HLMP-4740-HU202 [AVAGO]
SINGLE COLOR LED;
| 型号： | HLMP-4740-HU202 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | SINGLE COLOR LED |
| 文件： | 总10页 (文件大小：282K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-4700, HLMP-4719, HLMP-4740
HLMP-1700, HLMP-1719, HLMP-1790
3
T-1 / (5 mm), T-1 (3 mm), Low Current LED Lamps
4
Data Sheet
Description
Features
These tinted diffused LED lamps are designed and opti- •ꢀ Low power
mized specifically for low DC current operation. Luminous
intensity and forward voltage are tested at 2 mA to assure
consistent brightness at TTL output current levels.
•ꢀ High efficiency
•ꢀ CMOS-MOS compatible
•ꢀ TTL compatible
Applications
•ꢀ Wide viewing angle
•ꢀ Choice of package styles
•ꢀ Choice of colors
•ꢀ Low power DC circuits
•ꢀ Telecommunications indicators
•ꢀ Portable equipment
•ꢀ Keyboard indicators
Package Dimensions
0.89 (0.035)
6.10 (0.240)
0.64 (0.025)
SQUARE TYP.
0.55 (0.022)
5.59 (0.220)
0.40 (0.016)
0.65 (0.026) max
5.08 (0.200)
4.57 (0.180)
CATHODE LEAD
9.19 (0.362)
8.43 (0.332)
1.27(0.050)
NOM.
2.54 (0.100) NOM.
25.40(1.00)
MINIMUM
HLMP-4700, -4719, -4740
A
1.14 (.045)
0.51 (.020)
2.79 (.110)
2.29 (.090)
24.1(.95) MIN.
1.52 (.060)
1.02 (.040)
3.43 (.135)
2.92 (.115)
0.65 (0.026) max.
3.17 (.125)
2.67 (.105)
Ø
(0.022) 0.55
(0.016) 0.40
SQ. TYP.
4.70 (.185)
4.19 (.165)
6.35 (.250)
5.58 (.220)
HLMP-1700, -1719, -1790
B
Notes:
1. All dimensions are in mm (inches).
2. An epoxy meniscus may extend about 1 mm (0.040") down the leads.
3. For PCB hole recommendations, see the Precautions section.
Selection Guide
Luminous Intensity Iv (mcd) at 2 mA
Device
HLMP-
Package
Outline
1/2
Package Description
Color
Min.
1.5
1.5
1.5
0.9
0.9
1.0
1.0
1.0
0.8
0.8
0.9
0.9
0.9
1.0
1.0
1.0
Typ.
2.3
2.3
2.3
2.1
2.1
2.3
2.3
2.3
2.1
2.1
2.1
2.1
2.1
2.3
2.3
2.4
Max.
–
2q
T-1 3/4 Tinted Diffused
Red
4700
50
A
4700-C00xx
4700-CD0FH
4719
–
4.2
–
Yellow
Green
4719-A00xx
4740
–
–
4740-A00xx
4740-AB000
1700
–
3.2
–
T-1 Tinted Diffused
Red
50
B
1700-B00xx
1719
–
Yellow
–
1719-A00xx
1719-ABB00
1790
–
2.8
–
Green
1790-A00xx
1790-AB0FH
–
3.2
Note:
1. q1/2 is the typical off-axis angle at which the luminous intensity is half the axial luminous intensity.
2
Part Numbering System
HLMP – X 7 XX - X X X XX
Mechanical Option
00: Bulk
01: Tape & Reel, Crimped Leads
02, BH: Tape & Reel, Straight Leads
A1, B1: Right Angle Housing, Uneven Leads
A2, B2: Right Angle Housing, Even Leads
FH: 2 Iv bins select with Inventory Control
Color Bin Options
0: Full color bin distribution
B: Color bins 2 & 3 only
Maximum Iv Bin Options
0: Open (No. max. limit)
Others: Please refer to the Iv bin Table
Minimum Iv Bin Options
Please refer to the Iv Bin Table
Color Options
00: GaP HER
19: GaP Yellow
40: GaP Green
90: GaP Green
Package Options
4: T-13/4 (5 mm)
1: T-1 (3 mm)
3
Electrical/Optical Characteristics at T = 25°C
A
3
Symbol
Description
T-1 /
T-1
Min.
Typ.
1.7
1.8
1.9
Max. Units
Test Conditions
4
VF
Forward Voltage
4700
4719
4740
4700
4719
4740
4700
4719
4740
4700
4719
4740
4700
4719
4740
4700
4719
4740
4700
4719
4740
4700
4740
4700
4719
4740
1700
1719
1790
1700
1719
1790
1700
1719
1790
1700
1719
1790
1700
1719
1790
1700
1719
1790
1700
1719
1790
1700
1790
1700
1719
1790
2.0
2.5
2.2
V
2 mA
VR
Reverse Breakdown
Voltage
5.0
5.0
5.0
V
IR = 50 μA
Note 1
ld
Dominant
626
585
569
40
nm
nm
ns
Wavelength
Dl1/2
Spectral Line
Halfwidth
36
28
tS
Speed of Response
Capacitance
90
90
500
11
C
pF
°C/W
VF = 0,
15
f = 1 MHz
18
RqJ-PIN
Thermal Resistance
260[3]
290[4]
Junction to Cathode
Lead
lPEAK
Peak Wavelength
Luminous Efficacy
635
565
145
500
595
nm
Measurement at Peak
Note 2
hV
lumens/watt
Notes:
1. The dominant wavelength, l , is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the
d
device.
2. The radiant intensity, I , in watts per steradian, may be found from the equation I = I /h , where I is the luminous intensity in candelas and h is
e
e
V
V
V
V
luminous efficacy in lumens/watt.
3
3. T-1 / .
4
4. T-1.
4
Absolute Maximum Ratings
Parameter
Maximum Rating
Units
Power Dissipation
(Derate linearly from 92°C at 1.0 mA/°C)
Red
Yellow
Green
14
17.5
15.4
mW
DC and Peak Forward Current
Transient Forward Current (10 μs Pulse)[1]
Reverse Voltage (IR = 50 μA)
7
mA
mA
V
500
5.0
Operating Temperature Range
Red/Yellow
Green
-40 to 100
-20 to 100
°C
°C
Storage Temperature Range
Notes:
-40 to +100
°C
1. The transient peak current is the maximum non-recurring peak current the devices can withstand without damaging the LED die and wire bonds.
It is not recommended that the device be operated at peak currents beyond the Absolute Maximum Peak Forward Current.
1.0
T = 25° C
A
GREEN
YELLOW
RED
0.5
0
500
550
600
650
WAVELENGTH – nm
700
750
Figure 1. Relative intensity vs. wavelength.
10.0
10
8
TA - 25°C
GREEN
8.0
6.0
4.0
2.0
0
YELLOW
RED
6
4
2
0
YELLOW
GREEN
RED
0
2
4
6
8
10
0
0.5
1.0
1.5
2.0
2.5
I
-DC CURRENT PER LED - mA
VOLTAGE – V
DC
Figure 3. Relative luminous intensity vs. forward current.
Figure 2. Forward current vs. forward voltage.
5
0°
0°
10°
10°
1.0
0.8
0.6
0.4
20°
1.0
0.8
0.6
0.4
20°
30°
30°
40°
40°
50°
50°
60°
60°
70°
70°
0.2
0.0
80°
0.2
0.0
80°
90°
90°
10° 20° 30° 40° 50° 60° 70° 80° 90° 100°
10° 20° 30° 40° 50° 60° 70° 80° 90° 100°
Figure 4. Relative luminous intensity vs. angular displacement for T-13/4 lamp.
Figure 5. Relative llluminous intensity vs. angular displacement for T-1 lamp.
Intensity Bin Limits
Intensity Range (mcd)
Intensity Bin Limits
Intensity Range (mcd)
Color
Bin
B
Min.
Max.
Color
Bin
A
B
Min.
Max.
Red
0.9
1.5
Yellow
1.0
1.6
C
D
E
1.5
2.4
1.6
2.5
2.4
3.8
C
D
E
2.5
4.0
3.8
6.1
4.0
6.5
F
6.1
9.7
6.5
10.3
G
H
I
9.7
15.5
F
10.3
16.6
15.5
24.8
G
H
I
16.6
26.5
24.8
39.6
26.5
42.3
J
39.6
63.4
42.3
67.7
K
63.4
101.5
162.4
234.6
340.0
540.0
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
30900.0
J
67.7
108.2
173.2
250.0
360.0
510.0
800.0
1250.0
1800.0
2900.0
4700.0
7200.0
11700.0
18000.0
27000.0
L
101.5
162.4
234.6
340.0
540.0
850.0
1200.0
1700.0
2400.0
3400.0
4900.0
7100.0
10200.0
14800.0
21400.0
K
108.2
173.2
250.0
360.0
510.0
800.0
1250.0
1800.0
2900.0
4700.0
7200.0
11700.0
18000.0
M
N
O
P
L
M
N
O
P
Q
R
Q
R
S
T
S
U
V
W
X
Y
T
U
V
W
Maximum tolerance for each bin limit is 18ꢀ.
Z
Maximum tolerance for each bin limit is 18ꢀ.
6
Intensity Bin Limits
Color Categories
Intensity Range (mcd)
Lambda (nm)
Min.
Color
Bin
A
B
Min.
Max.
Color
Category #
Max.
Green
1.1
1.8
6
5
4
3
2
1
3
2
4
5
561.5
564.5
567.5
570.5
573.5
582.0
584.5
587.0
589.5
592.0
564.5
567.5
570.5
573.5
576.5
584.5
587.0
589.5
592.0
593.0
1.8
2.9
C
D
E
2.9
4.7
Green
4.7
7.6
7.6
12.0
F
12.0
19.1
G
H
I
19.1
30.7
30.7
49.1
Yellow
49.1
78.5
J
78.5
125.7
201.1
289.0
417.0
680.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
40000.0
Tolerance for each bin limit is 0.5 nm.
K
125.7
201.1
289.0
417.0
680.0
1100.0
1800.0
2700.0
4300.0
6800.0
10800.0
16000.0
25000.0
L
M
N
O
P
Q
R
S
T
U
V
W
Maximum tolerance for each bin limit is 18ꢀ.
Mechanical Option Matrix
Mechanical Option Code
Definition
00
01
02
A1
A2
B1
B2
BH
FH
R1
Bulk Packaging, minimum increment 500 pc/bag
Tape & Reel, crimped leads, min. increment 1300 pcs/bag for T-1 3/4, 1800 pcs/bag for T-1
Tape & Reel, straight leads, min. increment 1300 pcs/bag for T-1 3/4, 1800 pcs/bag for T-1
T-1, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
T-1, Right Angle Housing, even leads, minimum increment 500 pcs/bag
T-1 3/4, Right Angle Housing, uneven leads, minimum increment 500 pcs/bag
T-1 3/4, Right Angle Housing, even leads, minimum increment 500 pcs/bag
T-1, Tape & Reel, straight leads, minimum increment 2000 pcs/bag
Devices that require inventory control and 2 Iv bin select
Tape & Reel, crimped leads, reeled counter clockwise, cathode lead leaving the reel first
Notes: All categories are established for classification of products. Products may not be available in all categories. Please contact your local Avago
representative for further clarification/information.
7
Precautions:
Lead Forming:
•ꢀ The leads of an LED lamp may be preformed or cut to
•ꢀ Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
length prior to insertion and soldering on PC board.
•ꢀ For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
Note:
•ꢀ If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave soldering
to ensure that the maximum wave temperature does not exceed
250°C and the solder contact time does not exceeding 3sec. Over-
stressing the LED during soldering process might cause premature
failure to the LED due to delamination.
Soldering and Handling:
•ꢀ Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
•ꢀ Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
•ꢀ LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
•ꢀ At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
1.59 mm
•ꢀ If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
•ꢀ ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
•ꢀ Recommended PC board plated through holes (PTH)
size for LED component leads.
LED Component
Lead Size
0.45 x 0.45 mm
Plated Through
Hole Diameter
0.98 to 1.08 mm
•ꢀ Recommended soldering condition:
Diagonal
0.636 mm
(0.025 inch)
Wave
Soldering
Manual Solder
Dipping
–
[1],[2]
(0.018 x 0.018 inch)
(0.039 to 0.043 inch)
Pre-heat Temperature 105°C Max.
0.50 x 0.50 mm
(0.020 x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
Pre-heat Time
60 sec Max.
250°C Max.
3 sec Max.
–
Peak Temperature
260°C Max.
5 sec Max.
•ꢀ Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Dwell Time
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
Refer to application note AN5334 for more information
about soldering and handling of TH LED lamps.
8
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR
HOT AIR KNIFE
TURBULENT WAVE
250
Flux: Rosin flux
Solder bath temperature:
200
150
100
245°C 5°C (maximum peaꢀ temperature ꢁ 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum ꢁ 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C 5°C (maximum peaꢀ temperature ꢁ 250°C)
50
PREHEAT
Dwell time: 1.5 sec – 3.0 sec (maximum ꢁ 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
0
10
20
30
40
50
60
70
80
90
100
TIME (MINUTES)
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Color Bin
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
9
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3
max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
BIN: Color Bin
Supplier Code:
DATECODE: Date Code
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2013 Avago Technologies. All rights reserved. Obsoletes 5989-4256EN
AV02-1557EN - March 18, 2013
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