HLMP-HM65-T10DD [AVAGO]
SINGLE COLOR LED, GREEN, 5mm, ROHS COMPLIANT, PLASTIC PACKAGE-2;
| 型号： | HLMP-HM65-T10DD |
| 厂家： | 
AVAGO TECHNOLOGIES LIMITED |
| 描述： | SINGLE COLOR LED, GREEN, 5mm, ROHS COMPLIANT, PLASTIC PACKAGE-2 |
| 文件： | 总12页 (文件大小：211K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-HG65, HLMP-HM65, HLMP-HB65
Precision Optical Performance Red Green and Blue
New 5mm Standard Oval LEDs
Data Sheet
Description
Features
These Precision Optical Performance Oval LEDs are spe-
cifically designed for full color/video and passenger in-
formation signs. The oval shaped radiation pattern and
high luminous intensity ensure that these devices are
excellent for wide field of view outdoor applications
where a wide viewing angle and readability in sunlight
are essential. The package epoxy contains both UV-A
and UV-B inhibitors to reduce the effects of long term
exposure to direct sunlight.
• Well defined spatial radiation pattern
• High brightness material
• Available in Red, Green and Blue color
Red AlInGaP 626 nm
Green InGaN 525nm
Blue InGaN 470nm
• Superior resistance to moisture
• Standoff Package
Applications
• Tinted and diffused
• Full color signs
• Typical viewing angle 40° x 100°
Package Dimensions
MEASURED AT BASE OF LENS.
1.30 0.ꢀ0
0.50 0.10
0.0ꢀ0 0.004
10.ꢁ0 0.50
3.ꢁ0 0.ꢀ0
0.150 0.00ꢁ
sq. typ.
0.051 0.00ꢁ
0.4ꢀ5 0.0ꢀ0
5.ꢀ0 0.ꢀ0
0.ꢀ05 0.00ꢁ
cathode lead
7.00 0.ꢀ0
0.ꢀ76 0.00ꢁ
ꢀ.54 0.30
0.10 0.01ꢀ
ꢀ4.00
0.945
min.
1.00
0.039
1.0ꢀ
0.040
min.
max.
Notes:
All dimensions in millimeters (inches).
CAUTION: INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate
precautions during handling and processing. Refer to Application Note AN – 1142 for additional details.
Device Selection Guide
Color and Dominant Wavelength
λd (nm) Typ
Luminous Intensity Iv
(mcd) at ꢀ0 mA-Min
Luminous Intensity Iv
(mcd) at ꢀ0 mA-Max
[1]
[1]
Part Number
HLMP-HG65-VY0xx
HLMP-HM65-Y30xx
HLMP-HB65-QU0xx
Red 626
1150
1990
460
2400
5040
1150
Green 525
Blue 470
Tolerance for each intensity limit is 15ꢀ.
Notes:
1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested in pulsing condition.
Part Numbering System
HLMP-H x 65 - x x x xx
Packaging Option
ZZ: Flexi Ammopack
DD: Ammopacks
Color Bin Selection
0: Open distribution
Maximum Intensity Bin
0: No maximum intensity limit
Minimum Intensity Bin
Refer to Device Selection Guide.
Standoff/Non Standoff
5: Standoff
Color
G: Red 626
M: Green 525
B: Blue 470
Package
H: 5mm Standard Oval 40° x 100°
Note:
Please refer to AB 5337 for complete information about part numbering system.
2
Absolute Maximum Ratings
T = 25°C
J
Parameter
Red
Green and Blue
30
100 [3]
Unit
mA
mA
mW
V
DC Forward Current [1]
Peak Forward Current
Power Dissipation
50
100 [2]
120
116
Reverse Voltage
5 (IR = 100 μA)
130
5 (IR = 10 μA)
110
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
°C
-40 to +100
-40 to +100
-40 to +85
-40 to +100
°C
°C
Notes:
1. Derate linearly as shown in Figure 4.
2. Duty Factor 30ꢀ, frequency 1KHz.
3. Duty Factor 10ꢀ, frequency 1KHz.
Electrical / Optical Characteristics
T = 25°C
J
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
VF
V
IF = 20 mA
Red
Green
Blue
1.8
2.8
2.8
2.1
3.2
3.2
2.4
3.8
3.8
Reverse Voltage
Red
VR
V
5
5
IF = 100 μA
IF = 10 μA
Green & blue
Dominant Wavelength [1]
nm
IF = 20 mA
Red
Green
Blue
λd
618
520
460
626
525
470
630
540
480
Peak Wavelength
Red
Green
Blue
λPEAK
634
516
464
nm
Peak of Wavelength of Spectral
Distribution at IF = 20 mA
Thermal Resistance
Luminous Efficacy [2]
RθJ-PIN
240
°C/W
lm/W
LED Junction-to-Pin
Red
Green
Blue
ηV
150
530
65
Emitted Luminous Power/Emitted
Radiant Power
Notes:
1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp
2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = I /η where I is the luminous intensity in candelas and η is
V
V
V
V
the luminous efficacy in lumens/watt.
3
AlInGaP Red
1
100
80
60
40
20
0
0.8
0.6
0.4
0.2
0
0
1
2
3
550
600
650
700
FORWARD VOLTAGE - V
WAVELENGTH - nm
Figure 1. Relative Intensity vs Wavelength
Figure ꢀ. Forward Current vs Forward Voltage
60
50
40
30
20
10
0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
20
40
60
80
100
0
20
40
60
80
100
TA- AMBIENT TEMPERATURE - C
DC FORWARD CURRENT - mA
Figure 3. Relative Intensity vs Forward Current
Figure 4. Maximum Forward Current vs Ambient Temperature
4
InGaN Blue and Green
1.0
0.9
0.8
100
80
60
40
20
0
0.7
BLUE
GREEN
0.6
0.5
0.4
0.3
0.2
0.1
0.0
380
430
480
530
580
630
0
1
2
3
4
5
FORWARD VOLTAGE - V
WAVELENGTH - nm
Figure 5. Relative Intensity vs Wavelength
Figure 6. Forward Current vs Forward Voltage
35
30
25
20
15
10
5
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
BLUE
GREEN
0
0
20
40
60
80
100
0
20
40
60
80
100
120
TA - AMBIENT TEMPERATURE - °C
DC FORWARD CURRENT - mA
Figure 7. Relative Intensity vs Forward Current
Figure ꢁ. Maximum Forward Current vs Ambient Temperature
10
8
6
4
2
0
BLUE
-2
-4
-6
-8
-10
GREEN
0
20
40
60
80
100
FORWARD CURRENT-mA
Figure 9. Relative dominant wavelength vs Forward Current
5
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
RED
BLUE
GREEN
RED
BLUE
GREEN
-90
-60
-30
0
30
60
90
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
ANGULAR DISPLACEMENT - DEGREES
Figure 10. Radiation Pattern – Major Axis
Figure 11. Radiation Pattern – Minor Axis
0.3
0.2
0.1
0
10
RED
GREEN
BLUE
RED
GREEN
BLUE
1
-0.1
-0.2
-0.3
-0.4
0.1
-40
-20
0
20
40
60
80
100 120 140
-40 -20
0
20
40
60
80
100 120 140
T -JUNCTION TEMPERATURE
J
T - JUNCTION TEMPERATURE - °C
J
Figure1ꢀ. Relative Light Output vs Junction Temperature
Figure 13. Relative Forward Voltage vs Junction Temperature
6
Intensity Bin Limit Table (1.ꢀ: 1 Iv Bin Ratio)
Intensity (mcd) at ꢀ0 mA
Green Color Bin Table
Min
Bin Dom
Max
Dom
Xmin
Ymin
Xmax
Ymax
Bin
Q
R
Min
Max
1
2
3
4
5
520.0 524.0 0.0743 0.8338
0.1650 0.6586
0.1856
0.1060
0.2068
0.1387
0.2273
0.1702
0.2469
0.2003
0.2659
0.2296
0.6556
0.8292
0.6463
0.8148
0.6344
0.7965
0.6213
0.7764
0.6070
0.7543
460
550
550
660
524.0 528.0 0.1060 0.8292
0.1856 0.6556
S
660
800
T
800
960
528.0 532.0 0.1387 0.8148
0.2068 0.6463
U
V
960
1150
1380
1660
1990
2400
2900
3500
4200
5040
1150
1380
1660
1990
2400
2900
3500
4200
532.0 536.0 0.1702 0.7965
0.2273 0.6344
W
X
Y
536.0 540.0 0.2003 0.7764
0.2469 0.6213
Z
1
Tolerance for each bin limit is 0.5nm.
2
3
Blue Color Bin Table
Tolerance for each bin limit is 15ꢀ
Min
Max
Bin Dom Dom
Xmin
Ymin
Xmax
Ymax
1
2
3
4
5
460.0 464.0 0.1440 0.0297
0.1818 0.0904
0.1766
0.1374
0.1699
0.1291
0.1616
0.1187
0.1517
0.1063
0.1397
0.0913
0.0966
0.0374
0.1062
0.0495
0.1209
0.0671
0.1423
0.0945
0.1728
0.1327
V Bin Table (V at ꢀ0mA)
F
Bin ID
VD
Min
Max
2.0
2.2
2.4
464.0 468.0 0.1374 0.0374
0.1766 0.0966
1.8
2.0
2.2
VA
468.0 472.0 0.1291 0.0495
0.1699 0.1062
VB
Notes:
472.0 476.0 0.1187 0.0671
0.1616 0.1209
1. Tolerance for each bin limit is 0.05V
2. binning only applicable to Red color.
V
F
476.0 480.0 0.1063 0.0945
0.1517 0.1423
Red Color Range
Tolerance for each bin limit is 0.5nm
Min
Dom
Max
Dom
Xmin
Ymin
Xmax
Ymax
Note:
1. All bin categories are established for classification of products.
Products may not be available in all bin categories. Please contact
your Avago representative for further information.
618
630
0.6872
0.6690
0.3126
0.3149
0.6890
0.7080
0.2943
0.2920
Tolerance for each bin limit is 0.5nm
7
Avago Color Bin on CIE 1931 Chromaticity Diagram
1.000
0.800
Green
1
2
3
4
5
0.600
0.400
0.200
0.000
Red
Blue
1
5
4
3
2
0.000
0.100
0.200
0.300
0.400
X
0.500
0.600
0.700
0.800
8
Precautions:
Lead Forming:
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ AllnGaP high brightness LED are using high
efficiency LED die with single wire bond as shown below. Customer
is advised to take extra precaution during wave soldering to ensure
that the maximum wave temperature does not exceed 260°C and
the solder contact time does not exceeding 5sec. Over-stressing the
LED during soldering process might cause premature failure to the
LED due to delamination.
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Avago Technologies LED configuration
Soldering and Handling:
• Care must be taken during PCB assembly and
soldering process to prevent damage to the LED
component.
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat
source (soldering iron’s tip) to the body is 1.59mm.
Soldering the LED using soldering iron tip closer than
1.59mm might damage the LED.
CATHODE
ANDOE
AlInGaP Device
InGaN Device
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
1.59mm
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended soldering condition:
Wave
Soldering
Manual Solder
Dipping
• Recommended PC board plated through holes (PTH)
[1, ꢀ]
size for LED component leads.
Pre-heat temperature 105 °C Max.
-
LED component
lead size
Plated through
hole diameter
Preheat time
Peak temperature
Dwell time
60 sec Max
260 °C Max.
5 sec Max.
-
Diagonal
260 °C Max.
5 sec Max
0.45 x 0.45 mm
(0.018x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)
0.636 mm
0.98 to 1.08 mm
0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm
Note:
(0.020x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
Refer to application note AN5334 for more information about
soldering and handling of high brightness TH LED lamps.
9
Example of Wave Soldering Temperature Profile for TH LED
260°C Max
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature: 255°C 5°C
(maximum peak temperature = 260°C)
105°C Max
Dwell time: 3.0 sec - 5.0 sec
(maximum = 5sec)
60 sec Max
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
TIME (sec)
Ammo Packs Drawing
12.70 1.00
0.50 0.0394
6.35 1.30
0.25 0.0512
CATHODE
20.50 1.00
0.8071 0.0394
9.125 0.625
0.3593 0.0246
18.00 0.50
0.7087 0.0197
4.00 0.20
0.1575 0.008
TYP
Ø
A
A
12.70 0.30
0.50 0.0118
VIEW A - A
0.70 0.20
0.0276 0.0079
Note: All dimensions in millimeters (inches)
10
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX
ADHESIVE TAPE MUST BE
FACING UPWARDS.
LABEL ON THIS
SIDE OF BOX
ANODE LEAD LEAVES
THE BOX FIRST.
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 260C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
11
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3 max temp 260C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB”only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and no
color bin)
OR
(ii) Color bin incorporated with VF Bin
VB: VF bin “VB”
(Applicable for part number that have both color bin
and VF bin)
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR
AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAIN-
TENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS.
CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUP-
PLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-1485EN - April 20, 2011
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