HLMP-KB45-AD202 [AVAGO]

T-1 SINGLE COLOR LED, BLUE, 3mm, ROHS COMPLIANT, PLASTIC PACKAGE-2;


型号：	HLMP-KB45-AD202
厂家：	AVAGO TECHNOLOGIES LIMITED
描述：	T-1 SINGLE COLOR LED, BLUE, 3mm, ROHS COMPLIANT, PLASTIC PACKAGE-2
文件：	总8页 (文件大小：129K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HLMP-DB25, HLMP-KB45

T-1¾ (5 mm), T-1 (3 mm)

Blue LED Lamps

Data Sheet

Description

Features

These blue LEDs are designed in industry standard T-1 and

T-1¾ package with clear and non diﬀused optics. They are

also available in tape and reel, and ammo-pack option for

ease of handling and use.

ꢀꢁ Popular T-1¾ and T-1 diameter packages

ꢀꢁ General purpose leads

ꢀꢁ Reliable and rugged

ꢀꢁ Available on tape and reel

ꢀꢁ Binned for color and intensity

These blue lamps are ideal for use as indicators and for

general purpose lighting. Blue lamps oﬀer color diﬀeren-

tiation as blue is attractive and not widely available.

Applications

ꢀꢁ Status indicators

ꢀꢁ Small message panel

ꢀꢁ Running and decorative lights for commercial use

Package Dimensions

HLMP-KB45

HLMP-DB25

3.18 (0.125)

2.67 (0.105)

5.08 (0.200)

4.57 (0.180)

3.43 (0.135)

2.92 (0.115)

9.19 (0.352)

8.43 (0.332)

4.70 (0.185)

6.35 (0.250)

4.19 (0.165)

5.58 (0.220)

1.02 (0.040)

NOM.

0.89 (0.035)

0.64 (0.025)

23.0

MIN.

23.0

MIN.

(0.90)

0.45 (0.018)

SQUARE NOMINAL

0.45 (0.018)

SQUARE NOM.

CATHODE

1.27 (0.050)

NOM.

2.54 (0.100) NOM.

1.27 (0.050)

NOM.

6.10 (0.240)

5.59 (0.220)

CATHODE

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).

2. EPOXY MENISCUS MAY EXTEND ABOUT 1 mm (0.040") DOWN THE LEADS.

2.54 (0.100)

NOM.

CAUTION: Devices are Class I ESD sensitive. Please observe appropriate precautions dur-

ing handling and processing. Refer to Application Note AN-1142 for additional details.

Selection Guide

Luminous Intensity Iv (mcd)

Part Number

Package

T-1

Viewing Angle

Min.

Max.

HLMP-KB45-A00xx

HLMP-DB25-B00xx

–

T-1¾

Part Numbering System

HLMP - x x xx - x x x xx

Mechanical Option

00: Bulk

02: Tape & Reel, Straight Leads

DD: Ammo Pack

Color Bin Options

0: Full Color Bin Distribution

Maximum Iv Bin Options

0: Open (no max. limit)

Minimum Iv Bin Options

Please refer to the Iv Bin Table

Viewing Angle

25: 25 degrees

45: 40 degrees

Color Options

B: Blue

Package Options

D: T-1¾ (5 mm)

K: T-1 (3 mm)

Absolute Maximum Ratings at T = 25°C

Parameter

Blue

Units

Peak Forward Current

DC Current^[1]

Reverse Voltage

Not recommended for reverse bias

Transient Forward Current^[2](10 ꢂsec Pulse)

LED Junction Temperature

Operating Temperature

Storage Temperature

350

115

°C

–20 to +80

–30 to +100

Wave Soldering Temperature [1.59 mm (0.063 in.) from Body]ꢂꢁ

ꢁ

250°C for 3 seconds

260°C for 5 seconds

Solder Dipping Temperature [1.59 mm (0.063 in.) from Body]

Notes:

1. Derate linearly from 50°C as shown in Figure 6.

2. The transient peak current is the maximum non-recurring peak current that can be applied to the device without damaging the LED die and

wirebond. It is not recommended that this device be operated at peak currents above the Absolute Maximum Peak Forward Current.

Optical Characteristics at T = 25°C

Color, Dominant

Luminous Intensity

Wavelength

Peak Wavelength

(nm)

Typ.

464

Viewing Angle

[1]

[2]

I (mcd) @ I = 20 mA

ꢃ

(nm)

ꢃ

2ꢄ

Degrees

PEAK

1/2

Part Number

Min.

Typ.

470

Typ.

HLMP-DB25-B00xx

HLMP-KB45-A00xx

Notes:

1. The dominant wavelength, ꢃ , is derived from the CIE chromaticity diagram and represents the single wavelength which deﬁnes the color of the

device.

ꢄ

1/2

is the oﬀ-axis angle at which the luminous intensity is half of the axial luminous intensity.

Electrical Characteristics at T = 25°C

Thermal Resistance

Rꢄ (°C/W)

Junction to

Cathode Lead

Typ.

Forward Voltage

Speed

Response

Capacitance

J-PIN

V (Volts)

C (pF), V = 0,

@ I = 20 mA

ꢅ (ns)

f = 1 MHz

Typ.

Part Number

Typ.

3.2

Max.

3.8

Typ.

500

HLMP-DB25-B00xx

HLMP-KB45-A00xx

260

290

3.8

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

380

430

480

530

580

630

680

V_F– FORWARD VOLTAGE – V

WAVELENGTH - nm

Figure 1. Relative intensity vs. wavelength

1.6

Figure 2. Forward current vs. forward voltage

1.4

1.2

1.0

10 KHz

3 KHz

1 KHz

300 Hz

100 Hz REFRESH RATE

1.00E-06

1.00E-05

1.00E-04

1.00E-03

1.00E-02

PULSE WIDTH (SECONDS)

I_P– PEAK FORWARD CURRENT – mA

Figure 3. Relative intensity vs. peak forward current (300 ꢂs pulse width,

10 ms period)

Figure 4. Maximum Tolerable Peak Current vs Pulse Width

1.4

1.2

1.0

0.8

0.6

0.4

0.2

10 20 30 40 50 60 70 80 90

T_A– AMBIENT TEMPERATURE – °C

I_F– DC FORWARD CURRENT – mA

Figure 5. Relative luminous intensity vs. forward current

Figure 6. Maximum DC forward current vs. ambient temperature. Derating

based on T_Jmax. = 115°C

0°

10°

20°

1.0

30°

40°

50°

60°

70°

80°

90°

10° 20° 30° 40° 50° 60° 70° 80° 90° 100°

Figure 7. Relative luminous intensity vs. angular displacement for HLMP-DB25

0°

10°

20°

1.0

30°

40°

50°

60°

70°

80°

90°

10° 20° 30° 40° 50° 60° 70° 80° 90° 100°

Figure 8. Relative luminous intensity vs. angular displacement for HLMP-KB45

Soldering/Cleaning

Cleaning agents from the ketone family (acetone, methyl

ethyl ketone, etc.) and from the chlorinated hydrocarbon

family (methylene chloride, trichloro-ethylene, carbon

tetrachloride, etc.) are not recommended for cleaning LED

parts. All of these various solvents attack or dissolve the

encapsulating epoxies used to form the package of plastic

LED parts.

Intensity Bin Limits

Intensity Range (mcd)

Color Bin Limits (nm at 20 mA)

Blue

nm @ 20 mA

Min.

Bin

Min.

Max.

Bin ID

Max.

30.0

40.0

460.0

464.0

468.0

472.0

476.0

480.0

40.0

50.0

464.0

50.0

65.0

468.0

65.0

85.0

472.0

85.0

110.0

140.0

180.0

240.0

310.0

400.0

520.0

680.0

880.0

476.0

110.0

140.0

180.0

240.0

310.0

400.0

520.0

680.0

Tolerance for each bin limit is 0.5 nm.

Tolerance for each bin limit is 15ꢀ.

Mechanical Option Matrix

Mechanical

Option Code

Deﬁnition

Bulk Packaging, minimum increment 500 pcs/bag

Tape & Reel, straight leads, minimum increment 1300 pcs/reel

Ammo Pack, straight leads with minimum increment 2000pcs/pack

Note:

All categories are established for classiﬁcation of products. Products may not be available in all

categories. Please contact your local Avago representative for further clariﬁcation/information.

Precautions:

Lead Forming:

ꢀꢁ Wave soldering parameters must be set and maintained

according to the recommended temperature and dwell

time. Customer is advised to perform daily check on the

soldering proﬁle to ensure that it is always conforming

to recommended soldering conditions.

ꢀꢁ The leads of an LED lamp may be preformed or cut to

length prior to insertion and soldering on PC board.

ꢀꢁ For better control, it is recommended to use proper

tool to precisely form and cut the leads to applicable

length rather than doing it manually.

Note:

1. PCB with diﬀerent size and design (component density) will

have diﬀerent heat mass (heat capacity). This might cause a

change in temperature experienced by the board if same wave

soldering setting is used. So, it is recommended to re-calibrate

the soldering proﬁle again before loading a new type of PCB.

2. Customer is advised to take extra precaution during wave

soldering to ensure that the maximum wave temperature

does not exceed 250°C and the solder contact time does not

exceeding 3sec. Over-stressing the LED during soldering process

might cause premature failure to the LED due to delamination.

ꢀꢁ If manual lead cutting is necessary, cut the leads after

the soldering process. The solder connection forms a

mechanical ground which prevents mechanical stress

due to lead cutting from traveling into LED package.

This is highly recommended for hand solder operation,

as the excess lead length also acts as small heat sink.

Soldering and Handling:

ꢀꢁ Care must be taken during PCB assembly and soldering

ꢀꢁ Any alignment ﬁxture that is being applied during

wave soldering should be loosely ﬁtted and should

not apply weight or force on LED. Non metal material

is recommended as it will absorb less heat during wave

soldering process.

process to prevent damage to the LED component.

ꢀꢁ LED component may be eﬀectively hand soldered

to PCB. However, it is only recommended under

unavoidable circumstances such as rework. The closest

manual soldering distance of the soldering heat source

(soldering iron’s tip) to the body is 1.59mm. Soldering

the LED using soldering iron tip closer than 1.59mm

might damage the LED.

ꢀꢁ At elevated temperature, LED is more susceptible to

mechanical stress. Therefore, PCB must allowed to cool

down to room temperature prior to handling, which

includes removal of alignment ﬁxture or pallet.

1.59 mm

ꢀꢁ If PCB board contains both through hole (TH) LED and

other surface mount components, it is recommended

that surface mount components be soldered on the

top side of the PCB. If surface mount need to be on the

bottom side, these components should be soldered

using reﬂow soldering prior to insertion the TH LED.

ꢀꢁ ESD precaution must be properly applied on the

soldering station and personnel to prevent ESD

damage to the LED component that is ESD sensitive.

Do refer to Avago application note AN 1142 for details.

The soldering iron used should have grounded tip to

ensure electrostatic charge is properly grounded.

ꢀꢁ Recommended PC board plated through holes (PTH)

size for LED component leads.

LED Component

Lead Size

Plated Through

Hole Diameter

Diagonal

ꢀꢁ Recommended soldering condition:

0.45 x 0.45 mm

0.636 mm

0.98 to 1.08 mm

Wave

Soldering

Manual Solder

Dipping

(0.018 x 0.018 inch)

(0.025 inch)

(0.039 to 0.043 inch)

[1],[2]

0.50 x 0.50 mm

0.707 mm

1.05 to 1.15 mm

Pre-heat Temperature 105°C Max.

–

(0.020 x 0.020 inch)

(0.028 inch)

(0.041 to 0.045 inch)

Pre-heat Time

60 sec Max.

250°C Max.

3 sec Max.

–

ꢀꢁ Over-sizing the PTH can lead to twisted LED after

clinching. On the other hand under sizing the PTH can

cause diﬃculty inserting the TH LED.

Peak Temperature

260°C Max.

5 sec Max.

Dwell Time

Note:

Refer to application note AN5334 for more information

about soldering and handling of TH LED lamps.

1. Above conditions refers to measurement with thermocouple

mounted at the bottom of PCB.

2. It is recommended to use only bottom preheaters in order to

reduce thermal stress experienced by LED.

Example of Wave Soldering Temperature Proﬁle for TH LED

Recommended solder:

Sn63 (Leaded solder alloy)

SAC305 (Lead free solder alloy)

LAMINAR

HOT AIR KNIFE

TURBULENT WAVE

250

Flux: Rosin ﬂux

Solder bath temperature:

200

150

100

245°C 5°C (maximum peak temperature = 250°C)

Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)

Note: Allow for board to be suﬃciently cooled to

room temperature before exerting mechanical force.

Recommended solder:

Sn63 (Leaded solder alloy)

SAC305 (Lead free solder alloy)

Flux: Rosin ﬂux

Solder bath temperature:

245°C 5°C (maximum peak temperature = 250°C)

PREHEAT

Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)

Note: Allow for board to be suﬃciently cooled to

room temperature before exerting mechanical force.

100

TIME (MINUTES)

Packaging Label:

(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)

STANDARD LABEL LS0002

(1P) Item: Part Number

RoHS Compliant

max temp 250C

(Q) QTY: Quantity

CAT: Intensity Bin

BIN: Color Bin

(1T) Lot: Lot Number

LPN:

(9D)MFG Date: Manufacturing Date

(P) Customer Item:

(V) Vendor ID:

(9D) Date Code: Date Code

Made In: Country of Origin

DeptID:

(ii) Avago Baby Label (Only available on bulk packaging)

RoHS Compliant

max temp 250C

Lamps Baby Label

(1P) PART #: Part Number

(1T) LOT #: Lot Number

(9D)MFG DATE: Manufacturing Date

QUANTITY: Packing Quantity

C/O: Country of Origin

Customer P/N:

CAT: Intensity Bin

BIN: Color Bin

Supplier Code:

DATECODE: Date Code

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-2213EN - October 26, 2009

HLMP-KB45-AD202 [AVAGO]

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