HLMP-3316-I00XX [AVAGO]
T-1 3/4 (5mm) High Intensity LED Lamps; T-1 3/4 （5毫米）高强度LED灯
| 型号： | HLMP-3316-I00XX |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1 3/4 (5mm) High Intensity LED Lamps |
| 文件： | 总10页 (文件大小：326K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-331x, HLMP-341x, HLMP-351x Series
3
T-1 / (5 mm) High Intensity LED Lamps
4
Data Sheet
Description
Features
3
This family of T-1 / nondiffused LED lamps is
• High intensity
4
specially designed for applications requiring higher
on-axis intensity than is achievable with a standard
lamp. The light generated is focused to a narrow
beam to achieve this effect.
• Choice of 3 bright colors
– High Efficiency Red
– Yellow
– High Performance Green
3
• Popular T-1 / diameter package
4
• Selected minimum intensities
• Narrow viewing angle
• General purpose leads
• Reliable and rugged
• Available on tape and reel
Selection Guide
Luminous Intensity Iv (mcd) @ 10 mA
Color
Part Number
Min.
22.00
22.0
14.7
10.6
10.6
Max.
Red
HLMP-3316
-
-
-
-
-
HLMP-3316-I00xx
HLMP-3416
Yellow
Green
HLMP-3519
HLMP-3519-F00xx
Part Numbering System
H L M P - 3 x 1 x - x x x x x
Mechanical Options
00: Bulk
01: Tape & Reel, Crimped Leads
02: Tape & Reel, Straight Leads
B1: Right Angle Housing, Uneven Leads
B2: Right Angle Housing, Even Leads
Color Bin Options
0: Full Color Bin Distribution
Maximum Iv Bin Options
0: Open (no max. limit)
Others: Please refer to the Iv Bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Brightness Level
6, 9: Higher Brightness
Color Options
3: GaP HER
4: GaP Yellow
5: GaP Green
Package Dimensions
5.08 (0.200)
4.57 (0.180)
9.19 (0.362)
8.43 (0.332)
0.65
(0.026)
MAX.
0.89 (0.035)
0.64 (0.025)
25.40
(1.00)
MIN.
CATHODE
LEAD
(NOTE 1)
0.46 (0.018)
SQUARE
NOM.
1.27 (0.050)
NOM.
6.10 (0.240)
5.59 (0.220)
Notes:
1. All dimensions are in millimeters (inches).
2. An epoxy meniscus may extend about 1 mm (0.40") down the leads.
3. For PCB hole recommendations, see the Precautions section.
2.54 (0.100)
NOM.
2
Electrical Characteristics at T = 25°C
A
Device
HLMP-
Symbol
Description
Min.
22
Typ.
60.0
50.0
70.0
35
Max.
Units
mcd
mcd
mcd
Deg.
Test Conditions
IV
Luminous Intensity
3316
3416
3519
3316
IF = 10 mA (Figure 3)
IF = 10 mA (Figure 8)
IF = 10 mA (Figure 13)
14.7
10.6
2q1/2
Including Angle Between Half
Luminous Intensity Points
IF = 10 mA
See Note 1 (Figure 6)
3416
3519
35
24
Deg.
Deg.
nm
IF = 10 mA
See Note 1 (Figure 11)
IF = 10 mA
See Note 1 (Figure 16)
lPEAK
Dl1/2
ld
Peak Wavelength
Spectral Line Halfwidth
Dominant Wavelength
Speed of Response
Capacitance
331X
341X
351X
635
583
565
Measurement at Peak
(Figure 1)
331X
341X
351X
40
36
28
nm
nm
ns
331X
341X
351X
626
585
569
See Note 2 (Figure 1)
ts
331X
341X
351X
90
90
500
C
331X
341X
351X
11
15
18
pF
°C/W
V
VF = 0; f = 1 MHz
RqJ-PIN
Thermal Resistance
Forward Voltage
331X
341X
351X
260
Junction to Cathode
Lead
VF
331X
341X
351X
1.9
2.0
2.1
2.4
2.4
2.7
IF = 10 mA (Figure 2)
IF = 10 mA (Figure 7)
IF = 10 mA (Figure 12)
VR
Reverse Breakdown Volt.
Luminous Efficacy
All
5.0
V
IR = 100 µA
See Note 3
hV
331X
341X
351X
145
500
595
lumens
Watt
Notes:
1. q is the off-axis angle at which the luminous intensity is half the axial luminous intensity.
1/2
2. The dominant wavelength, l , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of
d
the device.
3. Radiant intensity, I , in watts/steradian, may be found from the equation I = I /h , where I is the luminous intensity in candelas and h is the
e
e
v
v
v
v
luminous efficacy in lumens/watt.
3
Absolute Maximum Ratings at T = 25°C
A
Parameter
331X Series
341X Series
351X Series
Units
mA
mA
mA
mW
V
Peak Forward Current
Average Forward Current[1]
DC Current[2]
90
25
30
135
5
60
20
20
85
5
90
25
30
135
5
Power Dissipation[3]
Reverse Voltage (IR = 100 µA)
Transient Forward Current[4]
(10 µsec Pulse)
500
500
500
mA
LED Junction Temperature
110
110
110
°C
°C
°C
Operating Temperature Range
-40 to +100
-40 to +100
-40 to +100
-40 to +100
-20 to +100
-40 to +100
Storage Temperature Range
Notes:
1. See Figure 5 (Red), 10 (Yellow), or 15 (Green) to establish pulsed operating conditions.
2. For Red and Green series derate linearly from 50°C at 0.5 mA/°C. For Yellow series derate linearly from 50°C at 0.2 mA/°C.
3. For Red and Green series derate power linearly from 25°C at 1.8 mW/°C. For Yellow series derate power linearly from 50°C at 1.6 mW/°C.
4. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and
wirebond. It is not recommended that the device be operated at peak currents beyond the peak forward current listed in the Absolute Maxi-
mum Ratings.
Figure 1. Relative intensity vs. wavelength.
4
High Efficiency Red HLMP-331X Series
Figure 2. Forward current vs. forward voltage
characteristics.
Figure 3. Relative luminous intensity vs. DC
forward current.
Figure 4. Relative efficiency (luminous intensity
per unit current) vs. peak LED current.
Figure 5. Maximum tolerable peak current vs.
pulse duration (IDC MAX as per MAX ratings).
Figure 6. Relative luminous intensity vs. angular displacement.
5
Yellow HLMP-341X Series
Figure 7. Forward current vs. forward voltage
characteristics.
Figure 8. Relative luminous intensity vs. DC
forward current.
Figure 9. Relative efficiency (luminous intensity
per unit current) vs. peak current.
Figure 10. Maximum tolerable peak current vs.
pulse duration (IDC MAX as per MAX ratings).
Figure 11. Relative luminous intensity vs. angular displacement.
6
Green HLMP-351X Series
Figure 12. Forward current vs. forward voltage
characteristics.
Figure 13. Relative luminous intensity vs. DC
forward current.
Figure 14. Relative efficiency (luminous inten-
sity per unit current) vs. peak LED current.
Figure 15. Maximum tolerable peak current vs.
pulse duration (IDC MAX as per MAX ratings).
Figure 16. Relative luminous intensity vs. angular displacement. T-13/4 lamp.
7
Table 2. Intensity Bin Limit
Intensity Range
Table 2. (Cont'd)
Table 2. (Cont'd)
Intensity Range
(mcd)
Intensity Range
(mcd)
(mcd)
Color
Bin
H
I
Min.
Max.
Color
Bin
G
H
I
Min.
Max.
Color
Bin
E
Min.
Max.
15.5
24.8
16.6
26.5
7.6
12.0
24.8
39.6
26.5
42.3
F
12.0
19.1
J
39.6
63.4
42.3
67.7
G
H
I
19.1
30.7
K
63.4
101.5
J
67.7
108.2
30.7
49.1
L
101.5
162.4
234.6
340.0
540.0
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
162.4
K
108.2
173.2
250.0
360.0
510.0
800.0
1250.0
1800.0
2900.0
4700.0
7200.0
11700.0
18000.0
173.2
49.1
78.5
M
N
O
P
234.6
L
250.0
J
78.5
125.7
201.1
289.0
417.0
680.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
40000.0
340.0
M
N
O
P
360.0
K
125.7
201.1
289.0
417.0
680.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
540.0
Yellow
510.0
L
Red
850.0
800.0
Green
M
N
O
P
Q
R
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
30900.0
1250.0
1800.0
2900.0
4700.0
7200.0
11700.0
18000.0
27000.0
Q
R
S
T
S
Q
R
U
V
W
X
Y
T
U
V
S
T
W
U
V
W
Z
Maximum tolerance for each bin limit is 18ꢀ.
8
Color Categories
Lambda (nm)
Color
Cat #
6
Min.
Max.
561.5
564.5
567.5
570.5
573.5
582.0
584.5
587.0
589.5
592.0
564.5
567.5
570.5
573.5
576.5
584.5
587.0
589.5
592.0
593.0
5
Green
4
3
2
1
3
Yellow
2
4
5
Tolerance for each bin limit is ± 0.5 nm.
Mechanical Option Matrix
Mechanical Option Code
Definition
00
Bulk Packaging, minimum increment 500 pcs/bag
01
Tape & Reel, crimped leads, minimum increment 1300 pcs/bag
Tape & Reel, straight leads, minimum increment 1300 pcs/bag
Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
Right Angle Housing, even leads, minimum increment 500 pcs/bag
02
B1
B2
Note:
All Categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago repre-
sentative for further clarification/information.
9
Precautions
Lead Forming
• Wavesolderingparametermustbesetandmaintained
according to recommended temperature and dwell
time in the solder wave. Customer is advised to
periodically check on the soldering profile to ensure
the soldering profile used is always conforming to
recommended soldering condition.
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering into PC board.
• If lead forming is required before soldering, care must
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
• If necessary, use fixture to hold the LED component
in proper orientation with respect to the PCB during
soldering process.
• Proper handling is imperative to avoid excessive
thermal stresses to LED components when heated.
Therefore, the soldered PCB must be allowed to cool
to room temperature, 25°C, before handling.
• It is recommended that tooling made to precisely
form and cut the leads to length rather than rely upon
hand operation.
Soldering Conditions
• Special attention must be given to board fabrication,
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
• CaremustbetakenduringPCBassemblyandsoldering
process to prevent damage to LED component.
• The closest LED is allowed to solder on board is 1.59
mm below the body (encapsulant epoxy) for those
parts without standoff.
• Recommended PC board plated through hole sizes
for LED component leads:
LED Component
Lead Size
Plated Through
-Hole Diameter
• Recommended soldering conditions:
Diagonal
Lead size (typ.) 0.45 × 0.45 mm
0.636 mm
0.98 to 1.08 mm
(0.039 to 0.043 in)
Manual Solder
Dipping
(0.018 × 0.018 in.) (0.025 in)
Wave Soldering
105 °C Max.
30 sec Max.
250 °C Max.
3 sec Max.
Dambar shear- 0.65 mm
off area (max.) (0.026 in)
0.919 mm
(0.036 in)
Pre-heat Temperature
Pre-heat Time
–
–
Lead size (typ.) 0.50 × 0.50 mm
0.707 mm
1.05 to 1.15 mm
(0.041 to 0.045 in)
Peak Temperature
Dwell Time
260 °C Max.
5 sec Max.
(0.020 × 0.020 in.) (0.028 in)
Dambar shear- 0.70 mm
off area (max.) (0.028 in)
0.99 mm
(0.039 in)
Note: Refer to application note AN1027 for more information
on soldering LED components.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
BOTTOM SIDE
OF PC BOARD
250
200
150
100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
FLUXING
50
30
SOLDER: SN63; FLUX: RMA
PREHEAT
20 30
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
0
10
40
50
TIME – SECONDS
Figure 17. Recommended wave soldering profile.
60
70
80
90 100
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes 5989-4259EN
AV02-1023EN - July 24, 2013
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