AMMC-5620-W50 [AVAGO]
6 - 20 GHz High Gain Amplifier; 6 - 20 GHz的高增益放大器
| 型号： | AMMC-5620-W50 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | 6 - 20 GHz High Gain Amplifier |
| 文件： | 总8页 (文件大小：588K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AMMC-5620
6 - 20 GHz High Gain Amplifier
Data Sheet
Chip Size: 1410 x 1010 µm (55.5 x 39.7 mils)
Chip Size Tolerance: 10 µm ( 0.4 mils)
Chip Thickness: 100 10 µm (4 0.4 mils)
Pad Dimensions: 80 x 80 µm (3.1 x 3.1 mils or larger)
Description
Features
Avago Technologies’ AMMC-5620 MMIC is a GaAs wide- • Frequency Range: 6 - 20 GHz
band amplifier designed for medium output power and
high gain over the 6 - 20 GHz frequency range. The 3
cascaded stages provide high gain while the single bias
• High Gain: 19 dB Typical
• Output Power: 15dBm Typical
supply offers ease of use. It is fabricated using a PHEMT • Input and Output Return Loss: < -10 dB
integrated circuit process. The RF input and output ports
have matching circuitry for use in 50-Ω environments.
The backside of the chip is both RF and DC ground. This
• Positive Gain Slope: + 0.21dB/GHz Typical
• Single Supply Bias: 5 V @ 95 mA Typical
helpssimplifytheassemblyprocessandreducesassembly
related performance variations and costs. For improved
Applications
• General purpose, wide-band amplifier in communica-
tion systems or microwave instrumentation
reliability and moisture protection, the die is passivated
at the active areas.The MMIC is a cost effective alternative
to hybrid (discrete FET) amplifiers that require complex
tuning and assembly processes.
• High gain amplifier
[1]
AMMC-5620 Absolute Maximum Ratings
Symbol
Parameters/Conditions
Drain Supply Voltage
Total Drain Current
DC Power Dissipation
RF CW Input Power
Channel Temp.
Units
V
Min.
Max.
7.5
V
DD
I
mA
W
135
1.0
DD
P
P
DC
dBm
° C
20
in
T
ch
+150
T
Operating Backside Temp. ° C
Storage Temp. ° C
- 55
- 65
b
T
stg
+165
+300
T
max
Maximum Assembly Temp. ° C
(60 sec max)
Note:
1. Operation in excess of any one of these conditions may result in permanent damage to this device.
Note: These devices are ESD sensitive. The following precautions are strongly recommended.
Ensure that an ESD approved carrier is used when dice are transported from one destination to
another. Personal grounding is to be worn at all times when handling these devices
[1]
AMMC-5620 DC Specifications/Physical Properties
Symbol
Parameters and Test Conditions
Units
V
Min.
Typical
5
Max.
V
Recommended Drain Supply Current
DD
I
I
Total Drain Supply Current ( V = 5V)
mA
mA
70
95
130
DD
DD
DD
Total Drain Supply Current ( V = 7V)
105
DD
[3]
q
ch-b
Thermal Resistance
°C/W
33
(Backside temperature (T ) = 25 °C
b
Notes:
1. Backside temperature Tb = 25°C unless otherwise noted
2. Channel-to-backside Thermal Resistance (qch-b) = 47°C/W at Tchannel (Tc) = 150°C as measured using infrared microscopy. Thermal Resistance
at backside temperature (Tb) = 25°C calculated from measured data.
[3]
AMMC-5620 RF Specifications
Tb = 25°C, V =5V, I
95 mA, Z =50 Ω
DD= o
DD
Symbol Parameters and Test Conditions
Units
dB
Min.
Typical Max.
2
S21
Small-signal Gain
16
19
22
Positive Small-signal Gain Slope
Input Return Loss
dB/GHz
dB
+0.21
13
Gain Slope
RL
RL
10
10
in
Output Return Loss
dB
14
out
2
S12
Reverse Isolation
dB
- 55
15
P
Output Power at 1 dB Gain Compression @ 20 GHz
Saturated Output Power (3dB Gain Compression) @ 20 GHz
Output 3rd Order Intercept Point @ 20 GHz
Noise Figure @ 20 GHz
dBm
dBm
dBm
dB
12.5
14.5
-1dB
sat
P
17
OIP3
23.5
4.2
NF
5.0
Notes:
3. 100% on-wafer RF test is done at frequency = 6, 13 and 20 GHz, except as noted.
2
AMMC-5620 Typical Performances (T =25°C, V =5V, I = 95 mA,
chuck DD DD
25
20
15
10
5
0
-10
-20
-30
-40
-50
-60
-70
0
-10
-20
-30
-40
0
4
7
10
13
16
19
22
4
7
10
13
16
19
22
4
7
10
13
16
19
22
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 1. Gain
Figure 2. Isolation
Figure 3. Input Return Loss
0
-10
-20
-30
-40
10
8
18
15
12
9
6
4
6
2
3
0
0
4
7
10
13
16
19
22
4
7
10
13
16
19
22
4
7
10
13
16
19
22
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 4.Output Return Loss
Figure 5. Noise Figure
Figure 6. Output Power at 1dB Gain Com-
pression
AMMC-5620 Typical Performances vs. Supply Voltage (T = 25°C, Zo=50Ω)
b
25
0
-10
-20
0
Vdd=4V
Vdd=5V
Vdd=6V
20
15
10
5
-20
-40
-60
-80
-30
Vdd=4V
Vdd=5V
Vdd=6V
Vdd=4V
Vdd=5V
Vdd=6V
-40
0
-50
4
7
10
13
16
19
22
4
7
10
13
16
19
22
4
7
10
13
16
19
22
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 7. Gain and Voltage
Figure 8. Isolation and Voltage
Figure 9. Input Return Loss and Voltage
3
AMMC-5620 Typical Performances vs. Supply Voltage (cont.) (T = 25°C, Zo=50Ω)
b
20
16
12
8
0
-10
-20
-30
-40
Vdd=4V
Vdd=5V
Vdd=6V
Vdd=4V
Vdd=5V
Vdd=6V
4
0
4
7
10
13
16
19
22
4
7
10
13
16
19
22
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 10. Output Return Loss and Voltage
Figure 11. Output Power and Voltage
AMMC-5620 Typical Performance vs. Temperature (V = 5V, Zo=50Ω)
DD
24
20
16
12
8
0
-10
-20
-30
-40
-50
-60
-70
0
-10
-20
-30
-40
-40 C
25 C
85 C
-40 C
25 C
85 C
-40 C
25 C
85 C
4
0
4
7
10
13
16
19
22
4
7
10
13
16
19
22
4
7
10
13
16
19
22
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 12. Gain and Temperature
Figure 14. Input Return Loss and Tem-
perature
Figure 13. Isolation and Temperature
0
-5
7
6
5
4
3
2
18
15
12
-10
-15
-20
-25
-30
-35
9
-40 C
25 C
85 C
6
3
0
-40 C
25 C
85 C
-40 C
25 C
85 C
1
0
4
7
10
13
16
19
22
4
7
10
13
16
19
22
4
7
10
13
16
19
22
FREQUENCY (GHz)
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 15. Output Return Loss and Tem-
perature
Figure 16. Noise Figure and Temperature
Figure 17. Output Power and Temperature
4
[1]
AMMC-5620 Typical Scattering Parameters (T = 25°C, V =5 V, I = 107 mA)
b
DD
DD
S11
S21
dB
S12
S22
Freq GHz
2.00
dB
Mag Phase
0.72 -147
0.69 -168
0.67 173
0.65 154
0.64 134
0.63 111
0.56 81
Mag Phase
0.07 -176
0.16 146
0.31 114
0.59 87
dB
Mag
Phase
46
dB
Mag Phase
-2.9
-23.3
-16.1
-10.0
-4.6
-50.0
-46.1
-44.0
-42.9
-42.1
-41.5
-42.1
-44.7
-49.0
-53.7
-58.0
-60.6
-61.9
-64.4
-64.4
-63.1
-63.5
-64.4
-64.4
-64.2
-62.1
-63.3
-64.4
-62.1
-61.9
-62.1
-62.9
-64.1
-61.2
-60.0
-61.8
-62.1
-61.9
-62.7
-61.9
-61.9
-60.0
-60.9
-64.1
-67.5
-67.5
0
-1.5
0.85
0.75
0.66
0.6
-72
2.50
-3.3
0
-1
-2.5
-89
3.00
-3.5
0.01
0.01
0.01
0.01
0.01
0.01
0
-46
-89
-132
-179
128
72
-3.6
-104
-118
-136
-158
175
157
165
-173
-164
-155
-102
-61
3.50
-3.7
-4.5
4.00
-3.8
0.8
1.1
62
-5.3
0.54
0.46
0.33
0.17
0.08
0.06
0.05
0.03
0.02
0.04
0.06
0.09
0.11
0.12
0.14
0.15
0.16
0.18
0.18
0.19
0.2
4.50
-4.0
6.6
2.15 34
3.96 -5
-6.7
5.00
-5.0
12.0
15.2
16.7
17.0
17.2
17.4
17.9
18.2
18.4
18.4
18.4
18.5
18.5
18.5
18.5
18.5
18.5
18.6
18.6
18.7
18.8
18.9
19.1
19.2
19.3
19.5
19.7
19.9
20.0
20.1
20.2
20.3
20.3
20.2
19.9
-9.6
5.50
-7.7
0.41 49
5.73 -50
6.84 -91
7.06 -123
7.28 -150
7.41 -173
7.81 164
8.12 142
8.29 121
8.34 101
8.35 83
8.37 65
8.36 48
8.37 32
8.38 16
-15.2
-21.8
-24.8
-26.4
-30.0
-34.5
-28.3
-23.8
-21.2
-19.3
-18.1
-17.1
-16.3
-15.7
-15.1
-14.7
-14.4
-14.2
-14.0
-13.7
-13.6
-13.4
-13.3
-13.3
-13.2
-13.2
-13.3
-13.4
-13.6
-14.0
-14.1
-14.6
-15.1
-15.5
6.00
-12.0
-16.9
-21.9
-27.2
-32.8
-33.4
-30.9
-27.7
-24.9
-22.6
-20.7
-19.3
-18.2
-17.3
-16.6
-16.0
-15.6
-15.3
-15.1
-15.0
-14.9
-14.9
-15.0
-15.0
-14.9
-14.7
-14.3
-13.8
-13.1
-11.9
-10.5
-9.0
0.25 23
19
6.50
0.14
5
0
-30
-78
-123
-160
-178
-179
-169
157
144
145
130
127
126
125
118
107
107
98
7.00
0.08 -8
0
7.50
0.04 -18
0.02 -17
0.02 -5
0
8.00
0
8.50
0
9.00
0.03 -15
0.04 -32
0.06 -50
0.07 -66
0.09 -80
0.11 -92
0.12 -103
0.14 -113
0.15 -123
0.16 -131
0.17 -140
0.17 -148
0.18 -156
0.18 -164
0.18 -172
0.18 179
0.18 170
0.18 160
0.18 149
0.18 137
0.19 122
0
-60
9.50
0
-65
10.00
10.50
11.00
11.50
12.00
12.50
13.00
13.50
14.00
14.50
15.00
15.50
16.00
16.50
17.00
17.50
18.00
18.50
19.00
19.50
20.00
20.50
21.00
21.50
0
-72
0
-78
0
-84
0
-90
0
-95
8.4
1
0
-101
-105
-110
-115
-120
-126
-131
-136
-140
-145
-150
-154
-159
-166
-171
-177
179
173
168
162
8.43 -14
8.48 -29
8.53 -44
0
0
0
8.6
-58
0
0.2
8.71 -73
8.81 -87
8.97 -101
9.11 -116
9.25 -131
9.43 -145
9.62 -161
9.84 -176
0
0.21
0.21
0.21
0.22
0.22
0.22
0.22
0.22
0.21
0.21
0.2
0
82
0
94
0
95
0
60
0
80
0
70
0
67
10
168
0
70
0.2
106
10.2 151
10.3 134
10.4 117
10.3 99
10.2 80
9.88 60
0
61
0.22 89
0.25 72
0
45
0
41
0.2
0.3
53
0
38
0.19
0.18
0.17
0.35 36
0.42 19
0
13
22.00
Note:
-7.5
0
5
Data obtained from on-wafer measurements.
5
Biasing and Operation
Assembly Techniques
The AMMC-5620 is normally biased with a single positive The backside of the AMMC-5620 chip is RF ground. For
drain supply connected to the VDD bond pads shown in
Figure 19. The recommended supply voltage is 5V, which
results in IDD = 95 mA (typical).
microstripline applications, the chip should be attached
directly to the ground plane (e.g., circuit carrier or heat-
sink) using electrically conductive epoxy[1].
No ground wires are required because all ground con- For best performance, the topside of the MMIC should be
nections are made with plated through-holes to the
backside of the device.
brought up to the same height as the circuit surrounding
it. This can be accomplished by mounting a gold plated
metal shim (same length and width as the MMIC) under
Refer the Absolute Maximum Ratings table for allowed the chip, which is of the correct thickness to make the
DC and thermal conditions.
chip and adjacent circuit coplanar.
The amount of epoxy used for chip and or shim at-
tachment should be just enough to provide a thin fillet
around the bottom perimeter of the chip or shim. The
ground plane should be free of any residue that may
jeopardize electrical or mechanical attachment.
The location of the RF bond pads is shown in Figure
20. Note that all the RF input and output ports are in a
Ground-Signal-Ground configuration.
RF connections should be kept as short as reasonable to
minimize performance degradation due to undesirable
series inductance. A single bond wire is sufficient for sig-
nal connections, however double-bonding with 0.7 mil
gold wire or the use of gold mesh[2] is recommended
for best performance, especially near the high end of the
frequency range.
Thermosonic wedge bonding is the preferred method
for wire attachment to the bond pads. Gold mesh can
be attached using a 2 mil round tracking tool and a tool
force of approximately 22 grams with an ultrasonic pow-
er of roughly 55 dB for a duration of 76 8 mS. A guided
wedge at an ultrasonic power level of 64 dB can be used
for the 0.7 mil wire. The recommended wire bond stage
temperature is 150 ± 2 ° C.
Caution should be taken to not exceed the Absolute
Maximum Rating for assembly temperature and time.
The chip is 100 µm thick and should be handled with
care. This MMIC has exposed air bridges on the top
surface and should be handled by the edges or with a
custom collet (do not pick up die with vacuum on die
center.)
This MMIC is also static sensitive and ESD handling pre-
cautions should be taken.
Notes:
1. Ablebond 84-1 LM1 silver epoxy is recommended.
2. Buckbee-Mears Corporation, St. Paul, MN, 800-262-3824
6
VD1
Feedback
network
Feedback
network
RF Output
Feedback
network
Matching
Matching
RF Input
Matching
Matching
Figure 18. AMMC-5620 Schematic
To power supply
100 pF chip capacitor
Gold plated shim
AMMC-5620
RF Input
RF Output
Figure 19. AMMC-5620 Assembly Diagram
7
875 (VDD)
1010
910
350 (RFOut)
350 (RFIn)
0
0
90
1315
1410
Figure 20. AMMC-5620 Bond Pad Locations.
(dimensions in microns)
Ordering Information:
AMMC-5620-W10 = 10 devices per tray
AMMC-5620-W50 = 50 devices per tray
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, AV02-0528EN in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0222EN
AV02-0528EN - June 19, 2007
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