HCPL-4731-560E [AVAGO]
Logic IC Output Optocoupler, 2-Element, 3750V Isolation, 0.300 INCH, ROHS COMPLIANT, DIP-8;
| 型号： | HCPL-4731-560E |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Logic IC Output Optocoupler, 2-Element, 3750V Isolation, 0.300 INCH, ROHS COMPLIANT, DIP-8 |
| 文件： | 总14页 (文件大小：302K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
6N139, 6N138, HCPL-0701, HCPL-0700,
HCNW139, HCNW-138
Low Input Current, High Gain Optocouplers
Data Sheet
Lead (Pb) Free
RoHS 6 fully
compliant
RoHS 6 fully compliant options available;
-xxxE denotes a lead-free product
Description
Features
• High current transfer ratio – 2000% typical (4500 %
typical for HCNW139/138)
These high gain series couplers use a Light Emitting
Diode and an integrated high gain photodetector to
provide extremely high current transfer ratio between
input and output. Separate pins for the photodiode
and output stage result in TTL compatible saturation
voltages and high speed operation. Where desired the
• Low input current requirements – 0.5 mA
• TTL compatible output – 0.1V VOL typical
• Performance guaranteed over temperature 0°C
to70°C
V
CC
and VO terminals may be tied together to achieve
• Base access allows gain bandwidth adjustment
• High output current – 60mA
• Safetyapproval
UL recognized – 3750 V rms for 1minute and 5000 V
rms* for 1minute per UL 1577
CSA approved
conventional photodarlington operation. A base
access terminal allows a gain bandwidth adjustment to
be made.
The 6N139, HCPL-0701, and CNW139 are for use in CMOS,
LSTTL or other low power applications. A 400% mini-
mum current transfer ratio is guaranteed over 0to 70°C
operating range for only 0.5 mA of LED current.
IEC/EN/DIN EN 60747-5-2 approved with VIORM = 1414
Vpeak for HCNW139 and HCNW138
The 6N138, HCPL-0700, and HCNW138 are designed for
use mainly in TTL applications. Current Transfer Ratio
(CTR) is 300% minimum over 0 to 70°C for an LED current
of 1.6 mA (1TTL Unit load ). A 300% minimum CTR
enables operation with 1 TTL Load using a 2.2 kΩ
pull-up resistor.
• Available in 8-Pin DIP or SOIC-8 footprint or widebody
package
• MIL-PRF-38534 hermetic version available
(HCPL-5700/1)
Applications
Functional Diagram
• Ground isolate most logic families – TTL/TTL, CMOS/
TTL, CMOS/CMOS, LSTTL/TTL, CMOS/LSTTL
• Low input current line receiver
• High voltage insulation (HCNW139/138)
• EIA RS-232C line receiver
• Telephone ring detector
• 117 V ac line voltage status indicator – low input
8
7
6
5
NC
ANODE
CATHODE
NC
1
2
3
4
V
V
V
CC
B
TRUTH TABLE
LED
V
O
ON
OFF
LOW
HIGH
O
GND
power dissipation
• Low power systems – ground isolation
*5000 V rms/1 minute rating is for HCNW139/138 and Option 020
(6N139/138) products only.
A 0.1 µF bypass capacitor connected between pins 8 and 5 is
recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Selection for lower input current down to 250 µA is
available upon request.
lead profile is designed to be compatible with standard
surface mount processes.
The HCPL-0701 and HCPL-0700 are surface mount devices
packaged in an industry standard SOIC-8 footprint.
The HCNW139 and HCNW138 are packaged in a
widebody encapsulation that provides creepage and
clearance dimensions suitable for safety approval by
regulatory agencies worldwide.
The SOIC-8 does not require “through holes” in a PCB.
This package occupies approximately one-third the
footprint area of the standard dual-in-line package. The
Selection Guide
Widebody
Package
(400 mil)
8-Pin DIP
(300 Mil)
Hermetic
Single and
Dual
Channel
Packages
HCPL-
Small Outline SO-8
Dual
Single
Channel
Package
HCPL-
Dual
Minimum
Input ON
Current
(IF)
Absolute
Maxi-
mum
Single
Channel
Package
Channel
Package
HCPL-
Channel
Package
HCPL-
Single
Channel
Package
Minimum
CTR
V
CC
6N139
2731[1]
2730[1]
4731[1]
0701
0731
HCNW139
HCNW138
0.5 mA
1.6 mA
40 µA
400%
300%
800%
300%
18 V
7 V
6N138
HCPL-4701[1]
0700
070A[1]
0730
073A[1]
18 V
20 V
0.5 mA
5701[1]
5700[1]
5731[1]
5730[1]
Note:
1. Technical data are on separate Avago publications.
2
Ordering Information
6N138, 6N139, HCPL-0700 and HCPL-0701 are UL Recognized with 3750Vrms for 1 minute per UL1577 and are approved
under CSA Component Acceptance Notice #5, File CA 88324.
Option
Part
RoHS
non RoHS
Surface
Mount
Gull
Tape
UL 5000 Vrms/
1 Minute rating
IEC/EN/DIN
Number
Compliant Compliant Package
Wing
& Reel
EN 60747-5-2 Quantity
-000E
-300E
-500E
-020E
-320E
-520E
-060E
-360E
-560E
-000E
no option 300 mil DIP-8
50 per tube
#300
#500
#020
#320
#520
#060
#360
#560
300 mil DIP-8
300 mil DIP-8
300 mil DIP-8
300 mil DIP-8
300 mil DIP-8
300 mil DIP-8
300 mil DIP-8
300 mil DIP-8
X
X
X
X
50 per tube
1000 per reel
50 per tube
50 per tube
1000 per reel
50 per tube
50 per tube
1000 per reel
100 per tube
1500 per reel
100 per tube
1500 per reel
42 per tube
42 per tube
750 per reel
X
X
6N138
6N139
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
no option SO-8
HCPL-0700 -500E
HCPL-0701 -060E
-560E
#500
#060
#560
SO-8
SO-8
SO-8
X
X
X
X
X
X
HCNW138 -000E
HCNW139 -300E
-500E
no option 400 mil
#300
#500
Widebody
DIP-8
X
X
X
X
X
To order, choose a part number from the part number
column and combine with the desired option from
the option column to form an order entry.
Schematic
V
CC
8
I
CC
Example 1:
I
F
6N138-560E to order product of 300 mil DIP Gull Wing
Surface Mount package in Tape and Reel packaging
with IEC/EN/DIN EN 60747-5-2 Safety Approval and
RoHS compliant.
2
+
ANODE
V
F
–
3
CATHODE
I
O
6
5
V
O
Example 2:
HCPL-0700 to order product of 300 mil DIP package in
Tube packaging and non RoHS compliant.
GND
SHIELD
I
B
Optiondatasheetsareavailable. ContactyourAvagosales
representative or authorized distributor for information.
7
V
B
Remarks: The notation ‘#XXX’ is used for existing
products, while (new) products launched since July 15,
2001 and RoHS compliant will use ‘–XXXE.’
3
Package Outline Drawings
8-Pin DIP Package (6N139/6N138)**
7.62 0.25
(0.300 0.010ꢀ
9.65 0.25
(0.380 0.010ꢀ
8
1
7
6
5
6.35 0.25
(0.250 0.010ꢀ
TYPE NUMBER
OPTION CODE*
DATE CODE
A XXXXZ
YYWW
U R
UL
2
3
4
RECOGNITION
1.78 (0.070ꢀ MAX.
1.19 (0.047ꢀ MAX.
+ 0.076
- 0.051
0.254
5° TYP.
+ 0.003ꢀ
- 0.002ꢀ
3.56 0.13
(0.140 0.005ꢀ
(0.010
4.70 (0.185ꢀ MAX.
0.51 (0.020ꢀ MIN.
2.92 (0.115ꢀ MIN.
DIMENSIONS IN MILLIMETERS AND (INCHESꢀ.
1.080 0.320
(0.043 0.013ꢀ
0.65 (0.025ꢀ MAX.
* MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
2.54 0.25
(0.100 0.010ꢀ
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 milsꢀ MAX.
**JEDEC Registered Data.
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)
LAND PATTERN RECOMMENDATION
1.016 (0.040ꢀ
9.65 0.25
(0.380 0.010ꢀ
6
5
8
1
7
6.350 0.25
(0.250 0.010ꢀ
10.9 (0.430ꢀ
2.0 (0.080ꢀ
2
3
4
1.27 (0.050ꢀ
9.65 0.25
1.780
(0.070ꢀ
MAX.
(0.380 0.010ꢀ
1.19
(0.047ꢀ
MAX.
7.62 0.25
(0.300 0.010ꢀ
+ 0.076
0.254
- 0.051
3.56 0.13
(0.140 0.005ꢀ
+ 0.003ꢀ
- 0.002ꢀ
(0.010
1.080 0.320
(0.043 0.013ꢀ
0.635 0.25
(0.025 0.010ꢀ
12° NOM.
0.635 0.130
(0.025 0.005ꢀ
2.54
(0.100ꢀ
BSC
DIMENSIONS IN MILLIMETERS (INCHESꢀ.
LEAD COPLANARITY = 0.10 mm (0.004 INCHESꢀ.
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 milsꢀ MAX.
4
Small Outline SO-8 Package (HCPL-0701/HCPL-0700)
LAND PATTERN RECOMMENDATION
8
7
6
5
5.994 0.203
(0.236 0.008ꢀ
XXX
3.937 0.127
(0.155 0.005ꢀ
YWW
TYPE NUMBER
(LAST 3 DIGITSꢀ
7.49 (0.295ꢀ
DATE CODE
1
2
3
4
PIN ONE
1.9 (0.075ꢀ
0.406 0.076
(0.016 0.003ꢀ
1.270
(0.050ꢀ
BSC
0.64 (0.025ꢀ
0.432
(0.017ꢀ
*
7°
5.080 0.127
(0.200 0.005ꢀ
45° X
3.175 0.127
(0.125 0.005ꢀ
0 ~ 7°
0.228 0.025
(0.009 0.001ꢀ
1.524
(0.060ꢀ
0.203 0.102
(0.008 0.004ꢀ
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASHꢀ
5.207 0.254 (0.205 0.010ꢀ
*
0.305
(0.012ꢀ
MIN.
DIMENSIONS IN MILLIMETERS (INCHESꢀ.
LEAD COPLANARITY = 0.10 mm (0.004 INCHESꢀ MAX.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 milsꢀ MAX.
8-Pin Widebody DIP Package (HCNW139/HCNW138)
11.ꢀꢀ
MAX.
11.23 ꢀ.15
(ꢀ.442 ꢀ.ꢀꢀ6ꢁ
(ꢀ.433ꢁ
9.ꢀꢀ ꢀ.15
(ꢀ.354 ꢀ.ꢀꢀ6ꢁ
7
6
5
8
TYPE NUMBER
DATE CODE
A
HCNWXXXX
YYWW
1
3
2
4
1ꢀ.16 (ꢀ.4ꢀꢀꢁ
TYP.
1.55
(ꢀ.ꢀ61ꢁ
MAX.
7° TYP.
+ ꢀ.ꢀ76
- ꢀ.ꢀꢀ51
ꢀ.254
+ ꢀ.ꢀꢀ3ꢁ
- ꢀ.ꢀꢀ2ꢁ
(ꢀ.ꢀ1ꢀ
5.1ꢀ
MAX.
(ꢀ.2ꢀ1ꢁ
3.1ꢀ (ꢀ.122ꢁ
3.9ꢀ (ꢀ.154ꢁ
ꢀ.51 (ꢀ.ꢀ21ꢁ MIN.
2.54 (ꢀ.1ꢀꢀꢁ
TYP.
1.8ꢀ ꢀ.15
(ꢀ.ꢀ71 ꢀ.ꢀꢀ6ꢁ
ꢀ.4ꢀ (ꢀ.ꢀ16ꢁ
ꢀ.56 (ꢀ.ꢀ22ꢁ
DIMENSIONS IN MILLIMETERS (INCHESꢁ.
NOTE: FLOATING LEAD PROTRUSION IS ꢀ.25 mm (1ꢀ milsꢁ MAX.
5
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)
11.23 0.1ꢀ
(0.442 0.00ꢁ6
LAND PATTERN RECOMMENDATION
7
ꢁ
ꢀ
8
9.00 0.1ꢀ
(0.3ꢀ4 0.00ꢁ6
13.ꢀꢁ
(0.ꢀ346
1
3
2
4
2.29
1.3
(0.096
(0.0ꢀ16
12.30 0.30
1.ꢀꢀ
(0.0ꢁ16
MAX.
(0.484 0.0126
11.00
MAX.
(0.4336
4.00
MAX.
(0.1ꢀ86
1.80 0.1ꢀ
(0.071 0.00ꢁ6
1.00 0.1ꢀ
(0.039 0.00ꢁ6
0.7ꢀ 0.2ꢀ
(0.030 0.0106
+ 0.07ꢁ
- 0.00ꢀ1
2.ꢀ4
(0.1006
BSC
0.2ꢀ4
+ 0.0036
- 0.0026
(0.010
DIMENSIONS IN MILLIMETERS (INCHES6.
7° NOM.
LEAD COPLANARITY = 0.10 mm (0.004 INCHES6.
NOTE: FLOATING LEAD PROTRUSION IS 0.2ꢀ mm (10 mils6 MAX.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C 0.5 °C/SEC.
PEAK
TEMP.
245 °C
PEAK
TEMP.
240 °C
PEAK
TEMP.
230 °C
200
100
0
2.5 C 0.5 °C/SEC.
SOLDERING
30
TIME
160 °C
150 °C
140 °C
SEC.
200 °C
30
SEC.
3 °C + 1 °C/–0.5 °C
PREHEATING TIME
150 °C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
50
100
150
200
250
TIME (SECONDS)
NOTE: NON-HALIDE FLUX SHOULD BE USED.
6
Recommended Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
tp
15 SEC.
* 260 +0/-5 °C
Tp
TL
217 °C
NOTES:
RAMP-UP
3 °C/SEC. MAX.
RAMP-DOWN
6 °C/SEC. MAX.
THE TIME FROM 25 °C to PEAK
TEMPERATURE = 8 MINUTES MAX.
150 - 200 °C
Tsmax
Tsmin
Tsmax = 200 °C, Tsmin = 150 °C
NOTE: NON-HALIDE FLUX SHOULD BE USED.
ts
tL
PREHEAT
60 to 180 SEC.
60 to 150 SEC.
* RECOMMENDED PEAK TEMPERATURE FOR
WIDEBODY 400mils PACKAGE IS 245 °C
25
t 25 °C to PEAK
TIME
Regulatory Information
The 6N139/138, HCNW139/138, and HCPL-0701/0700 have been approved by the following organizations:
UL
IEC/EN/DIN EN 60747-5-2
Recognized under UL 1577, Component Recognition
Program, File E55361.
Approved under
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01
(HCNW139/138 only)
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
Insulation and Safety Related Specifications
8-Pin DIP
Widebody
(400 Mil)
Value
(300 Mil)
Value
SO-8
Value
Parameter
Symbol
Units Conditions
Minimum External
Air Gap (External
Clearance)
L(101)
7.1
4.9
9.6
mm
mm
mm
Measured from input terminals
to output terminals, shortest
distance through air.
Minimum External
Tracking (External
Creepage)
L(102)
7.4
4.8
10.0
1.0
Measured from input terminals
to output terminals, shortest
distance path along body.
Minimum Internal
Plastic Gap
(Internal Clearance)
0.08
0.08
Through insulation distance,
conductor to conductor, usually
the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
Minimum Internal
Tracking (Internal
Creepage)
NA
200
IIIa
NA
200
IIIa
4.0
200
IIIa
mm
Measured from input terminals
to output terminals, along
internal cavity.
Tracking Resistance
(Comparative
Tracking Index)
CTI
Volts
DIN IEC 112/VDE 0303 Part 1
Isolation Group
Material Group
(DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
7
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW139 and HCNW138)
Description
Symbol
Characteristic
Units
Installation Classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤600 V rms
I-IV
I-III
for rated mains voltage ≤1000 V rms
Climatic Classification
55/100/21
2
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
Input to Output Test Voltage, Method b*
V
1414
Vpeak
Vpeak
IORM
,
VPR = 1.875 x VIORM 100% Production Test with tP = 1 sec,
VPR
2652
2121
8000
Partial Discharge < 5 pC
Input to Output Test Voltage, Method a*
,
VPR = 1.5 x VIORM Type and Sample Test,
VPR
Vpeak
tP = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec)
VIOTM
Vpeak
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 11, Thermal Derating curve.)
Case Temperature
TS
175
400
700
°C
Current (Input Current IF, PS = 0)
Output Power
IS,INPUT
PS,OUTPUT
mA
mW
> 109
Ω
,
Insulation Resistance at TS V = 500 V
RS
IO
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN 60747-5-2, for a
detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in applica-
tion.
8
Absolute Maximum Ratings* (No Derating Required up to 85°C)
Parameter
Symbol
Min.
-55
Max.
125
85
Units
°C
Storage Temperature
TS
Operating Temperature**
Average Forward Input Current
Peak Forward Input Current
(50% Duty Cycle, 1 ms Pulse Width)
Peak Transient Input Current
(<1 µs Pulse Width, 300 pps)
Reverse Input Voltage
T
-40
°C
A
IF(AVG)
IFPK
20
mA
mA
40
IF(TRAN)
VR
1.0
A
5
3
V
V
HCNW139/138
Input Power Dissipation
Output Current (Pin 6)
PI
IO
35
60
0.5
mW
mA
V
Emitter Base Reverse Voltage (Pin 5-7)
VEB
Supply Voltage and Output Voltage
(6N139, HCPL-0701, HCNW139)
Supply Voltage and Output Voltage
(6N138, HCPL-0700, HCNW138)
Output Power Dissipation
V
-0.5
-0.5
18
7
V
V
CC
V
CC
PO
PT
100
135
mW
mW
Total Power Dissipation
Lead Solder Temperature (for Through Hole Devices)
HCNW139/138
260°C for 10 sec., 1.6 mm below seating plane
260°C for 10 sec., up to seating plane
See Package Outline Drawings section
Reflow Temperature Profile
(for SOIC-8 and Option #300)
*JEDEC Registered Data for 6N139 and 6N138.
**0°C to 70°C on JEDEC Registration.
Recommended Operating Conditions
Parameter
Symbol
Min.
4.5
0.5
0
Max.
18
Units
Power Supply Voltage
Forward Input Current (ON)
Forward Input Voltage (OFF)
Operating Temperature
V
V
mA
V
CC
IF(ON)
12.0
0.8
VF(OFF)
T
0
70
°C
A
9
Electrical Specifications
0°C ≤ T ≤ 70°C, 4.5 V ≤ V ≤ 18 V, 0.5 mA ≤ IF(ON) ≤ 12 mA, 0 V ≤ VF(OFF) ≤ 0.8 V, unless otherwise specified.
A
CC
All Typicals at T = 25°C. See Note 7.
A
Parameter
Sym.
Device
Min. Typ.** Max. Units
Test ConditionsFig.
Note
Current Transfer
Ratio
CTR
6N139
HCPL-0701
400* 2000 5000
%
IF = 0.5 mA
V = 4.5
VO = 0.4 V
2, 3
1, 2,
4
CC
HCNW139
400
4500
6N139
500* 1600 2600
IF = 1.6 mA
HCPL-0701
HCNW139
500
300
200
3000
1600
850
IF = 5.0 mA
IF = 12 mA
IF = 1.6 mA
6N138
300* 1600 2600
HCPL-0700
HCNW138
1500
Logic Low Output
Voltage
V
OL
6N139
HCPL-0701
HCNW139
0.1
0.4
V
IF = 0.5 mA,
IO = 2 mA
VCC = 4.5
1
2
IF = 1.6 mA,
IO = 8 mA
IF = 5.0 mA,
IO = 15 mA
0.2
0.1
IF = 12 mA,
IO = 24 mA
IF = 1.6 mA,
IO = 4.8 mA
6N138
HCPL-0700
HCNW138
Logic High
Output Current
IOH
6N139
HCPL-0701
HCNW139
6N138
HCPL-0700
HCNW138
6N138/139
HCPL-0701/
0700
HCNW139
HCNW138
6N138/139
HCPL-0701/
0700
HCNW139
HCNW138
0.05
0.1
100
250
1.5
µA
V = V = 18V
IF = 0 mA
2
O
CC
V = V = 7 V
O
CC
Logic Low Supply
Current
ICCL
0.4
mA
µA
V
IF = 1.6 mA, V = Open,
10
2
2
O
V = 18 V
CC
0.5
2
Logic High
Supply Current
ICCH
0.01
10
IF = 0 mA, VO = Open,
V = 18 V
CC
1
Input Forward
Voltage
V
F
6N138
6N139
HCPL-0701
HCPL-0700
HCNW139
HCNW138
1.25
1.0
1.40
1.45
1.7*
1.75
T = 25°C
A
IF = 1.6 mA
4, 8
1.85
1.95
T = 25°C
A
0.95
5.0*
3.0
Input Reverse
BVR
V
IR = 10 µA, T = 25°C
A
HCNW139
HCNW138
IR = 100 µA, T = 25°C
A
Breakdown Voltage
Temperature
∆V
F
-1.8
mV/°C IF = 1.6 mA
8
Coefficient of
Forward Voltage
∆T
A
Input
Capacitance
CIN
60
90
pF
f = 1 MHz, VF = 0 V
HCNW139
HCNW138
*JEDEC Registered Data for 6N139 and 6N138.
**All typical values at T = 25°C and VCC = 5 V, unless otherwise noted.
A
10
Switching Specifications (AC)
Over recommended operating conditions (TA = 0 to 70°C), VCC = 5 V, unless otherwise specified.
Parameter
Sym.
Device
Min. Typ.**
Max.
TA =25°C
25*
Units Test Conditions
Fig.
Note
Propagation
Delay Time
to Logic Low
at Output
tPHL
6N139
HCPL-0701
HCNW139
6N139
5
30
2
µs
µs
IF = 0.5 mA,
5, 6,
7, 9,
12
2, 4
Rl = 4.7 kΩ
0.2
1*
10*
60*
7*
IF = 12 mA,
HCPL-0701
HCNW139
6N138
Rl = 270 Ω
11
15
1.6
µs
IF = 1.6 mA,
HCPL-0700
HCNW138
6N139
Rl = 2.2 kΩ
11
90
Propagation
Delay Time
tPLH
18
µs
IF = 0.5 mA,
5, 6,
7, 9,
12
2, 4
HCPL-0701
HCNW139
6N139
Rl = 4.7 kΩ
to Logic High
at Output
115
10
2
10
µs
IF = 12 mA,
HCPL-0701
HCNW139
6N138
Rl = 270 Ω
11
50
35*
µs
IF = 1.6 mA,
HCPL-0700
HCNW138
Rl = 2.2 kΩ
70
Common Mode
Transient
|CMH|
|CML|
1000 10000
V/µs
IF = 0 mA,
TA = 25°C
Rl = 2.2 kΩ
|VCM| = 10
Vp-p
13
13
5, 6
5, 6
Immunity at
Logic High
Output
Common Mode
Transient
1000 10000
V/µs
IF = 1.6 mA,
TA = 25°C
Rl = 2.2 kΩ
|VCM| = 10
Vp-p
Immunity at
Logic Low
Output
*JEDEC Registered Data for 6N139 and 6N138.
**All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.
11
Package Characteristics
Parameter
Sym.
Min.
Typ.**
Max.
Units
Test Conditions
Fig.
Note
Input-Output Momentary
Withstand Voltage†
Option 020
V
ISO
3750
V rms
RH < 50%, t = 1 min.,
3, 8
T = 25°C
A
5000
3, 9
HCNW139
HCNW138
Resistance (Input-Output)
RI-O
CI-O
1012
0.6
Ω
VI-O = 500 Vdc
RH < 45%
3
3
Capacitance (Input-Output)
pF
f = 1 MHz
**All typicals at TA = 25°C, unless otherwise noted.
†TheInput-OutputMomentaryWithstandVoltageisadielectricvoltageratingthatshouldnotbeinterpretedasaninput-outputcontinuousvoltagerating.
For the continuous voltage rating refer to the IEC/EN/DIN EN 60747-5-2 Insulation Characteristics Table (if applicable), your equipment level safety
specification or Avago Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage.”
Notes:
1. DC CURRENT TRANSFER RATIO (CTR) is defined as the ratio of output collector current, IO, to the forward LED input current, IF, times 100%.
2. Pin 7 Open.
3. Device considered a two-terminal device. Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.
4. Use of a resistor between pin 5 and 7 will decrease gain and delay time. Significant reduction in overall gain can occur when using resistor values
below 47 kΩ. For more information, please contact your local Avago Components representative.
5. Common mode transient immunity in a Logic High level is the maximum tolerable (positive) dVCM/dt of the common mode pulse, VCM, to assure
that the output will remain in a Logic High state (i.e., VO > 2.0 V). Common mode transient immunity in a Logic Low level is the maximum tolerable
(negative) dVCM/dt of the common mode pulse, V , to assure that the output will remain in a Logic Low state (i.e., VO <0.8 V).
CM
6. In applications where dV/dt may exceed 50,000 V/µs (such as static discharge) a series resistor, RCC, should be included to protect the
detector IC from destructively high surge currents. The recommended value is RCC = 220 Ω.
7. Use of a 0.1 µF bypass capacitor connected between pins 8 and 5 adjacent to the device is recommended.
8. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage 4500 V rms for 1 second (leakage detection
current limit, II-O < 5 µA). This test is performed before the 100% production test shown in the IEC/EN/DIN EN 60747-5-2 Insulation Related Char-
acteristics Table, if applicable.
9. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage > 6000 V rms for 1 second (leakage detection
current limit, II-O < 5 µA). This test is performed before the 100% production test for partial discharge (method b) shown in the IEC/EN/DIN EN
60747-5-2 Insulation Related Characteristics Table, if applicable.
12
5.0 mA
4.5 mA
4.0 mA
85°C
50
25
0
2000
1600
1200
800
100
10
70°C
25°C
70°C
-40°C
T
= 85° C
A
1.0
T
= 70° C
= 25° C
= 0° C
A
A
A
A
T
T
T
0.5 mA
V
V
O
= 5 V
= 0.4 V
0.1
CC
400
0
V
T
A
= 5 V
= 25° C
= -40° C
CC
0.01
0.01
0
1.0
– OUTPUT VOLTAGE – V
2.0
0.1
1.0
10
0.1
1
10
V
O
I
– INPUT DIODE FORWARD CURRENT – mA
I
– FORWARD CURRENT – mA
F
F
Figure 1. 6N138/6N139 DC transfer character-
istics
Figure 2. Current transfer ratio vs. forward
current 6N138/6N139
Figure 3. 6N138/6N139 output current vs. input
diode forward current
40
24
1000
I
I
R
= 0.5 mA
I
R
= 1.6 mA
F
F
F
35
30
25
20
15
10
= 4.7 kΩ
21
18
15
12
9
= 2.2 kΩ
L
L
+
100
1/f = 50 µs
t
t
1/f = 50 µs
t
PLH
PLH
V
F
–
10
T
T
= 85°C
= 70°C
A
A
1.0
0.1
T
T
T
= 25°C
= 0°C
6
A
A
A
PHL
0.01
0.001
t
PHL
3
0
5
0
= -40°C
-60 -40 -20
0
20 40 60 80 100
-60 -40 -20
0
20 40 60 80 100
1.1
1.2
1.3
1.4
1.5
1.6
V
– FORWARD VOLTAGE – V
T
– TEMPERATURE – °C
F
T
– TEMPERATURE – °C
A
A
Figure 4. Input diode forward current vs.
forward voltage
Figure 5. Propagation delay vs. temperature
Figure 6. Propagation delay vs. temperature
4
1.6
I
R
= 12 mA
F
100
= 270 kΩ
I = 1.6 mA
F
L
T
= 25° C
A
1/f = 50 µs
t
PLH
t
f
3
2
1.5
1.4
t
r
10
1
0
1.3
1.2
I
– ADJUSTED FOR V
= 2 V
OL
t
F
PHL
1
0.1
-60 -40 -20
0
20 40 60 80 100
1.0
10
-60
-40
-20
0
20 40
60 80 100
R
– LOAD RESISTANCE – kΩ
L
T
– TEMPERATURE – °C
T
– TEMPERATURE – °C
A
A
Figure 7. Propagation delay vs. temperature
Figure 8. Forward voltage vs. temperature
Figure 9. Nonsaturated rise and fall times vs.
load resistance
13
WIDEBODY
(mWꢀ
0.8
0.7
0.6
0.5
0.4
0.3
0.2
1000
P
S
900
800
700
600
500
400
300
200
I
(mAꢀ
S
V
= 18 V
CC
V
= 5 V
CC
0.1
0
100
0
0
25
50 75 100 125 150 175
0
2
4
6
8
10 12 14 16
T
– CASE TEMPERATURE – °C
S
I
– FORWARD CURRENT
F
Figure 10. Logic low supply current vs. forward current
Figure 11. Thermal derating curve, dependence of safety limiting value
with case temperature per IEC/EN/DIN EN 60747-5-2
I
F
I
PULSE
GEN.
F
0
8
7
6
5
+5 V
1
2
3
4
Z
t
= 50 Ω
O
r
5 V
V
= 5 ns
O
R
L
10% DUTY CYCLE
I/f < 100 µs
(SATURATED
RESPONSEꢀ
1.5 V
1.5 V
V
O
V
OL
0.1 µF
I
MONITOR
F
t
t
PHL
PLH
C
= 15 pF*
L
R
M
5 V
* INCLUDES PROBE AND
FIXTURE CAPACITANCE
V
O
90%
10%
90%
10%
(NON-SATURATED
RESPONSEꢀ
t
f
t
r
Figure 12. Switching test circuit
R
(SEE NOTE 6ꢀ
CC
I
F
t , t = 16 ns
8
7
6
5
1
2
3
4
+5 V
r
f
10 V
90% 90%
V
CM
B
A
0 V
10%
10%
R
L
t
r
t
f
V
O
V
5 V
V
O
V
FF
SWITCH AT A: I = 0 mA
F
V
V
+
O
CM
OL
–
SWITCH AT B: I = 1.6 mA
F
PULSE GEN.
Figure 13. Test circuit for transient immunity and typical waveforms
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0543EN
AV02-1359EN - January 28, 2010
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