HLMP-HB70-TVBDD [AVAGO]
Green and Blue 5mm Standard Oval LEDs;
| 型号： | HLMP-HB70-TVBDD |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | Green and Blue 5mm Standard Oval LEDs |
| 文件： | 总11页 (文件大小：1259K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-HM70/HM71, HLMP-HB70/HB71
Green and Blue 5mm Standard Oval LEDs
Data Sheet
Description
Features
The oval shaped radiation pattern and high luminous intensity
ensure that these devices are excellent for wide field of view
outdoor applications where a wide viewing angle and
readability in sunlight are essential. The package epoxy
contains both UV inhibitors to reduce the effects of long-term
exposure to direct sunlight.
Well-defined spatial radiation patterns
High brightness material
Available in green and blue color
—
—
Green InGaN 525 nm
Blue InGaN 470 nm
Superior resistance to moisture
Standoff and non stand-off package
Tinted and diffused
Applications
Mono color signs
Typical viewing angle 40° x 100°
CAUTION
InGaN devices are Class 1C HBM ESD sensitive
per JEDEC Standard. Observe appropriate
precautions during handling and processing.
Refer to Application Note AN-1142 for additional
details.
Package Dimensions
0.50 0.10
0.004SQ. TYP.
1.02
0.040
0.70
0.028
3.80
0.150
A
MAX.
MAX.
0.020
5.20
0.204
2.54
0.10
CATHODE
LEAD
1.00
0.039
MIN.
7.00
0.275
25.00
0.984
MIN.
MEASURED AT BASE OF LENS.
3.80 0.20
B
0.50 0.10
0.004 SQ TYP.
10.45 0.50
0.41 0.020
1.30 0.20
0.051 0.008
0.020
0.150 0.008
5.20 0.20
0.205 0.008
CATHODE LEAD
2.54 0.30
7.00 0.20
24.00
MIN.
1.00
0.10 0.012
0.276 0.008
0.945
1.02
MIN.
MAX.
0.039
0.040
Notes:
All dimensions in millimeters (inches).
Tolerance is 0.20 mm unless otherwise specified.
Avago Technologies
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HLMP-HM70/HM71, HLMP-HB70/HB71
Data Sheet
Device Selection Guide
Device Selection Guide
Luminous Intensity
Color and Dominant
Iv (mcd) at 20 mAb,c,d
Package
Drawing
Wavelength d
(nm), Typa
Part Number
Standoff
Min
Max
HLMP-HB70-TVBDD
HLMP-HB70-TVCDD
HLMP-HB71-TVBDD
HLMP-HB71-TVCDD
HLMP-HM70-23BDD
HLMP-HM70-23CDD
HLMP-HM71-23BDD
HLMP-HM71-23CDD
Blue 470
800
800
1380
1380
1380
1380
5040
5040
5040
5040
No
No
Yes
Yes
No
No
Yes
Yes
A
A
B
B
A
A
B
B
Blue 470
Blue 470
800
Blue 470
800
Green 525
Green 525
Green 525
Green 525
3500
3500
3500
3500
a.
b. The luminous intensity is measured on the mechanical axis of the lamp package, and it is tested with pulsing condition.
c. The optical axis is closely aligned with the package mechanical axis.
The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d. Tolerance for each intensity bin limit is 15ꢀ.
Part Numbering System
HLMP-H x xx – x x x x x
Packaging Option
DD: Ammopack
Color Bin Selection
B: Color bin 2 and 3
C: Color bin 3 and 4
Maximum Intensity Bin
Refer to Device Selection Guide.
Minimum Intensity Bin
Refer to Device Selection Guide.
Standoff/Non Standoff
70: Without Standoff
71: With Standoff
Color
B: Blue
M: Green
Package
H: 5mm Standard Oval 40° x 100°
Note: Refer to AB 5337 for complete information on the part numbering system.
Avago Technologies
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HLMP-HM70/HM71, HLMP-HB70/HB71
Data Sheet
Absolute Maximum Ratings
Absolute Maximum Ratings
T = 25 °C
A
Parameter
Blue and Green
Unit
mA
DC Forward Currenta
30
mA
Peak Forward Current
100b
110
Power Dissipation
mW
°C
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
110
–40 to +85
–40 to +100
°C
°C
a.
Derate linearly as shown in Figure 4.
b. Duty Factor 10ꢀ, frequency 1 KHz.
Electrical/Optical Characteristics
T = 25 °C
A
Parameter
Symbol
Min
Typ
Max
Unit
Test Conditions
Forward Voltage
Green and Blue
VF
IF = 20 mA
IR = 10 μA
2.8
5
3.1
3.6
V
V
Reverse Voltagea
Green and Blue
VR
Dominant Wavelengthb
d
IF = 20 mA
520
460
525
470
540
480
nm
nm
Green
Blue
Peak Wavelength
Green
PEAK
Peak of Wavelength of Spectral Distribution at
IF = 20 mA
517
461
nm
nm
Blue
Thermal Resistance
RJ-PIN
240
°C/W
Im/W
LED Junction-to-Cathode Lead
Luminous Efficacyc
ηV
Emitted Luminous Flux/Electrical Power
475
68
Green
Blue
a.
Indicates product final testing condition; long-term reverse bias is not recommended.
b. The dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp.
c.
The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the luminous
efficacy in lumens/watt.
Avago Technologies
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HLMP-HM70/HM71, HLMP-HB70/HB71
Data Sheet
InGaN Blue and Green
InGaN Blue and Green
Figure 2 Forward Current vs. Forward Voltage
Figure 1 Relative Intensity vs. Wavelength
30
25
20
15
10
5
1.0
0.9
0.8
Blue
Green
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0
380
430
480
530
580
630
0
1
2
3
4
WAVELENGTH - nm
FORWARD VOLTAGE - V
Figure 3 Relative Intensity vs. Forward Current
Figure 4 Maximum Forward Current vs. Ambient Temperature
35
30
25
20
15
10
5
1.4
1.2
1
0.8
0.6
0.4
0.2
0
0
0
20
40
60
80
100
0
5
10
15
20
25
30
35
TA - AMBIENT TEMPERATURE - °C
DC FORWARD CURRENT - mA
Figure 5 Relative Dominant Wavelength vs Forward Current
12
10
8
6
Green
4
Blue
2
0
-2
-4
0
5
10
15
20
25
30
FORWARD CURRENT - mA
Avago Technologies
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HLMP-HM70/HM71, HLMP-HB70/HB71
Data Sheet
InGaN Blue and Green
Figure 6 Radiation Pattern, Major Axis
Figure 7 Radiation Pattern, Minor Axis
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
90
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
ANGULAR DISPLACEMENT - DEGREES
Figure 8 Relative Light Output vs Junction Temperature
Figure 9 Forward Voltage Shift vs Junction Temperature
10
0.3
BLUE
GREEN
BLUE
GREEN
0.2
0.1
0
1
-0.1
-0.2
-0.3
0.1
-40
-20
0
20
40
60
80
100 120
-40
-20
0
20
40
60
80
100 120
TJ - JUNCTION TEMPERATURE
T - JUNCTION TEMPERATURE
J
Avago Technologies
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HLMP-HM70/HM71, HLMP-HB70/HB71
Data Sheet
Intensity Bin Limits (1.2: 1 Iv Bin Ratio)
Intensity Bin Limits (1.2: 1 Iv Bin Ratio)
Intensity (mcd) at 20 mA
Bina
Intensity (mcd) at 20 mA
Bina
Min
Max
Min
Max
T
U
V
800
960
960
Y
Z
1
2
3
1990
2400
2900
3500
4200
2400
2900
3500
4200
5040
1150
1380
1660
1990
1150
1380
1660
W
X
a.
Tolerance for each bin limit is 15ꢀ.
Green Color Bin Table
Bina
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
520.0
524.0
0.0743
0.1650
0.1060
0.1856
0.1387
0.2068
0.1702
0.2273
0.2003
0.2469
0.8338
0.6586
0.8292
0.6556
0.8148
0.6463
0.7965
0.6344
0.7764
0.6213
0.1856
0.1060
0.2068
0.1387
0.2273
0.1702
0.2469
0.2003
0.2659
0.2296
0.6556
0.8292
0.6463
0.8148
0.6344
0.7965
0.6213
0.7764
0.6070
0.7543
2
3
4
5
524.0
528.0
532.0
536.0
528.0
532.0
536.0
540.0
a.
Tolerance for each bin limit is 0.5 nm.
Blue Color Bin Table
Bina
Min Dom
Max Dom
Xmin
Ymin
Xmax
Ymax
1
460.0
464.0
0.1440
0.1818
0.1374
0.1766
0.1291
0.1699
0.1187
0.1616
0.1063
0.1517
0.0297
0.0904
0.0374
0.0966
0.0495
0.1062
0.0671
0.1209
0.0945
0.1423
0.1766
0.1374
0.1699
0.1291
0.1616
0.1187
0.1517
0.1063
0.1397
0.0913
0.0966
0.0374
0.1062
0.0495
0.1209
0.0671
0.1423
0.0945
0.1728
0.1327
2
3
4
5
464.0
468.0
472.0
476.0
468.0
472.0
476.0
480.0
a.
Tolerance for each bin limit is 0.5 nm.
Note: All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago
representative for further information.
Avago Technologies
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HLMP-HM70/HM71, HLMP-HB70/HB71
Data Sheet
Precautions
Wave soldering parameters must be set and maintained
Precautions
according to the recommended temperature and dwell
time. The customer is advised to perform daily checks on
the soldering profile to ensure that it is always conforming
to recommended soldering conditions.
Lead Forming
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
NOTE PCBs with different size and design
(component density) will have different heat
mass (heat capacity). This might cause a
change in temperature experienced by the
board if the same wave soldering setting is
used. So, it is recommended to recalibrate the
soldering profile again before loading a new
type of PCB.
For better control, it is recommended to use the proper
tool to precisely form and cut the leads to the applicable
length rather than doing it manually.
If manual lead cutting is necessary, cut the leads after the
soldering process. The solder connection forms a
mechanical ground that prevents mechanical stress due to
lead cutting from traveling into LED package. This is highly
recommended for hand soldering operation, as the excess
lead length also acts as small heat sink.
Avago Technologies LED Configuration
Soldering and Handling
Take care during PCB assembly and soldering process to
prevent damage to the LED component.
LED component may be effectively hand soldered to PCB.
However, it is recommended only under unavoidable
circumstances, such as rework. The closest manual
soldering distance of the soldering heat source (soldering
iron’s tip) to the body is 1.59 mm. Soldering the LED using
soldering iron tip closer than 1.59 mm might damage the
LED.
Cathode
InGaN device
1.59mm
Any alignment fixture that is being applied during wave
soldering should be loosely fitted and should not apply
weight or force on LED. Nonmetal material is
recommended as it will absorb less heat during wave
soldering process.
ESD precautions must be properly applied on the
soldering station and personnel to prevent ESD damage to
the LED component that is ESD sensitive. Refer to Avago
application note AN 1142 for details. The soldering iron
used should have a grounded tip to ensure electrostatic
charge is properly grounded.
At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, the PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
If the PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended that
surface mount components be soldered on the top side of
the PCB. If the surface mount must be on the bottom side,
these components should be soldered using reflow
soldering prior to insertion the TH LED.
Recommended soldering condition:
Wave
Manual Solder
Dipping
Solderinga,b
Pre-heat temperature
105 °C Max.
60 sec Max
260 °C Max.
5 sec Max.
—
—
Preheat time
Peak temperature
Dwell time
260 °C Max.
5 sec Max
a.
Above conditions refer to measurement with thermocouple mounted
at the bottom of PCB.
b. It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
Avago Technologies
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HLMP-HM70/HM71, HLMP-HB70/HB71
Data Sheet
Application Precautions
The following table shows the recommended PC board
plated through holes (PTH) size for LED component leads.
Application Precautions
The drive current of the LED must not exceed the
maximum allowable limit across temperature as stated in
the data sheet. Constant current driving is recommended
to ensure consistent performance.
LEDs do exhibit slightly different characteristics at different
drive currents that might result in larger performance
variations (such as intensity, wavelength, and forward
voltage). The user is recommended to set the application
current as close as possible to the test current to minimize
these variations.
The LED is not intended for reverse bias. Use other
appropriate components for such purposes. When driving
the LED in matrix form, it is crucial to ensure that the
reverse bias voltage does not exceed the allowable limit of
the LED.
LED Component
Lead Size
Plated Through Hole
Diameter
Diagonal
0.45 × 0.45 mm
(0.018 × 0.018 inch)
0.636 mm
(0.025 in.)
0.98 to 1.08 mm
(0.039 to 0.043 in.)
0.50 x 0.50 mm
(0.020 × 0.020 inch)
0.707 mm
(0.028 in.)
1.05 to 1.15 mm
(0.041 to 0.045 in.)
Over-sizing the PTH can lead to a twisted LED after
clinching. On the other hand, under-sizing the PTH can
cause difficulty when inserting the TH LED.
NOTE Refer to application note AN5334 for more
information about soldering and handling of
high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
260°C Max
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C 5°C
(maximum peak temperature = 260°C)
105°C Max
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
60 sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Avago Technologies
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HLMP-HM70/HM71, HLMP-HB70/HB71
Data Sheet
Ammo Packs Drawing
Ammo Packs Drawing
12.70 1.00
0.50 0.0394
6.35 1.30
0.25 0.0512
CATHODE
20.50 1.00
0.8071 0.0394
9.125 0.625
0.3593 0.0246
18.00 0.50
0.7087 0.0197
4.00 0.20
0.1575 0.008
TYP
Ø
A
A
12.70 0.30
0.50 0.0118
VIEW A - A
0.70 0.20
0.0276 0.0079
Packaging Box for Ammo Packs
Avago Technologies
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HLMP-HM70/HM71, HLMP-HB70/HB71
Data Sheet
Packaging Labels
Packaging Labels
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
(1P) Item: Part Number
RoHS Compliant
e3
max temp 260C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3
max temp 260C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Avago Technologies
- 10 -
Acronyms and Definitions
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
—
Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin
—
—
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB” only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB, where:
OR
—
(ii) Color bin incorporated with VF Bin
2 is color bin 2 only
VB is VF bin "VB"
—
Applicable for part number that have both color bin
and VF bin
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS
PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR
FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE
CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago Technologies and the A logo are trademarks of Avago Technologies in the United
States and other countries. All other brand and product names may be trademarks of their
respective companies.
Lead (Pb) Free
RoHS 6 fully
compliant
Data subject to change. Copyright © 2005-2016 Avago Technologies. All Rights Reserved.
AV02-3730EN – July 13, 2016
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