ADS8323YB/2K [BB]

16-Bit, 500kSPS, microPower Sampling ANALOG-TO-DIGITAL CONVERTER; 16位, 500KSPS ,微功耗模拟数字转换器
ADS8323YB/2K
型号: ADS8323YB/2K
厂家: BURR-BROWN CORPORATION    BURR-BROWN CORPORATION
描述:

16-Bit, 500kSPS, microPower Sampling ANALOG-TO-DIGITAL CONVERTER
16位, 500KSPS ,微功耗模拟数字转换器

转换器
文件: 总16页 (文件大小:271K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ADS8323  
®
A
D
S
8
3
2
3
SBAS224B DECEMBER 2001 REVISED MAY 2002  
16-Bit, 500kSPS, microPower Sampling  
ANALOG-TO-DIGITAL CONVERTER  
DESCRIPTION  
FEATURES  
The ADS8323 is a 16-bit, 500kSPS Analog-to-Digital Con-  
verter (ADC) with an internal 2.5V reference. The device  
includes a 16-bit capacitor-based SAR ADC with inherent  
sample-and-hold. The ADS8323 offers a full 16-bit interface,  
or an 8-bit option where data is read using two read cycles.  
HIGH-SPEED PARALLEL INTERFACE  
500kSPS SAMPLING RATE  
LOW POWER: 85mW at 500kSPS  
BIPOLAR INPUT RANGE  
TQFP-32 PACKAGE  
The ADS8323 is available in a TQFP-32 package and is  
specified over the industrial –40°C to +85°C temperature  
range.  
APPLICATIONS  
HIGH-SPEED DATA AQUISITION  
OPTICAL POWER MONITORING  
MOTOR CONTROL  
ATE  
BYTE  
SAR  
Output Latches  
and  
Parallel  
Three State  
Data  
ADS8323  
Drivers  
Output  
+IN  
CDAC  
IN  
S/H Amp  
CLOCK  
Comparator  
CONVST  
CS  
Conversion  
and Control  
Logic  
REFIN  
RD  
BUSY  
Internal  
+2.5V Ref  
REFOUT  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2001, Texas Instruments Incorporated  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
www.ti.com  
PACKAGE/ORDERING INFORMATION  
MAXIMUM  
INTEGRAL  
LINEARITY  
ERROR (LSB)  
NO  
MISSING  
CODES  
SPECIFICATION  
TEMPERATURE  
RANGE  
PACKAGE  
ORDERING  
NUMBER  
TRANSPORT  
MEDIA, QUANTITY  
PRODUCT  
ERROR (LSB) PACKAGE-LEAD DESIGNATOR(1)  
ADS8323Y  
±8  
"
±6  
"
14  
"
15  
"
TQFP-32  
PBS  
"
PBS  
"
40°C to 85°C  
ADS8323Y/250  
ADS8323Y/2K  
ADS8323YB/250  
ADS8323YB/2K  
Tape and Reel, 250  
Tape and Reel, 2000  
Tape and Reel, 250  
Tape and Reel, 2000  
"
"
"
ADS8323YB  
TQFP-32  
40°C to 85°C  
"
"
"
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.  
ABSOLUTE MAXIMUM RATINGS  
Absolute Maximum Ratings over operating free-air temperature (unless  
otherwise noted)(1)  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
Supply Voltage, DGND to DVDD .............................................................. 0.3V to 6V  
Supply Voltage, AGND to AVDD ............................................................... 0.3V to 6V  
Analog Input Voltage Range ..................... AGND - 0.3V to AVDD + 0.3V  
Reference Input Voltage ........................... AGND - 0.3V to AVDD + 0.3V  
Digital Input Voltage Range ...................... DGND - 0.3V to DVDD + 0.3V  
Ground Voltage Differences, AGND to DGND ................................ ±0.3V  
Voltage Differences, DVDD to AGND ..................................... 0.3V to 6V  
Power Dissipation .......................................................................... 850mW  
Operating Virtual Junction Temperature Range, TJ ........ 40°C to 150°C  
Operating Free-Air Temperature Range, TA ...................... 40°C to 85°C  
Storage Temperature Range, TSTG .................................. 65°C to 150°C  
Lead Temperature 1.6mm (1/16 inch) from Case for 10sec ..................... 260°C  
This integrated circuit can be damaged by ESD. Texas  
Instruments recommends that all integrated circuits be handled  
with appropriate precautions. Failure to observe proper han-  
dling and installation procedures can cause damage.  
ESD damage can range from subtle performance degrada-  
tion to complete device failure. Precision integrated circuits  
may be more susceptible to damage because very small  
parametric changes could cause the device not to meet its  
published specifications.  
NOTE: (1) Stresses beyond those listed under "absolute maximum ratings" may  
cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those  
indicated under "recommended operating conditions" is not implied. Exposure  
to absolute-maximum-rated conditions of extended periods may affect device  
reliability.  
RECOMMENDED OPERATING CONDITIONS  
POWER SUPPLY  
MIN  
TYP  
MAX  
UNIT  
DISSIPATION RATING TABLE  
DERATING  
(1)  
Supply Voltage AVDD  
4.75  
4.75  
5.0  
5.0  
5.25  
5.25  
V
V
(1)  
TA 25°C  
POWER  
RATING  
FACTOR  
ABOVE  
T
TA = 70°C  
POWER  
RATING  
TA = 85°C  
POWER  
RATING  
DVDD  
ANALOG/REFERENCE INPUTS  
PACKAGE  
A = 25°C(1)  
Differential analog input voltage  
(IN+ to IN)  
External Reference Voltage  
REFIN  
+REFIN  
2.55  
V
V
TQFP-32  
1636mW  
13.09mW/°C  
1047mW  
850mW  
1.5  
2.5  
NOTE: (1) This is the inverse of the traditional junction-to-ambient thermal  
resistance (RθJA). Thermal resistances are not production tested and are for  
informational purposes only.  
NOTE: (1) The voltage difference between AVDD and DVDD terminals cannot  
exceed 0.3V to maintain performance specifications.  
EQUIVALENT INPUT CIRCUIT  
AVDD  
DVDD  
C(SAMPLE)  
20pF  
RON  
20Ω  
AIN  
DIN  
AGND  
DGND  
Diode Turn-On Voltage: 0.35V  
Equivalent Analog Input Circuit  
Equivalent Digital Input Circuit  
ADS8323  
2
SBAS224B  
www.ti.com  
ELECTRICAL CHARACTERISTICS  
At 40°C to +85°C, +DVDD = +AVDD = +5V, VREF = +2.5V, fSAMPLE = 500kSPS, and fCLK = 20 fSAMPLE, unless otherwise specified.  
ADS8323Y  
TYP  
ADS8323YB  
PARAMETER  
RESOLUTION  
CONDITIONS  
MIN  
MAX  
MIN  
TYP  
MAX  
UNITS  
16  
Bits  
ANALOG INPUT  
Full-Scale Input Span(1)  
Absolute Input Range  
+IN (IN)  
+IN  
VREF  
0.3  
0.3  
+VREF  
AVDD + 0.3  
AVDD + 0.3  
V
V
V
IN  
Capacitance  
Leakage Current  
25  
±1  
pF  
nA  
SYSTEM PERFORMANCE  
No Missing Codes  
Integral Linearity Error  
Differential Linearity Error  
Offset Error  
Gain Error(3)  
Common-Mode Rejection Ratio  
14  
15  
Bits  
LSB(2)  
LSB  
±4  
±3  
±1  
±0.25  
70  
50  
±8  
±3  
±1  
±0.5  
±0.12  
±6  
±2  
±0.5  
±1  
mV  
±0.25 % of FSR  
At DC  
VIN = 1Vp-p at 1MHz  
dB  
dB  
Noise  
60  
±3  
µVrms  
LSB  
Power-Supply Rejection  
At FFFFH Output Code  
SAMPLING DYNAMICS  
Conversion Time  
Acquisition Time  
1.6  
0.4  
µs  
µs  
Throughput Rate  
Aperture Delay  
Aperture Jitter  
Small-Signal Bandwidth  
Step Response  
Overvoltage Recovery  
500  
kSPS  
ns  
ps  
MHz  
ns  
ns  
10  
30  
20  
100  
150  
DYNAMIC CHARACTERISTICS  
Total Harmonic Distortion(4)  
SINAD  
VIN = 5Vp-p at 100kHz  
90  
81  
94  
93  
83  
96  
dB  
dB  
dB  
V
V
IN = 5Vp-p at 100kHz  
IN = 5Vp-p at 100kHz  
Spurious-Free Dynamic Range  
REFERENCE OUTPUT  
Voltage  
Source Current  
Drift  
IOUT = 0  
Static Load  
IOUT = 0  
2.475  
1.5  
2.50  
2.525  
10  
2.48  
2.52  
V
µA  
ppm/°C  
mV  
25  
0.6  
Line Regulation  
4.75V VCC 5.25V  
REFERENCE INPUT  
Range  
2.55  
V
DIGITAL INPUT/OUTPUT  
Logic Family  
Logic Levels:  
VIH  
CMOS  
IIH +5µA  
IIL 5µA  
3.0  
0.3  
4.0  
+DVDD  
0.8  
V
V
V
V
VIL  
VOH  
IOH = 1.6mA  
IOL = +1.6mA  
VOL  
0.4  
Data Format  
Binary Twos Complement  
POWER-SUPPLY REQUIREMENT  
Power-Supply Voltage  
+AVDD  
4.75  
4.75  
5
5
5.25  
5.25  
25  
V
V
+DVDD  
Supply Current  
Power Dissipation  
fSAMPLE = 500kSPS  
fSAMPLE = 500kSPS  
17  
85  
mA  
mW  
125  
TEMPERATURE RANGE  
Specified Performance  
40  
+85  
°C  
Specifications same as ADS8323Y.  
NOTES: (1) Ideal input span; does not include gain or offset error. (2) LSB means Least Signifcant Bit, with VREF equal to +2.5V; 1LSB = 76µV. (3) Measured relative  
to an ideal, full-scale input (+In (In)) of 4.9999V. Thus, gain error includes the error of the internal voltage reference. (4) Calculated on the first nine harmonics  
of the input frequency.  
ADS8323  
SBAS224B  
3
www.ti.com  
TIMING CHARACTERISTICS(1)(2)  
All specifications typical at 40°C to +85°C, +DVDD = +5V.  
ADS8323Y  
TYP  
ADS8323YB  
TYP  
PARAMETER  
SYMBOL  
MIN  
MAX  
MIN  
MAX  
UNITS  
Conversion Time  
Acquisition Time  
CLOCK Period  
CLOCK HIGH Time  
CLOCK LOW Time  
CONVST LOW to CLOCK HIGH  
CONVST LOW Time  
CONVST LOW to BUSY HIGH  
CS LOW to CONVST LOW  
CONVST HIGH  
CLOCK HIGH to BUSY LOW  
CS HIGH  
CS LOW to RD LOW  
RD HIGH to CS HIGH  
RD LOW Time  
tCONV  
tACQ  
tC1  
tW1  
tW2  
tD1  
tW3  
tD2  
tD3  
tW4  
tD4  
tW5  
tD5  
tD6  
tW6  
tD7  
1.6  
0.4  
µs  
µs  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
100  
40  
40  
10  
20  
25  
25  
0
20  
0
0
0
50  
40  
5
RD LOW to Data Valid  
Data Hold from RD HIGH  
BYTE Change to RD LOW(3)  
RD HIGH Time  
tD8  
tD9  
tW7  
0
20  
NOTES: (1) All input signals are specified with rise and fall times of 5ns, tR = tF = 5ns (10% to 90% of DVDD), and timed from a voltage level of (VIL + VIH)/2. (2)  
See timing diagram, below. (3) BYTE is asynchronous; when BYTE is 0, bits 15 through 0 appear at DB15-DB0. When BYTE is 1, bits 15 through 8 appear on  
DB7-DB0. RD may remain LOW between changes in BYTE.  
TIMING DIAGRAM  
tC1  
tW2  
tW1  
CLOCK  
1
2
3
4
5
17  
18  
19  
20  
1
2
3
4
17  
18  
19  
20  
Acquisition  
Conversion  
tCONV  
Acquisition  
tACQ  
tD1  
CONVST  
tW3  
tW4  
BUSY  
BYTE  
tD2  
tD4  
tD3  
tW5  
CS  
RD  
tD5  
tD9  
tD6  
tW6  
tD7  
tD8  
tW7  
DB15-D8  
DB7-D0  
Bits 15-8  
Bits 7-0  
Bits 15-8  
Bits 7-0  
FF  
Bits 15-8  
ADS8323  
4
SBAS224B  
www.ti.com  
PIN CONFIGURATION  
Top View  
TQFP  
32 31 30 29 28 27 26 25  
1
2
3
4
5
6
7
8
24 CS  
DB15  
DB14  
DB13  
DB12  
DB11  
DB10  
DB9  
23 BYTE  
22 RD  
21 CONVST  
20 CLOCK  
19 DGND  
18 +DVDD  
17 BUSY  
ADS8323  
DB8  
9
10 11 12 13 14 15 16  
PIN ASSIGNMENTS  
PIN  
NAME  
I/O DESCRIPTION  
PIN  
NAME  
I/O DESCRIPTION  
19  
20  
DGND  
P
Digital Ground  
1
2
DB15  
DB14  
DB13  
DB12  
DB11  
DB10  
DB9  
DO Data Bit 15 - MSB  
DO Data Bit 14  
DO Data Bit 13  
DO Data Bit 12  
DO Data Bit 11  
DO Data Bit 10  
DO Data Bit 9  
DO Data Bit 8  
DO Data Bit 7  
DO Data Bit 6  
DO Data Bit 5  
DO Data Bit 4  
DO Data Bit 3  
DO Data Bit 2  
DO Data Bit 1  
DO Data Bit 0 - LSB  
CLOCK  
DI  
An external CMOS compatible clock can be applied  
to the CLOCK input to synchronize the conversion  
process to an external source.  
3
4
21  
22  
CONVST DI  
Convert Start, Active LOW.  
5
RD  
DI  
Synchronization pulse for the parallel output, Active  
LOW.  
6
3
23  
BYTE  
DI  
Selects 8 most significant bits (LOW) or 8 least  
significant bits (HIGH). Data valid on pins 9-16.  
8
DB8  
9
DB7  
24  
25  
26  
27  
28  
29  
30  
31  
CS  
IN  
DI  
AI  
AI  
P
Chip Select, Active LOW.  
Inverting Input Channel  
Noninverting Input Channel  
Analog Ground  
10  
11  
12  
13  
14  
15  
16  
17  
18  
DB6  
DB5  
+IN  
DB4  
AGND  
+AVDD  
NC  
DB3  
P
Analog Power Supply, +5VDC.  
No Connect  
DB2  
AI  
DB1  
NC  
No Connect  
DB0  
REFIN  
Reference Input. When using the internal 2.5V  
BUSY  
+DVDD  
DO HIGH when a conversion is in progress.  
Digital Power Supply, +5VDC.  
reference tie this pin directly to REFOUT  
REFOUT AO Reference Output  
.
P
32  
NOTE: AI is Analog Input, AO is Analog Output, DI is Digital Input, DO is Digital Output, and P is Power-Supply Connection.  
ADS8323  
SBAS224B  
5
www.ti.com  
TYPICAL CHARACTERISTICS  
At 40°C to +85°C, +DVDD = +AVDD = +5V, VREF = +2.5V, fSAMPLE = 500kSPS, and fCLK = 20 fSAMPLE, unless otherwise specified.  
SIGNAL-TO-NOISE RATIO AND  
SIGNAL-TO-(NOISE+DISTORTION)  
vs INPUT FREQUENCY  
FREQUENCY SPECTRUM  
(4096 Point FFT; fIN = 100.1kHz, 0.2dB)  
90  
85  
80  
75  
0
30  
50  
SNR  
70  
90  
SINAD  
110  
130  
1
10  
100  
250  
0
25  
50  
75 100 125 150 175 200 225 250  
Frequency (kHz)  
Frequency (kHz)  
SPURIOUS-FREE DYNAMIC RANGE AND  
TOTAL HARMONIC DISTORTION  
vs INPUT FREQUENCY  
INL+ vs TEMPERATURE  
100  
95  
90  
85  
80  
75  
100  
95  
90  
85  
80  
75  
0.3  
0.2  
0.1  
0
22.9  
15.3  
7.6  
SFDR  
THD  
0
0.1  
7.6  
1
10  
100  
250  
40  
20  
0
20  
40  
60  
80  
100  
Temperature (°C)  
Frequency (kHz)  
DNL+ vs TEMPERATURE  
INLvs TEMPERATURE  
19.1  
11.4  
3.8  
0.25  
0.15  
3.8  
0.05  
0
0
3.8  
7.6  
11.4  
15.3  
0.05  
0.10  
0.15  
0.20  
0.05  
3.8  
11.4  
0.05  
0.15  
40  
20  
0
20  
40  
60  
80  
100  
40  
20  
0
20  
40  
60  
80  
100  
Temperature (°C)  
Temperature (°C)  
ADS8323  
6
SBAS224B  
www.ti.com  
TYPICAL CHARACTERISTICS (Cont.)  
At 40°C to +85°C, +DVDD = +AVDD = +5V, VREF = +2.5V, fSAMPLE = 500kSPS, and fCLK = 20 fSAMPLE, unless otherwise specified.  
DNLvs TEMPERATURE  
GAIN ERROR vs TEMPERATURE  
0.6  
0.4  
45.8  
30.5  
15.3  
0
10  
8
762.9  
610.4  
457.8  
305.2  
152.6  
0
0.2  
6
0
4
0.2  
0.4  
0.6  
15.3  
30.5  
45.8  
2
0
2  
152.6  
40  
20  
0
20  
40  
60  
80  
100  
40  
20  
0
20  
40  
60  
80  
100  
Temperature (°C)  
Temperature (°C)  
VREF vs TEMPERATURE  
IQ vs TEMPERATURE  
2.0  
1.0  
26.2  
0.8  
0.4  
13.1  
0.0  
0
1.0  
2.0  
3.0  
4.0  
5.0  
6.0  
7.0  
8.0  
13.1  
26.2  
39.3  
52.4  
65.5  
78.6  
91.8  
104.9  
0
0.4  
0.8  
1.2  
40  
20  
0
20  
40  
60  
80  
100  
40  
20  
0
20  
40  
60  
80  
100  
Temperature (°C)  
Temperature (°C)  
POSITIVE FULL-SCALE vs TEMPERATURE  
BIPOLAR ZERO vs TEMPERATURE  
5.4  
412.0  
335.7  
253.4  
183.1  
106.8  
30.5  
1.4  
1
106.8  
76.3  
4.4  
3.4  
0.6  
0.2  
0.2  
0.6  
1  
45.8  
2.4  
15.3  
1.4  
15.3  
45.8  
76.3  
0.4  
0.6  
45.8  
40  
20  
0
20  
40  
60  
80  
100  
40  
20  
0
20  
40  
60  
80  
100  
Temperature (°C)  
Temperature (°C)  
ADS8323  
SBAS224B  
7
www.ti.com  
TYPICAL CHARACTERISTICS (Cont.)  
At 40°C to +85°C, +DVDD = +AVDD = +5V, VREF = +2.5V, fSAMPLE = 500kSPS, and fCLK = 20 fSAMPLE, unless otherwise specified.  
LINEARITY ERROR AND  
DIFFERENTIAL LINEARITY ERROR vs CODE  
NEGATIVE FULL-SCALE vs TEMPERATURE  
1
0
76.3  
4
3
2
0
1
0
1  
2  
3  
4  
1  
2  
3  
4  
5  
76.3  
152.6  
228.9  
305.2  
381.5  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
0.5  
1.0  
1.5  
0000H 2000H 4000H 6000H 8000H A000H C000H E000H FFFFH  
40  
20  
0
20  
40  
60  
80  
100  
Temperature (°C)  
Decimal Code  
NOTE: This mode of operation is described in more detail in  
the Timing and Control section of this data sheet.  
THEORY OF OPERATION  
The ADS8323 is a high-speed Successive Approximation  
Register (SAR) 16-bit ADC with an internal 2.5V bandgap  
reference that operates from a single +5V supply. The input  
is fully differential with a typical common-mode rejection of  
70dB. The part accepts a differential analog input voltage in  
the range of VREF to +VREF, centered on the common-mode  
voltage (see the Analog Input section). The part will also  
accept bipolar input ranges when a level shift circuit is used  
at the front end (see Figure 7). See Figure 1 for the basic  
operating circuit for the ADS8323.  
SAMPLE-AND-HOLD SECTION  
The sample-and-hold on the ADS8323 allow the ADC to  
accurately convert an input sine wave of full-scale amplitude  
to 16-bit resolution. The input bandwidth of the sample-and-  
hold is greater than the Nyquist rate (Nyquist equals one-half  
of the sampling rate) of the ADC even when the ADC is  
operated at its maximum throughput rate of 500kSPS. The  
typical small-signal bandwidth of the sample-and-hold ampli-  
fier is 20MHz. Typical aperture delay time, or the time it takes  
for the ADS8323 to switch from the sample to the hold mode  
following the negative edge of the CONVST signal, is 10ns.  
The average delta of repeated aperture delay values is typi-  
cally 30ps (also known as aperture jitter). These specifications  
reflect the ability of the ADS8323 to capture AC input signals  
accurately at the exact same moment in time.  
The ADS8323 requires an external clock to run the conver-  
sion process. This clock can vary between 25kHz (1.25kHz  
throughput) and 10MHz (500kSPS throughput). The duty  
cycle of the clock is unimportant as long as the minimum  
HIGH and LOW times are at least 40ns and the clock period  
is at least 100ns. The minimum clock frequency is governed  
by the parasitic leakage of the Capacitive Digital-to-Analog  
Converter (CDAC) capacitors internal to the ADS8323.  
REFERENCE  
The analog input is provided to two input pins, +IN and IN.  
When a conversion is initiated, the differential input on these  
pins is sampled on the internal capacitor array. A conversion  
is initiated on the ADS8323 by bringing CONVST (pin 21)  
LOW for a minimum of 20ns. CONVST LOW places the  
sample-and-hold amplifier in the hold state and the conver-  
sion process is started. The BUSY output (pin 17) will go  
HIGH when the conversion begins and will stay HIGH during  
the conversion. While a conversion is in progress, both  
inputs are disconnected from any internal function. When the  
conversion result is latched into the output register, the  
BUSY signal will go LOW. The data can be read from the  
parallel output bus following the conversion by bringing both  
RD and CS LOW.  
If the internal reference is used, REFOUT (pin 32) should be  
directly connected to REFIN (pin 31). The ADS8323 can  
operate, however, with an external reference in the range of  
1.5V to 2.55V for a corresponding full-scale range of 3.0V to  
5.1V. The internal reference of the ADS8323 is double-  
buffered. If the internal reference is used to drive an external  
load, a buffer is provided between the reference and the load  
applied to REFOUT (pin 32) (the internal reference can typi-  
cally source or sink 10µA of current; compensation capaci-  
tance should be at least 0.1µF to minimize noise). If an  
external reference is used, the second buffer provides isola-  
tion between the external reference and the CDAC. This  
buffer is also used to recharge all of the capacitors of the  
CDAC during conversion.  
ADS8323  
8
SBAS224B  
www.ti.com  
+5V Analog Supply  
10µF  
+
0.1µF  
0.1µF  
+
20pF  
Analog Input  
32 31 30 29 28 27 26 25  
Chip Select  
1
2
3
4
5
6
7
8
DB15  
DB14  
DB13  
DB12  
DB11  
DB10  
DB9  
CS 24  
BYTE 23  
RD 22  
Read Input  
Conversion Start  
Clock Input  
CONVST 21  
CLOCK 20  
DGND 19  
+DVDD 18  
BUSY 17  
ADS8323  
Busy Output  
DB8  
9
10 11 12 13 14 15 16  
FIGURE 1. Typical Circuit Configuration.  
When the input is differential, the amplitude of the input is the  
difference between the +IN and IN input, or (+IN) (IN).  
The peak-to-peak amplitude of each input is ±1/2VREF around  
this common voltage. However, since the inputs are 180°  
out-of-phase, the peak-to-peak amplitude of the differential  
voltage is +VREF to VREF. The value of VREF also determines  
the range of the voltage that may be common to both inputs  
(see Figure 5).  
ANALOG INPUT  
The analog input is bipolar and fully differential. There are  
two general methods of driving the analog input of the  
ADS8323: single-ended or differential, as shown in Figures 2  
and 3. When the input is single-ended, the IN input is held  
at the common-mode voltage. The +IN input swings around  
the same common voltage and the peak-to-peak amplitude is  
the (common-mode + VREF) and the (common-mode VREF).  
The value of VREF determines the range over which the  
common-mode voltage may vary (see Figure 4).  
In each case, care should be taken to ensure that the output  
impedance of the sources driving the +IN and IN inputs are  
matched. If matching is not observed, it may result in offset  
error, which changes with temperature. Often, a small capacitor  
(20pF) between the positive and negative inputs helps to match  
their impedance.  
VREF to +VREF  
peak-to-peak  
ADS8323  
The input current on the analog inputs depends on a number  
of factors: sample rate, input voltage, and source imped-  
ance. Essentially, the current into the ADS8323 charges the  
internal capacitor array during the sampling period. After this  
capacitance has been fully charged, there is no further input  
current. The source of the analog input voltage must be able  
to charge the input capacitance (25pF) to a 16-bit settling  
level within 4 clock cycles (400ns), if the minimum acquisition  
time is used. When the converter goes into the hold mode,  
the input impedance is greater than 1G.  
Common  
Voltage  
Single-Ended Input  
VREF  
peak-to-peak  
ADS8323  
Common  
VREF  
Voltage  
peak-to-peak  
Care must be taken regarding the absolute analog input  
voltage. The +IN and IN inputs should always remain within  
the range of AGND 0.3V to AVDD + 0.3V.  
Differential Input  
FIGURE 2. Methods of Driving the ADS8323 either Single-  
Ended or Differential.  
ADS8323  
SBAS224B  
9
www.ti.com  
+IN  
CM + VREF  
CM Voltage  
+VREF  
IN = CM Voltage  
VREF  
t
CM VREF  
Single-Ended Inputs  
+IN  
+VREF  
CM + 1/2VREF  
CM Voltage  
CM 1/2VREF  
VREF  
IN  
t
Differential Inputs  
(+IN) + (IN)  
NOTES: Common-Mode Voltage (Differential Mode) =  
, Common-Mode Voltage (Single-Ended Mode) = IN.  
2
The maximum differential voltage between +IN and IN of the ADS8323 is VREF. See Figures 4 and 5 for a further  
explanation of the common voltage range for single-ended and differential inputs.  
FIGURE 3. Using the ADS8323 in the Single-Ended and Differential Input Modes.  
5
4
5
4
AVDD = 5V  
4.55  
AVDD = 5V  
4.025  
3.8  
3
3
2.75  
Single-Ended Input  
Differential Input  
2.25  
2
2
1.2  
1
0.975  
1
0.45  
0
0
1  
1  
2.55  
2.5  
2.55  
2.5  
1.0  
1.5  
2.0  
REF (V)  
3.0  
1.0  
1.5  
2.0  
REF (V)  
3.0  
V
V
FIGURE 4. Single-Ended Input: Common-Mode Voltage  
Range vs VREF  
FIGURE 5. Differential Input: Common-Mode Voltage Range  
vs VREF  
.
.
ADS8323  
10  
SBAS224B  
www.ti.com  
NOISE  
R1  
Figure 6 shows the transition noise of the ADS8323. A low-  
level DC input was applied to the analog-input pins and the  
converter was put through 8192 conversions. The digital  
output of the ADC will vary in output code due to the internal  
noise of the ADS8323. This is true for all 16-bit SAR-type  
ADCs. The ADS8323, with five output codes for the σ distribu-  
tion, will yield a < ±0.8LSB transition noise at 5V operation.  
Remember that to achieve this low-noise performance, the  
peak-to-peak noise of the input signal and reference must be  
< 50µV.  
4kΩ  
+IN (pin 26)  
OPA132  
20kΩ  
Bipolar  
Input  
IN (pin 25)  
ADS8323  
R2  
OPA353  
REFOUT (pin 32)  
2.5V  
BIPOLAR INPUT  
R1  
R2  
±10V  
±5V  
±2.5V  
1kΩ  
2kΩ  
4kΩ  
5kΩ  
10kΩ  
20kΩ  
5052  
FIGURE 7. Level Shift Circuit for Bipolar Input Ranges.  
DIGITAL INTERFACE  
TIMING AND CONTROL  
1968  
See the timing diagram in the Timing Characteristics section for  
detailed information on timing signals and their requirements.  
818  
300  
54  
The ADS8323 uses an external clock (CLOCK, pin 20) that  
controls the conversion rate of the CDAC. With a 10MHz  
external clock, the ADC sampling rate is 500kSPS that  
corresponds to a 2µs maximum throughput time.  
0014  
0015  
0016  
Code  
0017  
0018  
FIGURE 6. Histogram of 8192 Conversions of a Low-Level  
DC Input.  
EXPLANATION OF CLOCK, BUSY AND BYTE PINS  
CLOCKAn external clock must be provided for the  
ADS8323. The maximum clock frequency is 10MHz and that  
provides 500kSPS throughput. The minimum clock frequency  
is 25kHz and that provides 1.25kHz throughput. The mini-  
mum clock cycle is 100ns (see Timing Diagram, tC1), and  
CLOCK must remain HIGH (see Timing Diagram, tW1) or  
LOW (see Timing Diagram, tW2) for at least 40ns.  
AVERAGING  
Averaging the digital codes can compensate the noise of the ADC.  
By averaging conversion results, transition noise will be reduced by  
a factor of 1/n, where n is the number of averages. For example,  
averaging 4 conversion results will reduce the transition noise by  
1/2 to ±0.4LSB. Averaging should only be used for input signals  
with frequencies near DC. For AC signals, a digital filter can be  
used to low-pass filter and decimate the output codes. This works  
in a similar manner to averagingfor every decimation by 2, the  
signal-to-noise ratio will improve 3dB.  
BUSYInitially BUSY output is LOW. Reading data from  
output register or sampling the input analog signal will not  
affect the state of the BUSY signal. After the CONVST input  
goes LOW and conversion starts, a maximum of 25ns later  
the BUSY output will go HIGH. That signal will stay HIGH  
during conversion and will provide the status of the internal  
ADC to the DSP or uC. At the end of conversion, on the rising  
edge of 17th clock cycle, new data from the internal ADC is  
latched into the output registers. The BUSY signal will go  
LOW a maximum of 25ns later (see Timing Diagram, tD4).  
BIPOLAR INPUTS  
The differential inputs of the ADS8323 were designed to accept  
bipolar inputs (VREF and +VREF) around the common-mode  
voltage, which corresponds to a 0V to 5V input range with a  
2.5V reference. By using a simple op amp circuit featuring four  
high-precision external resistors, the ADS8323 can be config-  
ured to accept bipolar inputs. The conventional ±2.5V, ±5V, and  
±10V input ranges could be interfaced to the ADS8323 using  
the resistor values shown in Figure 7.  
BYTEThe output data will appear as a full 16-bit word on  
DB15-DB0 (MSB-LSB or D15-D0) if BYTE is LOW. If there is  
only an 8-bit bus available on a board, the result may also be  
read on an 8-bit bus by using only DB7-DB0. In this case, two  
reads are necessary (see Timing Diagram). The first, as  
before, leaving BYTE LOW and reading the 8 least significant  
bits on DB7-DB0, then bringing BYTE HIGH. When BYTE is  
HIGH, the upper 8 bits (D15-D8) will appear on DB7-DB0.  
ADS8323  
SBAS224B  
11  
www.ti.com  
START OF A CONVERSION AND READING DATA  
LAYOUT  
By bringing the CONVST signal LOW, the input data is  
immediately placed in the hold mode (10ns). Although CS  
must be LOW when CONVST goes LOW to initiate a conver-  
sion. The conversion follows with the next rising edge of  
CLOCK. If it is important to detect a hold command during a  
certain clock cycle, then the falling edge of the CONVST  
signal must occur at least 10ns before the rising edge of  
CLOCK (see Timing Diagram, tD1). The CONVST signal can  
remain LOW without initiating a new conversion. The CONVST  
signal must be HIGH for at least 20ns (see Timing Diagram,  
For optimum performance, care should be taken with the  
physical layout of the ADS8323 circuitry. This is particularly  
true if the CLOCK input is approaching the maximum through-  
put rate.  
As the ADS8323 offers single-supply operation, it will often  
be used in close proximity with digital logic, microcontrollers,  
microprocessors, and digital signal processors. The more  
digital logic present in the design and the higher the switch-  
ing speed, the more difficult it will be to achieve good  
performance from the converter.  
t
W4) before it is brought LOW again and CONVST must stay  
LOW for at least 20ns (see Timing Diagram, tW3). Once a  
CONVST signal goes LOW, further impulses of this signal  
are ignored until the conversion is finished or the part is  
reset.  
The basic SAR architecture is sensitive to glitches or sudden  
changes on the power supply, reference, ground connec-  
tions, and digital inputs that occur just prior to latching the  
output of the analog comparator. Thus, during any single  
conversion for an n-bit SAR converter, there are n windows”  
in which large external transient voltages can affect the  
conversion result. Such glitches might originate from switch-  
ing power supplies, nearby digital logic, or high-power de-  
vices.  
When the conversion is finished (after 16 clock cycles) the  
sampling switches will close and sample the new value. The  
start of the next conversion must be delayed to allow the  
input capacitor of the ADS8323 to be fully charged. This  
delay time depends on the driving amplifier, but should be at  
least 400ns. To gain acquisition time, the falling edge of  
CONVST must take place just before the rising edge of  
CLOCK (see Timing Diagram, tD1). One conversion cycle  
requires 20 clock cycles. However, reading data during the  
conversion or on a falling hold edge might cause a loss in  
performance.  
The degree of error in the digital output depends on the  
reference voltage, layout, and the exact timing of the external  
event. Their error can change if the external event changes  
in time with respect to the CLOCK input.  
On average, the ADS8323 draws very little current from an  
external reference as the reference voltage is internally  
buffered. If the reference voltage is external and originates  
from an op amp, make sure that it can drive the bypass  
capacitor or capacitors without oscillation. A 0.1µF bypass  
capacitor is recommended from pin 31 directly to ground.  
Reading Data (RD, CS)In general, the data outputs are in  
tri-state. Both CS and RD must be LOW to enable these  
outputs. RD and CS must stay LOW together for at least  
40ns (see Timing Diagram, tD7) before the output data is  
valid. RD must remain HIGH for at least 20ns (see Timing  
Diagram, tW7) before bringing it back LOW for a subsequent  
read command. 16 clock-cycles after the start of a conver-  
sion (next rising edge of clock after the falling edge of  
CONVST), the new data is latched into the output register  
and the reading process can start again.  
The AGND and DGND pins should be connected to a clean  
ground point. In all cases, this should be the analogground.  
Avoid connections which are too close to the grounding point  
of a microcontroller or digital signal processor. If required, run  
a ground trace directly from the converter to the power-  
supply entry point. The ideal layout will include an analog  
ground plane dedicated to the converter and associated  
analog circuitry.  
CS being LOW tells the ADS8323 that the bus on the board  
is assigned to the ADS8323. If an ADC shares a bus with  
digital gates, there is a possibility that digital (high-frequency)  
noise gets coupled into the ADC. If the bus is just used by the  
ADS8323, CS can be hard-wired to ground. The output data  
should not be read 125ns prior to the falling edge of CONVST  
and 10ns after the falling edge.  
As with the GND connections, VDD should be connected to a  
+5V power supply plane, or trace, that is separate from the  
connection for digital logic until they are connected at the  
power entry point. Power to the ADS8323 should be clean  
and well bypassed. A 0.1µF ceramic bypass capacitor should  
be placed as close to the device as possible. In addition, a  
1µF to 10µF capacitor is recommended. If needed, an even  
larger capacitor and a 5or 10series resistor may be used  
to low-pass filter a noisy supply. In some situations, addi-  
tional bypassing may be required, such as a 100µF electro-  
lytic capacitor, or even a Pi filter made up of inductors and  
capacitors all designed to essentially low-pass filter the +5V  
supply, removing the high-frequency noise.  
The ADS8323s output is in Binary Twos Complement for-  
mat (see Figure 8).  
DESCRIPTION  
ANALOG VALUE  
2 VREF  
DIGITAL OUTPUT  
Full-Scale Range  
BINARY TWOS COMPLEMENT  
Least Significant  
Bit (LSB)  
2 VREF/65535  
BINARY CODE  
HEX CODE  
7FFF  
+Full Scale  
Midscale  
+VREF 1 LSB  
0V  
0111 1111 1111 1111  
0000 0000 0000 0000  
1111 1111 1111 1111  
1000 0000 0000 0000  
0000  
Midscale 1LSB  
Zero  
0V 1 LSB  
VREF  
FFFF  
8000  
TABLE I. Ideal Input Voltages and Output Codes.  
ADS8323  
12  
SBAS224B  
www.ti.com  
Binary Twos  
Complement  
BTC  
65535  
0111 1111 1111 1111  
65534  
65533  
0111 1111 1111 1110  
0111 1111 1111 1101  
32769  
32768  
32767  
0000 0000 0000 0001  
0000 0000 0000 0000  
1111 1111 1111 1111  
1000 0000 0000 0010  
1000 0000 0000 0001  
1000 0000 0000 0000  
2
1
0
2.499962V  
VNFS = VCM VREF = 0V  
2.500038V  
VPFS = VCM + VREF = 5V  
0.000038V  
0.000076V  
0.000152V  
VPFS 1LSB = 4.999924V  
VBPZ = 2.5V  
Unipolar Analog Input Voltage  
4.999848V  
1LSB = 76µV  
VCM = 2.5V  
16-BIT  
V
REF = 2.5V  
Bipolar Input, Binary Twos Complement Output: (BTC)  
Negative Full-Scale Code = VNFS = 8000H, Vcode = VCM VREF  
Bipolar Zero Code  
= VBPZ = 0000H, Vcode = VCM  
Positive Full-Scale Code = VPFS = 7FFFH, Vcode = (VCM + VREF) 1LSB  
FIGURE 8. Ideal Conversion Characteristics (Condition: Single-Ended. VCM = IN= 2.5V, VREF = 2.5V).  
ADS8323  
SBAS224B  
13  
www.ti.com  
PACKAGE DRAWING  
PBS (S-PQFP-G32)  
MPQF027 NOVEMBER 1995  
PLASTIC QUAD FLATPACK  
0,23  
0,17  
M
0,50  
0,08  
24  
17  
25  
32  
16  
9
0,13 NOM  
1
8
3,50 TYP  
Gage Plane  
5,05  
SQ  
4,95  
0,25  
7,10  
SQ  
0,10 MIN  
6,90  
0°7°  
0,70  
0,40  
1,05  
0,95  
Seating Plane  
0,08  
1,20 MAX  
4087735/A 11/95  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
ADS8323  
14  
SBAS224B  
www.ti.com  
PACKAGE OPTION ADDENDUM  
www.ti.com  
9-Dec-2004  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
TQFP  
TQFP  
TQFP  
TQFP  
Drawing  
ADS8323Y/250  
ADS8323Y/2K  
ADS8323YB/250  
ADS8323YB/2K  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PBS  
32  
32  
32  
32  
250  
2000  
250  
None  
None  
None  
None  
CU SNPB  
CU SNPB  
CU SNPB  
CU SNPB  
Level-3-220C-168 HR  
Level-3-220C-168 HR  
Level-3-220C-168 HR  
Level-3-220C-168 HR  
PBS  
PBS  
PBS  
2000  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional  
product content details.  
None: Not yet available Lead (Pb-Free).  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,  
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
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