HFBR-5984LZ [AVAGO]

FIBER OPTIC TRANSCEIVER, 1280-1380nm, 200Mbps(Tx), 200Mbps(Rx), BOARD/PANEL MOUNT, LC CONNECTOR, ROHS COMPLIANT PACKAGE-10;
HFBR-5984LZ
型号: HFBR-5984LZ
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

FIBER OPTIC TRANSCEIVER, 1280-1380nm, 200Mbps(Tx), 200Mbps(Rx), BOARD/PANEL MOUNT, LC CONNECTOR, ROHS COMPLIANT PACKAGE-10

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HFBR-5984LZ  
RoHS Compliant, 200 MBd Low-Cost SBCON Transceivers in  
2 x 5 SFF Package Style  
Data Sheet  
Description  
Features  
Fully RoHS Compliant  
Multisourced 2 x 5 SFF package style with LC  
receptacle  
Single +3.3 V power supply  
Wave solder and aqueous wash process  
compatibility  
The HFBR-5984LZ transceiver from Avago  
Technologies provides the system designer with  
a product to implement the SBCON specification  
and to be compatible with IBM ESCON  
architecture.  
This transceiver is supplied in the industry  
standard 2 x 5 SFF with an LC fiber connector  
interface.  
Manufactured in an ISO 9001 certified facility  
SBCON 200 MBd specification  
Transmitter Sections  
Applications  
®
Interconnection with IBM compatible processors,  
The transmitter section of the HFBR-5984LZ  
utilizes a 1300 nm InGaAsP LED. This LED is  
packaged in the optical subassembly portion of  
the transmitter section. It is driven by a custom  
silicon IC which converts differential PECL  
logic signals, ECL referenced (shifted) to a +3.3  
V supply, into an analog LED drive current.  
directors and channel attachment units  
– Disk and tape drives  
– Communication controllers  
Data communication equipment  
– Local area networks  
– Point-to-point communication  
Receiver Sections  
The receiver section of the HFBR-5984LZ  
utilizes an InGaAs PIN photodiode coupled to  
a custom silicon transimpedance preamplifier  
IC. It is packaged in the optical subassembly  
portion of the receiver.  
This PIN/preamplifier combination is coupled  
to a custom quantizer IC which provides the  
final pulse shaping for the logic output and the  
Signal Detect function. The Data output is  
differential. The Signal Detect output is single-  
ended. Both Data and Signal Detect outputs are  
PECL compatible, ECL referenced (shifted) to a  
+3.3 V power supply. The receiver outputs, Data  
Out and Data Out Bar, are squelched at Signal  
Detect Deassert.  
Package  
The overall package concept for the Avago The electrical subassembly consists of a high  
Technologies transceiver consists of three basic volume multilayer printed circuit board on  
elements; the two optical subassemblies, an which the ICs and various surface-mounted  
electrical subassembly, and the housing as passive circuit elements are attached.  
illustrated in the block diagram in Figure 1.  
Both the receiver and transmitter sections  
The package outline drawing and pin out are include an internal shield for the electrical and  
shown in Figures 2 and 5. The details of this optical subassemblies to ensure high immunity  
package outline and pin out are compliant with to external EMI fields.  
the multisource definition of the 2 x 5 SFF. The  
The solder posts of the Avago Technologies  
lowprofileoftheAvagoTechnologies transceiver  
design are isolated from the internal circuit of  
design complies with the maximum height  
the transceiver.  
allowed for the LC connector over the entire  
length of the package.  
The transceiver is attached to a printed circuit  
board with the ten signal pins and the two  
solder posts which exit the bottom of the  
housing. The two solder posts provide the  
primary mechanical strength to withstand the  
loads imposed on the transceiver by mating  
with the LC connectored fiber cables.  
The optical subassemblies utilize a high-volume  
assembly process together with low-cost lens  
elementswhichresultinacost-effectivebuilding  
block.  
RX SUPPLY  
DATA OUT  
QUANTIZER IC  
DATA OUT  
PIN PHOTODIODE  
PRE-AMPLIFIER  
SUBASSEMBLY  
RX GROUND  
SIGNAL  
DETECT  
LC  
RECEPTACLE  
T GROUND  
X
LED  
DATA IN  
OPTICAL  
SUBASSEMBLY  
LED DRIVER IC  
DATA IN  
T SUPPLY  
X
Figure 1. Block Diagram.  
2
RX  
TX  
Mounting  
Studs/Solder  
Posts  
Top  
View  
o
o
o
o
o
RECEIVER SIGNAL GROUND  
RECEIVER POWER SUPPLY  
SIGNAL DETECT  
RECEIVER DATA OUT BAR  
RECEIVER DATA OUT  
o
o
o
o
o
1
2
3
4
5
10  
9
8
7
6
TRANSMITTER DATA IN BAR  
TRANSMITTER DATA IN  
TRANSMITTER DISABLE (LASER BASED PRODUCTS ONLY)  
TRANSMITTER SIGNAL GROUND  
TRANSMITTER POWER SUPPLY  
Figure 2. Pin Out Diagram.  
Pin Descriptions:  
Pin 6 Transmitter Power Supply  
V
TX:  
CC  
Pin 1 Receiver Signal Ground V RX:  
EE  
Provide +3.3 V dc via the recommended  
transmitter power supply filter circuit. Locate  
the power supply filter circuit as close as  
Directly connect this pin to the receiver ground  
plane.  
possible to the V  
TX pin.  
CC  
Pin 2 Receiver Power Supply V RX:  
CC  
Pin 7 Transmitter Signal Ground  
TX:  
Provide +3.3 V dc via the recommended receiver  
power supply filter circuit. Locate the power  
supply filter circuit as close as possible to the  
V
EE  
Directly connect this pin to the transmitter  
ground plane.  
V
RX pin.  
CC  
Pin 3 Signal Detect SD:  
Pin 8 Transmitter Disable T  
:
DIS  
Normal optical input levels to the receiver  
result in a logic “1” output.  
No internal connection. Optional feature for  
laser based products only.  
Low optical input levels to the receiver result  
in a fault condition indicated by a logic “0”  
output.  
Pin 9 Transmitter Data In TD+:  
No internal terminations are provided. See  
recommended circuit schematic.  
This Signal Detect output can be used to drive  
a PECL input on an upstream circuit, such as  
Signal Detect input or Loss of Signal-bar.  
Pin 10 Transmitter Data In Bar TD-:  
No internal terminations are provided. See  
recommended circuit schematic.  
Pin 4 Receiver Data Out Bar RD-:  
No internal terminations are provided. See  
recommended circuit schematic.  
Mounting Studs/Solder Posts  
The mounting studs are provided for transceiver  
mechanical attachment to the circuit board. It  
is recommended that the holes in the circuit  
board be connected to chassis ground.  
Pin 5 Receiver Data Out RD+:  
No internal terminations are provided. See  
recommended circuit schematic.  
3
Application Information  
these technologies in the industry. The industry  
convention is 1.5 dB aging for 1300 nm LEDs.  
The Applications Engineering group is available  
to assist you with the technical understanding The 1300 nm Avago Technologies LEDs are  
and design trade-offs associated with these specified to experience less than 1 dB of aging  
transceivers. You can contact them through over normal commercial equipment mission life  
your Avago Technologies sales representative. periods. Contact your Avago Technologies sales  
representative for additional details.  
The following information is provided to answer  
some of the most common questions about the  
use of these parts.  
Recommended Handling Precautions  
Avago Technologies recommends that normal  
static precautions be taken in the handling and  
assembly of these transceivers to prevent  
damage which may be induced by electrostatic  
discharge (ESD). The HFBR-5984LZ series of  
transceivers meet MIL-STD-883C Method 3015.4  
Class 2 products.  
Transceiver Optical Power Budget versus Link Length  
Optical Power Budget (OPB) is the available  
optical power for a fiber optic link to  
accommodate fiber cable losses plus losses due  
to in-line connectors, splices, optical switches,  
and to provide margin for link aging and  
unplanned losses due to cable plant  
reconfiguration or repair.  
Care should be used to avoid shorting the  
receiver data or signal detect outputs directly  
to ground without proper current limiting  
impedance.  
AvagoTechnologiesLEDtechnologyhasproduced  
1300 nm LED devices with lower aging  
characteristics than normally associated with  
PHY DEVICE  
VCC (+3.3 V)  
TERMINATE AT  
TRANSCEIVER INPUTS  
Z = 50  
Z = 50 Ω  
TD-  
LVPECL  
100 Ω  
TD+  
130 Ω  
130 Ω  
10  
9
8
7
6
VCC (+3.3 V)  
1 µH  
10 µF  
TX  
C2  
C3  
VCC (+3.3 V)  
RX  
1 µH  
C1  
RD+  
RD-  
1
2
3
4
5
Z = 50 Ω  
100 Ω  
LVPECL  
Z = 50 Ω  
Z = 50 Ω  
V
CC (+3.3 V)  
130 Ω  
130 Ω  
130 Ω  
82 Ω  
SD  
TERMINATE AT  
DEVICE INPUTS  
Note: C1 = C2 = C3 = 10 nF or 100 nF  
Figure 3. Recommended Decoupling and Termination Circuits  
4
Solder and Wash Process Compatibility  
Board Layout - Decoupling Circuit, Ground Planes  
and Termination Circuits  
The transceivers are delivered with protective  
process plugs inserted into the LC receptacle. It is important to take care in the layout of your  
This process plug protects the optical circuit board to achieve optimum performance  
subassemblies during wave solder and aqueous from these transceivers. Figure 4 provides a  
wash processing and acts as a dust cover during good example of a schematic for a power supply  
shipping.  
decoupling circuit that works well with these  
parts.Itisfurtherrecommendedthatacontiguous  
ground plane be provided in the circuit board  
directly under the transceiver to provide a low  
inductance ground for signal return current.  
This recommendation is in keeping with good  
high frequency board layout practices. Figures  
3 and 4 show two recommended termination  
schemes.  
These transceivers are compatible with either  
industrystandardwaveorhandsolderprocesses.  
Shipping Container  
The transceiver is packaged in a shipping  
containerdesignedtoprotectitfrommechanical  
and ESD damage during shipment or storage.  
TERMINATE AT  
TRANSCEIVER INPUTS  
PHY DEVICE  
VCC (+3.3 V)  
VCC (+3.3 V)  
10 nF  
130  
130 Ω  
Z = 50 Ω  
TD-  
LVPECL  
Z = 50 Ω  
TD+  
82 Ω  
82 Ω  
10  
9
8
7
6
VCC (+3.3 V)  
VCC (+3.3 V)  
1 µH  
C2  
TX  
V
CC (+3.3 V)  
10 nF  
10 µF  
C3  
RX  
130 Ω  
130 Ω  
RD+  
RD-  
1 µH  
C1  
1
2
3
4
5
LVPECL  
Z = 50 Ω  
VCC (+3.3 V)  
10 nF  
Z = 50 Ω  
Z = 50 Ω  
82 Ω  
82 Ω  
130 Ω  
SD  
82 Ω  
TERMINATE AT DEVICE INPUTS  
Note: C1 = C2 = C3 = 10 nF or 100 nF  
Figure 4. Alternative Termination Circuits  
5
Board Layout - Hole Pattern  
Board Layout - Art Work  
The Avago Technologies transceiver complies The Applications Engineering group has  
with the circuit board “Common Transceiver developed a Gerber file artwork for a multilayer  
Footprint” hole pattern defined in the original printed circuit board layout incorporating the  
multisource announcement which defined the 2 recommendations above. Contact your local  
x 5 SFF package style. This drawing is repro- Avago Technologies sales representative for  
duced in Figure 6 with the addition of ANSI details.  
Y14.5M compliant dimensioning to be used as  
a guide in the mechanical layout of your circuit  
board. Figure 6 illustrates the recommended  
panel opening and the position of the circuit  
board with respect to this panel.  
Figure 5. Package Outline Drawing  
6
Figure 6. Recommended Board Layout Hole Pattern and Panel Opening  
Electrostatic Discharge (ESD)  
There are two design cases in which immunity The second case to consider is static discharges  
to ESD damage is important.  
to the exterior of the equipment chassis con-  
taining the transceiver parts. To the extent that  
the LC connector is exposed to the outside of  
the equipment chassis it may be subject to  
whatever ESD system level test criteria that the  
equipment is intended to meet.  
Thefirstcaseisduringhandlingofthetransceiver  
prior to mounting it on the circuit board. It is  
important to use normal ESD handling  
precautions for ESD sensitive devices. These  
pre-cautions include using grounded wrist  
straps, work benches, and floor mats in ESD  
controlled areas.  
7
Regulatory Compliance  
Transceiver Reliability and Performance  
Qualification Data  
These transceiver products are intended to  
enable commercial system designers to develop The 2 x 5 SFF transceivers have passed Avago  
equipment that complies with the various Technologies reliability and performance  
international regulations governing certifica- qualification testing and are undergoing ongoing  
tion of Information Technology Equipment. See quality and reliability monitoring. Details are  
the Regulatory Compliance Table for details. available from your Avago Technologies sales  
Additional information is available from your representative.  
Avago Technologies sales representative.  
These transceivers are manufactured at the  
Avago Technologies Singapore location which is  
an ISO 9001 certified facility.  
Electromagnetic Interference (EMI)  
Most equipment designs utilizing this high  
Ordering Information  
speed transceiver from Avago Technologies will  
be required to meet the requirements of FCC in  
the United States, CENELEC EN55022 (CISPR  
22) in Europe and VCCI in Japan.  
The HFBR-5984LZ 1300 nm product is available  
for production orders through the Avago  
Technologies Component There are two design  
cases in which immunity to Field Sales Offices  
and Authorized Distributors world wide.  
This product is suitable for use in designs  
ranging from a desktop computer with a single  
transceiver to a concentrator or switch product  
with a large number of transceivers.  
Fortechnicalinformationregardingthisproduct,  
please visit Avago Technologies website at  
www.avagotech.com.Usethequicksearchfeature  
to search for this part number. You may also  
contact Avago Technologies Customer Response  
Center.  
Immunity  
Equipment utilizing these transceivers will be  
subjecttoradio-frequencyelectromagneticfields  
in some environments. These transceivers have  
a high immunity to such fields.  
Applications Support Materials  
Contact your local Avago Technologies  
Component Field Sales Office for information  
on how to obtain PCB layouts and evaluation  
boards for the 2 x 5 SFF transceivers.  
For additional information regarding EMI,  
susceptibility, ESD and conducted noise testing  
procedures and results. Refer to Application  
Note 1166 Minimizing Radiated Emissions of  
High-Speed Data Communications Systems.  
Regulatory Compliance Table  
Feature  
Test Method  
Performance  
Electrostatic Discharge  
JEDEC/EIA  
Meets Class 2 (2000 to 3999 Volts).  
(ESD) to the Electrical Pins  
JESD22-A114-A and  
MIL-STD-883 Method 3015  
(Human Body Model)  
Variation of  
Withstand up to 3000 V applied between electrical pins.  
Electrostatic Discharge  
(ESD) to the LC Receptacle  
Typically withstand at least 25 kV without damage when the LC Connector  
Receptacle is contacted by a Human Body Model probe.  
IEC 61000-4-2  
Electromagnetic  
Interference (EMI)  
FCC Class B  
CENELEC CEN55022 VCCI  
Class 2  
Transceivers typically provide a 10 dB margin to the noted standard limits  
when tested at a certified test range with the transceiver mounted to a  
circuit card without a chassis enclosure.  
Immunity  
Variation of  
IEC 61000-4-3  
Typically show no measurable effect from a 10 V/m field swept from 80 to  
450 MHz applied to the transceiver when mounted to a circuit card without  
a chassis enclosure.  
Eye Safety  
AEL Class 1  
EN60825-1 (+A11)  
Compliant per Avago Technologies testing under single fault conditions.  
TUV Certification #: E9771332-13  
UL File #: E173874  
8
Absolute Maximum Ratings  
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to  
each parameter in isolation, all other parameters having values within the recommended operating conditions. It  
should not be assumed that limiting values of more than one parameter can be applied to the product at the same time.  
Exposure to the absolute maximum ratings for extended periods can adversely affect device reliability.  
Parameter  
Symbol  
Minimum  
Typical  
Maximum Unit  
Reference  
Storage Temperature  
TS  
-40  
+100  
+260  
10  
°C  
°C  
Sec.  
V
Lead Soldering Temperature  
Lead Soldering Time  
Supply Voltage  
TSOLD  
tSOLD  
VCC  
VI  
-0.5  
-0.5  
3.6  
Data Input Voltage  
Differential Input Voltage  
Output Current  
VCC  
V
VD  
2.0  
V
Note 1  
IO  
50  
mA  
Recommended Operating Conditions  
Parameter  
Symbol  
Minimum  
Typical  
Maximum Unit  
Reference  
Case Operating Temperature  
TC  
-20  
+85  
°C  
Supply Voltage  
VCC  
2.97  
3.63  
V
Data Input Voltage - Low  
Data Input Voltage - High  
Data and Signal Detect Output Load  
VIL - VCC  
VIH - VCC  
RL  
-1.81  
-1.165  
-1.475  
-0.880  
V
V
W
50  
Note 2  
PCB Assembly Process Compatibility  
Parameter  
Symbol  
Minimum  
Typical  
Maximum Unit  
Reference  
Hand Lead Soldering  
Temperature  
Time  
tsolder  
ttime  
+260  
10  
°C  
sec  
Wave Soldering and Aqueous Wash  
Temperature  
Time  
tsolder  
ttime  
+260  
10  
110  
°C  
sec  
psi  
1
1
Aqueous Wash Pressure  
Transmitter Electrical Characteristics  
(T = -20°C to +85°C, V = 2.97 V to 3.63 V)  
C
CC  
Parameter  
Symbol  
Minimum  
Typical  
Maximum Unit  
Reference  
Supply Current  
ICC  
133  
175  
mA  
Note 3  
Power Dissipation  
PDISS  
IIL  
0.45  
-2  
0.64  
W
Note 4  
Data Input Current - Low  
Data Input Current - High  
-350  
µA  
µA  
IIH  
18  
350  
9
Receiver Electrical Characteristics  
(T = -20°C to +85°C, V = 2.97 V to 3.63 V)  
C
CC  
Parameter  
Symbol  
Minimum  
Typical  
Maximum Unit  
Reference  
Supply Current  
ICC  
65  
125  
mA  
W
V
Note 5  
Power Dissipation  
PDISS  
0.25  
0.46  
-1.62  
-0.86  
1.3  
Note 4  
Note 6  
Note 6  
Note 7  
Note 7  
Note 6  
Note 6  
Note 7  
Note 7  
Data Output Voltage - Low  
Data Output Voltage - High  
Data Output Rise Time  
Data Output Fall Time  
VOL - VCC  
-1.86  
-1.10  
0.35  
0.35  
-1.86  
-1.10  
0.35  
0.35  
VOH - VCC  
V
tr  
ns  
ns  
V
tf  
1.3  
Signal Detect Output Voltage - Low  
Signal Detect Output Voltage - High  
Signal Detect Output Rise Time  
Signal Detect Output Fall Time  
VOL - VCC  
-1.62  
-0.86  
2.2  
VOH - VCC  
V
tr  
tf  
ns  
ns  
2.2  
Transmitter Optical Characteristics  
(T = -20°C to +85°C, V = 2.97 V to 3.63 V)  
C
CC  
Parameter  
Symbol  
Minimum  
Typical  
Maximum Unit  
Reference  
Output Optical Power  
62.5/125 µm, NA = 0.275 Fiber EOL  
BOL  
PO  
-19.5  
-20.5  
-16.0  
-16.0  
-14.0  
-14.0  
dBm avg.  
Note 8  
Optical Extinction Ratio  
Center Wavelength  
8
dB  
nm  
nm  
Note 9  
lc  
1280  
1380  
175  
Figure 7  
Spectral Width - FWHM  
Dl  
147  
1
Note 10  
Figure 7  
Note 11, 12  
Figure 7  
Note 11, 12  
Figure 7  
Optical Rise Time  
Optical Fall Time  
Total Jitter  
tr  
1.7  
1.7  
0.8  
ns  
ns  
ns  
tf  
1.2  
0.2  
Tj  
Note 13  
Receiver Optical Characteristics  
(T = -20°C to +85°C, V = 2.97 V to 3.63 V)  
C
CC  
Parameter  
Symbol  
Minimum  
Typical  
Maximum Unit  
Reference  
Input Optical Power  
Minimum at Window Edge  
PIN Min. (W)  
Pin Min (C)  
+1 dB  
dBm avg.  
Note 14  
Figure 8  
Input Optical Power  
Minimum at Eye Center  
PIN Min. (C)  
-29  
dBm avg.  
Note 15  
Figure 8  
Input Optical Power Maximum  
Operating Wavelength  
Systematic Jitter  
PIN Max.  
-14  
dBm avg.  
nm  
Note 14  
l
1280  
1380  
1.0  
SJ  
0.2  
ns  
Note 16  
Note 17  
Note 18  
Note 19  
Eyewidth  
tew  
1.4  
-44.5  
-45  
0.5  
0
ns  
Signal Detect - Asserted  
Signal Detect - Deasserted  
Signal Detect - Hysteresis  
PA  
-35.5  
-36  
dBm avg.  
dBm avg.  
dB  
PD  
PA - PD  
tA  
4.0  
Signal Detect Assert Time  
(off to on)  
500  
µs  
Note 20  
Note 21  
Signal Detect Deassert Time  
(on to off)  
tD  
0
500  
µs  
10  
Notes:  
1. This is the maximum voltage that can be applied across the Differential  
Transmitter Data Inputs to prevent damage to the input ESD protection  
circuit.  
14. Thisspecificationisintendedtoindicatetheperformanceofthereceiver  
sectionofthetransceiverwhenInputOpticalPowersignalcharacteristics  
arepresentperthefollowingconditions.TheInputOpticalPowerdynamic  
rangefromtheminimumlevel(withawindowtime-width)tothemaximum  
2. The outputs are terminated with 50 W connected to V –2 V.  
CC  
3. The power supply current needed to operate the transmitter is provided  
to differential ECL circuitry. This circuitry maintains a nearly constant  
current flow from the power supply. Constant current operation helps  
to prevent unwanted electrical noise from being generated and  
conducted or emitted to neighboring circuitry.  
levelistherangeoverwhichthereceiverisguaranteedtoprovideoutput  
–12  
data with a Bit Error Ratio (BER) better than or equal to 10  
.
At the Beginning of Life (BOL).  
Over the specified operating temperature and voltage ranges.  
Receiver data window time-width is 1.4 ns or greater and centered at  
4. The power dissipation value is the power dissipated in the receiver  
itself. Power dissipation is calculated as the sum of the products of  
supply voltage and currents, minus the sum of the products of the  
output voltages and currents.  
mid-symbol.  
Input signal is 200 MBd, Pseudo Random-Bit-Stream 2 –1 data  
pattern.  
7
Transmitter cross-talk effects have been included in Receiver  
5. Thisvalueismeasuredwiththeoutputsterminatedinto50Wconnected  
sensitivity. Transmitter should be running at 50% duty cycle (nominal)  
between 8 - 200 Mb/s, while Receiver sensitivity  
is measured.  
to V –2 V and an Input Optical Power Level of –14.5 dBm average.  
CC  
6. This value is measured with respect to V with the output terminated  
CC  
into 50 W connected to V –2 V.  
15. All conditions of note 14 apply except that the measurement is made at  
CC  
7. The output rise time and fall times are measured between 20% and 80%  
the center of the symbol with no window time-width and with a BER  
-15  
levels with the output connected to V – 2 V through 50 W.  
better than or equal to 10  
.
CC  
8. These optical power values are measured with the following conditions:  
16. The receiver systematic jitter specification applies to optical powers  
between –14.5 dBm avg. to –27.0 dBm avg. at the receiver. Receiver  
Systematic Jitter is equal to the sum of Duty Cycle Distortion (DCD) and  
DataDependentJitter(DDJ).DCDisequivalenttoPulse-WidthDistortion  
(PWD). Systematic Jitter is measured at the 50% signal level with 200  
The Beginning of Life (BOL) to the End of Life (EOL) optical power  
degradation is assumed to be 1.5 dB per the industry convention for  
long wavelength LEDs. The actual degradation observed in normal  
commercial environments will be <1.0 dB with Avago Technologies  
1300 nm LED products.  
7
MBd, PRBS 2 –1 electrical output data pattern.  
Over the specified operating voltage and temperature ranges.  
Input Signal: 1010 data pattern, 200 Mb/s NRZ code.  
17. Eye-width specified defines the minimum clock time-position range,  
centered around the center of the 5 ns baud interval, at which the BER  
–12  
7
must be 10 or better. Test data pattern is PRBS 2 –1. The typical  
change in input optical power to open the eye to 1.4 nsec from a closed  
eye is less than 1.0 dB.  
200  
3.0  
180  
18. Status Flag switching thresholds:  
HFBR-5930 TRANSMITTER  
TEST RESULTS  
OF λC, ∆λ AND tr/f ARE  
1.0  
1.5  
Direction of decreasing optical power:  
If Power >–36.0 dBm avg., then SF = 1 (high)  
If Power <–45.0 dBm avg., then SF = 0 (low)  
Direction of increasing optical power:  
If Power <–45.5 dBm avg., then SF = 0 (low)  
If Power >–35.5 dBm avg., then SF = 1 (high)  
160  
140  
120  
100  
CORRELATED AND  
COMPLY WITH THE  
ALLOWED SPECTRAL  
WIDTH AS A FUNCTION  
OF CENTER WAVELENGTH  
FOR VARIOUS RISE AND  
FALL TIMES.  
2.0  
tr/f – TRANSMITTER  
OUTPUT OPTICAL  
RISE/FALL TIMES –  
2.5  
3.0  
ns  
19. Status Flag Hysteresis is the difference in low-to-high and high-to-low  
switching thresholds. Thresholds must lie within optical power limits  
specified. TheHysteresisisdesiredtoavoidStatusFlagchatterwhenthe  
optical input is near the threshold.  
1260  
1280  
1300  
1320  
1340  
1360  
λ
C – TRANSMITTER OUTPUT OPTICAL RISE/FALL TIMES – ns  
20. The Status Flag output shall be asserted within 500 µs after a step  
increase of the Input Optical Power. The step will be from a low Input  
Optical Power <–45.5 dBm avg., to >–35.5 dBm avg.  
21. Status Flag output shall be de-asserted within 500 µs after a step  
decrease in the Input Optical Power. The Step will be  
from a high Input Optical Power >–36.0 dBm avg. to <–45.0 dBm avg.  
Figure 7. Transmitter Output Optical Spectral Width (FWHM) vs.  
Transmitter Output Optical Center Wavelength and Rise/Fall Times.  
9. The Extinction Ratio is a measure of the modulation depth of the optical  
signal. The data “0” output optical power is compared to the data “1”  
peak output optical and expressed in decibels. With the transmitter  
driven by a HALT Line State (12.5 Mhz square-wave) signal, the average  
opticalpowerismeasured. Thedata1peakpoweristhencalculatedby  
adding 3 dB to the measured average optical power. The data “0” output  
optical power is found by measuring the optical power when the  
transmitter is driven by a logic “0” input. The Extinction Ratio is the ratio  
of the optical power at the “0” level compared to the optical power at the  
“1” level expressed in decibels.  
6
CONDITIONS:  
1. T = +25 C  
A
5
2. V  
= 3.3 V dc  
CC  
3. INPUT OPTICAL RISE  
/FALL TIMES = 1.0/1.2 ns.  
4. INPUT OPTICAL POWER  
IS NORMALIZED TO  
4
3
2
1
0
CENTER OF DATA SYMBOL.  
5. NOTE 15 AND 16 APPLY.  
10. From an assumed Gaussian-shaped wavelength distribution, the  
relationship between FWHM and RMS values for Spectral Width is 2.35  
x RMS = FWHM.  
11. Inputconditions:100MHz, squarewavesignal, inputvoltagesareinthe  
range specified for V and V  
IL  
IH .  
-3  
-2  
-1  
0
1
2
3
12. Measured with electrical input signal rise and fall time of 0.35 to 1.3 ns  
(20-80%) at the transmitter input pins. Optical output rise and fall times  
are measured between 20% and 80% levels.  
EYE SAMPLING TIME POSITION (ns)  
Figure 8. Relative Input Optical Power vs. Eye Sampling Time Position.  
13. TransmitterSystematicJitterisequaltothesumofDutyCycleDistortion  
(DCD) and Data Dependent Jitter (DDJ). DCD is equivalent to Pulse-  
WidthDistortion(PWD). SystematicJitterismeasuredatthe50%signal  
7
level with 200 MBd, PRBS 2 –1 electrical input data pattern.  
11  
For product information and a complete list of distributors, please go to our web site: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte. in the United States and other countries.  
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.  
5989-4732EN - February 1, 2006  

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