HLMP-HL63-VV1DD
更新时间:2024-09-18 14:55:32
品牌:AVAGO
描述:SINGLE COLOR LED, AMBER, 5mm, ROHS COMPLIANT, PLASTIC PACKAGE-2
HLMP-HL63-VV1DD 概述
SINGLE COLOR LED, AMBER, 5mm, ROHS COMPLIANT, PLASTIC PACKAGE-2 可见光 LED
HLMP-HL63-VV1DD 规格参数
是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | ROHS COMPLIANT, PLASTIC PACKAGE-2 |
Reach Compliance Code: | compliant | HTS代码: | 8541.40.20.00 |
风险等级: | 5.75 | 颜色: | AMBER |
配置: | SINGLE | 最大正向电流: | 0.05 A |
透镜类型: | TINTED DIFFUSED | 标称发光强度: | 1265.0 mcd |
安装特点: | RADIAL MOUNT | 功能数量: | 2 |
端子数量: | 2 | 最高工作温度: | 100 °C |
最低工作温度: | -40 °C | 光电设备类型: | SINGLE COLOR LED |
总高度: | 7 mm | 包装方法: | AMMO PACK |
峰值波长: | 590 nm | 形状: | OVAL |
尺寸: | 5 mm | 表面贴装: | NO |
端子节距: | 2.54 mm | 视角: | 40 deg |
Base Number Matches: | 1 |
HLMP-HL63-VV1DD 数据手册
通过下载HLMP-HL63-VV1DD数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载HLMP-AG62/AG63, AH62/AH63, AL62/AL63
HLMP-HG62/HG63, HH62/HH63, HL62/HL63
5mm Mini Oval and Standard Oval AlInGaP LEDs
Data Sheet
Description
Features
These Precision Optical Performance AlInGaP Oval
LEDs are specifically designed for full color/video and
passenger information signs. The oval shaped radiation
pattern and high luminous intensity ensure that these
devices are excellent for wide field of view outdoor ap-
plications where a wide viewing angle and readability in
sunlight are essential. The package epoxy contains both
UV-A and UV-B inhibitors to reduce the effects of long
term exposure to direct sunlight.
• Viewing Angle: 30°x70° and 40°x100°
• Colors:
590nm Amber
615nm Red-Orange
626nm Red
• Well defined spatial radiation pattern
• High brightness material
• Superior resistance to moisture
Applications
• Package options:
Stand-off and Non Stand-off Leads
• Full color signs
• Tinted and diffused
Package Dimensions
For 5mm Mini Oval 30°x70°
Package Drawing A
0.ꢀ
0.032
max.
3.ꢀ0 0.200
0.150 0.00ꢀ
0.50 0.10
0.020 0.004
sq. typ.
ꢀ.70 0.20
0.342 0.00ꢀ
0.70
0.02ꢀ
max.
5.20 0.200
0.205 0.00ꢀ
2.54 0.3
0.100 0.012
cathode lead
min.
1.00
0.03ꢀ
24.00
0.945
min.
Package Drawing B
1.50 0.15
0.0591 0.006
0.50 0.10
0.020 0.004
sq. typ.
11.70 0.50
0.4606 0.020
3.ꢀ0 0.200
0.150 0.00ꢀ
0.70
0.02ꢀ
max.
5.20 0.20
0.205 0.00ꢀ
2.54 0.3
0.100 0.012
cathode lead
min.
24.00
0.945
ꢀ.70 0.20
0.342 0.00ꢀ
1.00
0.03ꢀ
min.
0.ꢀ
0.032
max.
For 5mm Standard Oval 40°x100°
Package Drawing C
1.02
max.
0.040
3.ꢀ0
0.150
0.50 0.10
.020 .004
sq. typ.
0.70
.02ꢀ
max.
5.20
0.205
2.54
0.10
cathode lead
1.00
.039
min.
25.00
0.9ꢀ4
7.00
0.276
min.
Package Drawing D
3.ꢀ0
0.150
1.50 0.15
0.059 0.006
0.50 0.10
0.020 0.004
sq. typ.
10.ꢀ0 0.50
0.425 0.020
5.20
0.205
cathode lead
min.
2.54 0.30
0.10 0.012
7.00
0.276
24.00
0.945
1.00
0.039
min.
1.02
0.040
max.
Notes:
All dimensions in millimeters (inches).
2
Device Selection Guide
5mm Mini Oval 30°x70°
Color and Dominant
Wavelength λd (nm)
Typ.
Luminous Intensity
Iv (mcd) at 20 mA
Min.
Luminous Intensity
Iv (mcd) at 20 mA
Max.
Package
Drawing
Part Number
Stand-Off
No
HLMP-AL62-UX0DD
HLMP-AL62-X10DD
HLMP-AH62-UX0DD
HLMP-AH62-X10DD
HLMP-AG62-UX0DD
HLMP-AG62-X10DD
HLMP-AL63-UX0DD
HLMP-AL63-X10DD
HLMP-AH63-UX0DD
HLMP-AH63-X10DD
HLMP-AG63-UX0DD
HLMP-AG63-X10DD
Amber 590
Amber 590
Red-Orange 615
Red-Orange 615
Red 626
960
1990
3500
1990
3500
1990
3500
1990
3500
1990
3500
1990
3500
A
A
A
A
A
A
B
B
B
B
B
B
1660
960
No
No
1660
960
No
No
Red 626
1660
960
No
Amber 590
Amber 590
Red-Orange 615
Red-Orange 615
Red 626
Yes
Yes
Yes
Yes
Yes
Yes
1660
960
1660
960
Red 626
1660
5mm Standard Oval 40°x100°
Color and Dominant
Wavelength λd (nm)
Typ
Luminous Intensity
Iv (mcd) at 20 mA
Min.
Luminous Intensity
Iv (mcd) at 20 mA
Max.
Package
Drawing
Part Number
Stand-Off
No
HLMP-HL62-TX0DD
HLMP-HH62-TX0DD
HLMP-HG62-TX0DD
HLMP-HL63-TX0DD
HLMP-HH63-TX0DD
HLMP-HG63-TX0DD
Notes:
Amber 590
Red-Orange 615
Red 626
800
800
800
800
800
800
1990
1990
1990
1990
1990
1990
C
C
C
D
D
D
No
No
Amber 590
Red-Orange 615
Red 626
Yes
Yes
Yes
1. The luminous intensity is measured on the mechanical axis of the lamp package.
2. Tolerance for each intensity limit is 15ꢀ.
3. Please refer to AN 5352 for detail information on features of stand-off and non stand-off LEDs.
3
Part Numbering System
HLMP- x x 62/63 - x x x x x
Packaging Option
DD: Ammopacks
Color Bin Selection
0: Open distribution
Maximum Intensity Bin
Refer to Device Selection Guide
Minimum Intensity Bin
Refer to Device Selection Guide.
Color
G: Red 626nm
H: Red Orange 615nm
L: Amber 590nm
Package
A: 5mm Mini Oval 30° x 70°
H: 5mm Standard Oval 40°x100°
Note: Please refer to AB 5337 for complete information on part numbering system.
Absolute Maximum Ratings
T = 25°C
A
Parameter
Value
Unit
mA
mA
mW
V
DC Forward Current [1]
Peak Forward Current
Power Dissipation
50
100 [2]
120
Reverse Voltage
5 (IR = 100 μA)
130
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
°C
-40 to +100
-40 to +100
°C
°C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty Factor 30ꢀ, frequency 1kHz.
4
Electrical / Optical Characteristics
T = 25°C
A
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
Amber
Red
2.2
2.1
2.0
VF
VR
1.8
5
2.4
V
V
IF = 20 mA
Red-Orange
Reverse Voltage
IR = 100 μA
Dominant Wavelength [1]
Amber
Red
Red-Orange
584.5
620
612
594.5
630
621.7
nm
IF = 20 mA
λd
Peak Wavelength
Amber
Red
590
626
615
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
nm
λPEAK
Red-Orange
Thermal Resistance
240
°C/W
LED Junction-to-Anode Lead
RθJ-PIN
Luminous Efficacy [2]
Amber
Red
480
150
260
lm/W
Emitted Luminous Power/Emitted
Radiant Power
ηV
Red-Orange
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp. Tolerance for each color of dominant
wavelength is 0.5nm.
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = IV/η where I is the luminous intensity in candelas and η is
V
V
V
the luminous efficacy in lumens/watt.
Figure 1. Relative intensity vs. peak wavelength
5
2.5
2
60
50
40
30
20
10
RED
RED-ORANGE
1.5
1
AMBER
0.5
0
0
0
10
20
30
40
50
0
0.5
1
1.5
2
2.5
3
DC FORWARD CURRENT - mA
FORWARD VOLTAGE - V
Figure 2. Forward current vs. forward voltage
Figure 3. Relative luminous intensity vs. forward current
55
50
45
40
35
30
25
20
15
10
5
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
0
20
40
60
80
100
120
-90
-60
-30
0
30
60
90
TA - AMBIENT TEMPERATURE - ºC
ANGULAR DISPLACEMENT - DEGREES
Figure 4. Maximum forward current vs. ambient temperature
Figure 5. Representative Radiation pattern for 30°x70° Lamp -Major Axis
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
-60
-30
0
30
60
90
-90
-60
-30
ANGULAR DISPLACEMENT - DEGREES
Figure 7. Representative Radiation pattern for 40°x100° Lamp -Major Axis
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
Figure 6. Representative Radiation pattern 30°x70° Lamp -Minor Axis
6
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10
1
AMBER
RED-ORANGE
RED
0.1
-90
-60
-30
0
30
60
90
-50
-25
0
25
50
75
100
125
150
JUNCTION TEMPERATURE - °C
ANGULAR DISPLACEMENT - DEGREES
Figure ꢀ. Representative Radiation pattern 40°x100° Lamp –Minor Axis
Figure 9. Relative Light Output vs Junction temperature
Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)
Intensity (mcd) at 20 mA
VF Bin Table (V at 20mA)
Bin ID
VD
Min
1.8
2.0
2.2
Max
2.0
2.2
2.4
Bin
U
V
Min
Max
VA
960
1150
1380
1660
1990
2400
2900
3500
VB
1150
1380
1660
1990
2400
2900
W
X
Tolerance for each bin limit is 0.05V
Y
Amber Color Bin Limits
Z
Bin
1
Min
Max
1
584.5
587.0
589.5
592.0
587.0
589.5
592.0
594.5
2
Tolerance for each bin limit is 15ꢀ
4
6
Tolerance for each bin limit is 0.5nm.
7
Precautions:
Lead Forming:
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms
a mechanical ground which prevents mechanical
stress due to lead cutting from traveling into LED
package. This is highly recommended for hand solder
operation, as the excess lead length also acts as small
heat sink.
Avago Technologies LED configuration
Soldering and Handling:
• Care must be taken during PCB assembly and
soldering process to prevent damage to the LED
component.
Anode
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The
closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59mm. Soldering the LED using soldering iron tip
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
1.59mm
Note: In order to further assist customer in designing jig accurately
that fit Avago Technologies’ product, 3D model of the product is
available upon request.
closer than 1.59mm might damage the LED.
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of alignment fixture or pallet.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on
the top side of the PCB. If surface mount need to be
on the bottom side, these components should be
soldered using reflow soldering prior to insertion the
TH LED.
• Recommended soldering condition:
Wave
Soldering
Manual Solder
Dipping
[1, 2]
Pre-heat temperature 105 °C Max.
-
Preheat time
Peak temperature
Dwell time
60 sec Max
250 °C Max.
3 sec Max.
-
260 °C Max.
5 sec Max
• Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size
Plated through
hole diameter
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
Diagonal
0.45 x 0.45 mm
0.636 mm
0.98 to 1.08 mm
(0.039 to 0.043 inch)
(0.018x 0.018 inch) (0.025 inch)
0.50 x 0.50 mm 0.707 mm
(0.020x 0.020 inch) (0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED
8
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
Flux: Rosin flux
Solder bath temperature:
245°C 5°C (maximum peak
temperature = 250°C)
200
150
100
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
50
PREHEAT
0
90
100
30
40
80
10
20
60
70
50
Ammo Packs Drawing
12.70 1.00
0.50 0.0394
6.35 1.30
0.25 0.0512
CATHODE
20.50 1.00
0.8071 0.0394
9.125 0.625
0.3593 0.0246
18.00 0.50
0.7087 0.0197
4.00 0.20
0.1575 0.008
TYP
Ø
A
A
12.70 0.30
0.50 0.0118
VIEW A - A
0.70 0.20
0.0276 0.0079
9
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
LABEL ON THIS
SIDE OF BOX
ANODE LEAD LEAVES
THE BOX FIRST.
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
10
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB”only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR
(ii) Color bin incorporated with VF Bin
VB: VF bin “VB”
(Applicable for part number that have both color bin
and VF bin)
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR
AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAIN-
TENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS.
CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUP-
PLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-1314EN - April 19, 2011
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