HLMP-1503-C00A1 [AVAGO]
T-1 SINGLE COLOR LED, HIGH PERFORMANCE GREEN, 3mm, PLASTIC PACKAGE-2;
| 型号： | HLMP-1503-C00A1 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1 SINGLE COLOR LED, HIGH PERFORMANCE GREEN, 3mm, PLASTIC PACKAGE-2 光电 |
| 文件： | 总13页 (文件大小：1357K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-1301, HLMP-1401, HLMP-1503,
HLMP-K401, HLMP-K600
T-1 (3 mm) Diffused LED Lamps
Data Sheet
Description
Features
This family of T-1 lamps is widely used in general-purpose •ꢀ ꢀHigh intensity
indicator applications. Diffusants, tints, and optical design
•ꢀ ꢀChoice of 4 bright colors:
are balanced to yield superior light output and wide view-
ing angles. Several intensity choices are available in each
color for increased design flexibility.
– High Efficiency Red
– Orange
– Yellow
– High Performance Green
•ꢀ ꢀPopular T-1 diameter package
•ꢀ ꢀSelected minimum intensities
•ꢀ ꢀWide viewing angle
•ꢀ ꢀGeneral purpose leads
•ꢀ ꢀReliable and rugged
•ꢀ ꢀAvailable on tape and reel
Package Dimensions
1.14 (.045)
0.51 (.020)
2.79 (.110)
2.29 (.090)
24.1(.95) MIN.
CATHODE
1.52 (.060)
1.02 (.040)
3.43 (.135)
2.92 (.115)
0.65 (0.026) max.
3.17 (.125)
2.67 (.105)
∅
(0.022) 0.55
(0.016) 0.40
SQ. TYP.
4.70 (.185)
4.19 (.165)
6.35 (.250)
5.58 (.220)
Notes:
1. All dimensions are in mm (inches).
2. An epoxy meniscus may extend about 1 mm (0.040") down the leads.
3. For PCB hole recommendations, see the Precautions section.
Selection Guide
Luminous Intensity Iv (mcd) at 10 mA
Material
Color
Part Number
Min.
3.4
3.4
5.4
8.6
8.6
2.2
3.6
5.7
5.7
5.7
2.1
3.4
3.4
5.4
1.0
2.6
4.2
4.2
4.2
1.0
Max.
–
GaAsP on GaP
Red
HLMP-1301
HLMP-1301-E00xx
HLMP-1301-FG0xx
HLMP-1301-G00xx
HLMP-1301-GH0xx
HLMP-1401
–
17.2
–
27.6
–
Yellow
HLMP-1401-D00xx
HLMP-1401-E00xx
HLMP-1401-EF0xx
HLMP-1401-EFBxx
HLMP-K401
–
–
18.4
18.4
–
Orange
Green
HLMP-K401-E00xx
HLMP-K401-EF0xx
HLMP-K401-FGDxx
HLMP-1503
–
10.8
17.2
–
GaP
HLMP-1503-C00xx
HLMP-1503-D00xx
HLMP-1503-DE0xx
HLMP-1503-DEDxx
HLMP-K600
–
–
13.4
13.4
–
Emerald Green[1]
Note:
1. Please refer to Application Note 1061 for information comparing standard green and emerald green light output degradation.…
2
Part Numbering System
HLMP – X X XX - X X X XX
Mechanical Option
00: Bulk
01: Tape & Reel, Crimped Leads
02, Bx: Tape & Reel, Straight Leads
A1: Right Angle Housing, Uneven Leads
A2: Right Angle Housing, Even Leads
Dx, EE: Ammo Pack, Straight Leads
R4: Tape & Reel, Counter Clockwise
Vx: Ammo Pack, Horizontal Leads
FG: Products need inventory control for Customer IDI
Color Bin Options
0: Full Color Bin Distribution
B: Color Bins 2 & 3 only
D: Color Bins 4 & 5 only
Maximum Iv Bin Options
0: Open (no max. limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Color Options
3: GaP HER
4: GaP Yellow (except K4xx Series)
5: GaP Green
6: GaP Emerald Green
Package Options
1: T-1 (3 mm)
K: T-1 (3 mm) Orange (K4xx) or Emerald Green (K6xx)
3
Absolute Maximum Ratings at T = 25 °C
A
Parameter
HER/Orange
Yellow
Green
Units
mA
mA
mA
V
Peak Forward Current
90
60
90
Average Forward Current[1]
DC Current[2]
25
20
25
30
20
30
Reverse Voltage (IR = 100 μA)
Transient Forward Current[4] (10 μsec Pulse)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
5
5
5
500
500
500
mA
°C
110
110
110
-40 to +100
-40 to +100
-40 to +100
-40 to +100
-20 to +100
-40 to +100
°C
°C
Notes:
1. See Figure 5 (HER/Orange), 10 (Yellow), or 15 (Green/Emerald Green) to establish pulsed operating conditions.
2. For Red, Orange, and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C.
3. For Red, Orange, and Green series derate power linearly from 25°C at 1.8 mW/°C. For Yellow series derate power linearly from 50°C at 1.6 mW/°C.
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maximum
Ratings.
4
Electrical Characteristics at T = 25 °C
A
Symbol
Description
Device HLMP-
Min.
Typ.
Max.
Units
Test Conditions
2θ1/2
Included Angle Between Half
Luminous Intensity Points
All
60
Deg.
IF = 10 mA
See Note 1
lPEAK
Peak Wavelength
High Efficiency Red
Orange
635
600
583
565
558
626
602
585
569
560
40
nm
Measurement at Peak
Yellow
Green
Emerald Green
High Efficiency Red
Orange
ld
Dominant Wavelength
nm
See Note 2
Yellow
Green
Emerald Green
High Efficiency Red
Yellow
Dl1/2
Spectral Line Halfwidth
Speed of Response
nm
ns
36
Green
28
Emerald Green
High Efficiency Red
Orange
24
ts
90
280
90
Yellow
Green
500
3100
11
Emerald Green
High Efficiency Red
Orange
C
Capacitance
pF
VF = 0;
4
f = 1 MHz
Yellow
15
Green
18
Emerald Green
All
35
RθJ-PIN
Thermal Resistance
Forward Voltage
290
°C/W
V
Junction to Cathode
Lead
VF
HER/Orange
Yellow
1.5
1.5
1.5
1.9
2.0
2.1
2.1
2.4
2.4
2.7
2.7
IF = 10 mA
Green
Emerald Green
All
VR
Reverse Breakdown Voltage
Luminous Efficacy
5.0
V
IR = 100 μA
hV
High Efficiency Red
Orange
145
380
500
595
655
lumens See Note 3
watt
Yellow
Green
Emerald Green
Notes:
1. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
2. The dominant wavelength, l , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the
d
device.
3. Radiant intensity, l , in watts/steradian, may be found from the equation I = I /h , where I is the luminous intensity in candelas and hv is the
e
e
v
v
v
luminous efficacy in lumens/watt.
5
1.0
0.5
0
EMERALD GREEN
ORANGE
AlGaAs RED
T = 25° C
A
HIGH
PERFORMANCE
GREEN
HIGH EFFICIENCY RED
YELLOW
500
550
600
650
WAVELENGTH – nm
700
750
Figure 1. Relative intensity vs. wavelength
T-1 High Efficiency Red, Orange Diffused Lamps
Figure 2. Forward current vs. forward voltage
characteristics
Figure 3. Relative luminous intensity vs. DC
forward current
Figure 4. Relative efficiency (luminous intensity
per unit current) vs. peak LED current
Figure 5. Maximum tolerable peak current vs.
pulse duration. (IDC MAX as per MAX ratings)
Figure 6. Relative luminous intensity vs. angular displacement
6
T-1 Yellow Diffused Lamps
Figure 7. Forward current vs. forward voltage
characteristics
Figure 8. Relative luminous intensity vs. forward
current
Figure 9. Relative efficiency (luminous intensity
per unit current) vs. peak current
Figure 10. Maximum tolerable peak current vs.
pulse duration. (IDC MAX as per MAX ratings)
Figure 11. Relative luminous intensity vs. angular displacement
7
T-1 Green/Emerald Green Diffused Lamps
Figure 12. Forward current vs. forward voltage
characteristics
Figure 13. Relative luminous intensity vs.
forward current
Figure 14. Relative efficiency (luminous intensi-
ty per unit vurrent) vs. peak LED current
Figure 16. Relative luminous intensity vs. angular displacement
Figure 15. Maximum tolerable peak current vs.
pulse duration. (IDC MAX as per MAX ratings)
8
Intensity Bin Limits
Color
Intensity Range (mcd)
Bin
D
E
Min.
Max.
2.4
3.8
3.8
6.1
F
6.1
9.7
G
H
I
9.7
15.5
15.5
24.8
24.8
39.6
J
39.6
63.4
K
L
63.4
101.5
162.4
234.6
340.0
540.0
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
30900.0
4.0
101.5
162.4
234.6
340.0
540.0
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
2.5
M
N
O
P
Red/Orange
Q
R
S
T
U
V
W
X
Y
Z
C
D
E
4.0
6.5
6.5
10.3
F
10.3
16.6
G
H
I
16.6
26.5
26.5
42.3
42.3
67.7
J
67.7
108.2
173.2
250.0
360.0
510.0
800.0
1250.0
1800.0
2900.0
4700.0
7200.0
11700.0
18000.0
27000.0
K
L
108.2
173.2
250.0
360.0
510.0
800.0
1250.0
1800.0
2900.0
4700.0
7200.0
11700.0
18000.0
Yellow
M
N
O
P
Q
R
S
T
U
V
W
9
Intensity Bin Limits, continued
Intensity Range (mcd)
Max.
Color
Bin
A
B
Min.
1.1
1.8
1.8
2.9
C
D
E
2.9
4.7
4.7
7.6
7.6
12.0
F
12.0
19.1
G
H
I
19.1
30.7
30.7
49.1
49.1
78.5
J
78.5
125.7
Green/
K
125.7
201.1
289.0
417.0
680.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
201.1
Emerald Green
L
289.0
M
N
O
P
417.0
680.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
40000.0
Q
R
S
T
U
V
W
Maximum tolerance for each bin limit is 18ꢀ.
10
Color Categories
Lambda (nm)
Max.
C olor
Category #
Min.
9
8
7
6
6
5
4
3
2
1
3
2
4
5
1
2
3
4
5
6
7
522.5
555.5
558.5
561.5
561.5
564.5
567.5
570.5
573.5
582.0
584.5
587.0
589.5
592.0
597.0
599.5
602.0
604.5
607.5
610.5
613.5
555.5
558.5
561.5
564.5
564.5
567.5
570.5
573.5
576.5
584.5
587.0
589.5
592.0
593.0
599.5
602.0
604.5
607.5
610.5
613.5
616.5
Emerald Green
Green
Yellow
Orange
8
616.5
619.5
Tolerance for each bin limit is 0.5 nm.
11
Mechanical Option Matrix
Mechanical Option Code
Definition
00
01
02
A1
A2
BG
BJ
Bulk Packaging, minimum increment 500 pcs/bag
Tape & Reel, crimped leads, minimum increment 1800 pcs/bag
Tape & Reel, straight leads, minimum increment 1800 pcs/bag
Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
Right Angle Housing, even leads, minimum increment 500 pcs/bag
Tape & Reel, straight leads in 2K increment
Tape & Reel, straight leads in 2K increment
DD
DJ
EE
Ammo Pack, straight leads in 2K increment
Ammo Pack, straight leads in 2K increment
Ammo Pack, straight leads in 5K increment
R4
VA
VB
FG
Tape & Reel, straight leads, counter clockwise, anode lead leaving the reel first
Ammo Pack, horizontal leads in 2K increment
Ammo Pack, horizontal leads in 2K increment
Inventory Control for Customer IDI
Note: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago
representative for further clarification or information.
12
Precautions
Lead Forming
• The wave soldering parameter must be set and
maintained according to the recommended
temperature and dwell time in the solder wave.
Customer is advised to periodically check the soldering
profile to ensure the soldering profile used always
conforms to recommended soldering condition.
• The leads of an LED lamp may be preformed or cut to
length before they are inserted and soldered into the
PC board.
• If forming a lead is required before it is soldered, then
take care to avoid any excessive mechanical stress
induced to the LED package. Otherwise, cut the LED
leads to length after soldering at room temperature.
The solder joint formed will absorb the mechanical
stress of the lead cutting from traveling to the LED chip
die attach and wirebond.
• If necessary, use a fixture during soldering process to
hold the LED component in the proper orientation
with respect to the PCB.
• Proper handling is a must to avoid excessive thermal
stresses to LED components when heated. Therefore,
the soldered PCB must be allowed to cool to room
temperature, 25 °C, before handling.
• It is recommended that tooling be made precisely and
the leads cut to length, rather than relying on your
hand.
Soldering Conditions
• Care must be taken during PCB assembly and soldering
• To ensure solderability, pay special attention to board
fabrication, solder masking, surface plating and lead
hole size and component orientation.
process to prevent damage to LED component.
• Here are the recommended PC board plated through-
• The closest an LED is allowed to be soldered on board is
1.59 mm below the body (encapsulant epoxy) for those
parts without standoff.
hole sizes for LED component leads:
LED Component
Lead Size
Diagonal
Plated Through-
Hole Diameter
• Recommended soldering conditions:
Wave Soldering Manual Solder Dipping
Lead size (typ.) 0.45 × 0.45 mm
(0.018 × 0.018 in.)
0.636 mm
(0.025 in)
0.98 to 1.08 mm
(0.039 to 0.043 in)
Pre-heat Temperature 105 °C Max.
–
Pre-heat Time
Peak Temperature
Dwell Time
30 sec Max.
250 °C Max.
3 sec Max.
–
Dambar shear- 0.65 mm
off area (max.) (0.026 in)
0.919 mm
(0.036 in)
260 °C Max.
5 sec Max.
Lead size (typ.) 0.50 × 0.50 mm
(0.020 × 0.020 in.)
0.707 mm
(0.028 in)
1.05 to 1.15 mm
(0.041 to 0.045 in)
Dambar shear- 0.70 mm
off area (max.) (0.028 in)
0.99 mm
(0.039 in)
Note: Refer to application note AN1027 for more information on
soldering LED components.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
BOTTOM SIDE
OF PC BOARD
250
200
150
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
FLUXING
100
50
30
SOLDER: SN63; FLUX: RMA
PREHEAT
20 30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
0
10
40
50
60
70
80
90 100
TIME – SECONDS
Figure 17. Recommended wave soldering profile
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes 5989-4252EN
AV02-1555EN - August 22, 2013
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