HLMP-HM57-SV0ZZ [AVAGO]
T-1 3/4 SINGLE COLOR LED, GREEN, 5mm, PLASTIC PACKAGE-2;
| 型号： | HLMP-HM57-SV0ZZ |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | T-1 3/4 SINGLE COLOR LED, GREEN, 5mm, PLASTIC PACKAGE-2 光电 |
| 文件： | 总12页 (文件大小：292K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
higher
performance
AluminumꢀIndium
GalliumPhosphideꢀ
HLMP-HD55, HLMP-HM57, HLMP-HB57
Precision Optical Performance Red, Green and Blue
5 mm Standard Oval LEDs
Data Sheet
Description
Features
Theseꢀ Precisionꢀ Opticalꢀ Performanceꢀ Ovalꢀ LEDsꢀ areꢀ
specificallyꢀdesignedꢀforꢀfullꢀcolor/videoꢀandꢀpassengerꢀ
informationꢀsigns.ꢀTheꢀovalꢀshapedꢀradiationꢀpatternꢀandꢀ
highꢀluminousꢀintensityꢀensureꢀtheseꢀdevicesꢀareꢀexcellentꢀ
forꢀwideꢀfieldꢀofꢀviewꢀoutdoorꢀapplicationsꢀwhereꢀaꢀwideꢀ
viewingꢀangleꢀandꢀreadabilityꢀinꢀsunlightꢀareꢀessential.ꢀ
Theseꢀlampsꢀhaveꢀveryꢀsmooth,ꢀmatchedꢀradiationꢀpat-
ternsꢀensuringꢀconsistentꢀcolorꢀmixingꢀinꢀfullꢀcolorꢀapplica-
tions,ꢀmessageꢀuniformityꢀacrossꢀtheꢀviewingꢀangleꢀofꢀtheꢀ
sign.ꢀHighꢀefficiencyꢀLEDꢀmaterialꢀisꢀusedꢀinꢀtheseꢀlamps:ꢀ
•ꢀ Wellꢀdefinedꢀspatialꢀradiationꢀpattern
•ꢀ Highꢀbrightnessꢀmaterial
•ꢀ Availableꢀinꢀred,ꢀgreenꢀandꢀblueꢀcolorꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
RedꢀAlInGaPꢀ630ꢀnmꢀ
GreenꢀInGaNꢀ525ꢀnmꢀ
BlueꢀInGaNꢀ470ꢀnm
ꢀ
ꢀ
ꢀ
ꢀ
•ꢀ Tintedꢀandꢀdiffused
Benefits
•ꢀ Viewingꢀangleꢀdesignedꢀforꢀwideꢀfieldꢀofꢀviewꢀapplica-
tions
(AlInGaPꢀII)ꢀforꢀredꢀcolor,ꢀIndiumꢀGalliumꢀNitrideꢀ(InGaN)ꢀ
forꢀblueꢀandꢀgreen.ꢀEachꢀlampꢀisꢀmadeꢀwithꢀanꢀadvanceꢀ
opticalꢀgradeꢀepoxyꢀofferingꢀsuperiorꢀhighꢀtemperatureꢀ
andꢀhighꢀmoistureꢀresistanceꢀinꢀoutdoorꢀapplications.ꢀ
•ꢀ Superiorꢀperformanceꢀforꢀoutdoorꢀenvironments
Applications
TheꢀpackageꢀepoxyꢀcontainsꢀbothꢀUV-AꢀandꢀUV-Bꢀinhibi-
torsꢀtoꢀreduceꢀtheꢀeffectsꢀofꢀlongꢀtermꢀexposureꢀtoꢀdirectꢀ •ꢀ Fullꢀcolorꢀsigns
sunlight.
•ꢀ Commercialꢀoutdoorꢀadvertising
Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
A
NOTE: MEASURED AT BASE OF LENS.
ꢀ.50 0.ꢀ5
(0.059 0.006ꢁ
ꢀꢀ.90 0.50
(0.469 0.0ꢀ9ꢁ
3.80 0.25
(0.ꢀ50 0.0ꢀ0ꢁ
0.50 0.ꢀ0
(0.020 0.004ꢁ
SQ. TYP.
0.70
MAX.
(0.028ꢁ
2.54 0.25
(0.ꢀ0 0.0ꢀ0ꢁ
5.20 0.25
(0.204 0.0ꢀ0ꢁ
CATHODE LEAD
(SEE NOTE Aꢁ
ꢀ.0
(0.039ꢁ
MAX.
ꢀ.00
(0.039ꢁ
MIN.
24.00
(0.945ꢁ
7.00 0.25
(0.275 0.0ꢀ0ꢁ
MIN.
B
ꢀ.50 0.ꢀ5
(0.059 0.006ꢁ
ꢀꢀ.80 0.50
(0.465 0.0ꢀ9ꢁ
0.50 0.ꢀ0
SQ. TYP.
(0.020 0.004ꢁ
0.70
(0.028ꢁ
MAX.
2.54 0.25
(0.ꢀ0 0.0ꢀ0ꢁ
5.20 0.50
(0.205 0.020ꢁ
CATHODE LEAD
(SEE NOTE Aꢁ
ꢀ.0
(0.039ꢁ
MAX.
ꢀ.00
(0.039ꢁ
MIN.
24.00
(0.945ꢁ
6.85 0.25
(0.270 0.0ꢀ0ꢁ
MIN.
NOTES:
ꢀ. DIMENSIONS IN MILLIMETERS (INCHESꢁ.
2. FOR InGaN BLUE AND GREEN (PACKAGE Bꢁ, IF HEAT-SINKING APPLICATION IS REQUIRED, THE TERMINAL FOR HEAT SINK IS ANODE.
Device Selection Guide
Luminous Intensity Iv
Typical Dominant
(mcd) at 20 mA
Minimum
680ꢀ
Package
Part Number
Color
Wavelength l (nm)
Maximum
1900ꢀ
880ꢀ
Lens Type
Dimension
d
HLMP-HD55-NR0xxꢀ
HLMP-HB57-KN0xxꢀ
HLMP-HB57-LMCxxꢀ
HLMP-HB57-LP0xxꢀ
HLMP-HM57-SV0xxꢀ
HLMP-HM57-RSCxxꢀ
HLMP-HM57-RU0xxꢀ
Redꢀ
630ꢀ
470ꢀ
470ꢀ
470ꢀ
525ꢀ
525ꢀ
525ꢀ
Tinted,ꢀDiffusedꢀ
Tinted,ꢀDiffusedꢀ
Tinted,ꢀDiffusedꢀ
Tinted,ꢀDiffusedꢀ
Tinted,ꢀDiffusedꢀ
Tinted,ꢀDiffusedꢀ
Tinted,ꢀDiffusedꢀ
Aꢀ
Bꢀ
Bꢀ
Bꢀ
Bꢀ
Bꢀ
Bꢀ
Blueꢀ
310ꢀ
Blueꢀ
400ꢀ
680ꢀ
Blueꢀ
400ꢀ
1150ꢀ
5500ꢀ
2500ꢀ
4200ꢀ
Greenꢀ
Greenꢀ
Greenꢀ
1900ꢀ
1500ꢀ
1500ꢀ
Notes:
1.ꢀ Toleranceꢀforꢀluminousꢀintensityꢀmeasurementꢀisꢀ 15ꢁ.
2.ꢀ Theꢀluminousꢀintensityꢀisꢀmeasuredꢀonꢀtheꢀmechanicalꢀaxisꢀofꢀtheꢀlampꢀpackage.
3.ꢀ Theꢀopticalꢀaxisꢀisꢀcloselyꢀalignedꢀwithꢀtheꢀpackageꢀmechanicalꢀaxis.
4.ꢀ Theꢀdominantꢀwavelength,ꢀl ,ꢀisꢀderivedꢀfromꢀtheꢀChromaticityꢀDiagramꢀandꢀrepresentsꢀtheꢀcolorꢀofꢀtheꢀlamp.
d
5.ꢀ LEDꢀlightꢀoutputꢀisꢀbrightꢀenoughꢀtoꢀcauseꢀinjuriesꢀtoꢀtheꢀeyes.ꢀPrecautionsꢀmustꢀbeꢀtakenꢀtoꢀpreventꢀlookingꢀdirectlyꢀatꢀtheꢀLEDꢀwithꢀunaidedꢀ
eyes.
2
Part Numbering System
H L M P -
x x 5 x - x x x x x
Mechanical Option
00:ꢀBulk
DD:ꢀAmmoꢀPack
ZZ:ꢀFlexi-Bin;ꢀAmmoꢀPack
ꢀ
ꢀ
ꢀ
Color Bin Option
0:ꢀFullꢀColorꢀBinꢀDistribution
C:ꢀColorꢀBinꢀ3ꢀ&ꢀ4
ꢀ
ꢀ
Maximum Intensity Bin
ReferꢀtoꢀDeviceꢀSelectionꢀGuide
ꢀ
ꢀ
Minimum Intensity Bin
ReferꢀtoꢀDeviceꢀSelectionꢀGuide
Color
ꢀ
ꢀ
ꢀ
B:ꢀBlueꢀ470ꢀnm
D:ꢀRedꢀ630ꢀnm
M:ꢀGreenꢀ525ꢀnm
Package
H:ꢀ5ꢀmmꢀStandardꢀOval
ꢀ
Note:ꢀPleaseꢀreferꢀtoꢀABꢀ5337ꢀforꢀcompleteꢀinformationꢀaboutꢀpartꢀnumberingꢀsystem.
o
Absolute Maximum Rating at T = 25 C
A
Parameters
DCꢀForwardꢀCurrent[1]
Blue and Green
30ꢀ
Red
50ꢀ
100ꢀ[3]ꢀ
Unit
mAꢀ
mAꢀ
mWꢀ
°Cꢀ
°Cꢀ
°Cꢀ
ꢀ
PeakꢀPulsedꢀForwardꢀCurrentꢀꢀ
PowerꢀDissipationꢀ
100[2]
ꢀ
116ꢀ
120ꢀ
LEDꢀJunctionꢀTemperatureꢀ
OperatingꢀTemperatureꢀRangeꢀ
StorageꢀTemperatureꢀRangeꢀ
130ꢀ
130ꢀ
-40ꢀtoꢀ+85ꢀ
-ꢀ 40ꢀtoꢀ100ꢀ
-40ꢀtoꢀ120ꢀ
-40ꢀtoꢀ+100ꢀ
ꢀ
Notes:
1.ꢀ DerateꢀlinearlyꢀasꢀshownꢀinꢀFiguresꢀ2ꢀandꢀ7.
2.ꢀ Dutyꢀfactorꢀ10ꢁ,ꢀfrequencyꢀ1ꢀKHz.
3.ꢀ Dutyꢀfactorꢀ30ꢁ,ꢀfrequencyꢀ1ꢀKHz.
3
Electrical/Optical Characteristics
°
T = 25 C
A
Value
Typ.
Parameters
Symbol
Min.
Max.
Units
Test Condition
Forward Voltageꢀ
Redꢀ
Greenꢀ
VFꢀ
ꢀ
ꢀ
ꢀ
Vꢀ
ꢀ
IFꢀ=ꢀ20ꢀmAꢀ
ꢀ
ꢀ
ꢀ
2.0ꢀ
2.8ꢀ
2.8ꢀ
2.20ꢀ
3.30ꢀ
3.20ꢀ
2.40ꢀ
3.85ꢀ
3.85ꢀ
ꢀꢀ
ꢀ
ꢀ
Blueꢀ
Reverse Voltageꢀ
Redꢀ
Green,ꢀBlueꢀ
VRꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
Vꢀ
ꢀ
ꢀ
5.0ꢀ
5.0ꢀ
IRꢀ=ꢀ100ꢀµAꢀ
IRꢀ=ꢀ10ꢀµA
ꢀ
ꢀ
Capacitanceꢀ
Redꢀ
Greenꢀ
Blueꢀ
Cꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
pFꢀ
VFꢀ=ꢀ0,ꢀfꢀ=ꢀ1ꢀMHzꢀ
ꢀ
ꢀ
ꢀ
40ꢀ
65ꢀ
64
Thermal Resistance[1]
Dominant Wavelength[2,3]
Redꢀ
Greenꢀ
Blueꢀ
ꢀ
RqJ-PINꢀ
ꢀ
240ꢀ
ꢀ
°C/Wꢀ
LEDꢀJunction-to-Pin
IFꢀ=ꢀ20ꢀmAꢀ
ꢀ
ldꢀ
ꢀ
ꢀ
ꢀ
nmꢀ
ꢀ
ꢀ
ꢀ
ꢀ
622ꢀ
520ꢀ
460ꢀ
630ꢀ
525ꢀ
470ꢀ
634ꢀ
540ꢀ
480ꢀ
ꢀꢀ
ꢀ
ꢀ
Peak Wavelengthꢀ
Redꢀ
Greenꢀ
lPEAKꢀ
nmꢀ
PeakꢀofꢀWavelengthꢀofꢀSpectralꢀꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
639ꢀ
516ꢀ
464ꢀ
ꢀ
ꢀ
ꢀ
DistributionꢀatꢀIFꢀ=ꢀ20ꢀmAꢀ
ꢀ
ꢀ
Blueꢀ
Spectral Half Widthꢀ
Redꢀ
Greenꢀ
Dl1/2ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
nmꢀ
WavelengthꢀWidthꢀatꢀSpectral
Distributionꢀ1/2ꢀPowerꢀPointꢀatꢀ
IFꢀ=ꢀ20ꢀmAꢀ
ꢀ
ꢀ
ꢀ
ꢀ
17ꢀ
32ꢀ
23ꢀ
ꢀ
ꢀ
ꢀ
Blueꢀ
Luminous Efficacy[4]
Redꢀ
Greenꢀ
ꢀ
hvꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
lm/Wꢀ
ꢀ
ꢀ
EmittedꢀLuminousꢀ
Power/EmittedꢀRadiantꢀPowerꢀ
ꢀ
ꢀ
ꢀ
ꢀ
155ꢀ
520ꢀ
75
Blueꢀ
Luminous Fluxꢀ
Redꢀ
Greenꢀ
Blueꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
jVꢀ
ꢀ
ꢀ
1300ꢀ
3000ꢀ
600
mlmꢀ
IFꢀ=ꢀ20ꢀmAꢀ
Luminous Efficiency [5]
Redꢀ
Greenꢀ
Blueꢀ
ꢀ
heꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
30ꢀ
50ꢀ
10
ꢀ
ꢀ
lm/Wꢀ
ꢀ
LuminousꢀFlux/ElectricalꢀPowerꢀ
IFꢀ=ꢀ20ꢀmAꢀ
Notes:
1.ꢀ ForꢀAlInGaPꢀRed,ꢀtheꢀthermalꢀresistanceꢀappliedꢀtoꢀLEDꢀjunctionꢀtoꢀcathodeꢀlead.ꢀForꢀInGaNꢀBlueꢀandꢀGreen,ꢀtheꢀthermalꢀresistanceꢀappliedꢀtoꢀ
LEDꢀjunctionꢀtoꢀanodeꢀlead.
2.ꢀ Theꢀdominantꢀwavelength,ꢀl ,ꢀisꢀderivedꢀfromꢀtheꢀChromaticityꢀDiagramꢀandꢀrepresentsꢀtheꢀcolorꢀofꢀtheꢀlamp.
d
3.ꢀ Toleranceꢀforꢀeachꢀcolorꢀbinꢀlimitꢀisꢀ ꢀ0.5ꢀnm.
4.ꢀ Theꢀradiantꢀintensity,ꢀIeꢀinꢀwatts/steradian,ꢀmayꢀbeꢀfoundꢀfromꢀtheꢀequationꢀIeꢀ=ꢀIv/h ,ꢀwhereꢀIvꢀisꢀtheꢀluminousꢀintensityꢀinꢀcandelasꢀandꢀh ꢀisꢀ
v
v
theꢀluminousꢀefficacyꢀinꢀlumens/watt.
5.ꢀ h ꢀ=ꢀj ꢀ/ꢀI ꢀꢀxꢀV ꢀ,ꢀwhereꢀj ꢀꢀisꢀtheꢀemittedꢀluminousꢀflux,ꢀIFꢀꢀisꢀelectricalꢀforwardꢀcurrentꢀandꢀVFꢀꢀisꢀtheꢀforwardꢀvoltage.
e
V
F
F
V
4
AlInGaP Red
60
50
40
30
20
ꢀ0
0
0
20
40
60
80
ꢀ00
T
– AMBIENT TEMPERATURE – °C
A
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. ambient temperature.
Figure 3. Forward current vs. forward voltage.
Figure 4. Relative luminous intensity vs. forward
current.
InGaN Blue and Green
35
30
25
20
ꢀ5
ꢀ0
5
0
0
20
40
60
80
ꢀ00
T
– AMBIENT TEMPERATURE – °C
A
Figure 5. Relative intensity vs. wavelength.
Figure 6. Forward current vs. forward voltage.
Figure 7. Maximum forward current vs. ambient
temperature.
5
Figure 8. Relative intensity vs. forward current.
Figure 9. Relative dominant wavelength vs. DC for-
ward current.
ꢀ.0
0.5
0
0
30
60
90
ꢀ20
ꢀ50
ꢀ80
ANGULAR DISPLACEMENT – DEGREES
Figure 10. Spatial radiation pattern – major axis.
ꢀ.0
0.5
0
0
30
60
90
ꢀ20
ꢀ50
ꢀ80
ANGULAR DISPLACEMENT – DEGREES
Figure 11. Spatial radiation pattern – minor axis.
6
Intensity Bin Limit Table
Blue Color Bin Table
Intensity (mcd) at 20 mA
Bin
1ꢀ
ꢀ
Min. Dom
460.0ꢀ
Max. Dom
464.0ꢀ
Xmin
Ymin
Xmax
Ymax
Bin
Kꢀ
Lꢀ
Mꢀ
Nꢀ
Pꢀ
Qꢀ
Rꢀ
Min
Max
0.1440ꢀ
0.1818ꢀ
0.1374ꢀ
0.1766ꢀ
0.1291ꢀ
0.1699ꢀ
0.1187ꢀ
0.1616ꢀ
0.1063ꢀ
0.1517ꢀ
0.0297ꢀ
0.0904ꢀ
0.0374ꢀ
0.0966ꢀ
0.0495ꢀ
0.1062ꢀ
0.0671ꢀ
0.1209ꢀ
0.0945ꢀ
0.1423ꢀ
0.1766ꢀ
0.1374ꢀ
0.1699ꢀ
0.1291ꢀ
0.1616ꢀ
0.1187ꢀ
0.1517ꢀ
0.1063ꢀ
0.1397ꢀ
0.0913ꢀ
0.0966
0.0374
0.1062
0.0495
0.1209
0.0671
0.1423
0.0945
0.1728
0.1327
310ꢀ
400ꢀ
ꢀ
ꢀ
400ꢀ
520ꢀ
2ꢀ
ꢀ
464.0ꢀ
468.0ꢀ
520ꢀ
680ꢀ
ꢀ
ꢀ
680ꢀ
880ꢀ
3ꢀ
ꢀ
468.0ꢀ
472.0ꢀ
880ꢀ
1150ꢀ
1500ꢀ
1900ꢀ
2500ꢀ
3200ꢀ
4200ꢀ
5500ꢀ
ꢀ
ꢀ
1150ꢀ
1500ꢀ
1900ꢀ
2500ꢀ
3200ꢀ
4200ꢀ
4ꢀ
ꢀ
472.0ꢀ
476.0ꢀ
ꢀ
ꢀ
Sꢀ
Tꢀ
Uꢀ
5ꢀ
ꢀ
476.0ꢀ
ꢀ
480.0ꢀ
ꢀ
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ0.5ꢀnm.
Vꢀ
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ15ꢁ.
Green Color Bin Table
Bin
1ꢀ
ꢀ
Min. Dom
520.0ꢀ
Max. Dom
524.0ꢀ
Xmin
Ymin
Xmax
Ymax
0.0743ꢀ
0.1650ꢀ
0.1060ꢀ
0.1856ꢀ
0.1387ꢀ
0.2068ꢀ
0.1702ꢀ
0.2273ꢀ
0.2003ꢀ
0.2469ꢀ
0.8338ꢀ
0.6586ꢀ
0.8292ꢀ
0.6556ꢀ
0.8148ꢀ
0.6463ꢀ
0.7965ꢀ
0.6344ꢀ
0.7764ꢀ
0.6213ꢀ
0.1856ꢀ
0.1060ꢀ
0.2068ꢀ
0.1387ꢀ
0.2273ꢀ
0.1702ꢀ
0.2469ꢀ
0.2003ꢀ
0.2659ꢀ
0.2296ꢀ
0.6556
0.8292
0.6463
0.8148
0.6344
0.7965
0.6213
0.7764
0.6070
0.7543
ꢀ
ꢀ
2ꢀ
ꢀ
524.0ꢀ
528.0ꢀ
ꢀ
ꢀ
3ꢀ
ꢀ
528.0ꢀ
532.0ꢀ
ꢀ
ꢀ
4ꢀ
ꢀ
532.0ꢀ
536.0ꢀ
ꢀ
ꢀ
5ꢀ
ꢀ
536.0ꢀ
ꢀ
540.0ꢀ
ꢀ
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ0.5ꢀnm.
Red Color Range
Min. Dom
Max. Dom
Xmin
Ymin
Xmax
Ymax
622ꢀ
ꢀ
634ꢀ
ꢀ
0.6904ꢀ
0.6726ꢀ
0.3094ꢀ
0.3106ꢀ
0.6945ꢀ
0.7135ꢀ
0.2888
0.2865
Toleranceꢀforꢀeachꢀbinꢀlimitꢀisꢀ ꢀ0.5ꢀnm.
7
Avago Color Bin on CIE 1931 Diagram
ꢀ.000
0.800
ꢀ
2
3
4
5
Green
0.600
0.400
0.200
0.000
Y
Red
Blue
5
4
3
2
ꢀ
0.000 0.ꢀ00 0.200 0.300 0.400 0.500 0.600 0.700 0.800
X
Relative Light Output vs. Junction Temperature
10
GREEN
1
RED
BLUE
80
0.1
-40
-20
0
20
40
60
100
120
TJ - JUNCTION TEMPERATURE - °C
8
mechanicalꢀstress.Therefore,ꢀPCBꢀmustꢀallowedꢀtoꢀcoolꢀ
downꢀtoꢀroomꢀtemperatureꢀpriorꢀtoꢀhandling,ꢀwhichꢀ
includesꢀremovalꢀofꢀalignmentꢀfixtureꢀorꢀpallet.
Note:ꢀ
Precautions:
1.ꢀ PCBꢀwithꢀdifferentꢀsizeꢀandꢀdesignꢀ(componentꢀdensity)ꢀwillꢀhaveꢀ
differentꢀheatꢀmassꢀ(heatꢀcapacity).ꢀThisꢀmightꢀcauseꢀaꢀchangeꢀinꢀ
temperatureꢀ experiencedꢀ byꢀ theꢀ boardꢀ ifꢀ sameꢀ waveꢀ solderingꢀ
settingꢀisꢀused.ꢀSo,ꢀitꢀisꢀrecommendedꢀtoꢀre-calibrateꢀtheꢀsolderingꢀ
profileꢀagainꢀbeforeꢀloadingꢀaꢀnewꢀtypeꢀofꢀPCB.
Lead Forming:
•ꢀ TheꢀleadsꢀofꢀanꢀLEDꢀlampꢀmayꢀbeꢀpreformedꢀorꢀcutꢀtoꢀ
lengthꢀpriorꢀtoꢀinsertionꢀandꢀsolderingꢀonꢀPCꢀboard.
2.ꢀ AvagoꢀTechnologies’ꢀhighꢀbrightnessꢀLEDꢀareꢀusingꢀhighꢀefficiencyꢀ
LEDꢀdieꢀwithꢀsingleꢀwireꢀbondꢀasꢀshownꢀbelow.ꢀCustomerꢀisꢀadvisedꢀ
toꢀ takeꢀ extraꢀ precautionꢀ duringꢀ waveꢀ solderingꢀ toꢀ ensureꢀ thatꢀ
theꢀmaximumꢀwaveꢀtemperatureꢀdoesꢀnotꢀexceedꢀ250°Cꢀandꢀtheꢀ
solderꢀcontactꢀtimeꢀdoesꢀnotꢀexceedingꢀ3sec.ꢀOver-stressingꢀtheꢀ
LEDꢀduringꢀsolderingꢀprocessꢀmightꢀcauseꢀprematureꢀfailureꢀtoꢀtheꢀ
LEDꢀdueꢀtoꢀdelamination.
•ꢀ Forꢀbetterꢀcontrol,ꢀitꢀisꢀrecommendedꢀtoꢀuseꢀproperꢀ
toolꢀtoꢀpreciselyꢀformꢀandꢀcutꢀtheꢀleadsꢀtoꢀapplicableꢀ
lengthꢀratherꢀthanꢀdoingꢀitꢀmanually.
•ꢀ Ifꢀmanualꢀleadꢀcuttingꢀisꢀnecessary,ꢀcutꢀtheꢀleadsꢀafterꢀ
theꢀsolderingꢀprocess.ꢀTheꢀsolderꢀconnectionꢀformsꢀ
aꢀ mechanicalꢀ groundꢀ whichꢀ preventsꢀ mechanicalꢀ
stressꢀ dueꢀ toꢀ leadꢀ cuttingꢀ fromꢀ travelingꢀ intoꢀ LEDꢀ
package.ꢀThisꢀisꢀhighlyꢀrecommendedꢀforꢀhandꢀsolderꢀ
operation,ꢀasꢀtheꢀexcessꢀleadꢀlengthꢀalsoꢀactsꢀasꢀsmallꢀ
heatꢀsink.
Avago Technologies LED configuration
Soldering and Handling:
•ꢀ Care
must
be
taken
during
PCB
assembly
andsolderingꢀ
CATHODE
ANODE
processꢀtoꢀpreventꢀdamageꢀtoꢀtheꢀLEDꢀcomponent.ꢀ
•ꢀ LEDꢀ componentꢀ mayꢀ beꢀ effectivelyꢀ handꢀ solderedꢀ
toꢀ PCB.ꢀ However,ꢀ itꢀ isꢀ onlyꢀ recommendedꢀ underꢀ
unavoidableꢀ circumstancesꢀ suchꢀ asꢀ rework.ꢀ Theꢀ
closestꢀ manualꢀ solderingꢀ distanceꢀ ofꢀ theꢀ solderingꢀ
heatꢀ sourceꢀ (solderingꢀ iron’sꢀ tip)ꢀ toꢀ theꢀ bodyꢀ isꢀ
1.59mm.ꢀSolderingꢀtheꢀLEDꢀusingꢀsolderingꢀironꢀtipꢀ
closerꢀthanꢀ1.59mmꢀmightꢀdamageꢀtheꢀLED.
1.59mm
AlInGaP Device
InGaN Device
ꢀ
Note:ꢀElectricalꢀconnectionꢀbetweenꢀbottomꢀsurfaceꢀofꢀLEDꢀdieꢀandꢀ
theꢀleadꢀframeꢀisꢀachievedꢀthroughꢀconductiveꢀpaste.
•ꢀ Anyꢀ alignmentꢀ fixtureꢀ thatꢀ isꢀ beingꢀ appliedꢀ duringꢀ
waveꢀsolderingꢀshouldꢀbeꢀlooselyꢀfittedꢀandꢀshouldꢀ
notꢀapplyꢀweightꢀorꢀforceꢀonꢀLED.ꢀNonꢀmetalꢀmaterialꢀ
isꢀ recommendedꢀ asꢀ itꢀ willꢀ absorbꢀ lessꢀ heatꢀ duringꢀ
waveꢀsolderingꢀprocess.
•ꢀ Atꢀelevatedꢀtemperature,ꢀLEDꢀisꢀmoreꢀsusceptibleꢀtoꢀ
•ꢀ ESDꢀ precautionꢀ mustꢀ beꢀ properlyꢀ appliedꢀ onꢀ theꢀ
solderingꢀ stationꢀ andꢀ personnelꢀ toꢀ preventꢀ ESDꢀ
damageꢀtoꢀtheꢀLEDꢀcomponentꢀthatꢀisꢀESDꢀsensitive.ꢀ
DoꢀreferꢀtoꢀAvagoꢀapplicationꢀnoteꢀANꢀ1142ꢀforꢀdetails.ꢀ
Theꢀsolderingꢀironꢀusedꢀshouldꢀhaveꢀgroundedꢀtipꢀtoꢀ
ensureꢀelectrostaticꢀchargeꢀisꢀproperlyꢀgrounded.
•ꢀ IfꢀPCBꢀboardꢀcontainsꢀbothꢀthroughꢀholeꢀ(TH)ꢀLEDꢀandꢀ
otherꢀsurfaceꢀmountꢀcomponents,ꢀitꢀisꢀrecommendedꢀ
thatꢀsurfaceꢀmountꢀcomponentsꢀbeꢀsolderedꢀonꢀtheꢀ
topꢀsideꢀofꢀtheꢀPCB.ꢀIfꢀsurfaceꢀmountꢀneedꢀtoꢀbeꢀonꢀtheꢀ
bottomꢀside,ꢀtheseꢀcomponentsꢀshouldꢀbeꢀsolderedꢀ
usingꢀreflowꢀsolderingꢀpriorꢀtoꢀinsertionꢀtheꢀTHꢀLED.
•ꢀ Recommendedꢀsolderingꢀcondition:
Wave
Manual Solder
Dipping
Soldering [1, 2]
Pre-heat temperature
Preheat time
105 °C Max.
60 sec Max
250 °C Max.
3 sec Max.
-
•ꢀ RecommendedꢀPCꢀboardꢀplatedꢀthroughꢀholesꢀ(PTH)ꢀ
sizeꢀforꢀLEDꢀcomponentꢀleads.
-
Peak temperature
Dwell time
260 °C Max.
5 sec Max
LED component
lead size
Plated through
hole diameter
Diagonal
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
Note:ꢀ
1)ꢀ Aboveꢀ conditionsꢀ refersꢀ toꢀ measurementꢀ withꢀ thermocoupleꢀ
mountedꢀatꢀtheꢀbottomꢀofꢀPCB.
2)ꢀ Itꢀ isꢀ recommendedꢀ toꢀ useꢀ onlyꢀ bottomꢀ preheatersꢀ inꢀ orderꢀ toꢀ
reduceꢀthermalꢀstressꢀexperiencedꢀbyꢀLED.
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
•ꢀ Waveꢀ solderingꢀ parametersꢀ mustꢀ beꢀ setꢀ andꢀ
maintainedꢀ accordingꢀ toꢀ theꢀ recommendedꢀ
temperatureꢀ andꢀ dwellꢀ time.ꢀ Customerꢀ isꢀ advisedꢀ
toꢀ performꢀ dailyꢀ checkꢀ onꢀ theꢀ solderingꢀ profileꢀ toꢀ
ensureꢀthatꢀitꢀisꢀalwaysꢀconformingꢀtoꢀrecommendedꢀ
solderingꢀconditions.
•ꢀ Over-sizingꢀ theꢀ PTHꢀ canꢀ leadꢀ toꢀ twistedꢀ LEDꢀ afterꢀ
clinching.ꢀOnꢀtheꢀotherꢀhandꢀunderꢀsizingꢀtheꢀPTHꢀcanꢀ
causeꢀdifficultyꢀinsertingꢀtheꢀTHꢀLED.
9
ReferꢀtoꢀapplicationꢀnoteꢀAN5334ꢀforꢀmoreꢀinformationꢀaboutꢀsolderingꢀandꢀhandlingꢀofꢀhighꢀbrightnessꢀTHꢀLEDꢀlamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
Sn63 (Leaded solder alloy)
LAMINAR WAVE
TURBULENT WAVE
HOT AIR KNIFE
SAC305 (Lead free solder alloy)
250
200
150
100
50
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
PREHEAT
0
10
20
30
40
50
60
70
80
90
100
TIME (MINUTES)
Ammo Packs Drawing
6.35 ± ꢀ.30
(0.25 ± 0.05ꢀ2ꢁ
ꢀ2.70 ± ꢀ.00
(0.50 ± 0.0394ꢁ
CATHODE
20.5 ± ꢀ.00
(0.807ꢀ ± 0.0394ꢁ
9.ꢀ25 ± 0.625
(0.3593 ± 0.0246ꢁ
ꢀ8.00 ± 0.50
(0.7087 ± 0.0ꢀ97ꢁ
A
A
4.00 ± 0.20
(0.ꢀ575 ± 0.008ꢁ
ꢀ2.70 ± 0.30
(0.50 ± 0.0ꢀꢀ8ꢁ
∅
TYP.
VIEW A–A
0.70 ± 0.20
(0.0276 ± 0.0079ꢁ
ALL DIMENSIONS IN MILLIMETERS (INCHESꢁ.
Note: Theꢀammo-packsꢀdrawingꢀisꢀapplicableꢀforꢀpackagingꢀoptionꢀ–DDꢀ&ꢀ–ZZꢀandꢀregardlessꢀofꢀstandoffꢀorꢀnon-standoff.
10
Packaging Box for Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
+
A
AVAGO
TECHNOLOGIES
ANODE
–
CATHODE
ANODE LEAD LEAVES
THE BOX FIRST.
C
MOTHER LABEL
Note: ForꢀInGaNꢀdevice,ꢀtheꢀammoꢀpackꢀpackagingꢀboxꢀcontainsꢀESDꢀlogo.
Packaging Label
(i)ꢀ AvagoꢀMotherꢀLabel:ꢀ(Availableꢀonꢀpackagingꢀboxꢀofꢀammoꢀpackꢀandꢀshippingꢀbox)
STANDARD LABEL LS0002
RoHS Compliant
e1 max temp 250C
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN
(Q) QTY: Quantity
CAT: Intensity Bin
(9D) MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID
BIN: Refer to below information
REV:
DeptID:
Made In: Country of Origin
11
(ii)ꢀAvagoꢀBabyꢀLabelꢀ(Onlyꢀavailableꢀonꢀbulkꢀpackaging)
RoHS Compliant
e1 max temp 250C
PART #: Part Number
LOT#: Lot Number
MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:ꢀ
Example:
(i)ꢀ ColorꢀbinꢀonlyꢀorꢀVFꢀbinꢀonly
(i)ꢀ ColorꢀbinꢀonlyꢀorꢀVFꢀbinꢀonly
ꢀ
ꢀ
BIN:ꢀ2ꢀ(representꢀcolorꢀbinꢀ2ꢀonly)
BIN:ꢀVBꢀ(representꢀVFꢀbinꢀ“VB”ꢀonly)
ꢀ
(Applicableꢀforꢀpartꢀnumberꢀwithꢀcolorꢀbinsꢀbutꢀwithoutꢀ
VFꢀbinꢀORꢀpartꢀnumberꢀwithꢀVFꢀbinsꢀandꢀnoꢀcolorꢀbin)
ORꢀꢀꢀꢀꢀꢀꢀꢀꢀ
(ii)ꢀColorꢀbinꢀincorporateꢀwithꢀVFꢀBin
(ii)ꢀColorꢀbinꢀincorporatedꢀwithꢀVFꢀBin
ꢀ
ꢀ
ꢀ
BIN:ꢀ2VBꢀꢀ
ꢀ
(Applicableꢀforꢀpartꢀnumberꢀthatꢀhaveꢀbothꢀcolorꢀbinꢀ
andꢀVFꢀbin)
ꢀ
ꢀ
VB:ꢀVFꢀbinꢀ“VB”
2:ꢀꢀColorꢀbinꢀ2ꢀonly
DISCLAIMER:AVAGO’SPRODUCTSANDSOFTWAREARENOTSPECIFICALLYDESIGNED, MANUFACTUREDORAUTHORIZEDFORSALE
ASPARTS,COMPONENTSORASSEMBLIESFORTHEPLANNING,CONSTRUCTION,MAINTENANCEORDIRECTOPERATIONOFANUCLEAR
FACILITYORFORUSEINMEDICALDEVICESORAPPLICATIONS. CUSTOMERISSOLELYRESPONSIBLE,ANDWAIVESALLRIGHTSTOMAKE
CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0305EN
AV02-0371EN - July 6, 2007
相关型号：
HLMP-HM65-114ZZ
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AVAGO
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