HLMP-EL2S-XZLDD [AVAGO]
T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs;
| 型号： | HLMP-EL2S-XZLDD |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs |
| 文件： | 总12页 (文件大小：408K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-EGxx, HLMP-ELxx
T-1¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs
Data Sheet
Description
Features
These High Brightness AlInGaP LEDs provide superior • Viewing angle: 15°, 23° and 30°
light output for excellent readability in sunlight and are
extremely reliable. AlInGaP LED technology provides
extremely stable light output over long periods of time.
• Well defined spatial radiation pattern
• High brightness material
Precision Optical Performance lamps utilize the aluminum • Available in Red and Amber
indium gallium phosphide (AlInGaP) technology.
– Red AlInGaP 621 nm
– Amber AlInGaP 590 nm
• Superior resistance to moisture
• Package options:
These LED lamps are untinted. T-1¾ packages incorpo-
rating second generation optics producing well defined
spatial radiation patterns at specific viewing cone angles.
These lamps are made with an advanced optical grade
epoxy offering superior high temperature and high
moisture resistance performance in outdoor signal and
sign application. The epoxy contains uv inhibitor to reduce
the effects of long term exposure to direct sunlight.
– With and without standoff
Applications
•ꢀ Traffic management:
– Traffic signals
Benefits
– Pedestrian signals
– Work zone warning lights
– Variable message signs
•ꢀ Solar Power signs
•ꢀ Commercial outdoor advertising
– Signs
•ꢀ Superior performance for outdoor environment
– Marquee
Package Dimension
A: Non-standoff
B: Standoff
5.00 0.20
(0.197 0.008)
5.00 0.20
(0.197 0.008)
1.14 0.20
(0.045 0.008)
8.71 0.20
(0.343 0.008)
8.71 0.20
(0.343 0.008)
d
1.14 0.20
(0.045 0.008)
2.35 (0.093)
MAX.
0.70 (0.028)
MAX.
1.50 0.15
(0.059 0.006)
31.60
MIN.
31.60
MIN.
(1.244)
(1.244)
0.70 (0.028)
MAX.
CATHODE
LEAD
CATHODE
LEAD
0.50 0.10
(0.020 0.004)
0.50 0.10
(0.020 0.004)
SQ. TYP.
SQ. TYP.
1.00
MIN.
1.00
(0.039)
MIN.
(0.039)
5.80 0.20
(0.228 0.008)
5.80 0.20
(0.228 0.008)
CATHODE
FLAT
CATHODE
FLAT
2.54 0.38
(0.100 0.015)
2.54 0.38
(0.100 0.015)
Part Number
HLMP-Ex1T
HLMP-Ex2T
HLMP- Ex3T
Dimension ‘d’
13.03 0.25
12.73 0.25
12.26 0.25
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is 0.20 mm unless other specified.
3. Leads are mild steel with tin plating.
4. The epoxy meniscus is 1.21 mm max.
5. For identification of polarity after the leads are trimmed off, please
refer to the illustration below:
CATHODE
ANODE
2
Device Selection Guide
Luminous Intensity
Iv (mcd) at 20 mA
Color and Dominant
[1,2,5]
Wavelength λ (nm)
Typical Viewing
angle (°)
d
[3]
[4]
Part Number
Typ
Min
Max
Standoff
No
HLMP-EG1S-Z20DD
HLMP-EG1T-Z20DD
HLMP-EL1S-Z20DD
HLMP-EL1S-Z2KDD
HLMP-EL1S-Z2LDD
HLMP-EL1T-Z20DD
HLMP-EL1T-Z2KDD
HLMP-EL1T-Z2LDD
HLMP-EG2S-XZ0DD
HLMP-EG2T-XZ0DD
HLMP-EL2S-XZ0DD
HLMP-EL2S-XZKDD
HLMP-EL2S-XZLDD
HLMP-EL2T-XZ0DD
HLMP-EL2T-XZKDD
HLMP-EL2T-XZLDD
HLMP-EG3S-VX0DD
HLMP-EG3T-VX0DD
HLMP-EL3S-VX0DD
HLMP-EL3S-VXKDD
HLMP-EL3S-VXLDD
HLMP-EL3T-VX0DD
HLMP-EL3T-VXKDD
HLMP-EL3T-VXLDD
Notes:
Red 621
12000
12000
12000
12000
12000
12000
12000
12000
7200
27000
27000
27000
27000
27000
27000
27000
27000
16000
16000
16000
16000
16000
16000
16000
16000
9300
15
23
30
Red 621
Yes
No
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
Red 621
No
No
Yes
Yes
Yes
No
Red 621
7200
Yes
No
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
Red 621
7200
7200
No
7200
No
7200
Yes
Yes
Yes
No
7200
7200
4200
Red 621
4200
9300
Yes
No
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
Amber 590
4200
9300
4200
9300
No
4200
9300
No
4200
9300
Yes
Yes
Yes
4200
9300
4200
9300
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.
2. The optical axis is closely aligned with the package mechanical axis.
3. Dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d
4.
θ is the off-axis angle where the luminous intensity is half the on-axis intensity.
½
5. Tolerance for each bin limit is 15ꢀ
3
Part Numbering System
HLMP – E x xx – x x x xx
Packaging Option
DD: Ammopack
Color Bin Selection
0 : Full Distribution
K: Color bin 2 and 4
L: Color bin 4 and 6
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide
Viewing Angle and Lead Standoꢀ
1S: 15° without standoꢀ
1T: 15° with standoꢀ
2S: 23° without standoꢀ
2T: 23° with standoꢀ
3S: 30° without standoꢀ
3T: 30° with standoꢀ
Color
G: Red 621
L: Amber 590
Note: Refer to AB 5337 for complete information on the part numbering system.
4
Absolute Maximum Ratings T = 25° C
J
Parameter
Red/ Amber
50
100 [2]
Unit
mA
mA
mW
°C
DC Forward Current [1]
Peak Forward Current
Power Dissipation
120
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
130
-40 to +100
-40 to +100
°C
°C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty Factor 30ꢀ, frequency 1 kHz.
Electrical / Optical Characteristics T = 25° C
J
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
Amber/Red
Reverse Voltage [1]
VF
1.8
5
2.1
2.4
V
V
IF = 20 mA
VR
IR = 100 μA
Dominant Wavelength [2]
ld
Amber
Red
587.0
618.0
590.0
621.0
594.5
630.0
nm
IF = 20 mA
Peak Wavelength
Amber
lPEAK
594
629
nm
Peak of Wavelength of Spec-
tral Distribution at IF = 20 mA
Red
Thermal resistance
Luminous efficacy [3]
RqJ-PIN
240
°C/W
lm/W
LED junction to pin
hv
Amber
Red
500
205
Emitted Luminous Flux/
Emitted Radiant Flux
Notes:
1. Indicates product final testing condition, long term reverse bias is not recommended.
2. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp.
3. The radiant intensity, Ie in watts per steradian, maybe found from the equation Ie = Iv / ηV where Iv is the luminous intensity in candela and h is
v
the luminous efficacy in lumens/watt.
5
1.0
0.8
0.6
0.4
0.2
0.0
100
80
60
40
20
0
Red
Amber
500
550
600
650
700
0
1
2
3
4
FORWARD VOLTAGE - V
WAVELENGTH - nm
Figure 1. Relative Intensity vs Wavelength
Figure 2. Forward Current vs Forward Voltage
60.0
50.0
40.0
30.0
20.0
10.0
0.0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
20
40
60
80
100
120
0
10 20 30 40 50 60 70 80 90 100
FORWARD CURRENT - mA
TA - AMBIENT TEMPERATURE - °C
Figure 3. Relative Intensity vs Forward Current
Figure 4. Maximum Forward Current vs Ambient Temperature
2.0
1
0.8
0.6
0.4
0.2
0
Amber
Red
1.5
1.0
0.5
0.0
-0.5
-1.0
-1.5
-2.0
0
20
40
60
80
100
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
FORWARD CURRENT - mA
Figure 5. Dominant Wavelength Shift vs Forward Current
Figure 6. Representative Radiation Pattern for 15° Lamp
6
1
0.8
0.6
0.4
0.2
0
1
0.8
0.6
0.4
0.2
0
-90
-60
-30
0
30
60
90
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
ANGULAR DISPLACEMENT - DEGREES
Figure 7. Representative Radiation Pattern for 23° Lamp
Figure 8. Representative Radiation Pattern for 30° Lamp
0.4
0.3
0.2
0.1
0
250
200
150
100
50
Amber
Red
Amber
Red
-0.1
-0.2
-0.3
-0.4
0
-40 -20
0
20 40 60 80 100 120 140
TJ - JUNCTION TEMPERATURE - °C
-40 -20
0
20 40 60 80 100 120 140
TJ - JUNCTION TEMPERATURE - °C
Figure 9. Relative Light Output vs Junction Temperature
Figure 10. Forward Voltage Shift vs Junction Temperature
7
Intensity Bin Limit Table (1.3 : 1 Iv Bin Ratio)
Intensity (mcd) at 20 mA
Red Color Range
Min
Dom
Max
Dom
X min
Y Min
X max
Y max
Bin
V
Min
Max
618.0
630.0
0.6872
0.6690
0.3126
0.3149
0.6890
0.7080
0.2943
0.2920
4200
5500
7200
9300
12000
16000
5500
7200
9300
12000
16000
21000
W
X
Tolerance for each bin limit is 0.5 nm
Y
Amber Color Range
Z
Min
Dom
Max
Dom
1
Bin
Xmin
Ymin
Xmax Ymax
Tolerance for each bin limit is 15ꢀ
2
587.0
589.5
592.0
589.5
592.0
594.5
0.5570 0.4420 0.5670 0.4250
0.5530 0.4400 0.5720 0.4270
0.5720 0.4270 0.5820 0.4110
0.5670 0.4250 0.5870 0.4130
0.5870 0.4130 0.5950 0.3980
0.5820 0.4110 0.6000 0.3990
V Bin Table (V at 20 mA)
F
4
6
Bin ID
VD
Min
Max
2.0
2.2
2.4
1.8
2.0
2.2
VA
Tolerance for each bin limit is 0.5 nm
VB
Tolerance for each bin limit is 0.05 V
Note:
All bin categories are established for classification of products. Products
may not be available in all bin categories. Please contact your Avago
representative for further information.
Avago Color Bin on CIE 1931 Chromaticity Diagram
0.460
0.440
Amber
2
0.420
0.400
0.380
0.360
0.340
0.320
0.300
0.280
4
6
Red
0.500
0.550
0.600
0.650
X
0.700
0.750
0.800
8
Precautions:
Lead Forming:
Note:
• The leads of an LED lamp may be preformed or cut to
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 260°C and the solder
contact time does not exceeding 5sec. Over-stressing the LED during
soldering process might cause premature failure to the LED due to
delamination.
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Avago Technologies LED Configuration
Soldering and Handling:
• Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
Anode
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
1.59 mm
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
Note: In order to further assist customer in designing jig accurately
that fit Avago Technologies’ product, 3D model of the product is
available upon request.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• Recommended soldering condition:
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
Wave Soldering Manual Solder
[1, 2]
Dipping
Pre-heat temperature 105 °C Max.
-
Preheat time
Peak temperature
Dwell time
60 sec Max
260 °C Max.
5 sec Max.
-
260 °C Max.
5 sec Max
• Recommended PC board plated through holes (PTH)
size for LED component leads.
Note:
LED component
lead size
Plated through
hole diameter
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
Diagonal
0.45 x 0.45 mm
0.636 mm
0.98 to 1.08 mm
(0.039 to 0.043 inch)
(0.018x 0.018 inch) (0.025 inch)
0.50 x 0.50 mm 0.707 mm
(0.020x 0.020 inch) (0.028 inch)
• Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
9
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
260 °C Max
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C 5°C
(maximum peak temperature = 260°C)
105 °C Max
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
60sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Ammo Packs Drawing
6.35 ± ±.3ꢀ
ꢀ.25ꢀ ± ꢀ.ꢀ5±
±2.7ꢀ ± ±.ꢀꢀ
ꢀ.5ꢀꢀ ± ꢀ.ꢀ3ꢁ
CATHODE
2ꢀ.5 ± ±.ꢀꢀ
ꢀ.8ꢀ7ꢀ ± ꢀ.ꢀ3ꢁꢂ
ꢁ.±25 ± ꢀ.625
ꢀ.35ꢁ5 ± ꢀ.ꢀ2ꢂ5
±8.ꢀꢀ ± ꢀ.5ꢀ
ꢀ.7ꢀ85 ± ꢀ.ꢀ±ꢁ5
ꢂ.ꢀꢀ ± ꢀ.2ꢀ
ꢀ.±575 ± ꢀ.ꢀꢀ75
ꢀ.7ꢀ ± ꢀ.2ꢀ
ꢀ.ꢀ275 ± ꢀ.ꢀꢀ75
ø
TYP.
±2.7ꢀ ± ꢀ.3ꢀ
ꢀ.5ꢀꢀ ± ꢀ.ꢀ±2
A
A
VIEW A-A
Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff
10
Packaging Box for Ammo Packs
Note: The dimension for ammo pack is applicable for the device with standoff and without standoff.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 260C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
11
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3
max temp 260C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB”only)
(ii) Color bin incorporate with VF Bin
BIN: 2 VB
(Applicable for part number with color bins but without
VF bin OR part number with VF bins and no color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color bin
and VF bin)
VB: VF bin “VB”
2: Color bin 2 only
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale
as parts, components or assemblies for the planning, construction, maintenenace or direct operation of a
nuclear facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to
make claims against Avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2015 Avago Technologies. All rights reserved.
AV02-4951EN - June 17, 2015
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