ASMT-QBBE-NAHGE [AVAGO]
Single Color LED, Blue, 2.4mm, 3.20 X 2.80 MM, 1.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SMT, LCC-4;
| 型号： | ASMT-QBBE-NAHGE |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Single Color LED, Blue, 2.4mm, 3.20 X 2.80 MM, 1.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SMT, LCC-4 |
| 文件： | 总9页 (文件大小：150K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ASMT-QxBE-Nxxxx
Super 0.5W Power PLCC-4
Surface Mount LED Indicator
Data Sheet
Description
Features
The Super 0.5W Power PLCC-4 SMT LED is first Blue &
Green mid-Power PLCC-4 SMT LEDs using InGaN chip
technology. The package can be driven at high current
due to its superior package design. The product is able
to dissipate the heat more efficiently compared to the
Power PLCC-4 SMT LEDs. These LEDs produce higher light
output with better flux performance compared to the
Power PLCC-4 SMT LED.
ꢀ Industry Standard PLCC 4 platform (3.2x2.8x1.9mm)
ꢀ High reliability package with enhanced silicone resin
encapsulation
ꢀ High brightness with optimum flux performance
using InGaN chip technologies
ꢀ Available in Blue and Green color
ꢀ Available in 8mm carrier tape & 7 inch reel
ꢀ Low Thermal Resistance 40°C/W
ꢀ Super wide viewing angle at 120 degree
ꢀ JEDEC MSL 2a
The Super 0.5W Power PLCC-4 SMT LEDs are designed for
higher reliability, better performance, and operate under
a wide range of environmental conditions. The perfor-
mance characteristics of these new mid-power LEDs
make them uniquely suitable for use in harsh conditions
such as in automotive applications, and in electronics
signs and signals.
Applications
1. Electronic signs and signals
a. Decorative/Advertising Lighting
b. Channel Lettering
To facilitate easy pick and place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel is
shipped in single intensity and color bin, to provide close
uniformity.
c. Signs Luminaire
d. RGB Backlighting
CAUTION: ASMT-QXBE-Nxxxx LEDs are ESD sensitive. Please observe appropriate precautions
during handling and processing. Refer to Avago Application Note AN-1142 for additional details.
Package Drawing
2.8 ꢀ.2
2.2 ꢀ.2
ꢀ.6 ꢀ.3
1.15 ꢀ.2
1.9 ꢀ.2
A
A
C
C
ꢀ.7
CATHODE
MARKING
Notes:
1. All dimensions in millimeters
2. Lead polarity as shown in figure 13.
3. Terminal finish: Ag plating.
4. Encapsulation material: silicone resin.
Figure 1. Package Drawing
Table 1. Device Selection Guide
[1]
Luminous Flux, ꢁ (lm)
V
Color
Part Number
Min. Flux (lm)
Typ. Flux (lm)
Max. Flux (lm)
Test Current (mA) Dice Technology
Blue
ASMT-QBBE-N0B0E
ASMT-QGBE-NFH0E
3.4
4.8
7.0
150
150
InGaN
InGaN
Green
Notes:
15.0
23.0
33.0
1.
ꢁ is the total luminous flux output as measured with an integrating sphere at mono pulse conditions.
V
2. Tolerance = 12ꢀ
Part Numbering System
ASMT–QX BE–NX X X X
2 3 4 5
1
Packaging Option
Colour Bin Selection
Max. Flux Bin Selection
Min. Flux Bin Selection
Color
B - Blue
G - Green
2
Table 2. Absolute Maximum Ratings (T = 25 °C)
A
Parameters
ASMT-QWBE-Nxxxx
DC Forward Current [1]
Peak Forward Current [2]
Power Dissipation
Reverse Voltage
150 mA
300 mA
513 mW
-4V
Junction Temperature
Operating Temperature
Storage Temperature
125 °C
-40 °C to +110 °C
-40 °C to +110 °C
Notes:
1. Derate Linearly as shown in Figure 6.
2. Duty Factor = 10ꢀ, Frequency = 1kHz
Table 3. Optical Characteristics (T = 25 °C)
J
Peak
Wavelength
Dominant
Wavelength λ Angle 2ꢂ
(nm)
Typ.
Viewing
Luminous
Efficiency
ꢃ (lm/W)
e
Total Flux /
[1]
Luminous Intensity
Φ (lm) / I (cd)
D
½
λ
(nm)
(Degrees)
PEAK
V
V
Dice
Color
Part Number
Technology
Typ.
Typ.
120
120
Typ.
10
Typ.
Blue
ASMT-QBBE-Nxxxx
ASMT-QGBE-Nxxxx
InGaN
459.0
516.5
464.5
522.0
2.75
2.75
Green
Notes:
InGaN
35
1.
ꢂ is the off-axis angle where the luminous intensity is ½ the peak intensity.
½
Table 4. Electrical Characteristics (T = 25 °C)
J
Forward Voltage VF (Volts) @ IF = 150 mA
Part Number
Typ.
3.6
3.6
Max.
4.1
Thermal Resistance Rꢂ (°C/W)
J-P
ASMT-QBBE-N0B0E
ASMT-QGBE-NFH0E
40
4.1
40
3
35ꢀ
3ꢀꢀ
25ꢀ
2ꢀꢀ
15ꢀ
1ꢀꢀ
5ꢀ
1.ꢀ
ꢀ.9
ꢀ.8
ꢀ.7
ꢀ.6
ꢀ.5
ꢀ.4
ꢀ.3
ꢀ.2
ꢀ.1
ꢀ.ꢀ
Blue
Green
ꢀ
ꢀ
1
2
3
4
5
38ꢀ
43ꢀ
48ꢀ
53ꢀ
58ꢀ
63ꢀ
68ꢀ
73ꢀ
78ꢀ
FORWARD VOLTAGE - V
WAVELENGTH - nm
Figure 2. Relative Intensity Vs. Wavelength
Figure 3. Forward Current Vs. Forward Voltage
1.2
1.1
1
1.2
1
0.8
0.6
0.4
0.2
0
0.9
0.8
0.7
0.6
0
30
60
90
120
150
-50
0
50
100
150
DC FORWARD CURRENT - mA
JUNCTION TEMPERATURE - °C
Figure 4. Relative Flux Vs. Forward Current
Figure 5. Relative Flux Vs. Temperature
160
140
120
100
80
160
140
RꢂJP = 40°C/W
RꢂJA = 90°C/W
120
RꢂJA = 110°C/W
100
80
60
40
20
0
60
40
20
0
0
20
40
60
80
100
120
0
20
40
60
80
100
120
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 6a. Maximum Forward Current Vs. Ambient Temperature.
DeratedBased on TJMAX = 125°C, RθJ-A=110°C/W & 90°C/W
Figure 6b. Maximum Forward Current Vs. Solder Point Temperature.
Derated Based on TJMAX = 125°C, RθJ-P=40°C/W.
4
ꢀ.4ꢀ
ꢀ.3ꢀ
ꢀ.2ꢀ
ꢀ.1ꢀ
ꢀ.ꢀꢀ
ꢀ.4ꢀ
ꢀ.3ꢀ
ꢀ.2ꢀ
ꢀ.1ꢀ
ꢀ.ꢀꢀ
tp
tp
T
D =
IF
D =
ꢀ.ꢀ5
ꢀ.1ꢀ
ꢀ.25
ꢀ.5ꢀ
1
T
D =
ꢀ.ꢀ5
ꢀ.1ꢀ
ꢀ.25
ꢀ.5ꢀ
1
tp
tp
T
D =
IF
T
ꢀ.ꢀꢀꢀꢀ1 ꢀ.ꢀꢀꢀ1 ꢀ.ꢀꢀ1 ꢀ.ꢀ1
ꢀ.1
ꢀ
1ꢀ
1ꢀꢀ
ꢀ.ꢀꢀꢀꢀ1 ꢀ.ꢀꢀꢀ1 ꢀ.ꢀꢀ1 ꢀ.ꢀ1
ꢀ.1
ꢀ
1ꢀ
1ꢀꢀ
tp - Time - (s)
tp - Time - (s)
Figure 7a. Maximum Pulse Current Vs. Ambient Temperature.
Derated Based on TA = 25°C, RθJ-A=110°C/W.
Figure 7b. Maximum Pulse Current Vs. Ambient Temperature.
Derated Based on TA= 85°C, RθJ-P=110°C/W.
ꢀ.25
ꢀ.2
ꢀ.15
ꢀ.1
ꢀ.ꢀ5
ꢀ
54ꢀ
53ꢀ
52ꢀ
51ꢀ
5ꢀꢀ
49ꢀ
48ꢀ
47ꢀ
46ꢀ
-5ꢀ
-25
ꢀ
25
5ꢀ
75
1ꢀꢀ
-ꢀ.ꢀ5
-ꢀ.1
-ꢀ.15
-ꢀ.2
-ꢀ.25
ꢀ
3ꢀ
6ꢀ
9ꢀ
12ꢀ
15ꢀ
FORWARD CURRENT - mA
T J - JUNCTION TEMPERATURE - °C
Figure 8. Dominant wavelength Vs. forward current.
Figure 9. Forward Voltage Shift Vs. Temperature.
1
ꢀ.9
ꢀ.8
ꢀ.7
ꢀ.6
ꢀ.5
ꢀ.4
ꢀ.3
ꢀ.2
ꢀ.1
ꢀ
-9ꢀ
-6ꢀ
-3ꢀ
ꢀ
3ꢀ
6ꢀ
9ꢀ
ANGULAR DISPLACEMENT - DEGREES
Figure 10. Radiation Pattern
5
1ꢀ - 3ꢀ SEC.
255 - 26ꢀºC
3 C/SEC. MAX.
217ºC
2ꢀꢀºC
-6ºC/SEC. MAX.
D
15ꢀºC
3ºC/SEC. MAX.
6ꢀ - 12ꢀ SEC.
1ꢀꢀ SEC. MAX.
TIME
(Acc. to J-STD-ꢀ2ꢀC)
Note: For detail information on reflow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
Note: Diameter "D" should be smaller than 2.2mm
Figure 12. Recommended Pick and Place Nozzle Size
Figure 11. Recommended Pb-free Reflow Soldering Profile
2.4
ꢀ.6
ꢀ.9 X 6
1.3 x 6
1.1
A
C
A
C
ꢀ.4
A
C
A
C
4.6
C
C
ꢀ.3
CATHODE
MARKING
SOLDER MASK
ANODE
A
CATHODE
MARKING
MINIMUM 55 mm2 OF CATHODE PAD
FOR IMPROVED HEAT DISSIPATION
CATHODE
C
Figure 13. Recommended Soldering Pad Pattern
6
TRAILER
COMPONENT
LEADER
2ꢀꢀ mm MIN. FOR Ø18ꢀ REEL.
2ꢀꢀ mm MIN. FOR Ø33ꢀ REEL.
48ꢀ mm MIN. FOR Ø18ꢀ REEL.
96ꢀ mm MIN. FOR Ø33ꢀ REEL.
C
A
USER FEED DIRECTION
Figure 14. Tape Leader and Trailer Dimensions
4
ꢀ.1
4
ꢀ.1
2 ꢀ.ꢀ5
+ꢀ.1
1.75 ꢀ.1
2.29 ꢀ.1
Ø1.5
–ꢀ
C
C
3.5 ꢀ.ꢀ5
3.8 ꢀ.1
+ꢀ.3
–ꢀ.1
8
A
A
+ꢀ.1
3.ꢀ5 ꢀ.1
Ø1
–ꢀ
ꢀ.229 ꢀ.ꢀ1
8°
ALL DIMENSIONS IN mm.
Figure 15. Tape Dimensions
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 16. Reeling Orientation
7
Device Color (X )
Handling Precaution
1
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is a
soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
B
Blue
G
Green
product and cause premature failure. During assembly Flux Bin Select (X X )
2 3
or handling, the unit should be held on the body only.
Please refer to Avago Application Note AN 5288 for detail
information.
Individual reel will contain parts from one bin only
X2
X3
Min Flux Bin
Max Flux Bin
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 2a
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the reli-
ability of the product. Do refer to Avago Application Note
AN5305 Handling of Moisture Sensitive Surface Mount
Devices for details.
Flux Bin Limits
Bin ID
Min. (lm)
3.40
Max. (lm)
0
A
B
C
D
E
4.30
4.30
5.50
5.50
7.00
A. Storage before use
7.00
9.00
-
Unopen moisture barrier bag (MBB) can be stored
at <40°C/90ꢀRH for 12 months. If the actual shelf
life has exceeded 12 months and the HIC indicates
that baking is not required, then it is safe to reflow
the LEDs per the original MSL rating.
9.00
11.50
15.00
19.50
25.50
33.00
43.00
56.00
73.00
11.50
15.00
19.50
25.50
33.00
43.00
56.00
F
G
H
J
-
It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
-
The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
K
L
-
The LEDs must be kept at <30°C / 60ꢀRH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
Tolerance of each bin limit = 12ꢀ
Color Bin Select (X )
4
Individual reel will contain parts from one full bin only.
C. Control for unfinished reel
X
-
For any unuse LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at <5ꢀRH.
4
0
Full Distribution
1 and 2 only
D. Control of assembled boards
A
B
C
G
H
Z
-
If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
need to be stored in sealed MBB with desiccant
or desiccator at <5ꢀRH to ensure no LEDs have
exceeded their floor life of 672 hours.
2 and 3 only
3 and 4 only
1, 2 and 3 only
2, 3 and 4 only
Special binning
E. Baking is required if:
-
-
“10ꢀ”is Not Green and “5ꢀ”HIC indicator is Azure.
The LEDs are exposed to condition of >30°C / 60ꢀ
RH at any time.
-
The LEDs floor life exceeded 672 hours.
Recommended baking condition: 60 5°C for 20 hours.
8
Color Bin Limits
VF Bin Limits
Blue
Min. (nm)
460.0
Max. (nm)
465.0
Bin ID
S5
Min.
3.20
3.50
3.80
Max.
3.50
3.80
4.10
1
2
3
4
465.0
470.0
S6
470.0
475.0
S7
Tolerance of each bin limit = 0.1V
475.0
480.0
Packaging Option (X )
5
Green
Min. (nm)
515.0
Max. (nm)
520.0
Option
Test Current
Package Type Reel Size
1
2
3
4
E
150mA
Top Mount
7 Inch
520.0
525.0
525.0
530.0
530.0
535.0
Tolerance of each bin limit = 1 nm
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02-0864EN - April 8, 2010
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