HLMP-1540-H00VR [AVAGO]
T-1 SINGLE COLOR LED, GREEN, 3mm, PLASTIC PACKAGE-2;
| 型号： | HLMP-1540-H00VR |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1 SINGLE COLOR LED, GREEN, 3mm, PLASTIC PACKAGE-2 光电 |
| 文件： | 总12页 (文件大小：788K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-3707, HLMP-3907, HLMP-3750, HLMP-3850,
HLMP-3950, HLMP-3960, HLMP-3390, HLMP-3490,
HLMP-3590, HLMP-1340, HLMP-1440, HLMP-1540,
HLMP-K640
T-13/4 (5 mm), T-1 (3 mm), Ultra-Bright LED Lamps
Data Sheet
Description
Features
These non-diffused lamps out-perform conventional
LED lamps. By utilizing new higher intensity material, we
achieve superior product performance.
• Improved brightness
• Improved color performance
3
• Available in popular T-1 and T-1 / packages
4
The HLMP-3750/-3390/-1340 Series Lamps are Gallium
Arsenide Phosphide on Gallium Phosphide red light emit-
ting diodes. The HLMP-3850/-3490/-1440 Series are Gal-
lium Arsenide Phosphide on Gallium Phosphide yellow
light emitting diodes. The HLMP-3950/3590/3960/1540/
K640 Series Lamps are Gallium Phosphide green light
emitting diodes.
• New sturdy leads
• IC compatible/low current capability
• Reliable and rugged
• Choice of 3 bright colors
- High Efficiency Red
- High Brightness Yellow
- High Performance Green
Applications
• Lighted switches
• Backlighting front panels
• Light pipe sources
• Keyboard indicators
Selection Guide
Luminous Intensity Iv (mcd) @ 20mA
Device
Package
Description
Package
Outline
Color
HLMP-
Min.
90.2
90.2
90.2
96.2
96.2
96.2
111.7
111.7
111.7
111.7
170.0
111.7
35.2
37.6
43.6
35.2
13.8
35.2
23.5
23.5
27.3
27.3
43.6
4.2
Typ.
Max.
2 1/2 Degree
q
T-13/4
Red
3707-L00xx
3750
-
-
24
24
24
24
24
24
24
24
24
24
24
24
32
32
32
45
45
45
45
45
45
45
45
45
45
F
125.0
125.0
140.0
140.0
150.0
-
-
A
A
A
A
A
F
3750-L00xx
3850
-
Yellow
Green
-
3850-K00xx
3850-KL0xx
3907-K00xx
3914-K00xx
3950
-
294.0
-
-
-
D
A
A
A
E
265.0
265.0
300.0
265.0
55.0
55.0
55.0
55.0
-
-
3950-K00xx
3950-LM0xx
3960-K0xxx
3390
-
490.0
-
T-13/4 Low Profile
Red
-
B
B
B
C
C
C
C
C
C
C
C
C
C
Yellow
Green
Red
3490
-
3590
-
T-1
1340
-
1340-H00xx
1340-J00xx
1440
-
55.0
45.0
45.0
45.0
45.0
60.0
21.0
20.0
-
Yellow
Green
-
1440-H00xx
1540
-
-
1540-H00xx
1540-IJ0xx
K640
-
139.6
-
Emerald Green
K640-FGNxx
10.6
34.0
2
Package Dimensions
3.17 (.125)
2.67 (.105)
Ø
5.08 (0.200)
4.57 (0.180)
3.43 (.135)
2.92 (.115)
9.19 (0.362)
8.43 (0.332)
4.70 (.185)
4.19 (.165)
0.89 (0.035)
0.64 (0.025)
12.44 (0.490)
11.68 (0.460)
1.14 (.045)
0.51 (.020)
6.35 (.250)
5.58 (.220)
1.32 (0.052)
1.02 (0.040)
0.46 (0.018)
0.65 (0.026) max.
SQUARE NOMINAL
23.0
(0.90)
MIN.
0.46 (0.018)
SQUARE NOMINAL
24.1 (.95) min.
1.27 (0.050)
NOM.
1.52 (.060)
1.02 (.040)
6.1 (0.240)
5.6 (0.220)
CATHODE
(0.022) 0.55
(0.016) 0.40
SQ. TYP.
2.79 (.110)
2.29 (.090)
2.54 (0.100)
NOM.
PACKAGE OUTLINE "A"
HLMP-3750/3850/3950
PACKAGE OUTLINE "B"
HLMP-3390/3490/3590
PACKAGE OUTLINE "C"
HLMP-1340/1440/1540
5.08 (0.200)
4.78 (0.188)
5.08 (0.200)
4.78 (0.188)
5.08 (0.200)
4.57 (0.180)
9.07 (0.357)
8.56 (0.337)
9.07 (0.357)
8.56 (0.337)
9.19 (0.362)
8.43 (0.332)
1.02 (0.040)
MAX.
13.11 (0.516)
12.34 (0.486)
12.47 (0.491)
11.71 (0.461)
0.65
(0.026)
MAX.
0.89 (0.035)
0.64 (0.025)
0.89 (0.035)
0.64 (0.025)
0.65 (0.026) MAX.
0.89 (0.035)
0.64 (0.025)
1.02 (0.040) MAX.
EPOXY
MENISCUS
25.40
(1.00)
MIN.
1.32 (0.052)
1.02 (0.040)
23.0
MIN.
22.86 (0.900)
MIN.
CATHODE
LEAD
(NOTE 1)
(0.900)
0.53 (0.021)
0.43 (0.017)
0.46 (0.018)
SQUARE
NOM.
SQ.
0.46 (0.018)
SQUARE NOMINAL
1.52 (0.060)
1.02 (0.040)
1.52 (0.060)
1.02 (0.040)
1.27 (0.050)
NOM.
6.10 (0.240)
5.60 (0.220)
6.10 (0.240)
Ø
6.10 (0.240)
5.59 (0.220)
5.60 (0.220)
CATHODE
FLAT
CATHODE
FLAT
2.79 (0.110)
2.29 (0.090)
2.54 (0.100)
NOM.
2.54 (0.100)
NOM.
PACKAGE OUTLINE "F"
HLMP-3707/3907
PACKAGE OUTLINE "E"
HLMP-3960
PACKAGE OUTLINE "D"
HLMP-3914
Notes:
1. All dimensions are in millimeters (inches).
2. An epoxy meniscus may extend about 1 mm (0.40") down the leads.
3. For PCB hole recommendations, see the Precautions section.
3
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk
01: Tape & Reel, Crimped Leads
02, Bx: Tape & Reel, Straight Leads
A1, B1: Right Angle Housing, Uneven Leads
A2, B2: Right Angle Housing, Even Leads
Dx, Ex: Ammo Pack, Straight Leads
FH: 2 Iv Bin Select with Inventory Control
Vx: Ammo Pack, Crimped Leads
Color Bin Options
0: Full Color Bin Distribution
N: Color Bin 6 & 7 Only
Maximum Iv Bin Options
0: Open (No. Max. Limit)
Others: Please Refer to the Iv Bin Table
Minimum Iv Bin Options
Please Refer to the Iv Bin Table
Color Options
3, 7: GaP HER
4, 8: GaP Yellow (except K4xx series)
5, 9: GaP Green
6: GaP Emerald Green
Package Option
1, K: T-1 (3 mm)
3
3: T-1 / (5 mm)
4
Absolute Maximum Ratings at T = 25°C
A
Parameter
Red
90
Yellow
60
Green/Emerald Green
Units
mA
mA
mA
mA
Peak Forward Current
Average Forward Current[1]
DC Current[2]
90
25
20
25
30
20
30
Transient Forward Current[3]
(10 µs Pulse)
500
500
500
Reverse Voltage (IR = 100 µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
5
5
5
V
110
110
110
°C
°C
°C
-40 to +100
-40 to +100
-40 to +100
-40 to +100
-20 to +100
-40 to +100
Notes:
1. See Figure 2 to establish pulsed operating conditions.
2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C.
3. The transient peak current is the maximum non-recurring peak current the devices can withstand without damaging the LED die and wire bonds.
It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.
4
Electrical/Optical Characteristics at T = 25°C
A
3
T-1 /
Test
Conditions
4
3
Symbol
Description
T-1 /
Low Dome
T-1
Min.
Typ.
Max.
Units
4
λPEAK
Peak
Wavelength
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
635
583
565
558
nm
Measurement
at Peak
λd
Dominant
Wavelength
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
626
585
569
560
nm
nm
ns
Note 1
∆λ3/4
Spectral Line
Halfwidth
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
40
36
28
24
τs
Speed of
Respond
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
90
90
500
3100
C
Capacitance
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
11
15
18
35
pF
VF = 0,
f = 1 MHz
RθJ-PIN
Thermal
Resistance
37xx
38xx
39xx
3390
3490
3590
210
210
210
510
290
290
290
290
°C/W
Junction to
Cathode Lead
1340
1440
1540
K640
VF
VR
ηv
Forward
Voltage
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
1.5
1.5
1.5
1.9
2.1
2.2
2.2
2.6
2.6
3.0
3.0
V
V
IF = 20 mA
(Figure 3)
Reverse
Breakdown
Voltage
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
5.0
IF = 100 µA
Note 2
Luminous
Efficacy
37xx
38xx
39xx
3390
3490
3590
1340
1440
1540
K640
145
500
595
655
lumens
watt
Notes:
1. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the
device.
2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = IV/η , where IV is the luminous intensity in candelas and η is
V
V
the luminous efficacy in lumens/watt.
5
Red, Yellow, and Green
1.0
EMERALD GREEN
T
= 25° C
A
GREEN
HIGH EFFICIENCY RED
0.5
YELLOW
0
500
550
600
650
700
WAVELENGTH – nm
Figure 1. Relative intensity vs. wavelength.
Figure 3. Forward current vs. forward voltage.
Figure 2. Maximum tolerable peak current vs. pulse duration.
(IDC MAX as per MAX ratings).
Figure 4. Relative luminous intensity vs. forward current.
Figure 5. Relative efficiency (luminous intensity
per unit current) vs. peak current.
6
Figure 6. Relative luminous intensity vs. angular displacement.
T-13/4 lamp.
Figure 7. Relative luminous intensity vs. angular displacement.
T-13/4 low profile lamp.
Intensity Bin Limits
Intensity Range (mcd)
Color
Red
Bin
G
H
I
Min.
9.7
Max.
15.5
15.5
24.8
24.8
39.6
J
39.6
63.4
K
63.4
101.5
L
101.5
162.4
234.6
340.0
540.0
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
162.4
M
N
O
P
234.6
Figure 8. Relative luminous intensity vs. angular displacement.
T-1 lamp.
340.0
540.0
850.0
Q
R
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
30900.0
S
T
U
V
W
X
Y
Z
Maximum tolerance for each bin limit is 18ꢀ.
7
Intensity Bin Limits (continued)
Color Categories
Intensity Range (mcd)
Lambda (nm)
Min.
Color
Yellow
Bin
F
Min.
Max.
Color
Emerald Green
Cat #
9
Max.
10.3
16.6
552.5
555.5
558.5
561.5
561.5
564.5
567.5
570.5
573.5
582.0
584.5
587.0
589.5
592.0
597.0
599.5
602.0
604.5
607.5
610.5
613.5
616.5
555.5
558.5
561.5
564.5
564.5
567.5
570.5
573.5
576.5
584.5
587.0
589.5
592.0
593.0
599.5
602.0
604.5
607.5
610.5
613.5
616.5
619.5
G
H
I
16.6
26.5
8
26.5
42.3
7
42.3
67.7
6
J
67.7
108.2
173.2
250.0
360.0
510.0
800.0
1250.0
1800.0
2900.0
4700.0
7200.0
11700.0
18000.0
27000.0
1.8
Green
6
K
L
108.2
173.2
250.0
360.0
510.0
800.0
1250.0
1800.0
2900.0
4700.0
7200.0
11700.0
18000.0
1.1
5
4
M
N
O
P
3
2
Yellow
Orange
1
3
Q
R
2
4
S
5
T
1
U
V
W
A
B
C
D
E
2
3
4
Green/
Emerald
Green
5
1.8
2.9
6
2.9
4.7
7
4.7
7.6
8
7.6
12.0
Maximum tolerance for each bin limit is 0.5 nm.
F
12.0
19.1
G
H
I
19.1
30.7
30.7
49.1
49.1
78.5
J
78.5
125.7
201.1
289.0
417.0
680.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
40000.0
K
L
125.7
201.1
289.0
417.0
680.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
M
N
O
P
Q
R
S
T
U
V
W
Maximum tolerance for each bin limit is 18ꢀ.
8
Mechanical Option Matrix
Mechanical
Option Code
Definition
00
01
02
A1
A2
B1
B2
BJ
Bulk Packaging, minimum increment 500 pcs/bag
Tape & Reel, crimped leads, min. increment 1300 pcs/bag for T-13/4, 1800 pcs/bag for T-1
Tape & Reel, straight leads, min. increment 1300 pcs/bag for T-13/4, 1800 pcs/bag for T-1
T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
T-1, Right Angle Housing, even leads, minimum increment 500 psc/bag
T-13/4, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
T-13/4, Right Angle Housing, even leads, minimum increment 500 psc/bag
T-1, Tape & Reel, straight leads, minimum increment 2000 pcs/bag
Ammo Pack, straight leads in 5 K increment
EG
FH
VR
Devices that require inventory control and 2 Iv bin select
Ammo Pack, crimped leads, min. increment 2 k for T-13/4 and T-1
Note:
All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago repre-
sentative for further clarification/information.
9
Precautions:
Lead Forming:
•ꢀ Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
•ꢀ The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
•ꢀ For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
Note:
•ꢀ If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
1. PCB with different size and design (component density) will
have different heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering profile again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature
does not exceed 250°C and the solder contact time does not
exceeding 3sec. Over-stressing the LED during soldering process
might cause premature failure to the LED due to delamination.
Soldering and Handling:
•ꢀ Care must be taken during PCB assembly and soldering
•ꢀ Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
process to prevent damage to the LED component.
•ꢀ LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
•ꢀ At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
1.59 mm
•ꢀ If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
•ꢀ ESD precaution must be properly applied on the
soldering station and by personnel to prevent ESD
damage to the LED component that is ESD sensitive.
For details, refer to Avago application note AN 1142.
The soldering iron used should have a grounded tip to
ensure electrostatic charge is properly grounded.
•ꢀ Recommended PC board plated through holes (PTH)
size for LED component leads:
LED Component
Lead Size
Diagonal
Plated Through-
Hole Diameter
•ꢀ Recommended soldering conditions:
Lead size (typ.) 0.45 × 0.45 mm
(0.018 × 0.018 in.)
0.636 mm
(0.025 in)
0.98 to 1.08 mm
(0.039 to 0.043 in)
Wave
Soldering
Manual Solder
Dipping
[1],[2]
Dambar shear- 0.65 mm
off area (max.) (0.026 in)
0.919 mm
(0.036 in)
Pre-heat Temperature 105°C Max.
–
Lead size (typ.) 0.50 × 0.50 mm
(0.020 × 0.020 in.)
0.707 mm
(0.028 in)
1.05 to 1.15 mm
(0.041 to 0.045 in)
Pre-heat Time
Peak Temperature
Dwell Time
Notes:
1. These conditions refer to measurement with a thermocouple
mounted at the bottom of PCB.
2. To reduce thermal stress experienced by the LED, it is
recommended that you use only the bottom preheaters.
60 sec Max.
250°C Max.
3 sec Max.
–
260°C Max.
5 sec Max.
Dambar shear- 0.70 mm
off area (max.) (0.028 in)
0.99 mm
(0.039 in)
•ꢀ Over-sizing the PTH can lead to a twisted LED after it is
clinched. On the other hand, undersizing the PTH can
make inserting the TH LED difficult.
For more information about soldering and handling of TH
LED lamps, refer to application note AN5334.
10
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR
HOT AIR KNIFE
TURBULENT WAVE
250
Flux: Rosin ꢀux
Solder bath temperature:
200
150
100
245°C 5°C (maximum peaꢁ temperature ꢂ 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum ꢂ 3sec)
Note: Allow for board to be suꢃciently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin ꢀux
Solder bath temperature:
50
245°C 5°C (maximum peaꢁ temperature ꢂ 250°C)
PREHEAT
Dwell time: 1.5 sec – 3.0 sec (maximum ꢂ 3sec)
Note: Allow for board to be suꢃciently cooled to
room temperature before exerting mechanical force.
0
10
20
30
40
50
60
70
80
90
100
TIME (SECONDS)
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
11
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
BIN: Color Bin
Supplier Code:
DATECODE: Date Code
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. Obsoletes 5989-4254EN
AV02-1556EN - July 24, 2014
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Multi-Output Power-Supply ControllerWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9130CG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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SI9130LG-T1-E3
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9130_11
Pin-Programmable Dual Controller - Portable PCsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9137
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9137DB
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9137LG
Multi-Output, Sequence Selectable Power-Supply Controller for Mobile ApplicationsWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
SI9122E
500-kHz Half-Bridge DC/DC Controller with Integrated Secondary Synchronous Rectification DriversWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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VISHAY
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