (APD). A positive-ECL logic interface simpli-

ﬁes interface to external circuitry.

FIT Prediction Based on Telcordia SR-332 Parts Count

Procedure

Reliability Qualiﬁcation

The optical transceivers and receivers have been quali-

ﬁed in accordance with the requirements of Telcordia

Document GR-468-CORE. Reliability predictions follow

the method of Telcordia-SR-332. Avago internal test speci-

ﬁcations have also been applied. Testing was carried out

under the supervision of Avago Technologies Quality &

Reliability Department.

The Telcordia parts count method assumes that the mod-

ule failure rate is equal to the sum of the device compo-

nent failure rates. Modiﬁers are included to take into con-

sideration variations in module operation environments,

device quality requirements, temperature, and stress. The

tables that follow show the FIT for the components used

in the modules and the total FIT which have been calcu-

lated for an operating ambient temperature of 40°C.

Stress Test Pass Criteria

Product failure has occurred when the unit fails to respond

properly to a functional test. The functional test condition

shall not exceed the absolute maximum or minimum data

sheet limits.

Table 1a. FIT rate for AFCT-5745NPZ/ANPZ & AFCT-57J5ANPZ

Reliability Prediction Based On

Telecordia SR-332 - Parts Count Method

Temperature Factor @ 40°C

Stress Factor at 50%

Enviromental Factor

Telecordia Information/Data

Source

Component Base Quality

Total Component

Failure Rate (FITs)

Component

Quantity

Rate (FITs)

Factor

2.5G DFB Laser Diode

(1310nm)

Supplier Data

0.9

77.4

Monitor PIN

2.5G APD Photodiode

Pre-Amp IC

Capacitors

Telcordia (Photodiode)

Supplier Data

8.09

0.9

13.5

8.09

Telcordia (Fixed Ceramic)

Telcordia (Thick Film)

Supplier (Ferrite Beads)

Telcordia (Chip Coil- RF,Fixed)

Telcordia (Transformer Power)

Refer Telcordia (Silicon)

Telcordia (NPN Silicon <0.6W)

Supplier Data

Resistors

0.5

Inductors

Power Inductor

Diode

Transistors

Driver/Quantizer IC

Laser Driver IC

1.3

10.93

6.79

1.3

10.93

6.79

Supplier Data

IC, High Voltage Boost

Converter

Supplier Data

IC, P-MOSFET

Supplier Data

2.8

6.83

2.8

IC, Current Shunt Monitor

DMI management IC (uP)

Connector

6.83

Telcordia (Printed Board,Edge) 20

0.2

252.14

3.97E+06

AFCT-5745NPZ Module Failure @ 40°C (FITs)

MTTF @ 40°C (Hours)

Table 1b. FIT rate for AFCT-5745UPZ/AUPZ

Reliability Prediction Based On

Telecordia SR-332 - Parts Count Method

Temperature Factor @ 40°C

Stress Factor at 50%

Enviromental Factor

Component

Telecordia Information/

Data Source

Quality

Factor

Total Component

Failure Rate (FITs)

Component

Quantity

Base Rate (FITs)

2.5G DFB Laser Diode

(1550nm)

Supplier Data

0.9

77.4

Monitor PIN

2.5G APD Photodiode

Pre-Amp IC

Capacitors

Telcordia (Photodiode)

Supplier Data

8.09

0.9

13.5

8.09

Telcordia (Fixed Ceramic)

Telcordia (Thick Film)

Supplier (Ferrite Beads)

Telcordia (Chip Coil- RF,Fixed)

Telcordia (Transformer Power)

Refer Telcordia (Silicon)

Telcordia (NPN Silicon <0.6W)

Supplier Data

Resistors

0.5

Inductors

Power Inductor

Diode

Transistors

Driver/Quantizer IC

Laser Driver IC

1.3

10.93

6.79

1.3

10.93

6.79

Supplier Data

IC, High Voltage Boost

Converter

Supplier Data

IC, P-MOSFET

Supplier Data

2.8

6.83

2.8

IC, Current Shunt Monitor

DMI management IC (uP)

Connector

6.83

Telcordia (Printed Board,Edge) 20

0.2

252.14

3.97E+06

AFCT-5745UPZ Module Failure @ 40°C (FITs)

MTTF @ 40°C (Hours)

FITs at other temperatures can be derived following the procedure of Telcordia-SR332, assuming activation energy, Ea,

of 0.35eV to determine the component temperature factor πT. The following table shows FITs at diﬀerent temperatures

for the transmitter, receiver, and transceiver.

Table 2. FIT rates at diﬀerent operation ambient temperatures, following the Telcordia Parts Count Method

Operating Ambient

Temperture (°C)

AFCT-5745NPZ

(FITs)

AFCT-5745UPZ

(FITs)

252.14

302.57

378.21

453.85

252.14

302.57

378.21

453.85

The limitations of FIT prediction based on the Parts Count method include the fact that the piece part failure rates are

mostly obtained from the Telcordia database, which may not be exhaustive for state-of-the-art piece parts, and that

the results are independent of true module environmental stress tests. Nevertheless, the information obtained from

the Parts Count method is a useful reference during design-in and evaluation. Whenever possible, Avago substitute’s

internal data for the FIT rates of individual components, and predictions will be updated as more current data becomes

available.

Accelerated Aging Tests

Product integrity is also veriﬁed by Accelerated Aging. Tables 3a and 3b summarize the High Temperature Operating Life

stress (HTOL) performed on the product. On-going reliability monitoring will continue to add to the total device hours

under test.

Table 3a. Demonstrated Operating Life Test Performance – AFCT-5745NPZ/ANPZ & AFCT-57J5ANPZ

Test Name

Stress Test Conditions

Units Tested

Total Device Hours

No. of Failed Units

High Temperature

Operating Life

Vcc = 3.3V

Ta = 85°C

AFCT-5745NPZ

(11 X 2000 Hrs)

22,000

Table 3b. Demonstrated Operating Life Test Performance – AFCT-5745UPZ/AUPZ

Test Name

Stress Test Conditions

Units Tested

Total Device Hours

No. of Failed Units

High Temperature

Operating Life

Vcc = 3.3V

Ta = 85°C

AFCT-5745UPZ

(25 X 2000 Hrs)

50,000

Information on random FIT calculations based upon this data can be obtained from your local Avago Technologies

contact.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-2693EN - October 22, 2010

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