HLMP-EL30-MQ000 [AVAGO]
T-13/4 (5 mm) Precision Optical Performance AlInGaP LED Lamps; T- 13/4 （ 5毫米）的精密光学性能的AlInGaP LED灯
| 型号： | HLMP-EL30-MQ000 |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-13/4 (5 mm) Precision Optical Performance AlInGaP LED Lamps |
| 文件： | 总15页 (文件大小：395K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-ELxx, HLMP-EHxx, HLMP-EJxx, HLMP-EGxx
3
T-1 / (5 mm) Precision Optical Performance
4
AlInGaP LED Lamps
Data Sheet
Description
Features
• Well defined spatial radiation patterns
• Viewing angles: 8°, 15°, 23°, 30°
• High luminous output
ThesePrecisionOpticalPerformanceAlInGaPLEDsprovide
superior light output for excellent readability in sunlight
and are extremely reliable. AlInGaP LED technology pro-
vides extremely stable light output over long periods of
time.PrecisionOpticalPerformancelampsutilizethealumi-
num indium gallium phosphide (AlInGaP) technology.
• Colors:
590 nm amber
605 nm orange
615 nm reddish-orange
626 nm red
3
These LED lamps are untinted, nondiffused, T-1 / pack-
4
ages incorporating second generation optics producing
well defined spatial radiation patterns at specific viewing
cone angles.
• High operating temperature: T led =+130°C
J
• Superior resistance to moisture
These lamps are made with an advanced optical grade
epoxy, offering superior high temperature and high mois-
ture resistance performance in outdoor signal and sign
applications. The high maximum LED junction tempera-
ture limit of +130°C enables high temperature operation
inbrightsunlightconditions.Thepackageepoxycontains
both uv-a and uv-b inhibitors to reduce the effects of long
term exposure to direct sunlight.
• Package options:
With or without lead stand-offs
Applications
• Traffic management:
Traffic signals
Pedestrian signals
Work zone warning lights
Variable message signs
These lamps are available in two package options to give
the designer flexibility with device mounting.
• Commercial outdoor advertising:
Signs
Marquees
Benefits
• Viewinganglesmatchtrafficmanagementsignrequire-
ments
• Automotive:
Exterior and interior lights
• Colors meet automotive and pedestrian signal speci-
fications
• Superior performance in outdoor environments
• Suitable for autoinsertion onto PC boards
Device Selection Guide
Typical
Color and Dominant
Lamps without
Standoffs on Leads
(Outline Drawing A)
Lamps with Standoffs
on Leads
(Outline Drawing B)
Luminous Intensity
Viewing Angle
2θ1/2 (Deg.)[4]
Wavelength
(nm), Typ.[3]
Iv (mcd)[1,2,5] @ 20 mA
Min.
Max.
8°
Amber 590
HLMP-EL08-T0000
HLMP-EL08-VY000
HLMP-EL08-VYK00
HLMP-EL08-WZ000
HLMP-EL08-X1K00
HLMP-EL08-X1000
HLMP-EJ08-WZ000
HLMP-EJ08-X1000
HLMP-EJ08-Y2000
HLMP-EH08-UX000
HLMP-EH08-WZ000
HLMP-EH08-X1000
HLMP-EH08-Y2000
HLMP-EG08-T0000
HLMP-EG08-VY000
HLMP-EG08-WZ000
HLMP-EG08-X1000
HLMP-EG08-YZ000
HLMP-EG08-Y2000
HLMP-EL10-T0000
HLMP-EL10-VY000
2500
4200
4200
5500
7200
7200
5500
7200
9300
3200
5500
7200
9300
2500
4200
5500
7200
9300
9300
–
12000
12000
16000
21000
21000
16000
21000
27000
9300
HLMP-EL10-WZ000
HLMP-EL10-X1K00
HLMP-EL10-X1000
Orange 605
HLMP-EJ10-X1000
Red-Orange 615
HLMP-EH10-UX000
HLMP-EH10-WZ000
HLMP-EH10-X1000
HLMP-EH10-Y2000
HLMP-EG10-T0000
16000
21000
27000
–
Red 626
12000
16000
21000
16000
27000
HLMP-EG10-WZ000
HLMP-EG10-X1000
HLMP-EG10-Y2000
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d
4. θ is the off-axis angle where the luminous intensity is half the on-axis intensity.
1/2
5. Tolerance for each intensity bin limit is 15ꢀ.
2
Device Selection Guide
Typical
Color and Dominant
Lamps without
Standoffs on Leads
(Outline Drawing A)
Lamps with Standoffs
on Leads
(Outline Drawing B)
Luminous Intensity
Viewing Angle
2θ1/2 (Deg.)[4]
Wavelength
(nm), Typ.[3]
Iv (mcd)[1,2,5] @ 20 mA
Min.
Max.
15°
Amber 590
HLMP-EL17-M0000
520
–
HLMP-EL15-PS000
HLMP-EL15-QSK00
HLMP-EL15-QT000
HLMP-EL15-RU000
HLMP-EL15-TW000
HLMP-EL15-TWK00
HLMP-EL15-UX000
HLMP-EL15-VY000
HLMP-EL15-VYK00
HLMP-EL15-VW000
880
2500
2500
3200
4200
7200
7200
9300
12000
12000
7200
3200
2500
4200
5500
3200
4200
7200
9300
–
1150
1150
1500
2500
2500
3200
4200
4200
4200
1150
880
HLMP-EL17-TW000
HLMP-EL17-UX000
HLMP-EL17-VY000
Orange 605
Red-Orange 615
Red 626
HLMP-EJ17-QT000
HLMP-EJ17-SV000
HLMP-EJ15-PS000
HLMP-EJ15-RU000
HLMP-EJ15-SV000
HLMP-EH15-QT000
HLMP-EH15-RU000
HLMP-EH15-TW000
HLMP-EH15-UX000
HLMP-EG15-N0000
HLMP-EG15-PS000
HLMP-EG15-QT000
HLMP-EG15-RU000
HLMP-EG15-UX000
HLMP-EG15-TW000
1500
1900
1150
1500
2500
3200
680
HLMP-EH17-TW000
HLMP-EH17-UX000
HLMP-EG17-N0000
880
2500
3200
4200
9300
7200
HLMP-EG17-QT000
HLMP-EG17-RU000
HLMP-EG17-UX000
HLMP-EG17-TW000
1150
1500
3200
2500
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d
4. θ is the off-axis angle where the luminous intensity is half the on-axis intensity.
1/2
5. Tolerance for each intensity bin limit is 15ꢀ.
3
Device Selection Guide
Typical
Color and Dominant
Lamps without
Standoffs on Leads
(Outline Drawing A)
Lamps with Standoffs
on Leads
(Outline Drawing B)
Luminous Intensity
Viewing Angle
2θ1/2 (Deg.)[4]
Wavelength
(nm), Typ.[3]
Iv (mcd)[1,2,5] @ 20 mA
Min.
Max.
23°
Amber 590
HLMP-EL24-L0000
HLMP-EL24-MQ000
HLMP-EL24-NR000
HLMP-EL24-PS000
HLMP-EL24-QR000
HLMP-EL24-QRK00
HLMP-EL24-QS400
HLMP-EL24-QT000
HLMP-EL24-RU000
HLMP-EL24-RUK00
HLMP-EL24-SV000
HLMP-EL24-SUK00
HLMP-EL24-SU400
HLMP-EL24-SVK00
HLMP-EL24-TW000
HLMP-EL24-TWK00
HLMP-EJ24-QT000
HLMP-EH24-PS000
HLMP-EH24-QT000
HLMP-EH24-RU000
HLMP-EH24-SV000
HLMP-EG24-M0000
HLMP-EG24-PS000
HLMP-EG24-QT000
HLMP-EG24-RU000
HLMP-EL26-L0000
400
–
520
1500
1900
2500
1900
1900
2500
3200
4200
4200
5500
4200
4200
5500
7200
7200
3200
2500
3200
4200
5500
–
680
HLMP-EL26-PS000
880
1150
1150
1150
1150
1150
1150
1900
1900
1900
1900
2500
2500
1150
880
HLMP-EL26-QT000
HLMP-EL26-RU000
HLMP-EL26-SV000
HLMP-EL26-TW000
HLMP-EH26-PS000
Orange 605
Red-Orange 615
1150
1500
1900
520
HLMP-EH26-SV000
HLMP-EG26-M0000
HLMP-EG26-PS000
Red 626
880
2500
4200
4200
1150
1500
HLMP-EG26-RU000
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d
4. θ is the off-axis angle where the luminous intensity is half the on-axis intensity.
1/2
5. Tolerance for each intensity bin limit is 15ꢀ.
4
Device Selection Guide
Typical
Color and Dominant
Lamps without
Standoffs on Leads
(Outline Drawing A)
Lamps with Standoffs
on Leads
(Outline Drawing B)
Luminous Intensity
Viewing Angle
2θ1/2 (Deg.)[4]
Wavelength
(nm), Typ.[3]
Iv (mcd)[1,2,5] @ 20 mA
Min.
Max.
30°
Amber 590
HLMP-EL30-K0000
HLMP-EL30-MQ000
HLMP-EL32-K0000
HLMP-EL32-NR000
310
–
520
1500
1900
1500
1900
2500
2500
3200
3200
3200
4200
4200
3200
5500
5500
1900
2500
1500
1900
2500
4200
4200
–
680
HLMP-EL30-PQ000
HLMP-EL30-PR400
HLMP-EL30-PS000
HLMP-EL30-PSK00
HLMP-EL30-QT000
HLMP-EL30-QTK00
HLMP-EL30-ST000
HLMP-EL30-SU400
HLMP-EL30-SUK00
HLMP-EL30-STK00
HLMP-EL30-SV000
HLMP-EL30-SVK00
HLMP-EJ30-NR000
HLMP-EJ30-PS000
HLMP-EH30-MQ000
HLMP-EH30-NR000
HLMP-EH30-PS000
HLMP-EH30-QT000
HLMP-EH30-RU000
HLMP-EG30-K0000
HLMP-EG30-KN000
HLMP-EG30-MQ000
HLMP-EG30-NQ000
HLMP-EG30-NR000
HLMP-EG30-PQ000
HLMP-EG30-PR000
HLMP-EG30-PS000
HLMP-EG30-QT000
880
880
HLMP-EL32-PS000
HLMP-EL32-QT000
880
880
1150
1150
1900
1900
1900
1900
1900
1900
680
HLMP-EL32-SV000
Orange 605
HLMP-EJ32-PS000
HLMP-EH32-MQ000
HLMP-EH32-NR000
HLMP-EH32-PS000
HLMP-EH32-QT000
HLMP-EH32-RU000
HLMP-EG32-K0000
880
Red-Orange 615
520
680
880
1150
1500
270
Red 626
310
880
HLMP-EG32-MQ000
HLMP-EG32-NR000
520
1500
1500
1900
1500
1900
2500
3200
680
680
880
880
880
HLMP-EG32-QT000
1150
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. The optical axis is closely aligned with the package mechanical axis.
3. The dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d
4. θ is the off-axis angle where the luminous intensity is half the on-axis intensity.
1/2
5. Tolerance for each intensity bin limit is 15ꢀ.
5
Part Numbering System
HLMP - x x xx - x x x xx
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
YY: Flexi-Bin; Bulk Packaging
ZZ: Flexi-Bin; Ammo Pack
Color Bin Selections
0: No color bin limitation
4: Amber color bin 4 only
K: Amber color bins 2 and 4 only
Maximum Intensity Bin
0: No Iv bin limitation
Minimum Intensity Bin
Viewing Angle & Lead Stand Offs
08: 8 deg without lead stand offs
10: 8 deg with lead stand offs
15: 15 deg without lead stand offs
17: 15 deg with lead stand offs
24: 23 deg without lead stand offs
26: 23 deg with lead stand offs
30: 30 deg without lead stand offs
32: 30 deg with lead stand offs
Color
G: 626 nm Red
H: 615 nm Red-Orange
J: 605 nm Orange
L: 590 nm Amber
Package
E: 5 mm Round
Note: Please refer to AB 5337 for complete information on part numbering system.
6
Package Dimensions
A
B
5.00 ± 0.20
(0.197 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
8.71 ± 0.20
(0.343 ± 0.008)
d
1.14 ± 0.20
(0.045 ± 0.008)
2.35 (0.093)
MAX.
0.70 (0.028)
MAX.
1.50 ± 0.15
(0.059 ± 0.006)
31.60
(1.244)
MIN.
31.60
(1.244)
MIN.
0.70 (0.028)
MAX.
CATHODE
LEAD
CATHODE
LEAD
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
1.00
(0.039)
MIN.
0.50 ± 0.10
(0.020 ± 0.004)
SQ. TYP.
1.00
(0.039)
MIN.
5.80 ± 0.20
(0.228 ± 0.008)
5.80 ± 0.20
CATHODE
FLAT
(0.228 ± 0.008)
CATHODE
FLAT
2.54 ± 0.38
(0.100 ± 0.015)
2.54 ± 0.38
(0.100 ± 0.015)
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
2. TAPERS SHOWN AT TOP OF LEADS (BOTTOM OF LAMP PACKAGE) INDICATE AN EPOXY MENISCUS
THAT MAY EXTEND ABOUT 1 mm (0.040 in.) DOWN THE LEADS.
PART NO.
d
HLMP-XX10
12.37 ± 0.25
(0.487 ± 0.010)
12.42 ± 0.25
(0.489 ± 0.010)
12.52 ± 0.25
(0.493 ± 0.010)
11.96 ± 0.25
(0.471 ± 0.010)
HLMP-XX17
HLMP-XX26
HLMP-XX32
3. FOR DOME HEIGHTS ABOVE LEAD STAND-OFF SEATING PLANE, d, LAMP PACKAGE B, SEE TABLE.
7
Absolute Maximum Ratings at T = 25°C
A
[1,2,3]
DC Forward Current
..................................................................................... 50 mA
[2,3]
Peak Pulsed Forward Current
.......................................................................100 mA
[3]
Average Forward Current .................................................................................. 30 mA
Reverse Voltage (I = 100 µA)........................................................................................ 5 V
R
LED Junction Temperature....................................................................................... 130°C
Operating Temperature .........................................................................-40°C to +100°C
Storage Temperature ..............................................................................-40°C to +100°C
Notes:
1. Derate linearly as shown in Figure 4.
2. For long term performance with minimal light output degradation, drive currents between 10
mA and 30 mA are recommended. For more information on recommended drive conditions,
please refer to Application Brief I-024.
3. Operating at currents below 1 mA is not recommended. Please contact your local representa-
tive for further information.
Electrical/Optical Characteristics at T = 25°C
A
Parameter
Symbol
Min.
Typ.
Max.
Units
V
Test Conditions
Forward Voltage
IF = 20 mA
Amber (λd = 590 nm)
Orange (λd = 605 nm)
Red-Orange (λd = 615 nm)
Red (λd = 626 nm)
2.02
1.98
1.94
1.90
VF
2.4
Reverse Voltage
VR
5
20
V
IF = 100 µA
Peak Wavelength:
Peak of Wavelength of
Spectral Distribution
at IF = 20 mA
Amber (λd = 590 nm)
Orange (λd = 605 nm)
Red-Orange (λd = 615 nm)
Red (λd = 626 nm)
592
609
621
635
λPEAK
nm
nm
Spectral Halfwidth
∆λ1/2
17
Wavelength Width at
Spectral Distribution
1/2 Power Point at
IF = 20 mA
Speed of Response
ts
20
ns
Exponential Time
Constant, e-t/ts
Capacitance
C
40
pF
VF = 0, f = 1 MHz
Thermal Resistance
RθJ-PIN
240
°C/W
LED Junction-to-Cathode
Lead
Luminous Efficacy[1]
Amber (λd = 590 nm)
Orange (λd = 605 nm)
Red-Orange (λd = 615 nm)
Red (λd = 626 nm)
Emitted Luminous
Power/Emitted Radiant
Power
480
370
260
150
hv
lm/W
Luminous Flux
jv
he
500
mlm
IF = 20 mA
Luminous Efficiency [2]
Amber
Orange
Red-Orange
Red
Emitted Luminous
Flux/Electrical Power
12
13
13
13
lm/W
Note:
1. The radiant intensity, I , in watts per steradian, may be found from the equation I = I /h , where I is the luminous intensity in candelas and h
e
e
v
v
v
v
is the luminous efficacy in lumens/watt.
2. h = j / I x V , where j is the emitted luminous flux, I is electrical forward current and V is the forward voltage.
e
V
F
F
V
F
F
8
1.0
100
90
80
70
60
50
40
30
20
RED-ORANGE
RED
AMBER
ORANGE
RED
0.5
AMBER
10
0
1.0
0
550
600
650
700
1.5
2.0
2.5
3.0
WAVELENGTH – nm
V – FORWARD VOLTAGE – V
F
Figure 1. Relative intensity vs. peak wavelength
Figure 2. Forward current vs. forward voltage
3.0
2.5
2.0
1.5
1.0
55
50
45
40
35
30
25
20
15
10
5
0.5
0
0
0
20
40
60
80
100
120
0
20
40
60
T
– AMBIENT TEMPERATURE – °C
A
I – DC FORWARD CURRENT – mA
F
Figure 4. Maximum forward current vs. ambient temperature
Figure 3. Relative luminous intensity vs. forward
current
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
01.
0
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT – DEGREES
Figure 5. Representative spatial radiation pattern for 8° viewing angle lamps
9
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
30
60
90
120
150
180
Figure 6. Representative spatial radiation pattern for 15° viewing angle lamps
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-100
-50
0
50
100
ANGULAR DISPLACEMENT – DEGREES
Figure 7. Representative spatial radiation pattern for 23° viewing angle lamps
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
Figure 8. Representative spatial radiation pattern for 30° viewing angle lamps
10
10
Intensity Bin Limits
(mcd at 20 mA)
ORANGE
RED
RED-ORANGE
AMBER
Bin Name
Min.
Max.
400
K
L
310
1
400
520
M
N
P
520
680
680
880
880
1150
1500
1900
2500
3200
4200
5500
7200
9300
12000
16000
21000
27000
0.1
Q
R
S
1150
1500
1900
2500
3200
4200
5500
7200
9300
12000
16000
21000
-50
-25
0
25
50
75
100
125
150
JUNCTION TEMPERATURE – °C
Figure 9. Relative light output vs. junction temperature
T
U
V
W
X
Y
Z
1
2
Tolerance for each bin limit is 15ꢀ.
Amber Color Bin Limits
(nm at 20 mA)
Bin Name
Min.
Max.
1
2
4
6
584.5
587.0
589.5
592.0
587.0
589.5
592.0
594.5
Tolerance for each bin limit is 0.5 nm.
Note:
1. Bin categories are established for classifi-
cation of products. Products may not be
available in all bin categories.
Note:
Precautions:
Lead Forming:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
Thisishighlyrecommendedforhandsolderoperation,
as the excess lead length also acts as small heat sink.
Avago Technologies LED configuration
Soldering and Handling:
• CaremustbetakenduringPCBassemblyandsoldering
process to prevent damage to the LED component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The
closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59mm. Soldering the LED using soldering iron tip
closer than 1.59mm might damage the LED.
CATHODE
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
1.59mm
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of alignment fixture or pallet.
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended soldering condition:
Wave
Manual Solder
Dipping
Soldering [1, 2]
• Recommended PC board plated through holes (PTH)
Pre-heat temperature 105 °C Max.
-
size for LED component leads.
Preheat time
Peak temperature
Dwell time
60 sec Max
250 °C Max.
3 sec Max.
-
260 °C Max.
5 sec Max
LED component
lead size
Plated through
hole diameter
Diagonal
0.45 x 0.45 mm
0.636 mm
0.98 to 1.08 mm
(0.039 to 0.043 inch)
Note:
(0.018x 0.018 inch) (0.025 inch)
0.50 x 0.50 mm 0.707 mm
(0.020x 0.020 inch) (0.028 inch)
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Wavesolderingparametersmustbesetandmaintained
according to the recommended temperature and
dwell time. Customer is advised to perform daily check
on the soldering profile to ensure that it is always
conforming to recommended soldering conditions.
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
12
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
SAC305 (Lead free solder alloy)
250
200
150
100
50
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME (MINUTES)
Figure 10. Recommended wave soldering profile
Ammo Pack Drawing
6.35 1.30
(0.25 0.0512)
12.70 1.00
(0.50 0.0394)
CATHODE
20.50 1.00
(0.807 0.039)
9.125 0.625
(0.3593 0.0246)
18.00 0.50
(0.7087 0.0197)
A
A
4.00 0.20
(0.1575 0.008)
12.70 0.30
(0.50 0.0118)
∅
TYP.
VIEW A–A
0.70 0.20
(0.0276 0.0079)
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
13
Packaging Box for Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
+
A
AVAGO
TECHNOLOGIES
ANODE
–
CATHODE
ANODE LEAD LEAVES
THE BOX FIRST.
C
MOTHER LABEL
NOTE:
THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
14
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and
no color bin)
BIN: VB (represent VF bin “VB”only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
OR
(ii) Color bin incorporated with VF Bin
VB: VF bin “VB”
(Applicable for part number that have both color
bin and VF bin)
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR
FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE
CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies. All rights reserved. Obsoletes 5989-4368EN
AV02-0373EN - September 2, 2008
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