HSMS-8102-BLKG [AVAGO]

SILICON, MIXER DIODE;
HSMS-8102-BLKG
型号: HSMS-8102-BLKG
厂家: AVAGO TECHNOLOGIES LIMITED    AVAGO TECHNOLOGIES LIMITED
描述:

SILICON, MIXER DIODE

文件: 总6页 (文件大小:96K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
HSMS-8101, 8202, 8207, 8209  
Surface Mount Microwave Schottky Mixer Diodes  
Data Sheet  
Description/Applications  
Features  
These low cost microwave Schottky diodes are  
specifically designed for use at X/Ku-bands and are  
ideal for DBS and VSAT downconverter applications.  
They are available in SOT-23 and SOT-143 standard  
package configurations.  
Optimized for use at 10-14 GHz  
Low Capacitance  
Low Conversion Loss  
Low RD  
Low Cost Surface Mount Plastic Package  
Lead-free Option Available  
Note that Avago's manufacturing techniques assure that  
dice found in pairs and quads are taken from adjacent  
sites on the wafer, assuring the highest degree of match.  
Package Lead Code Identification (Top View)  
Plastic SOT-23 Package  
Plastic SOT-143 Package  
SINGLE  
3
SERIES  
3
1
2
1
2
#1  
#2  
RING  
QUAD  
CROSS-OVER  
QUAD  
3
4
3
4
1
2
1
2
#7  
#9  
Absolute Maximum Ratings[1], TA = +25°C  
Attention:  
Symbol Parameter  
Unit  
Min.  
Max.  
Observe precautions for  
handling electrostatic  
sensitive devices.  
PT  
PIV  
TJ  
Total Device Dissipation[2]  
mW  
V
75  
4
Peak Inverse Voltage  
Junction Temperature  
°C  
°C  
+150  
+150  
ESD Machine Model (Class A)  
TSTG, Top Storage and Operating  
Temperature  
-65  
ESD Human Body Model (Class 0)  
Refer to Avago Application Note A004R:  
Electrostatic Discharge Damage and Control.  
Notes:  
1. Operation in excess of any one of these conditions may result in  
permanent damage to the device.  
2. Measured in an infinite heat sink at TCASE = 25°C. Derate linearly to  
zero at 150°C per diode.  
2
DC Electrical Specifications, TA = 25°C  
HSMS-8101  
Units Min. Max. Min. Max. Min. Max. Min. Max.  
HSMS-8202  
HSMS-8207  
HSMS-8209  
Symbol Parameters and Test Conditions  
VBR  
CT  
Breakdown Voltage  
IR = 10 µA  
V
pF  
pF  
4
4
4
4
Total Capacitance  
VR = 0 V, f = 1 MHz  
0.26  
0.26  
0.04  
14  
0.26  
0.04  
14  
0.26  
0.04  
14  
DCT  
RD  
Capacitance Difference  
VR = 0 V, f = 1 MHz  
Dynamic Resistance  
IF = 5 mA  
14  
DRD  
VF  
Dynamic Resistance Difference  
IF = 5 mA  
2
2
2
Forward Voltage  
IF = 1 mA  
mV  
mV  
250  
350  
250  
350  
20  
250  
350  
20  
250  
350  
20  
DVF  
Forward Voltage Difference  
IF = 1 mA  
Lead Code  
1
2
7
9
Package Marking Code  
where x is date code  
R1x  
2Rx  
R7x  
R9x  
RF Electrical Parameters, TA = 25°C  
Symbol  
Parameter  
Units  
dB  
Typical  
6.3  
Lc  
Conversion Loss at 12 GHz  
IF Impedance  
ZIF  
150  
SWR  
SWR at 12 GHz  
1.2  
Note:  
DC Load Resistance = 0 ; LO Power = 1 mW.  
SPICE Parameters  
Linear Equivalent Circuit  
0.08 pF  
IS = 4.6 E-8  
RS = 6  
EG = 0.69  
CJO = 0.18 E-12  
PB (VJ) = 0.5  
M = 0.5  
TT = 0  
N = 1.09  
BV = 7.3  
0.17 pF  
1.0 nH  
1.3 nH 6  
IBV = 10E-5  
FC = 0.5  
R
j
Self Bias  
1 mA  
256  
2.5 mA  
142  
R
j
3
Typical Performance, TC = 25°C  
100  
30  
10  
30  
10  
9
8
7
6
I
(Left Scale)  
F
10  
1
V (Right Scale)  
F
TA = +125°C  
1
1
0.1  
T
T
A = +25°C  
A = –55°C  
0.3  
0.3  
0.01  
0
0.2  
0.4  
0.6  
0.8  
0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55  
–7 –5 –3 –1  
1
3
5
7
9
11 13  
FORWARD VOLTAGE (V)  
V - FORWARD VOLTAGE (V)  
LOCAL OSCILLATOR POWER (dBm)  
Figure 1. Typical Forward Current  
vs. Forward Voltage at Three  
Temperatures.  
Figure 2. Typical VF Match, HSMS-  
820X Pairs and Quads.  
Figure 3. Typical Conversion Loss  
vs. Local Oscillator Power.  
Ordering Information  
Specify part number followed by option. For example:  
Profile Option Descriptions  
-BLK = Bulk  
-TR1 = 3K pc. Tape and Reel,  
Device Orientation  
Figures 4, 5  
HSMS - 8101 - XXX  
Bulk or Tape and Reel Option  
-TR2 = 10K pc. Tape and Reel,  
Device Orientation  
Figures 4, 5  
Part Number  
Surface Mount Schottky  
Tape and Reeling conforms to  
Electronic Industries RS-481,  
Taping of Surface Mounted  
Components for Automated  
Placement.”  
Device Orientation  
REEL  
For lead-free option, the part  
number will have the character "G"  
at the end, eg. -TR2G for a 10K pc  
lead-free reel.  
CARRIER  
TAPE  
USER  
FEED  
DIRECTION  
COVER TAPE  
TOP VIEW  
4 mm  
END VIEW  
TOP VIEW  
4 mm  
END VIEW  
8 mm  
8 mm  
A B C  
A B C  
A B C  
A B C  
ABC  
ABC  
ABC  
ABC  
Note: "AB" represents package marking code.  
"C" represents date code.  
Note: "AB" represents package marking code.  
"C" represents date code.  
Figure 4. Option -TR1/-TR2 for SOT-23 Packages.  
Figure 5. Option -TR1/-TR2 for SOT-143 Packages.  
4
Package Characteristics  
Lead Material ...................................................................................... Alloy 42  
Lead Finish................................... Tin-Lead 85-15% (Non lead-free option)  
or Tin 100% (Lead-free option)  
Maximum Soldering Temperature.............................. 260°C for 5 seconds  
Minimum Lead Strength.......................................................... 2 pounds pull  
Typical Package Inductance .................................................................. 2 nH  
Typical Package Capacitance ..............................0.08 pF (opposite leads)  
Recommended PCB Pad Layout for  
Avago’s SOT-23 Products  
Package Dimensions  
Outline 23 (SOT-23)  
e2  
0.039  
1
e1  
0.039  
1
E1  
E
XXX  
0.079  
2.0  
e
L
B
0.035  
0.9  
C
DIMENSIONS (mm)  
D
SYMBOL  
MIN.  
0.79  
0.000  
0.37  
0.086  
2.73  
1.15  
0.89  
1.78  
0.45  
2.10  
0.45  
MAX.  
1.20  
0.100  
0.54  
0.152  
3.13  
1.50  
1.02  
2.04  
0.60  
2.70  
0.69  
0.031  
0.8  
A
A1  
B
A
inches  
Dimensions in  
mm  
C
D
A1  
E1  
e
e1  
e2  
E
Notes:  
XXX-package marking  
Drawings are not to scale  
L
Outline 143 (SOT-143)  
Recommended PCB Pad Layout for  
Avago’s SOT-143 Products  
e2  
e1  
0.112  
2.85  
B1  
0.079  
2
E
E1  
XXX  
0.033  
0.85  
L
0.114  
2.9  
0.081  
2.05  
0.048  
1.2  
0.071  
1.8  
B
C
e
DIMENSIONS (mm)  
0.033  
0.85  
D
SYMBOL  
MIN.  
0.79  
0.013  
0.36  
0.76  
0.086  
2.80  
1.20  
0.89  
1.78  
0.45  
2.10  
0.45  
MAX.  
1.097  
0.10  
0.54  
0.92  
0.152  
3.06  
1.40  
1.02  
2.04  
0.60  
2.65  
0.69  
A
A1  
B
A
0.047  
1.2  
0.031 0.033  
B1  
C
0.8  
0.85  
A1  
D
e
E1  
e
inches  
mm  
Dimensions in  
e1  
e2  
E
Notes:  
XXX-package marking  
L
Drawings are not to scale  
5
Tape Dimensions and Product Orientation  
For Outline SOT-23  
P
P
D
2
E
F
P
0
W
D
1
t1  
Ko  
13.5° MAX  
8° MAX  
9° MAX  
B
A
0
0
DESCRIPTION  
SYMBOL  
SIZE (mm)  
SIZE (INCHES)  
CAVITY  
LENGTH  
WIDTH  
DEPTH  
PITCH  
A
B
K
P
3.15 0.10  
2.77 0.10  
1.22 0.10  
4.00 0.10  
1.00 + 0.05  
0.124 0.004  
0.109 0.004  
0.048 0.004  
0.157 0.004  
0.039 0.002  
0
0
0
BOTTOM HOLE DIAMETER  
D
1
PERFORATION  
CARRIER TAPE  
DIAMETER  
PITCH  
POSITION  
D
1.50 + 0.10  
4.00 0.10  
1.75 0.10  
0.059 + 0.004  
0.157 0.004  
0.069 0.004  
P
E
0
WIDTH  
W
8.00+0.300.10 0.315+0.0120.004  
THICKNESS  
t1  
0.229 0.013  
0.009 0.0005  
DISTANCE  
BETWEEN  
CAVITY TO PERFORATION  
(WIDTH DIRECTION)  
F
3.50 0.05  
0.138 0.002  
CENTERLINE  
CAVITY TO PERFORATION  
(LENGTH DIRECTION)  
P
2.00 0.05  
0.079 0.002  
2
Tape Dimensions and Product Orientation  
For Outline SOT-143  
P
D
P2  
P0  
E
F
W
D1  
t1  
K
9° MAX  
9° MAX  
0
A0  
B
0
DESCRIPTION  
SYMBOL  
SIZE (mm)  
SIZE (INCHES)  
CAVITY  
LENGTH  
WIDTH  
DEPTH  
PITCH  
A
B
K
P
3.19 0.10  
2.80 0.10  
1.31 0.10  
4.00 0.10  
1.00 + 0.25  
0.126 0.004  
0.110 0.004  
0.052 0.004  
0.157 0.004  
0.039 + 0.010  
0
0
0
BOTTOM HOLE DIAMETER  
D
1
PERFORATION  
DIAMETER  
PITCH  
POSITION  
D
1.50 + 0.10  
4.00 0.10  
1.75 0.10  
0.059 + 0.004  
0.157 0.004  
0.069 0.004  
P
E
0
CARRIER TAPE  
DISTANCE  
WIDTH  
THICKNESS  
W
t1  
8.00+0.300.10 0.315+0.0120.004  
0.254 0.013  
0.0100 0.0005  
CAVITY TO PERFORATION  
(WIDTH DIRECTION)  
F
3.50 0.05  
0.138 0.002  
CAVITY TO PERFORATION  
(LENGTH DIRECTION)  
P
2.00 0.05  
0.079 0.002  
2
For product information and a complete list of distributors, please go to our web site:  
www.avagotech.com  
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Pte.  
in the United States and other countries.  
Data subject to change. Copyright © 2006 Avago Technologies Pte. All rights reserved.  
Obsoletes 5989-2496EN  
5989-4024EN September 8, 2006  

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