HDSM-501A [AVAGO]
Smart/Normal 7 Seg Numeric LED Display, Red, 14.22mm, PLASTIC, SMT, 10 PIN;
| 型号： | HDSM-501A |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Smart/Normal 7 Seg Numeric LED Display, Red, 14.22mm, PLASTIC, SMT, 10 PIN 光电 显示器 |
| 文件： | 总11页 (文件大小：107K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HDSM-40xx Series/HDSM-50xx Series
Surface MountSeven-SegmentDisplays
DataSheet
Description
Features
This revolutionary package and patent-pending design
transforms the seven-segment LED display into a
surface-mount device. Its low profile and ability to be
reflow soldered multiple times allows SMT
manufacturers to directly incorporate LED displays.
• Three colors available: HER, AlGaAs, and Green
• Industry standard character
– 10.16 mm (0.40 in.)
– 14.22 mm (0.56 in.)
• Operating temperature range of –40 to +85°C
• Gray face paint
– Gray package gives optimumcontrast and matches
well with neutral density filters
Applications
• Suitable for indoor and outdoor use
• Excellent character appearance
– Evenly lighted segments
– Wide viewing angle
• Typical applications include appliances, channel indi-
cators or TV, CATV, set-top boxes, converters, game
machines, point of sale terminals, and stock display
panels
• Design flexibility
– Common anode or common cathode
• Categorized for luminous intensity; green categorized
for color
• Designed for low current operation
– AlGaAs
• Packaged in tape and reel for SMT manufacturing
• ICS compatible
• Mechanically rugged
Device Selection Guide
AlGaAs
Internal
Red
HDSM-
HER
HDSM-
Green
HDSM-
Circuit
Diagram
Package
Drawing
Description
401A
403A
501A
503A
401E
403E
501E
503E
401G
403G
501G
503G
10.16 mm Common Anode
10.16 mm Common Cathode
14.22 mm Common Anode
14.22 Common Cathode
A
B
A
B
A
A
B
B
Package Dimensions
5.59
(0.220)
1.27
(0.050)
TERMINAL 10
10°
COUNTRY OF ORIGIN
LUMINOUS INTENSITY
CATEGORY
10.16
(0.400)
12.90
(0.508)
15.75 MAX.
(0.620 MAX.)
DATE CODE
1.17 ± 0.05
(0.046 ± 0.002)
TERMINAL 1
2.02
(0.080)
9.75 MAX.
(0.384 MAX.)
a
f
b
g
4.00
(0.157)
e
c
DP
d
0.56
(0.022)
1.95
(0.077)
A
7.80
(0.307)
1.27
(0.050)
TERMINAL 10
10°
COUNTRY OF ORIGIN
LUMINOUS INTENSITY
CATEGORY
17.02
(0.670)
14.22
(0.56)
19.75 MAX.
(0.778 MAX.)
DATE CODE
1.60 ± 0.05
(0.063 ± 0.002)
TERMINAL 1
2.02
(0.080)
12.75 MAX.
(0.502 MAX.)
a
f
b
g
4.00
(0.157)
e
c
0.56
(0.022)
DP
d
2.54
(0.100)
B
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25 mm.
2
Internal Circuit Diagram
10
9
8
7
6
10
9
8
7
6
a
a
COMMON ANODE
FUNCTION
COMMON CATHODE
FUNCTION
PIN
PIN
f
b
f
b
1
2
3
4
5
6
7
8
9
CATHODE e
1
2
ANODE e
CATHODE d
ANODE d
g
g
COMMON ANODE
CATHODE c
3
COMMON CATHODE
ANODE c
4
CATHODE DP
CATHODE b
5
ANODE DP
ANODE b
e
e
1
c
c
6
CATHODE a
7
ANODE a
COMMON ANODE
CATHODE f
8
COMMON CATHODE
ANODE f
d
d
DP
DP
9
10 CATHODE g
10
ANODE g
2
3
4
5
1
2
3
4
5
COMMON ANODE
COMMON CATHODE
Absolute Maximum Ratings at T = 25˚ C
A
HER
HDSM-
XXXG
Green
HDSM-
XXXG
AlGaAs
HDSM-
XXXA
Parameter
Symbol
Units
Power Dissipated per
Segment or DP
P
65
65
50
mW
D
Peak Forward Current
per Segment or DP
(1/ 10 Duty Cycle, 0.1 ms
pulse width)
I
120
120
90
mA
PEAK
[1]
[2]
[3]
DC Forward Current
per Segment or DP
I
20
20
10
mA
V
F
Reverse Voltage per
Segment or DP
V
5
5
5
R
Operating Temperature
Storage Temperature
LED Junction Temperature
Soldering Temperature
Notes:
T
–40to+85
–40to+85
110
–40to+85
–40to+85
110
–40to+85
–40to+85
110
˚C
˚C
˚C
O
T
S
T
J
See IR soldering profile (Figure 10)
1. Derate above 70˚C at 0.40 mA/ ˚C (see Figure 1).
2. Derate above 66˚C at 0.37 mA/ ˚C (see Figure 4).
3. Derate above 72˚C at 0.42 mA/ ˚C (see Figure 7).
3
Optical/ Electrical Characteristics at T = 25˚C
A
High Efficiency Red
Devices
Test
HDSM-
Parameter
Symbol
Min.
Typ.
Max. Units
Conditions
40XE
Luminous Intensity/ Segment
(Segment Average)
I
V
1250
2000
2000
3200
µcd
I = 10 mA
F
[1, 2]
50XE
Forward Voltage/ Segment or DP
Peak Wavelength
V
2.05
628
619
2.60
100
V
I = 20 mA
F
F
λ
λ
nm
nm
µA
I = 20 mA
F
PEAK
d
[3]
Dominant Wavelength
I = 20 mA
F
ALL
Reverse Current/ Segment
I
R
V = 5 V
R
[4]
or DP
Temperature Coefficient of
∆V / °C
–2
mV/ °C
F
V / Segment or DP
F
Thermal Resistance LED
Junction-to-PCB
Rθ
345
°C/ W/ Seg
J–PCB
[5]
Green
Devices
HDSM-
Test
Conditions
Parameter
Symbol
Min.
Typ.
Max. Units
40XG
50XG
Luminous Intensity/ Segment
(Segment Average)
I
V
2000
3200
3200
5000
µcd
I = 10 mA
F
[1, 2]
Forward Voltage/ Segment or DP
Peak Wavelength
V
2.25
566
573
2.60
100
V
I = 20 mA
F
F
λ
λ
nm
nm
µA
I = 20 mA
F
PEAK
d
[3]
Dominant Wavelength
I = 20 mA
F
ALL
Reverse Current/ Segment
I
R
V = 5 V
R
[4]
or DP
Temperature Coefficient of
∆V / °C
–2
mV/ °C
F
V / Segment or DP
F
Thermal Resistance LED
Junction-to-PCB
Rθ
345
°C/ W/ Seg
J–PCB
[5]
AlGaAs Red
Devices
HDSM-
Test
Conditions
Parameter
Symbol
Min.
Typ.
Max. Units
Luminous Intensity/ Segment
(Segment Average)
I
V
1250
2000
2000
3200
µcd
I = 5 mA
F
40XA
50XA
[1, 2]
Forward Voltage/ Segment or DP
Peak Wavelength
V
1.82
654
644
2.00
100
V
I = 20 mA
F
F
λ
λ
nm
nm
µA
I = 20 mA
F
PEAK
d
[3]
Dominant Wavelength
I = 20 mA
F
ALL
Reverse Current/ Segment
I
R
V = 5 V
R
[4]
or DP
Temperature Coefficient of
∆V / °C
–2
mV/ °C
F
V / Segment or DP
F
Thermal Resistance LED
Junction-to-PCB
Rθ
460
°C/ W/ Seg
J–PCB
[5]
Notes:
1. Case temperature of the device immediately prior to the intensity measurement is 25˚C.
2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.
3. The dominant wavelength, , is derived from the CIE Chromaticity Diagram and represents the single wavelength which defines the color of the device.
d
4. Typical specification for reference only. Do not exceed absolute maximum ratings.
5. Reference PCB is the substrate FR4 which acts as the LED chip carriers.
4
Luminous Intensity Bin Limits
Luminous Intensity Iv
(µcd) @ I = 5 mA
F
Part Number
Bin
J
Min.
1250
2000
2000
3200
Max.
2000
3200
3200
5050
HDSM-40xA
K
K
L
HDSM-50xA
Luminous Intensity Iv
(µcd) @ I = 10 mA
F
Part Number
Bin
K
L
Min.
2000
3200
3200
5050
1250
2000
2000
3200
Max.
HDSM-40xG
3200
5050
5050
8000
2000
3200
3200
5050
HDSM-50xG
HDSM-40xE
HDSM-50xE
L
M
J
K
K
L
Tolerance of the bin sorting is ± 10%.
5
HER
120
100
80
3.0
2.5
2.0
1.5
1.0
24
22
20
18
16
14
12
10
8
Rθ
= 600°C/W
J-A
Rθ
= 770°C/W
J-A
60
40
6
20
0
4
2
0
0.5
0
1
1.5
V – FORWARD VOLTAGE – V
F
2.0
2.5
3.0
50 55 60 65 70 75 80 85 90 95 100
0
5
10
15
20
25
T
– AMBIENT TEMPERATURE – °C
I
– FORWARD CURRENT PER SEGMENT – mA
A
F
Figure 1. Maximum allowable DC current vs.
ambient temperature.
Figure 2. Forward current vs. forward voltage
characteristics.
Figure 3. Relative luminous intensity vs. DC
forward current.
Green
120
100
80
3.0
2.5
2.0
1.5
1.0
24
22
Rθ
= 600°C/W
20
18
16
14
12
10
8
J-A
Rθ
= 770°C/W
J-A
60
40
6
4
2
0
20
0
0.5
0
1
1.5
2.0
2.5
3.0
3.5
50 55 60 65 70 75 80 85 90 95 100
0
5
10
15
20
25
T
– AMBIENT TEMPERATURE – °C
V
– FORWARD VOLTAGE – V
I
– FORWARD CURRENT PER SEGMENT – mA
A
F
F
Figure 4. Maximum allowable DC current vs.
ambient temperature.
Figure 5. Forward current vs. forward voltage
characteristics.
Figure 6. Relative luminous intensity vs. DC
forward current.
AlGaAs
12
120
100
80
3.0
2.5
2.0
1.5
1.0
10
8
Rθ
= 1200°C/W
J-A
6
4
2
0
60
40
20
0
0.5
0
0
20
40
60
80
100
1
1.5
2.0
2.5
0
5
10
15
20
25
T
– AMBIENT TEMPERATURE – °C
V
– FORWARD VOLTAGE – V
I
– FORWARD CURRENT PER SEGMENT – mA
A
F
F
Figure 7. Maximum allowable DC current vs.
ambient temperature.
Figure 8. Forward current vs. forward voltage
characteristics.
Figure 9. Relative luminous intensity vs. DC
forward current.
6
Infrared Reflow Profile
10 SEC. MAX.
230°C MAX.
120-150°C
3°C/SEC. MAX.
6°C/SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
Figure 10. Recommended reflow soldering profile.
Land Pattern
1.2
(0.047)
1.95
(0.077)
1.2
(0.047)
2.54
(0.10)
CENTERING
BOARD
CENTERING
BOARD
10.5 MIN. 16.7 MAX.
(0.413) (0.657)
14.6 MIN. 20.7 MAX.
(0.575)
(0.815)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. STENCIL THICKNESS OF 8 MILS IS RECOMMENDED.
3. ON A BOARD CONTAINING FINE PITCH COMPONENTS, A MULTI-LEVEL OR STEP STENCIL SHOULD BE USED.
Figure 11. Recommended land pattern for 0.4” package.
Figure 12. Recommended land pattern for 0.56” package.
7
Tape and Reel Packing
A
2.30
262.00
320.00
120°
110
90
100.00
330.00
RECYCLE SYMBOL
DETAIL X
2.30
R 6.75
10.75
NOTES:
1. MATERIAL OF THE PLASTIC REEL IS ESD-SAFE ABS MATERIAL.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. UNLESS OTHERWISE STATED,TOLERANCES ARE ±0.25 mm.
PACKAGE
0.4"
24.5
0.56"
32.5
A ± 0.1 mm
Figure 13. Reel dimensions for 0.4” and 0.56” packages.
8
16.00
(0.630)
2.00
(0.079)
4.00
(0.157)
1.50 (0.059)
1.50 ± 0.25
1.20
(0.047)
4.43
(0.174)
0.35
(0.014)
(0.059)
11.50
(0.453)
24.00 ± 0.30
(0.945 ± 0.012)
8° MAX.
5° MAX.
+0.10
–0.00
+0.10
–0.00
10.00
(0.394)
16.00
(0.630)
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 14. Tape dimensions for 0.4” package.
16.00
(0.630)
2.00(0.079)
1.50 (0.059)
1.75
(0.069)
4.00
(0.157)
2.00 (0.079)
4.43
(0.174)
0.35
(0.014)
14.20
(0.559)
32.00 ± 0.30
(1.260 ± 0.012)
5° MAX.
8° MAX.
+0.10
+0.10
13.00
20.00
–0.00
–0.00
(0.512)
(0.787)
NOTE:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 15. Tape dimensions for 0.56” package.
9
USER FEED DIRECTION
END
START
THERE SHALL BE A
MINIMUM OF 160 mm OF
EMPTY COMPONENT
PACKETS SEALED WITH
COVER TAPE
MOUNTED WITH COMPONENTS THERE SHALL BE A
MINIMUM OF 160 mm OF
MINIMUM OF
230 mm MAY
CONSIST OF
CARRIER AND/OR
COVER TAPE
EMPTY COMPONENT
PACKETS SEALED WITH
COVER TAPE
USER FEED DIRECTION
Electrical/ Optical
For more information on
electrical/optical characteristics,
please see Application Note 1005.
Contrast Enhancement
For information on contrast
enhancement, please see
Application Note 1015.
Soldering/ Cleaning
DECIMAL POINT (DP)
Cleaning agents from the ketone
family (acetone, methyl ethyl
ketone, etc.) and from the
chlorinated hydrocarbon family
(methylene chloride,
tricholoethylene, carbon
tetrachloride, etc.) are not
recommended for cleaning LED
parts. All of these various
solvents attack or dissolve the
encapsulating epoxies used to
form the package of plastic LED
parts.
PRINTED LABEL
Figure 16. Tape orientation.
For information on reflow
soldering the SMT S4, please
refer to Application Note 1060.
10
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.
5988-1955EN April 10, 2006
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