ASMT-VW00-NAHU1 [AVAGO]

Single Color LED, White;


型号：	ASMT-VW00-NAHU1
厂家：	AVAGO TECHNOLOGIES LIMITED
描述：	Single Color LED, White
文件：	总10页 (文件大小：420K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ASMT-Vx00

Right Angle Surface Mount White LED

Data Sheet

Description

Features

TheASMT-Vx00isarightanglepackagewiththedimension

of 4.0 (L) x 1.4 (W) x 0.8 (H) mm where it is developed ideal

for general purpose backlighting application.The package

is compatible with IR reﬂow solder processes. The small

size and wide viewing angle makes this LED compatible

for application where space is a premium.

• Right angle emitting conﬁguration

• 110° View Angle

• Slim Package formation

• High reliability package

• Good Intensity Output

To facilitate easy surface mount process during pick and

place assembly, the parts are packed in EIA-compliant

tape and reel which is further sealed in a moisture barrier

bag. Every reel of parts will be shipped in the single color

and single intensity bin formation to provide the customer

with close uniformity. The LEDs are available with 3500

units / reel.

• Compatible with IR Solder Reﬂow

Speciﬁcations

• InGaN Technology

• 3.2V, 20mA (typical)

• 110 viewing angle

Applications

• LCD Backlighting

• General purpose lighting

• Status indicator

CAUTION: ASMT-Vx00 is Class x ESD sensitive. Please observe appropriate precautions during handling

and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.

Package Dimensions

Notes:

1. All upper dimensions are in millimeters.

2. Tolerance = 0.1 mm unless otherwise speciﬁed.

Part Numbering System

ASMT–V x 00 – N x x x 1

2 3

Color Bin Selection

Max IV Bin Selection

Min IV Bin Selection

Color

W - White

Absolute Maximum Ratings (T = 25°C)

Parameter

DC Forward Current^[1]

ASMT-Vx00

Units

Power Dissipation

117

Reverse Voltage (I_R= 100µA)

LED Junction Temperature

Operating Temperature Range

Storage Temperature Range

Soldering Temperature

Storage Temperature Range

125

°C

-40 to 85

°C

-40 to 100

-40 to +100

Refer to Figure 8 & 9

°C

Note:

1. Derate linearly as shown in Figure 5.

Optical Characteristics (T = 25°C)

Luminous Intensity

Viewing Angle

[1]

[2]

(mcd)

Chromaticity Coordinates

[3]

Testing Current

2θ

1/2

(Degrees)

Part Number

ASMT-VW00

Notes:

I (mA)

Min.

Typ.

Max.

Typ.

1000

1400

1800

0.29

0.28

110

1. The luminous intensity I is measured at the on axis to the LED package which may not be aligned with the peak of the spatial radiation pattern.

2. The Chromaticity Coordinate is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.

3. 2θ is the oﬀ-axis angle where the luminous intensity is ½ the peak intensity.

1/2

Electrical Characteristics (T = 25°C)

Reverse Breakdown

V (Volts)

Thermal Resistance,

Rθj-p

Forward Voltage

V (Volts)

[1]

[2]

@ I = 100µA

(°C/W)

Testing Current

Part Number

I (mA)

Typ.

Max.

Min.

Typ.

ASMT-VW00

3.2

3.7

170

Note:

1. V_Ftolerance: ±0.1V.

2. R_θj-pis Thermal Resistance from LED junction to pin.

V Bin Limit (for reference only)

I Bin Limit (for reference only) [x x ]

V 1 2

[1]

[1,2]

Forward Voltage (V ) Bin Limits

Light Intensity (I ) Bin Limits

Forward Voltage (V) at 20mA

Intensity (mcd) at 20mA

Min.

2.7

2.8

2.9

3.0

3.1

3.2

3.3

3.4

3.5

3.6

Max.

2.8

2.9

3.0

3.1

3.2

3.3

3.4

3.5

3.6

3.7

Bin ID

Min.

Max.

1000

1051

1101

1151

1201

1251

1301

1351

1401

1451

1501

1551

1601

1651

1701

1751

1050

1100

1150

1200

1250

1300

1350

1400

1450

1500

1550

1600

1650

1700

1750

1800

Note:

1. Tolerance : 0.1V

Notes:

I Bins at T =25°C, I = 20 mA

V A F

2. Tolerance : 10ꢀ

Notes: Bin categories are established for classiﬁcation of products. Products may not be available in all categories. Please contact your Avago repre-

sentative for information on current available bins.

Color Bin Selections [X ]

Individual reel will contain parts from one full bin only.

Color Limits

(Chromaticity Coordinates)

Full Distribution

A only

White

Bin A

0.296

0.276

0.291

0.287

0.299

0.294

0.302

0.283

B only

C only

Bin B

Bin C

Bin D

Bin E

Bin F

0.301

0.265

0.296

0.276

0.302

0.283

0.305

0.272

D only

0.288

0.262

0.282

0.272

0.291

0.287

0.296

0.276

E only

F only

0.295

0.253

0.288

0.262

0.296

0.276

0.301

0.265

A and B only

B and C only

C and D only

D and E only

E and F only

A, B and C only

B, C and D only

C, D and E only

D, E and F only

Special Color Bin

A, B, C and D only

B, C, D and E only

C, D, E and F only

A, B, C, D and E only

B, C, D, E, and F only

0.280

0.248

0.272

0.258

0.282

0.272

0.288

0.262

0.287

0.240

0.280

0.248

0.288

0.262

0.295

0.253

Tolerances 0.01

0.32

0.30

0.28

0.26

0.24

0.22

0.26

0.27

0.28

0.29

X-COORDINATE

0.30

0.31

0.32

Notes:

1. Chromaticity Bins at T = 25°C, I = 20mA

2. Tolerance on chromaticity bins is 0.01

Notes: Color bin selection is not available until further notice. Only bin 0 can be ordered as of now.

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

WHITE

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

380 430

480 530 580

630 680 730

780

WAVELENGTH - nm

FORWARD VOLTAGE - V

Figure 1. Relative Intensity vs. Wavelength

Figure 2. Forward current vs. forward voltage

1.5

1.2

0.9

0.6

0.3

0.0

1.0

0.8

0.6

0.4

White

0.2

0.0

-90 -70 -50 -30 -10

10 30

50 70

OFF-AXIS ANGLE (°)

DC FORWARD CURRENT - mA

Figure 4. Relative intensity vs angle

Figure 3. Relative luminous intensity vs. mono pulse current

1.15

R_JA= 800°C/W

R_JA= 600°C/W

R_JA= 400°C/W

0.90

2.40

T_AAMBIENT TEMPERATURE - °C

Figure 5. Maximum forward current vs. ambient temperature

Figure 6. Recommended soldering land pattern

Derated based on T_JMAX = 125°C, Rθ_JA= 400°C/W / 600°C/W and 800°C/W

0.012

0.010

0.008

0.006

0.004

0.002

2mA

10 SEC. MAX.

230°C MAX.

4°C/SEC. MAX.

140-160°C

5mA

10mA

-3°C/SEC.

MAX.

4°C/SEC.

MAX.

20mA

30mA

0.000

OVER 2 MIN.

0.0000 0.0005 0.0010 0.0015 0.0020 0.0025 0.0030

X - COORDINATES

TIME

Figure 7. Chromaticity shift vs. current

Figure 8. Recommended leaded reﬂow soldering proﬁle

*Note: (x,y) values @ 30mA reference to (0.0)

10 to 30 SEC.

255 - 260 °C

3°C/SEC. MAX.

217 °C

200 °C

-6°C/SEC. MAX.

150 °C

3 °C/SEC. MAX.

100 SEC. MAX.

60 - 120 SEC.

TIME

Figure 9. Recommended Pb-free reﬂow soldering proﬁle

USER FEED DIRECTION

CATHODE SIDE

PRINTED LABEL

Figure 10. Reeling orientation

16.0 .10

[.630 .03ꢀ]

13.2 .10

[.520 .03ꢀ]

13.5 0.5

[.531 .020]

0.5

[.118 .020]

178.0 1.00

[7.0 .03ꢀ]

60.0 1.00

[2.362 .03ꢀ]

0.5

[.157 .020]

[.1ꢀ7 .020]

Figure 11. Reel dimensions

4.0 .ꢀ0

2.0 .ꢀ0

ꢀ.5 .ꢀ0

ꢀ.75 .ꢀ0

5.50 .ꢀ0

.ꢁ0

-.ꢀ0

ꢀ2.0

ꢀ.0 .ꢀ0

ꢀ.02 0.ꢀ 0.279 0.02

ꢀ0ºMAX

ꢀ.54 0.ꢀ

4.24 0.ꢀ

Figure 12. Carrier tape dimensions

Figure 13. Tape leader and trailer dimensions.

Reﬂow Soldering

Storage Condition

For more information on reﬂow soldering, refer to Applica-

tion Note AN-1060, Surface Mounting SMT LED Indicator

Components.

5 to 30°C @ 60ꢀ RH max.

Baking is required before mounting, if:

1. Humidity Indicator Card is >10ꢀ when read at 23 5°C.

2. Device expose to factory conditions <30°C/60ꢀ RH

more than 672 hours.

For more information on moisture sensitive device

handling, refer to Application Note AN5305, Handling

Moisture Sensitive Surface Mount LED.

Recommended baking condition: 60 5°C for 20 hours.

DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHO-

RIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR

DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY

RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE,

EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.

AV02-1318EN - June 19, 2008

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