HLMP-AG63-UX0DD [AVAGO]

5mm Mini Oval and Standard Oval AlInGaP LEDs; 5毫米小型田径场和标准椭圆的AlInGaP发光二极管


型号：	HLMP-AG63-UX0DD
厂家：	AVAGO TECHNOLOGIES LIMITED
描述：	5mm Mini Oval and Standard Oval AlInGaP LEDs 5毫米小型田径场和标准椭圆的AlInGaP发光二极管二极管
文件：	总11页 (文件大小：211K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HLMP-AG62/AG63, AH62/AH63, AL62/AL63

HLMP-HG62/HG63, HH62/HH63, HL62/HL63

5mm Mini Oval and Standard Oval AlInGaP LEDs

Data Sheet

Description

Features

These Precision Optical Performance AlInGaP Oval

LEDs are speciﬁcally designed for full color/video and

passenger information signs. The oval shaped radiation

pattern and high luminous intensity ensure that these

devices are excellent for wide ﬁeld of view outdoor ap-

plications where a wide viewing angle and readability in

sunlight are essential. The package epoxy contains both

UV-A and UV-B inhibitors to reduce the eﬀects of long

term exposure to direct sunlight.

• Viewing Angle: 30°x70° and 40°x100°

• Colors:

590nm Amber

615nm Red-Orange

626nm Red

• Well deﬁned spatial radiation pattern

• High brightness material

• Superior resistance to moisture

Applications

• Package options:

Stand-oﬀ and Non Stand-oﬀ Leads

• Full color signs

• Tinted and diﬀused

Package Dimensions

For 5mm Mini Oval 30°x70°

Package Drawing A

0.ꢀ

0.032

max.

3.ꢀ0 0.200

0.150 0.00ꢀ

0.50 0.10

0.020 0.004

sq. typ.

ꢀ.70 0.20

0.342 0.00ꢀ

0.70

0.02ꢀ

max.

5.20 0.200

0.205 0.00ꢀ

2.54 0.3

0.100 0.012

cathode lead

min.

1.00

0.03ꢀ

24.00

0.945

min.

Package Drawing B

1.50 0.15

0.0591 0.006

0.50 0.10

0.020 0.004

sq. typ.

11.70 0.50

0.4606 0.020

3.ꢀ0 0.200

0.150 0.00ꢀ

0.70

0.02ꢀ

max.

5.20 0.20

0.205 0.00ꢀ

2.54 0.3

0.100 0.012

cathode lead

min.

24.00

0.945

ꢀ.70 0.20

0.342 0.00ꢀ

1.00

0.03ꢀ

min.

0.ꢀ

0.032

max.

For 5mm Standard Oval 40°x100°

Package Drawing C

1.02

max.

0.040

3.ꢀ0

0.150

0.50 0.10

.020 .004

sq. typ.

0.70

.02ꢀ

max.

5.20

0.205

2.54

0.10

cathode lead

1.00

.039

min.

25.00

0.9ꢀ4

7.00

0.276

min.

Package Drawing D

3.ꢀ0

0.150

1.50 0.15

0.059 0.006

0.50 0.10

0.020 0.004

sq. typ.

10.ꢀ0 0.50

0.425 0.020

5.20

0.205

cathode lead

min.

2.54 0.30

0.10 0.012

7.00

0.276

24.00

0.945

1.00

0.039

min.

1.02

0.040

max.

Notes:

All dimensions in millimeters (inches).

Device Selection Guide

5mm Mini Oval 30°x70°

Color and Dominant

Wavelength λd (nm)

Typ.

Luminous Intensity

Iv (mcd) at 20 mA

Min.

Luminous Intensity

Iv (mcd) at 20 mA

Max.

Package

Drawing

Part Number

Stand-Oﬀ

HLMP-AL62-UX0DD

HLMP-AL62-X10DD

HLMP-AH62-UX0DD

HLMP-AH62-X10DD

HLMP-AG62-UX0DD

HLMP-AG62-X10DD

HLMP-AL63-UX0DD

HLMP-AL63-X10DD

HLMP-AH63-UX0DD

HLMP-AH63-X10DD

HLMP-AG63-UX0DD

HLMP-AG63-X10DD

Amber 590

Red-Orange 615

Red 626

960

1990

3500

1990

3500

1990

3500

1990

3500

1990

3500

1990

3500

1660

960

1660

960

Red 626

1660

960

Amber 590

Red-Orange 615

Red 626

Yes

1660

960

1660

960

Red 626

1660

5mm Standard Oval 40°x100°

Color and Dominant

Wavelength λd (nm)

Typ

Luminous Intensity

Iv (mcd) at 20 mA

Min.

Luminous Intensity

Iv (mcd) at 20 mA

Max.

Package

Drawing

Part Number

Stand-Oﬀ

HLMP-HL62-TX0DD

HLMP-HH62-TX0DD

HLMP-HG62-TX0DD

HLMP-HL63-TX0DD

HLMP-HH63-TX0DD

HLMP-HG63-TX0DD

Notes:

Amber 590

Red-Orange 615

Red 626

800

1990

Amber 590

Red-Orange 615

Red 626

Yes

1. The luminous intensity is measured on the mechanical axis of the lamp package.

2. Tolerance for each intensity limit is 15ꢀ.

3. Please refer to AN 5352 for detail information on features of stand-oﬀ and non stand-oﬀ LEDs.

Part Numbering System

HLMP- x x 62/63 - x x x x x

Packaging Option

DD: Ammopacks

Color Bin Selection

0: Open distribution

Maximum Intensity Bin

Refer to Device Selection Guide

Minimum Intensity Bin

Refer to Device Selection Guide.

Color

G: Red 626nm

H: Red Orange 615nm

L: Amber 590nm

Package

A: 5mm Mini Oval 30° x 70°

H: 5mm Standard Oval 40°x100°

Note: Please refer to AB 5337 for complete information on part numbering system.

Absolute Maximum Ratings

T = 25°C

Parameter

Value

Unit

DC Forward Current ^[1]

Peak Forward Current

Power Dissipation

100 ^[2]

120

Reverse Voltage

5 (IR = 100 μA)

130

LED Junction Temperature

Operating Temperature Range

Storage Temperature Range

°C

-40 to +100

°C

Notes:

1. Derate linearly as shown in Figure 4.

2. Duty Factor 30ꢀ, frequency 1kHz.

Electrical / Optical Characteristics

T = 25°C

Parameter

Symbol

Min.

Typ.

Max.

Units

Test Conditions

Forward Voltage

Amber

Red

2.2

2.1

2.0

V_F

V_R

1.8

2.4

I_F= 20 mA

Red-Orange

Reverse Voltage

I_R= 100 μA

Dominant Wavelength ^[1]

Amber

Red

Red-Orange

584.5

620

612

594.5

630

621.7

I_F= 20 mA

λd

Peak Wavelength

Amber

Red

590

626

615

Peak of Wavelength of Spectral

Distribution at I_F= 20 mA

λ_PEAK

Red-Orange

Thermal Resistance

240

°C/W

LED Junction-to-Anode Lead

Rθ_J-PIN

Luminous Eﬃcacy ^[2]

Amber

Red

480

150

260

lm/W

Emitted Luminous Power/Emitted

Radiant Power

η_V

Red-Orange

Notes:

1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp. Tolerance for each color of dominant

wavelength is 0.5nm.

2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/η where I is the luminous intensity in candelas and η is

the luminous eﬃcacy in lumens/watt.

Figure 1. Relative intensity vs. peak wavelength

2.5

RED

RED-ORANGE

1.5

AMBER

0.5

1.5

2.5

DC FORWARD CURRENT - mA

FORWARD VOLTAGE - V

Figure 2. Forward current vs. forward voltage

Figure 3. Relative luminous intensity vs. forward current

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

100

120

-90

-60

-30

T_A- AMBIENT TEMPERATURE - ºC

ANGULAR DISPLACEMENT - DEGREES

Figure 4. Maximum forward current vs. ambient temperature

Figure 5. Representative Radiation pattern for 30°x70° Lamp -Major Axis

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

-90

-60

-30

-90

-60

-30

ANGULAR DISPLACEMENT - DEGREES

Figure 7. Representative Radiation pattern for 40°x100° Lamp -Major Axis

ANGULAR DISPLACEMENT - DEGREES

Figure 6. Representative Radiation pattern 30°x70° Lamp -Minor Axis

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

AMBER

RED-ORANGE

RED

0.1

-90

-60

-30

-50

-25

100

125

150

JUNCTION TEMPERATURE - °C

ANGULAR DISPLACEMENT - DEGREES

Figure ꢀ. Representative Radiation pattern 40°x100° Lamp –Minor Axis

Figure 9. Relative Light Output vs Junction temperature

Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)

Intensity (mcd) at 20 mA

VF Bin Table (V at 20mA)

Bin ID

Min

1.8

2.0

2.2

Max

2.0

2.2

2.4

Bin

Min

Max

960

1150

1380

1660

1990

2400

2900

3500

1150

1380

1660

1990

2400

2900

Tolerance for each bin limit is 0.05V

Amber Color Bin Limits

Bin

Min

Max

584.5

587.0

589.5

592.0

587.0

589.5

592.0

594.5

Tolerance for each bin limit is 15ꢀ

Tolerance for each bin limit is 0.5nm.

Precautions:

Lead Forming:

Note:

1. PCB with diﬀerent size and design (component density) will have

diﬀerent heat mass (heat capacity). This might cause a change in

temperature experienced by the board if same wave soldering

setting is used. So, it is recommended to re-calibrate the soldering

proﬁle again before loading a new type of PCB.

2. Avago Technologies’ high brightness LED are using high eﬃciency

LED die with single wire bond as shown below. Customer is advised

to take extra precaution during wave soldering to ensure that the

maximum wave temperature does not exceed 250°C and the solder

contact time does not exceeding 3sec. Over-stressing the LED

during soldering process might cause premature failure to the LED

due to delamination.

• The leads of an LED lamp may be preformed or cut to

length prior to insertion and soldering on PC board.

• For better control, it is recommended to use proper

tool to precisely form and cut the leads to applicable

length rather than doing it manually.

• If manual lead cutting is necessary, cut the leads after

the soldering process. The solder connection forms

a mechanical ground which prevents mechanical

stress due to lead cutting from traveling into LED

package. This is highly recommended for hand solder

operation, as the excess lead length also acts as small

heat sink.

Avago Technologies LED conﬁguration

Soldering and Handling:

• Care must be taken during PCB assembly and

soldering process to prevent damage to the LED

component.

Anode

• LED component may be eﬀectively hand soldered

to PCB. However, it is only recommended under

unavoidable circumstances such as rework. The

closest manual soldering distance of the soldering

heat source (soldering iron’s tip) to the body is

1.59mm. Soldering the LED using soldering iron tip

Note: Electrical connection between bottom surface of LED die and

the lead frame is achieved through conductive paste.

• Any alignment ﬁxture that is being applied during

wave soldering should be loosely ﬁtted and should

not apply weight or force on LED. Non metal material

is recommended as it will absorb less heat during

wave soldering process.

1.59mm

Note: In order to further assist customer in designing jig accurately

that ﬁt Avago Technologies’ product, 3D model of the product is

available upon request.

closer than 1.59mm might damage the LED.

• ESD precaution must be properly applied on the

soldering station and personnel to prevent ESD

damage to the LED component that is ESD sensitive.

Do refer to Avago application note AN 1142 for details.

The soldering iron used should have grounded tip to

ensure electrostatic charge is properly grounded.

• At elevated temperature, LED is more susceptible to

mechanical stress. Therefore, PCB must allowed to

cool down to room temperature prior to handling,

which includes removal of alignment ﬁxture or pallet.

• If PCB board contains both through hole (TH) LED and

other surface mount components, it is recommended

that surface mount components be soldered on

the top side of the PCB. If surface mount need to be

on the bottom side, these components should be

soldered using reﬂow soldering prior to insertion the

TH LED.

• Recommended soldering condition:

Wave

Soldering

Manual Solder

Dipping

[1, 2]

Pre-heat temperature 105 °C Max.

Preheat time

Peak temperature

Dwell time

60 sec Max

250 °C Max.

3 sec Max.

260 °C Max.

5 sec Max

• Recommended PC board plated through holes (PTH)

size for LED component leads.

LED component

lead size

Plated through

hole diameter

Note:

1. Above conditions refers to measurement with thermocouple

mounted at the bottom of PCB.

2. It is recommended to use only bottom preheaters in order to reduce

thermal stress experienced by LED.

Diagonal

0.45 x 0.45 mm

0.636 mm

0.98 to 1.08 mm

(0.039 to 0.043 inch)

(0.018x 0.018 inch) (0.025 inch)

0.50 x 0.50 mm 0.707 mm

(0.020x 0.020 inch) (0.028 inch)

1.05 to 1.15 mm

(0.041 to 0.045 inch)

• Wave soldering parameters must be set and

maintained according to the recommended

temperature and dwell time. Customer is advised

to perform daily check on the soldering proﬁle to

ensure that it is always conforming to recommended

soldering conditions.

• Over-sizing the PTH can lead to twisted LED after

clinching. On the other hand under sizing the PTH can

cause diﬃculty inserting the TH LED

Example of Wave Soldering Temperature Proﬁle for TH LED

Recommended solder:

Sn63 (Leaded solder alloy)

SAC305 (Lead free solder alloy)

LAMINAR WAVE

HOT AIR KNIFE

TURBULENT WAVE

250

Flux: Rosin flux

Solder bath temperature:

245°C 5°C (maximum peak

temperature = 250°C)

200

150

100

Dwell time: 1.5 sec - 3.0 sec

(maximum = 3sec)

Note: Allow for board to be

sufficiently cooled to room

temperature before exerting

mechanical force.

PREHEAT

100

TIME (MINUTES)

Ammo Packs Drawing

12.70 1.00

0.50 0.0394

6.35 1.30

0.25 0.0512

CATHODE

20.50 1.00

0.8071 0.0394

9.125 0.625

0.3593 0.0246

18.00 0.50

0.7087 0.0197

4.00 0.20

0.1575 0.008

TYP

12.70 0.30

0.50 0.0118

VIEW A - A

0.70 0.20

0.0276 0.0079

Packaging Box for Ammo Packs

FROM LEFT SIDE OF BOX

ADHESIVE TAPE MUST BE

FACING UPWARDS.

LABEL ON THIS

SIDE OF BOX

ANODE LEAD LEAVES

THE BOX FIRST.

Note: For InGaN device, the ammo pack packaging box contain ESD logo

Packaging Label

(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)

STANDARD LABEL LS0002

RoHS Compliant

(1P) Item: Part Number

max temp 250C

(Q) QTY: Quantity

(1T) Lot: Lot Number

LPN:

CAT: Intensity Bin

BIN: Refer to below information

(9D)MFG Date: Manufacturing Date

(P) Customer Item:

(V) Vendor ID:

(9D) Date Code: Date Code

Made In: Country of Origin

DeptID:

(ii) Avago Baby Label (Only available on bulk packaging)

RoHS Compliant

e3 max temp 250C

Lamps Baby Label

(1P) PART #: Part Number

(1T) LOT #: Lot Number

(9D)MFG DATE: Manufacturing Date

QUANTITY: Packing Quantity

C/O: Country of Origin

Customer P/N:

CAT: Intensity Bin

Supplier Code:

BIN: Refer to below information

DATECODE: Date Code

Acronyms and Deﬁnition:

BIN:

Example:

(i) Color bin only or VF bin only

BIN: 2 (represent color bin 2 only)

BIN: VB (represent VF bin “VB”only)

(ii) Color bin incorporate with VF Bin

BIN: 2VB

(Applicable for part number with color bins but

without VF bin OR part number with VF bins and no

color bin)

(ii) Color bin incorporated with VF Bin

VB: VF bin “VB”

(Applicable for part number that have both color bin

and VF bin)

2: Color bin 2 only

DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR

AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAIN-

TENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS.

CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUP-

PLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-1314EN - April 19, 2011

HLMP-AG63-UX0DD [AVAGO]

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