HSMS-8209-TR1
更新时间：2024-09-18 18:38:53
品牌：AVAGO
描述：SILICON, X-KU BAND, MIXER DIODE, PLASTIC PACKAGE-4
概述
规格参数
数据手册HSMS-8209-TR1 概述
SILICON, X-KU BAND, MIXER DIODE, PLASTIC PACKAGE-4 RF二极管 微波混频二极管
HSMS-8209-TR1 规格参数
| 是否无铅： | 含铅 | 是否Rohs认证： | 不符合 |
| 生命周期： | Obsolete | 包装说明： | R-PDSO-G4 |
| 针数： | 4 | Reach Compliance Code： | compliant |
| ECCN代码： | EAR99 | HTS代码： | 8541.10.00.70 |
| 风险等级： | 5.15 | 外壳连接： | ANODE AND CATHODE |
| 配置： | CROSSOVER RING, 4 ELEMENTS | 最大二极管电容： | 0.26 pF |
| 二极管元件材料： | SILICON | 二极管类型： | MIXER DIODE |
| 频带： | X BAND TO KU BAND | 最大阻抗： | 150 Ω |
| JESD-30 代码： | R-PDSO-G4 | JESD-609代码： | e0 |
| 元件数量： | 4 | 端子数量： | 4 |
| 最大工作频率： | 14 GHz | 最小工作频率： | 10 GHz |
| 最高工作温度： | 150 °C | 封装主体材料： | PLASTIC/EPOXY |
| 封装形状： | RECTANGULAR | 封装形式： | SMALL OUTLINE |
| 峰值回流温度（摄氏度）： | NOT SPECIFIED | 认证状态： | Not Qualified |
| 子类别： | Microwave Mixer Diodes | 表面贴装： | YES |
| 技术： | SCHOTTKY | 端子面层： | TIN LEAD |
| 端子形式： | GULL WING | 端子位置： | DUAL |
| 处于峰值回流温度下的最长时间： | NOT SPECIFIED | Base Number Matches： | 1 |
HSMS-8209-TR1 数据手册
通过下载HSMS-8209-TR1数据手册来全面了解它。这个PDF文档包含了所有必要的细节，如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载HSMS-8101, 8202, 8207, 8209
Surface Mount Microwave Schottky Mixer Diodes
Data Sheet
Description/Applications
Features
• Optimized for use at 10‑14 GHz
• Low Capacitance
These low cost microwave Schottky diodes are specifically
designed for use at X/Ku‑bands and are ideal for DBS and
VSAT downconverter applications. They are available in
SOT‑23 and SOT‑143 standard package configurations.
• Low Conversion Loss
• Low RD
Note that Avago's manufacturing techniques assure that
dice found in pairs and quads are taken from adjacent
sites on the wafer, assuring the highest degree of
match.
• Low Cost Surface Mount Plastic Package
• Lead‑free
Plastic SOT-23 Package
Package Lead Code Identification
(Top View)
SINGLE
3
SERIES
3
1
2
1
2
#1
#2
Plastic SOT-143 Package
RING
QUAD
CROSS-OVER
QUAD
3
4
3
4
1
2
1
2
#7
#9
Absolute Maximum Ratings[1], TA = +25°C
Symbol Parameter
Unit Min. Max.
Attention: Observe precautions for
handling electrostatic sensitive devices.
ESD Machine Model (Class A)
ESD Human Body Model (Class 0)
Refer to Avago Application Note A004R:
Electrostatic Discharge Damage and Control.
PT
PIV
TJ
Total Device Dissipation[2] mW
—
—
—
‑65
75
Peak Inverse Voltage
Junction Temperature
V
4
°C
°C
+150
+150
TSTG, Top Storage and Operating
Temperature
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. Measured in an infinite heat sink at TCASE = 25°C. Derate linearly to
zero at 150°C per diode.
DC Electrical Specifications, TA = 25°C
Symbol Parameters and Test Conditions
HSMS-8101
Min. Max.
HSMS-8202
Min. Max.
HSMS-8207
Min. Max.
HSMS-8209
Min. Max.
Units
VBR
Breakdown Voltage
IR = 10 µA
V
4
4
4
4
CT
Total Capacitance
VR = 0 V, f = 1 MHz
pF
pF
Ω
0.26
—
0.26
0.04
14
0.26
0.04
14
0.26
0.04
14
DCT
RD
Capacitance Difference
VR = 0 V, f = 1 MHz
Dynamic Resistance
IF = 5 mA
14
DRD
VF
Dynamic Resistance Difference
IF = 5 mA
Ω
—
2
2
2
Forward Voltage
IF = 1 mA
mV
mV
250
350
—
250
350
20
250
350
20
250
350
20
DVF
Forward Voltage Difference
IF = 1 mA
Lead Code
1
2
7
9
Package Marking Code
where x is date code
R1x
2Rx
R7x
R9x
Linear Equivalent Circuit
RF Electrical Parameters, TA = 25°C
Symbol Parameter
Units
dB
Typical
0.08 pF
Lc
Conversion Loss at 12 GHz
IF Impedance
6.3
150
1.2
ZIF
Ω
SWR
SWR at 12 GHz
0.17 pF
1.0 nH
1.3 nH
6
Note:
DC Load Resistance = 0 Ω; LO Power = 1 mW.
R
j
Self Bias
SPICE Parameters
1 mA
256
2.5 mA
142
IS = 4.6 E‑8
RS = 6
EG = 0.69
TT = 0
Rj
CJO = 0.18 E‑12
PB (VJ) = 0.5
M = 0.5
N = 1.09
BV = 7.3
IBV = 10E‑5
FC = 0.5
2
Typical Performance, TC = 25°C
100
30
10
30
10
9
8
7
6
I (Left Scale)
F
10
1
V (Right Scale)
F
TA = +125 C
TA = +25 C
TA = –55 C
1
1
0.1
0.3
0.3
0.01
0
0.2
0.4
0.6
0.8
0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55
–7 –5 –3 –1
1
3
5
7
9
11 13
FORWARD VOLTAGE (V)
V - FORWARD VOLTAGE (V)
LOCAL OSCILLATOR POWER (dBm)
Figure 1. Typical Forward Current vs. Forward
Voltage at Three Temperatures.
Figure 2. Typical VF Match, HSMS-820X Pairs and
Quads.
Figure 3. Typical Conversion Loss vs. Local Oscillator
Power.
Ordering Information
Profile Option Descriptions
Specify part number followed by option. For example:
‑BLKG = Bulk
‑TR1G = 3K pc. Tape and Reel, Device Orientation
Figures 4, 5
HSMS ‑ 8101 ‑ XXXG
Bulk or Tape and Reel Option
‑TR2G = 10K pc. Tape and Reel, Device Orientation
Figures 4, 5
Part Number
Surface Mount Schottky
Tape and Reeling conforms to Electronic Industries RS‑
481, “Taping of Surface Mounted Components for Auto‑
mated Placement.”
Device Orientation
REEL
CARRIER
TAPE
USER
FEED
DIRECTION
COVER TAPE
TOP VIEW
4 mm
END VIEW
TOP VIEW
4 mm
END VIE W
8 mm
8 mm
A B C
A B C
A B C
A B C
ABC
ABC
ABC
ABC
Note: "AB" represents package marking code.
"C" represents date code.
Note: "AB" represents package marking code.
"C" re resents date code.
p
Figure 5. Option -TR1G/-TR2G for SOT-143 Packages.
Figure 4. Option -TR1G/-TR2G for SOT-23 Packages.
3
Package Characteristics
Lead Material
Alloy 42
Lead Finish
Tin 100% (Lead‑free option)
260°C for 5 seconds
2 pounds pull
Maximum Soldering Temperature
Minimum Lead Strength
Typical Package Inductance
Typical Package Capacitance
2 nH
0.08 pF (opposite leads)
Package Dimensions
Recommended PCB Pad Layout for Avago’s SOT-23
Outline 23 (SOT-23)
Products
e2
0.039
1
e1
0.039
1
E1
E
XXX
0.079
2.0
e
L
B
C
0.035
0.9
DIMENSIONS (mm)
D
SYMBOL
MIN.
0.79
0.000
0.30
0.08
2.73
1.15
0.89
1.78
0.45
2.10
0.45
MAX.
1.20
0.100
0.54
0.20
3.13
1.50
1.02
2.04
0.60
2.70
0.69
0.031
0.8
A
A1
B
C
D
E1
e
e1
e2
E
A
inches
mm
Dimensions in
A1
Notes:
XXX-package marking
Drawings are not to scale
L
Outline 143 (SOT-143)
Recommended PCB Pad Layout for Avago’s SOT-143
Products
e2
e1
0.112
2.85
B1
0.079
2
0.033
0.85
E
E1
XXX
0.114
2.9
0.081
2.05
0.048
1.2
0.071
1.8
L
B
C
e
0.033
0.85
DIMENSIONS (mm)
D
SYMBOL
MIN.
0.79
0.013
0.36
0.76
0.086
2.80
1.20
0.89
1.78
0.45
2.10
0.45
MAX.
1.097
0.10
0.54
0.92
0.152
3.06
1.40
1.02
2.04
0.60
2.65
0.69
0.047
1.2
0.031 0.033
A
A1
B
B1
C
D
E1
e
0.8
0.85
A
inches
mm
Dimensions in
A1
e1
e2
E
Notes:
XXX-package marking
Drawings are not to scale
L
4
Tape Dimensions and Product Orientation
For Outline SOT-23
P
P
D
2
E
F
P
0
W
D
1
t1
Ko
13.5° MAX
8° MAX
9°
MAX
B
A
0
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
0
3.15
±
±
±
±
0.10
0.10
0.10
0.10
0.124
0.109
0.048
0.157
0.039
±
±
±
±
±
0.004
0.004
0.004
0.004
0.002
B
2.77
1.22
4.00
0
K
0
P
D
1
BOTTOM HOLE DIAMETER
1.00 + 0.05
PERFORATION
CARRIER TAPE
DIAMETER
PITCH
POSITION
D
1.50 + 0.10
0.059 + 0.004
P
4.00
1.75
±
±
0.10
0.10
0.157
0.069
±
±
0.004
0.004
0
E
WIDTH
THICKNESS
W
t1
8.00+0.30-0.10 0.315+0.012-0.004
0.229 0.013 0.009 � 0.0005
±
DISTANCE
BETWEEN
CENTERLINE
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50
2.00
±
0.05
0.138
0.079
±
±
0.002
0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
2
±
0.05
5
Tape Dimensions and Product Orientation
For Outline SOT-143
P
D
P2
P0
E
F
W
D1
t1
K
9
°
MAX
9°
MAX
0
A0
B
0
DESCRIPTION
SYMBOL
SIZE (mm)
SIZE (INCHES)
CAVITY
LENGTH
WIDTH
DEPTH
PITCH
A
B
K
P
D
3.19
2.80
1.31
4.00
±
±
±
±
0.10
0.10
0.10
0.10
0.126
0.110
0.052
0.157
±
±
±
±
0.004
0.004
0.004
0.004
0
0
0
BOTTOM HOLE DIAMETER
1.00 + 0.25
0.039 + 0.010
1
PERFORATION
DIAMETER
PITCH
POSITION
D
P
E
1.50 + 0.10
0.059 + 0.004
4.00
1.75
±
±
0.10
0.10
0.157
±
0.004
0.004
0
0.069 �±
CARRIER TAPE
DISTANCE
WIDTH
THICKNESS
W
t1
8.00+0.30-0.10 0.315+0.012-0.004
0.254 0.013 0.0100 0.0005
±
±
CAVITY TO PERFORATION
(WIDTH DIRECTION)
F
3.50
2.00
±
0.05
0.138
0.079
±
0.002
CAVITY TO PERFORATION
(LENGTH DIRECTION)
P
±
0.05
±
0.002
2
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes 5989-4024EN
AV02-1365EN - May 29, 2009
HSMS-8209-TR1 相关器件
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| HSMS-8209-TR1G | AVAGO | SILICON, KU BAND, MIXER DIODE, ROHS COMPLIANT, PLASTIC PACKAGE-4 | 获取价格 |
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