ASMT-QBBC-NAECE [AVAGO]

Single Color LED, Blue, 2.4mm, 3.20 X 2.80 MM, 1.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SMT, LCC-4;


型号：	ASMT-QBBC-NAECE
厂家：	AVAGO TECHNOLOGIES LIMITED
描述：	Single Color LED, Blue, 2.4mm, 3.20 X 2.80 MM, 1.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SMT, LCC-4
文件：	总9页 (文件大小：139K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ASMT-QxBC-Nxxxx

Super 0.5W Power PLCC-4

Surface Mount LED Indicator

Data Sheet

Description

Features

The Super 0.5W Power PLCC-4 SMT LED is Blue mid-Power ꢀ Industry Standard PLCC 4 platform (3.2x2.8x1.9mm)

PLCC-4 SMT LEDs using InGaN chip technology. The

package can be driven at high current due to its superior

package design. The product is able to dissipate the heat

more eﬃciently compared to the Power PLCC-4 SMT LEDs.

ꢀ High reliability package with enhanced silicone resin

encapsulation

ꢀ High brightness with optimum ﬂux performance using

InGaN chip technologies

These LEDs produce higher light output with better ﬂux

performance compared to the Power PLCC-4 SMT LED.

ꢀ Available in Blue color

ꢀ Available in 8mm carrier tape & 7 inch reel

ꢀ Low Thermal Resistance 40°C/W

ꢀ Wide viewing angle at 120 degree

ꢀ JEDEC MSL 2

The Super 0.5W Power PLCC-4 SMT LEDs are designed for

higher reliability, better performance, and operate under

a wide range of environmental conditions. The perfor-

mance characteristics of these new mid-power LEDs make

them uniquely suitable for use in harsh conditions such as

in automotive applications, and in electronics signs and

signals.

Applications

1. Electronic signs and signals

To facilitate easy pick and place assembly, the LEDs are

packed in EIA-compliant tape and reel. Every reel is

shipped in single intensity and color bin, to provide close

uniformity.

a. Decorative/Advertising Lighting

b. Channel Lettering

c. Signs Luminaire

d. RGB Backlighting

CAUTION: ASMT-QxBC-Nxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions

during handling and processing. Refer to Avago Application Note AN-1142 for additional details.

Package Drawing

2.8 ꢀ.2

2.2 ꢀ.2

ꢀ.6 ꢀ.3

1.15 ꢀ.2

1.9 ꢀ.2

ꢀ.7

CATHODE

MARKING

Notes:

1. All Dimensions in millimeters.

2. Lead Polarity as shown in Figure 13.

3. Terminal Finish: Ag plating

4. Encapsulation material: Silicone resin

Figure 1. Package Drawing

Table 1. Device Selection Guide (T = 25°C)

[1]

Luminous Flux, ꢁ (lm)

Min. Flux

(lm)

Typ. Flux

(lm)

Max. Flux

(lm)

Test Current

(mA)

Color

Part Number

Dice Technology

Blue

ASMT-QBBC-NACxE

4.3

7.0

9.0

150

InGaN

Notes:

ꢁ is the total luminous ﬂux output as measured with an integrating sphere at mono pulse conditions.

2. Tolerance = 12ꢀ

Part Numbering System

ASMT- Q X₁B C – N X₂X₃X₄X₅

Packaging Option

Color Bin Selection

Max. Flux Bin Selection

Min. Flux Bin Selection

Color

B – Blue

Table 2. Absolute Maximum Ratings (T = 25°C)

Parameters

ASMT-QxBC-Nxxxx

150 mA

DC Forward Current ^[1]

Peak Forward Current ^[2]

Power Dissipation

300 mA

570 mW

Reverse Voltage, V_R@ 10 μA

Junction Temperature

Operating Temperature

Storage Temperature

125°C

-40°C to +120°C

Notes:

1. Derate Linearly as shown in Figure 6.

2. Duty Factor = 10ꢀ, Frequency = 1kHz

Table 3. Optical Characteristics (T = 25°C)

Peak

Wavelength

Dominant

Wavelength

ꢂ (nm)

Viewing

Angle 2ꢃ½

(Degrees)

Luminous

Eﬃciency

ꢄe (lm/W)

Total Flux / Lumi-

nous Intensity

ꢁ (lm) / I (cd)

[1]

ꢂ

PEAK

(nm)

Dice

Color

Part Number

Technology

Typ.

2.70

Blue

ASMT-QBBC-Nxxxx

InGaN

458.0

464.0

120

Notes:

1. ꢃ½ is the oﬀ-axis angle where the luminous intensity is ½ the peak intensity.

Table 4. Electrical Characteristics (T = 25°C)

Forward Voltage

Thermal

Resistance

V (Volts) @ I = 15ꢀ mA

Part Number

Typ.

3.4

Max.

Rꢃ (°C/W)

J-P

ASMT-QBBC-NxxxE

3.8

300

250

200

150

100

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

380 430 480 530 580 630 680 730 780

FORWARD VOLTAGE - V

WAVELENGTH - nm

Figure 2. Relative Intensity Vs. Wavelength

Figure 3. Forward Current Vs. Forward Voltage.

1.8

1.6

1.4

1.2

1.0

0.8

0.6

0.4

0.2

0.0

1.2

1.0

0.8

0.6

0.4

0.2

0.0

100

150

200

250

300

-50

-25

100

DC FORWARD CURRENT - mA

T_J- JUNCTION TEMPERATURE - °C

Figure 4. Relative Flux vs. Forward Current

Figure 5. Relative Flux Vs. Temperature

160

140

160

140

120

Rθ_JA= 90°C/W

Rθ_JP= 40°C/W

120

100

Rθ_JA= 110°C/W

100

120

140

100

120

140

TEMPERATURE (°C)

Figure 6a. Maximum Forward Current Vs. Ambient Temperature. Derated

Figure 6b. Maximum Forward Current Vs. Solder Point Temperature. Derated

Based on T_JMAX= 125°C, Rꢃ_J-A= 11ꢀ°C/W & 9ꢀ°C/W.

Based on T_JMAX= 125°C, Rꢃ_J-P= 4ꢀ°C/W.

0.40

0.30

0.20

0.10

0.00

0.40

0.30

0.20

0.10

0.00

D =

0.05

0.10

0.25

0.50

D =

0.05

0.10

0.25

0.50

D =

1.00E-05 1.00E-04 1.00E-03 1.00E-02 1.00E-01 1.00E+00 1.00E+01 1.00E+02

tp - Time - (S)

t - Time - (S)

Figure 7a. Maximum Pulse Current Vs. Ambient Temperature. Derated Based

Figure 7b. Maximum Pulse Current Vs. Ambient Temperature. Derated Based

on T_A= 25°C, Rꢃ_J-A= 11ꢀ°C/W.

on T_A= 85°C, Rꢃ_J-A= 11ꢀ°C/W.

510

500

490

480

470

460

450

440

0.25

0.20

0.15

0.10

0.05

0.00

-0.05

-0.10

-0.15

-0.20

100

150

200

250

300

-50

-25

100

FORWARD CURRENT - mA

TJ - JUNCTION TEMPERATURE - °C

Figure 8. Chromaticity Shift Vs. Forward Current

Figure 9. Forward Voltage Shift Vs. Temperature.

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

-90

-60

-30

ANGULAR DISPLACEMENT - DEGREES

Figure 1ꢀ. Radiation Pattern

1ꢀ - 3ꢀ SEC.

255 - 26ꢀ°C

3°C/SEC. MAX.

217°C

2ꢀꢀ°C

6°C/SEC. MAX.

15ꢀ°C

3°C/SEC. MAX.

6ꢀ - 12ꢀ SEC.

1ꢀꢀ SEC. MAX.

TIME

(Acc. to J-STD-ꢀ2ꢀC)

Note: For detail information on reﬂow soldering of Avago surface mount

LEDs, do refer to Avago Application Note AN 1060 Surface Mounting

SMT LED Indicator Components.

Note: Diameter "D" should be smaller than 2.2mm

Figure 12. Recommended Pb-free Reﬂow Soldering Proﬁle

Figure 11. Recommended Pick and Place Nozzle Size

2.4

0.6

0.9 X 6

1.3 x 6

0.4

1.1

4.6

0.3

CATHODE

MARKING

SOLDER MASK

ANODE

CATHODE

MARKING

MINIMUM 55 mm²OF CATHODE PAD

CATHODE

FOR IMPROVED HEAT DISSIPATION

Figure 13. Recommended Soldering Pad Pattern

TRAILER

COMPONENT

LEADER

2ꢀꢀ mm MIN. FOR Ø18ꢀ REEL.

2ꢀꢀ mm MIN. FOR Ø33ꢀ REEL.

48ꢀ mm MIN. FOR Ø18ꢀ REEL.

96ꢀ mm MIN. FOR Ø33ꢀ REEL.

USER FEED DIRECTION

Figure 14. Tape Leader and Trailer Dimensions

0.1

2 0.05

+0.1

–0

1.75 0.1

2.29 0.1

Ø1.5

3.5 0.05

3.8 0.1

+0.3

–0.1

+0.1

3.05 0.1

Ø1

–0

0.229 0.01

8°

ALL DIMENSIONS IN mm.

Figure 15. Tape Dimensions

USER FEED DIRECTION

CATHODE SIDE

PRINTED LABEL

Figure 16. Reeling Orientation

Device Color (X )

Color Bin Select (X4)

Individual reel will contain parts from one full bin only.

Blue

Full Distribution

1 and 2 only

Flux Bin Select (X X )

2 3

Individual reel will contain parts from one bin only

2 and 3 only

X₂

X₃

Min Flux Bin

Max Flux Bin

3 and 4 only

1, 2 and 3 only

2, 3 and 4 only

Special binning

Flux Bin Limits

Bin ID

Min. (lm)

3.40

Max. (lm)

4.30

Color Bin Limits

4.30

5.50

Blue

Min. (nm)

460.0

Max. (nm)

465.0

5.50

7.00

9.00

465.0

470.0

9.00

11.50

15.00

19.50

25.50

33.00

43.00

56.00

73.00

470.0

475.0

11.50

15.00

19.50

25.50

33.00

43.00

56.00

475.0

480.0

Tolerance of each bin limit = 1 nm

V Bin Limits

Bin ID

Min.

2.90

3.20

3.50

Max.

3.20

3.50

3.80

Tolerance of each bin limit = 12ꢀ

Tolerance of each bin limit = 0.1V

Packaging Option (X )

Option

Test Current

Package Type

Reel Size

150mA

Top Mount

7 Inch

Handling Precaution

The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft

material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product

and cause premature failure. During assembly or handling, the unit should be held on the body only. Please refer to

Avago Application Note AN 5288 for detail information.

Moisture Sensitivity

This product is qualiﬁed as Moisture Sensitive Level 2 per Jedec J-STD-020. Precautions when handling this moisture

sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305

Handling of Moisture Sensitive Surface Mount Devices for details.

A. Storage before use

– Unopen moisture barrier bag (MBB) can be stored at <40°C/90ꢀRH for 12 months. If the actual shelf life has

exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reﬂow the LEDs per the

original MSL rating.

– It is not recommended to open the MBB prior to assembly (e.g. for IQC).

B. Control after opening the MBB

– The humidity indicator card (HIC) shall be read immediately upon opening of MBB.

– The LEDs must be kept at <30°C / 60ꢀRH at all time and all high temperature related process including soldering,

curing or rework need to be completed within 1 year.

C. Control for unﬁnished reel

– For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5ꢀRH.

D. Control of assembly boards

– If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be

stored in sealed MBB with desiccant or desiccator at <5ꢀRH to ensure no LEDs have exceeded their ﬂoor life of 1

year.

E. Baking is required if

– “60ꢀ”HIC indicator is NOT Green.

– The LEDs are exposed to condition of >30°C/60ꢀ RH at any time.

– The LEDs ﬂoor life exceeded 1 year.

Recommended baking condition: 60 5°C for 20 hours.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-1885EN - April 8, 2010

ASMT-QBBC-NAECE [AVAGO]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E