HSMN-A430-V50M2 [AVAGO]

SINGLE COLOR LED, BLUE, ROHS COMPLIANT, PLASTIC, SMT, LCC-4;
HSMN-A430-V50M2
型号: HSMN-A430-V50M2
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

SINGLE COLOR LED, BLUE, ROHS COMPLIANT, PLASTIC, SMT, LCC-4

光电
文件: 总11页 (文件大小:247K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HSMx-A43x-xxxxx  
Surface Mount LED Indicator  
Data Sheet  
Description  
Features  
Industry Standard PLCC-4  
High reliability LED package  
High brightness using AllnGaP and InGaN dice tech-  
nologies  
High optical efficiency  
Narrow Viewing angle at 30°  
Available in 8mm carrier tape on 7-inch reel  
Compatible with both IR and TTW soldering process  
The Power PLCC-4 SMT LED with Lens are high-perfor-  
mance PLCC-4 package size SMT LEDs targeted mainly in  
Automotive & Electronics Signs and Signals (ESS) markets.  
These top-mount single-chip packages with focused radia-  
tion offer high brightness in beam direction and are excel-  
lent for interior automotive, indoor and outdoor sign and  
industrial applications. With additional lens in 30° variants,  
these products are especially fitting to applications for  
traffic lights, CHMSL and displays.  
The PLCC-4 package family is able to dissipate heat better  
compared to the PLCC-2 packages. In proportion to this  
increase in driving current, this family of LEDs is able to  
produce higher light output compared to the convention-  
al PLCC-2 SMT LEDs.  
Applications  
Interior automotive  
Instrument panel backlighting  
Central console backlighting  
Cabin backlighting  
Navigation and audio system  
Dome lighting  
As an extension of the standard flat top PLCC-4 SMT LEDs,  
the Power PLCC-4 with Lens device is able to provide fo-  
cused beams within narrow viewing angles (30°) meeting  
the market’s requirements for focused radiation and high  
brightness in beam directions.  
Push button backlighting  
Exterior automotive  
Turn signals  
The Power PLCC-4 SMT LED with 30° is ideal for panel,  
push button, or general backlighting in automotive interi-  
or & exterior, sign, office equipment, industrial equipment  
and home appliances applications. This package design  
coupled with careful selection of component materials al-  
low the Power PLCC-4 SMT LED with Lens to perform with  
higher reliability in a larger temperature range -40°C to  
100°C. This high reliability feature is crucial to allow the  
Power PLCC-4 SMT LED with Lens to do well in harsh en-  
vironments such as its target Automotive & ESS markets.  
The Power PLCC4 SMT LED with Lens package is also de-  
signed to be compatible with both IR-solder re-flow and  
through-the-wave soldering.  
CHMSL  
Rear Combination Lamp  
Side repeaters  
Electronic signs and signals  
Interior and exterior full color sign  
Variable message sign  
Garden lighting  
Office automation, home appliances, industrial equipment  
Front panel backlighting  
Push button backlighting  
Display backlighting  
CAUTION: HSMN, HSMM-A43x-xxxxx LEDs are Class 2 ESD sensitive. Please observe appropriate precautions  
during handling and processing. Refer to Avago Application Note AN-1142 for additional details.  
The new Avago Technologies Power PLCC-4 SMT LED with  
30° Lens will carry the part number HSMx- A43xxxxxx. The  
high brightness AlInGaP and InGaN dice technologies  
utilized will provide the product brightness that meets  
the Automotive and ESS markets requirements. The Lens  
package will complement and complete the existing AlIn-  
Gap & InGaN color standard Power-PLCC-4 LED that Ava-  
go Technologies offers, providing customers an extra Lens  
option from one supplier.  
To facilitate easy pick and place assembly, the LEDs are  
packed in EIA-compliant tape and reel. Every reel will be  
shipped in single intensity and color bin (except for red  
color), to provide close uniformity  
Package Dimensions  
2.8 ± ±0.2  
3.87 max.  
0.80 ± ±0.1  
2.2 ± ±0.2  
0.1 TYP.  
+ve  
-ve  
3.2 ± ±0.2  
3.5 ± ±0.2  
0.8 ± ±0.3  
-ve  
-ve  
0.5 ± ±0.1  
0.7 ± ±0.1  
Package marking  
Note: All dimensions in mm  
Electrical connection between all cathodes is recommended  
2
Device Selection Guide  
Color  
Part Number  
Min. I (mcd) Typ. I (mcd) Max. I (mcd) Test Current (mA) Dice Technology  
V
V
V
Red  
HSMC-A430-W50M1  
HSMC-A431-X90M1  
HSMJ-A430-W50M1  
HSMJ-A431-X90M1  
HSML-A431-X90M1  
HSMA-A430-W90M1  
HSMA-A431-Y00M1  
HSMA-A431-X90M1  
HSMA-A431-13NM1  
HSMM-A430-X90M2  
HSMN-A430-V50M2  
1125.00  
2300.00  
3550.00  
50  
50  
50  
50  
50  
50  
50  
50  
50  
30  
30  
AlInGaP  
AlInGaP  
AlInGaP  
AlInGaP  
AlInGaP  
AlInGaP  
AlInGaP  
AlInGaP  
AlInGaP  
InGaN  
2240.00  
1125.00  
2240.00  
2240.00  
1400.00  
2850.00  
2240.00  
7150.00  
2240.00  
715.00  
4000.00  
2300.00  
4500.00  
4500.00  
3000.00  
5000.00  
4700.00  
-
7150.00  
3550.00  
7150.00  
7150.00  
4500.00  
-
Red Orange  
Orange  
Amber  
7150.00  
14000.00  
7150.00  
2240.00  
Green  
Blue  
InGaN  
Notes:  
1. The luminous intensity I , is measured at the mechanical axis of the lamp package.  
V
The actual peak of the spatial radiation pattern may not be aligned with this axis.  
2. Iv tolerance 12ꢀ  
Part Numbering System  
HSM x - A X  
X X - X X X X X  
3 4 5 6 7 8 9  
1
2
Packaging Option  
Color Bin Selection  
Intensity Bin Select  
Device Specific Configuration  
Package Type  
LED Chip Color  
3
Absolute Maximum Ratings (T =25°C)  
A
Parameters  
HSMC/A  
HSMV  
HSMK/M/N  
DC Forward Current [1]  
70 mA  
70 mA  
30 mA  
Peak Forward Current [2]  
Power Dissipation  
Reverse Voltage  
200 mA  
200 mA  
240 mW  
5V  
90 mA  
114 mW  
4V  
180 mW  
5V  
Junction Temperature  
Operating Temperature  
Storage Temperature  
Notes:  
110 °C  
- 40 °C to + 100 °C  
- 40 °C to + 100 °C  
1. Derate linearly as shown in Figure 4.  
2. Duty factor = 10ꢀ, Frequency = 1kHz  
Optical Characteristics (T = 25 °C)  
A
Peak  
Wavelength  
(nm)  
Dominant  
Viewing Angle  
Luminous  
[2]  
Wavelength  
2q  
Efficacy  
½
[1]  
[3]  
l
PEAK  
l
(nm)  
(Degrees)  
Typical  
30  
h
V
(lm/W)  
D
Dice  
Technology  
Typical  
635  
621  
623  
609  
592  
518  
468  
500  
Typical  
626  
615  
617  
605  
590  
525  
470  
502  
Typical  
150  
240  
263  
320  
480  
500  
75  
Color  
Part Number  
Red  
HSMC-A43x  
AlInGaP  
AlInGaP  
AlInGaP  
AlInGaP  
AlInGaP  
InGaN  
Red  
Orange  
HSMJ-A43x  
HSMV-A430  
HSML-A431  
HSMA-A43x  
HSMM-A430  
HSMN-A43X  
HSMK-A43X  
30  
30  
Orange  
Amber  
Green  
Blue  
30  
30  
30  
InGaN  
30  
Cyan  
InGaN  
30  
285  
Notes:  
1. The dominant wavelength, l , is derived from the CIE Chromaticity Diagram and represents the color of the device.  
D
2. q½ is the off-axis angle where the luminous intensity is ½ the peak intensity.  
3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = I / h , where I is the luminous intensity in candelas and h is  
V
V
V
V
the luminous efficacy in lumens / watt.  
Electrical Characteristics (T = 25 °C)  
A
Forward Voltage V (Volts)@I =50 mA  
Reverse Voltage V @100mA  
Reverse Voltage V @10mA  
F
F
R
R
Minimum  
1.7  
Typical  
Maximum  
2.5  
Minimum  
Minimum  
Part Number  
HSMC/J/L/A  
HSMV  
2.2  
2.8  
5
5
-
-
1.7  
3.4  
Forward Voltage V (Volts)@I =30 mA  
Reverse Voltage V @100mA  
Reverse Voltage V @10mA  
F
F
R
R
Minimum  
Typical  
Maximum  
Minimum  
Minimum  
Part Number  
HSMK/M/N  
2.7  
3.9  
4.6  
-
5
4
1
0.8  
0.6  
0.4  
0.2  
0
InGaN  
Cyan  
AlInGaP Amber  
InGaN  
Green  
InGaN  
Blue  
AlInGaP Orange  
AlInGaP Red Orange  
AlInGaP Red  
380  
430  
480  
530  
580  
630  
680  
730  
780  
WAVELENGTH - nm  
Figure 1. Relative Intensity Vs. Wavelength  
80  
70  
HSMV  
HSMC/J/L/A  
60  
50  
40  
30  
20  
10  
0
HSMK/M/N  
0
1
2
3
4
5
FORWARD VOLTAGE - V  
Figure 2. Forward Current Vs. Forward Voltage  
1.2  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
1.0  
0.8  
0.6  
0.4  
0.2  
0
0
5
10  
DC FORWARD CURRENT - mA  
Figure 3b. Relative Intensity Vs. Forward Current (InGaN).  
15  
20  
25  
30  
35  
0
5 10 15 20 25 30 35 40 45 50 55 60 65 70 75  
DC FORWARD CURRENT - mA  
Figure 3a. Relative Intensity Vs. Forward Current (AlInGaP).  
5
80  
70  
60  
50  
40  
30  
20  
10  
0
35  
30  
300C/W  
25  
20  
15  
10  
5
300C/W  
350C/W  
470C/W  
350C/W  
470C/W  
0
0
20  
40  
60  
80  
100  
120  
0
20  
40  
60  
80  
100  
120  
AMBIENT TEMPERATURE – C  
AMBIENT TEMPERATURE – C  
Figure 4a. Maximum Forward Current Vs. Ambient Temperature.  
Derated Based on TJmax= 110°C (AlInGaP)  
Figure 4b. Maximum Forward Current Vs. Ambient Temperature.  
Derated Based on TJmax= 110°C (InGaN)  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
-90  
-60  
-30  
0
30  
60  
90  
ANGULAR DISPLACEMENT - DEGREES  
Figure 5. Radiation Pattern  
6
X
X
2.60  
(0.103)  
0.40 (0.016)  
1.10  
(0.043)  
Y
Y
0.50  
(0.020)  
4.50 (0.178)  
1.50 (0.059)  
REPRESENTS ELECTRICAL  
CONNECTIVITY BETWEEN PADS  
DIMENSIONS IN mm (INCHES).  
SOLDER RESIST  
Figure 6a. Recommended Soldering Pad Pattern (IR Reflow).  
X
X
0.5 (0.020)  
6.1 (0.240)  
2.8 (0.110)  
Y
2.0 (0.079)  
6.0 (0.236)  
1.0 (0.039)  
Y
2.0 (0.079)  
3.0 (0.118)  
DIMENSIONS IN mm (INCHES).  
REPRESENTS ELECTRICAL  
CONNECTIVITY BETWEEN PADS  
SOLDER RESIST  
Figure 6b. Recommended Soldering Pad Pattern (TTW).  
7
Vacuum Pick-up Tool  
Nozzle Inner Diameter  
size: 1.0 to 1.5 mm  
Soft Tip  
1.25mm  
Radius Contour  
Figure 7. Soft Tip Vacuum Pick-up Tool for Extracting SMT LED Components from Carrier Tape.  
10 to 20 SEC.  
-6°C/SEC MAX.  
20 SEC. MAX.  
255 °C +5°C  
-0°C  
217°C  
240°C MAX.  
3°C/SEC. MAX.  
100-150°C  
3°C/SEC MAX.  
125°C +/- 25°C  
183°C  
–6°C/SEC.  
MAX.  
3°C/SEC.  
MAX.  
60-150 SEC.  
MAX. 120 SEC.  
120 SEC. MAX.  
60-150 SEC.  
TIME  
TIME  
Figure 8a. Recommended SnPb Reflow Soldering Profile  
Figure 8b. Recommended Pb-free Reflow Soldering Profile.  
Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT  
LED Indicator Components.  
LAMINAR WAVE  
HOT AIR KNIFE  
TURBULENT WAVE  
BOTTOM SIDE  
OF PC BOARD  
250  
200  
150  
100  
TOP SIDE OF  
PC BOARD  
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)  
PREHEAT SETTING = 150 C (100 C PCB)  
SOLDER WAVE TEMPERATURE = 245 C  
AIR KNIFE AIR TEMPERATURE = 390 C  
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)  
AIR KNIFE ANGLE = 40  
FLUXING  
SOLDER: SN63; FLUX: RMA  
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY  
COOLED BEFORE EXERTING MECHANICAL FORCE.  
50  
30  
PREHEAT  
20 30  
0
10  
40  
50  
60  
70  
80  
90  
100  
TIME – SECONDS  
Figure 9. Recommended Wave Soldering Profile.  
8
TRAILER  
COMPONENT  
LEADER  
200 mm MIN. FOR 180 REEL.  
200 mm MIN. FOR 330 REEL.  
480 mm MIN. FOR 180 REEL.  
960 mm MIN. FOR 330 REEL.  
C
A
USER FEED DIRECTION  
Figure 10. Tape Leader and Trailer Dimensions  
8.00 0.10  
4.00 0.10  
2.00 0.0ꢀ  
1.ꢀ0 0.10  
1.7ꢀ 0.10  
ꢀ.ꢀ0 0.0ꢀ  
12.00 + 0.30  
- 0.10  
.388 0.02  
32° MAX  
8° MAX  
32° MAX  
8° MAX  
1.24  
3.ꢀ2 0.10  
3.00 0.10  
Figure 11. Tape Dimensions  
3.70 0.10  
USER FEED DIRECTION  
CATHODE SIDE  
PRINTED LABEL  
Figure 12. Reeling Orientation.  
9
Intensity Bin Select (X X )  
Moisture Sensitivity  
5
6
Individual reel will contain parts from one half bin only  
This product is qualified as Moisture Sensitive Level 2a  
per Jedec J-STD-020. Precautions when handling this  
moisture sensitive product is important to ensure the reli-  
ability of the product. Do refer to Avago Application Note  
AN5305 Handling of Moisture Sensitive Surface Mount  
Devices for details.  
X
Min Iv Bin  
5
X6  
0
2
3
4
5
6
7
8
9
Full Distribution  
2 half bins starting from X51  
3 half bins starting from X51  
4 half bins starting from X51  
5 half bins starting from X51  
2 half bins starting from X52  
3 half bins starting from X52  
4 half bins starting from X52  
5 half bins starting from X52  
A. Storage before use  
-
Unopen moisture barrier bag (MBB) can be stored at  
<40°C/90ꢀRH for 12 months. If the actual shelf life has  
exceeded 12 months and the HIC indicates that baking  
is not required, then it is safe to reflow the LEDs per the  
original MSL rating.  
-
It is not recommended to open the MBB prior to assem-  
bly (e.g. for IQC).  
B. Control after opening the MBB  
-
The humidity indicator card (HIC) shall be read immedi-  
ately upon opening of MBB.  
-
The LEDs must be kept at <30°C / 60ꢀRH at all time and  
all high temperature related process including solder-  
ing, curing or rework need to be completed within 672  
hours.  
Intensity Bin Limits  
Bin ID  
Min (mcd)  
Max (mcd)  
U1  
450.00  
560.00  
C. Control for unfinished reel  
U2  
V1  
V2  
W1  
W2  
X1  
X2  
Y1  
Y2  
Z1  
Z2  
11  
12  
21  
22  
560.00  
715.00  
715.00  
900.00  
-
For any unuse LEDs, they need to be stored in sealed  
MBB with desiccant or desiccator at <5ꢀRH.  
900.00  
1125.00  
1400.00  
1800.00  
2240.00  
2850.00  
3550.00  
4500.00  
5600.00  
7150.00  
9000.00  
11250.00  
14000.00  
18000.00  
D. Control of assembled boards  
1125.00  
1400.00  
1800.00  
2240.00  
2850.00  
3550.00  
4500.00  
5600.00  
7150.00  
9000.00  
11250.00  
14000.00  
-
If the PCB soldered with the LEDs is to be subjected to  
other high temperature processes, the PCB need to be  
stored in sealed MBB with desiccant or desiccator at  
<5ꢀRH to ensure no LEDs have exceeded their floor life  
of 672 hours.  
E. Baking is required if:  
-
-
“10ꢀis Not blue and “5ꢀHIC indicator turns pink.  
The LEDs are exposed to condition of >30°C / 60ꢀ RH at  
any time.  
-
The LEDs floor life exceeded 672 hours.  
Recommended baking condition: 60 5°C for 20 hours.  
Tolerance of each bin limit = 12ꢀ  
10  
Color Bin Select (X )  
7
Individual reel will contain parts from 1 full bin only  
Amber  
Min. (nm)  
Max. (nm)  
X7  
A
582.0  
584.5  
0
Full Distribution  
A and B only  
B
C
D
E
584.5  
587.0  
589.5  
592.0  
594.5  
587.0  
589.5  
592.0  
594.5  
597.0  
Z
Y
W
V
U
T
B and C only  
C and D only  
D and E only  
F
E and F only  
F and G only  
Orange  
Min. (nm)  
597.0  
Max. (nm)  
600.0  
S
G and H only  
A
B
C
D
E
Q
P
A, B and C only  
B, C and D only  
C, D and E only  
D, E and F only  
E, F and G only  
F, G and H only  
A, B, C and D only  
E, F G and H only  
600.0  
603.0  
603.0  
606.0  
N
M
L
606.0  
609.0  
609.0  
612.0  
Red/Orange  
Min. (nm)  
611.0  
Max. (nm)  
616.0  
K
1
A
B
616.0  
620.0  
2
Red  
Min. (nm)  
Max. (nm)  
Color Bin Limits  
Full Distribution  
Blue  
Min. (nm)  
Max. (nm)  
Tolerance of each bin limit = 1nm  
A
460.0  
465.0  
B
C
D
465.0  
470.0  
475.0  
470.0  
475.0  
480.0  
Packaging Option (X X )  
8
9
Option  
Test Current  
Package Type  
Reel Size  
M1  
50mA  
Top Mount  
13 inch  
M2  
30mA  
Top Mount  
13 inch  
Cyan  
Min. (nm)  
Max. (nm)  
A
490.0  
495.0  
Forward Voltage Bin Table  
B
C
D
495.0  
500.0  
505.0  
500.0  
505.0  
510.0  
For HSMV – A43x-xxxxx only  
Bin  
Min.  
Max.  
VA  
1.9  
2.2  
VB  
VC  
VD  
VE  
2.2  
2.5  
2.8  
3.1  
2.5  
2.8  
3.1  
3.4  
Green  
Min. (nm)  
Max. (nm)  
A
515.0  
520.0  
B
C
D
520.0  
525.0  
530.0  
525.0  
530.0  
535.0  
Tolerance for each bin limit = 0.1V  
For product information and a complete list of distributors, please go to our web site: www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.  
Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. Obsoletes AV01-0313EN  
AV02-0208EN - January 23, 2014  

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