BUF634P_技术文档

®

BUF634

250mA HIGH-SPEED BUFFER

FEATURES

APPLICATIONS

● HIGH OUTPUT CURRENT: 250mA

● VALVE DRIVER

● SLEW RATE: 2000V/µs

● SOLENOID DRIVER

● PIN-SELECTED BANDWIDTH:

● OP AMP CURRENT BOOSTER

● LINE DRIVER

30MHz to 180MHz

● LOW QUIESCENT CURRENT:

● HEADPHONE DRIVER

● VIDEO DRIVER

1.5mA (30MHz BW)

● WIDE SUPPLY RANGE: ±2.25 to ±18V

● INTERNAL CURRENT LIMIT

● MOTOR DRIVER

● TEST EQUIPMENT

● ATE PIN DRIVER

● THERMAL SHUTDOWN PROTECTION

● 8-PIN DIP, SO-8, 5-LEAD TO-220, 5-LEAD

DDPAK SURFACE-MOUNT

DESCRIPTION

The BUF634 is available in a variety of packages to

suit mechanical and power dissipation requirements.

Types include 8-pin DIP, SO-8 surface-mount, 5-lead

TO-220, and a 5-lead DDPAK surface-mount plastic

power package.

The BUF634 is a high speed unity-gain open-loop

buffer recommended for a wide range of applications.

It can be used inside the feedback loop of op amps to

increase output current, eliminate thermal feedback

and improve capacitive load drive.

For low power applications, the BUF634 operates

on 1.5mA quiescent current with 250mA output,

2000V/µs slew rate and 30MHz bandwidth. Band-

width can be adjusted from 30MHz to 180MHz by

connecting a resistor between V– and the BW Pin.

5-Lead

TO-220

5-Lead DDPAK

Surface Mount

G = 1

Output circuitry is fully protected by internal current

limit and thermal shut-down making it rugged and

1

2

3

4

1 2 3 4

5

easy to use.

8-Pin DIP Package

SO-8 Surface-Mount Package

BW

V_IN

V–

V+

BW

NC

V_IN

V–

1

2

3

4

8

7

6

5

NC

V+

V_O

NC

V_O

G = 1

NOTE: Tabs are connected

to V– supply.

BW

V_IN

V–

V+

V_O

International Airport Industrial Park

•

Mailing Address: PO Box 11400, Tucson, AZ 85734

FAXLine: (800) 548-6133 (US/Canada Only)

• Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111

Internet: http://www.burr-brown.com/

•

Cable: BBRCORP

•

Telex: 066-6491

•

FAX: (520) 889-1510

•

Immediate Product Info: (800) 548-6132

PDS-1206C

Printed in U.S.A. June, 1996

SBOS030

SPECIFICATIONS

ELECTRICAL

At T_A= +25°C⁽¹⁾, V_S= ±15V, unless otherwise noted.

BUF634P, U, T, F

LOW QUIESCENT CURRENT MODE WIDE BANDWIDTH MODE

PARAMETER

CONDITION

MIN

TYP

MAX

MIN

TYP

MAX

UNITS

INPUT

Offset Voltage

vs Temperature

vs Power Supply

Input Bias Current

Input Impedance

Noise Voltage

±30

±100

0.1

±0.5

80 || 8

4

±100

✻

±5

8 || 8

✻

mV

µV/°C

mV/V

µA

MΩ || pF

nV/√Hz

Specified Temperature Range

V

_S= ±2.25V⁽²⁾to ±18V

1

±2

✻

±20

V

_IN= 0V

_L= 100Ω

f = 10kHz

R

GAIN

R

_L= 1kΩ, V_O= ±10V

0.95

0.85

0.8

0.99

0.93

0.9

✻

V/V

R

_L= 100Ω, V_O= ±10V

R

_L= 67Ω, V_O= ±10V

OUTPUT

Current Output, Continuous

Voltage Output, Positive

Negative

±250

✻

mA

V

I

_O= 10mA

(V+) –2.1

(V–) +2.1

(V+) –3

(V–) +4

(V+) –4

(V–) +5

(V+) –1.7

(V–) +1.8

(V+) –2.4

(V– ) +3.5

(V+) –2.8

(V–) +4

✻

I

_O= –10mA

_O= 100mA

_O= –100mA

_O= 150mA

_O= –150mA

Positive

Negative

Positive

Negative

V

Short-Circuit Current

±350

±550

±400

✻

mA

DYNAMIC RESPONSE

Bandwidth, –3dB

R_L= 1kΩ

_L= 100Ω

20Vp-p, R_L= 100Ω

20V Step, R_L= 100Ω

30

20

2000

200

50

180

160

✻

MHz

V/µs

ns

R

Slew Rate

Settling Time, 0.1%

1%

ns

Differential Gain

Differential Phase

3.58MHz, V_O= 0.7V, R_L= 150Ω

4

2.5

0.4

0.1

%

°

POWER SUPPLY

Specified Operating Voltage

Operating Voltage Range

Quiescent Current, I_Q

±15

✻

V

mA

±2.25⁽²⁾

±18

±2

✻

±20

I_O= 0

±1.5

±15

TEMPERATURE RANGE

Specification

Operating

Storage

–40

–55

+85

+125

✻

°C

Thermal Shutdown

Temperature, T_J

Thermal Resistance, θ_JA

175

100

150

65

6

✻

°C

“P” Package⁽³⁾

“U” Package⁽³⁾

“T” Package⁽³⁾

“T” Package

“F” Package⁽³⁾

“F” Package

°C/W

θ_JA

θ_JC

θ_JA

θ_JC

65

6

V+

V_IN

V_O

V_IN

V_O

BW

V–

✻ Specifications the same as Low Quiescent Mode.

NOTES: (1) Tests are performed on high speed automatic test equipment, at approximately 25°C junction temperature. The power dissipation of this product will

cause some parameters to shift when warmed up. See typical performance curves for over-temperature performance. (2) Limited output swing available at low supply

voltage. See Output voltage specifications. (3) Typical when all leads are soldered to a circuit board. See text for recommendations.

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN

assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject

to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not

authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.

®

2

BUF634

PIN CONFIGURATION

Top View

8-Pin Dip Package

Top View

SO-8 Surface-Mount Package

5-Lead

TO-220

BW

NC

V_IN

V–

1

2

3

4

8

7

6

5

NC

V+

V_O

NC

5-Lead DDPAK

Surface Mount

G = 1

1

2

3

4

1 2 3 4

5

NC = No Connection

BW

V_IN

V–

V+

V_O

ABSOLUTE MAXIMUM RATINGS

Supply Voltage ..................................................................................... ±18V

Input Voltage Range ............................................................................... ±V_S

Output Short-Circuit (to ground) .................................................Continuous

Operating Temperature ..................................................... –40°C to +125°C

Storage Temperature ........................................................ –55°C to +125°C

Junction Temperature ....................................................................... +150°C

Lead Temperature (soldering,10s).................................................... +300°C

BW

V_IN

V–

V+

NOTE: Tab electrically

connected to V–.

V_O

ELECTROSTATIC

DISCHARGE SENSITIVITY

PACKAGE/ORDERING INFORMATION

Any integrated circuit can be damaged by ESD. Burr-Brown

recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling

and installation procedures can cause damage.

PACKAGE

DRAWING TEMPERATURE

NUMBER⁽¹⁾

PRODUCT

PACKAGE

RANGE

BUF634P

BUF634U

BUF634T

BUF634F

8-Pin Plastic DIP

SO-8 Surface-Mount

5-Lead TO-220

006

182

315

325

–40°C to +85°C

ESD damage can range from subtle performance degrada-

tion to complete device failure. Precision integrated circuits

may be more susceptible to damage because very small

parametric changes could cause the device not to meet

published specifications.

5-Lead DDPAK

NOTE: (1) For detailed drawing and dimension table, please see end of data

sheet, or Appendix C of Burr-Brown IC Data Book.

®

3

BUF634

TYPICAL PERFORMANCE CURVES

At T_A= +25°C, V_S= ±15V, unless otherwise noted.

GAIN and PHASE vs FREQUENCY

vs QUIESCENT CURRENT

GAIN and PHASE vs FREQUENCY

vs TEMPERATURE

10

5

R_L= 100Ω

R_S= 50Ω

V_O= 10mV

R_L= 100Ω

R_S= 50Ω

V_O= 10mV

5

0

Wide BW

Low I_Q

–5

–10

–15

–10

–15

0

–10

–20

–30

–40

–50

0

–10

–20

–30

–40

–50

Wide BW

I_Q= 15mA

I_Q= 9mA

I_Q= 4mA

I_Q= 2.5mA

I_Q= 1.5mA

T_J= –40°C

T_J= 25°C

T_J= 125°C

Low I_Q

1M

10M

100M

1G

1M

10M

100M

1G

Frequency (Hz)

GAIN and PHASE vs FREQUENCY

vs SOURCE RESISTANCE

GAIN and PHASE vs FREQUENCY

vs LOAD RESISTANCE

10

5

10

5

R_L= 100Ω

V_O= 10mV

R_S= 50Ω

V_O= 10mV

0

Wide BW

Low I_Q

Wide BW

Low I_Q

–5

–10

–15

–5

–10

–15

0

–10

–20

–30

–40

–50

0

–10

–20

–30

–40

–50

Wide BW

R_S= 0Ω

R_S= 50Ω

R_S= 100Ω

R_L= 1kΩ

R_L= 100Ω

R_L= 50Ω

Low I_Q

10M

100M

1G

10M

100M

1G

Frequency (Hz)

GAIN and PHASE vs FREQUENCY

vs LOAD CAPACITANCE

GAIN and PHASE vs FREQUENCY

vs LOAD CAPACITANCE

10

5

10

R_L= 100Ω

R_S= 50Ω

V_O= 10mV

R_L= 100Ω

R_S= 50Ω

V_O= 10mV

Low I_QMode

5

0

–5

–10

–15

–5

–10

–15

Wide BW Mode

0

–10

–20

–30

–40

–50

0

–10

–20

–30

–40

–50

C_L= 0pF

C_L= 0

C_L= 50pF

C_L= 200pF

C_L= 1nF

C_L= 50pF

C_L= 200pF

C_L= 1nF

10M

100M

1G

10M

100M

1G

Frequency (Hz)

®

4

BUF634

TYPICAL PERFORMANCE CURVES (CONT)

At T_A= +25°C, V_S= ±15V, unless otherwise noted.

GAIN and PHASE vs FREQUENCY

vs POWER SUPPLY VOLTAGE

POWER SUPPLY REJECTION vs FREQUENCY

100

90

80

70

60

50

40

30

20

10

0

10

5

R_L= 100Ω

R_S= 50Ω

V_O= 10mV

0

Wide BW

–5

–10

–15

Low I_Q

0

–10

–20

–30

–40

–50

Wide BW

Low I_Q

V_S= ±18V

Low I_Q

V_S= ±12V

V_S= ±5V

V_S= ±2.25V

1M

10M

100M

1G

1k

10k

100k

1M

10M

Frequency (Hz)

QUIESCENT CURRENT

vs BANDWIDTH CONTROL RESISTANCE

SHORT CIRCUIT CURRENT vs TEMPERATURE

20

18

16

14

12

10

8

500

450

400

350

300

250

200

+15V

15mA at R = 0

BW

R

Wide Bandwidth Mode

Low I_QMode

–15V

6

4

2

1.5mA at R = ∞

0

10

100

1k

10k

–50

–25

0

25

50

75

100

125

150

Resistance (Ω)

Junction Temperature (°C)

QUIESCENT CURRENT vs TEMPERATURE

Cooling

QUIESCENT CURRENT vs TEMPERATURE

7

6

5

4

3

2

1

0

20

15

10

5

Low I_QMode

Thermal Shutdown

≈10°C

Wide BW Mode

Cooling

Thermal Shutdown

0

–50 –25

0

25

50

75 100 125 150 175 200

–50 –25

0

25

50

75 100 125 150 175 200

Junction Temperature (°C)

®

5

BUF634

TYPICAL PERFORMANCE CURVES (CONT)

At T_A= +25°C, V_S= ±15V, unless otherwise noted.

OUTPUT VOLTAGE SWING vs OUTPUT CURRENT

V_IN= 13V

OUTPUT VOLTAGE SWING vs OUTPUT CURRENT

13

12

11

13

12

11

V_IN= 13V

V_S= ±15V

Wide BW Mode

V_S= ±15V

Low I_QMode

10

–10

–11

–12

–13

–11

–12

–13

T_J= –40°C

T_J= 25°C

T_J= 125°C

T_J= –40°C

T_J= 25°C

T_J= 125°C

V_IN= –13V

0

50

100

150

200

250

300

0

50

100

150

200

250

300

|Output Current| (mA)

MAXIMUM POWER DISSIPATION vs TEMPERATURE

3

2

1

0

12

10

8

TO-220 and DDPAK

Infinite Heat Sink

θ

_JC= 6°C/W

TO-220 and DDPAK

Free Air

8-Pin DIP

θ

_JA= 65°C/W

6

θ

_JA= 100°C/W

TO-220 and DDPAK

Free Air

4

θ

_JA= 65°C/W

SO-8

θ_JA= 150°C/W

2

0

–50

–25

0

25

50

75

100

125

150

–50

–25

0

25

50

75

100

125

150

Ambient Temperature (°C)

SMALL-SIGNAL RESPONSE

LARGE-SIGNAL RESPONSE

R_S= 50Ω, R_L= 100Ω

Input

100mV/div

10V/div

Wide BW

Mode

Wide BW

Mode

Low I_Q

Mode

Low I_Q

Mode

20ns/div

®

6

BUF634

OUTPUT CURRENT

APPLICATION INFORMATION

The BUF634 can deliver up to ±250mA continuous output

current. Internal circuitry limits output current to approxi-

mately ±350mA—see typical performance curve “Short

Circuit Current vs Temperature”. For many applications,

however, the continuous output current will be limited by

thermal effects.

Figure 1 is a simplified circuit diagram of the BUF634

showing its open-loop complementary follower design.

V+

The output voltage swing capability varies with junction

temperature and output current—see typical curves “Output

Voltage Swing vs Output Current.” Although all four pack-

age types are tested for the same output performance using

a high speed test, the higher junction temperatures with the

DIP and SO-8 package types will often provide less output

voltage swing. Junction temperature is reduced in the DDPAK

surface-mount power package because it is soldered directly

to the circuit board. The TO-220 package used with a good

heat sink further reduces junction temperature, allowing

maximum possible output swing.

Thermal

Shutdown

200Ω

V_IN

V_O

(1)

I₁

THERMAL PROTECTION

150Ω

4kΩ

Power dissipated in the BUF634 will cause the junction

temperature to rise. A thermal protection circuit in the

BUF634 will disable the output when the junction tempera-

ture reaches approximately 175°C. When the thermal pro-

tection is activated, the output stage is disabled, allowing the

device to cool. Quiescent current is approximately 6mA

during thermal shutdown. When the junction temperature

cools to approximately 165°C the output circuitry is again

enabled. This can cause the protection circuit to cycle on and

off with a period ranging from a fraction of a second to

several minutes or more, depending on package type, signal,

load and thermal environment.

BW

V–

Signal path indicated in bold.

Note: (1) Stage currents are set by I₁.

FIGURE 1. Simplified Circuit Diagram.

Figure 2 shows the BUF634 connected as an open-loop

buffer. The source impedance and optional input resistor,

R_S, influence frequency response—see typical curves. Power

supplies should be bypassed with capacitors connected close

to the device pins. Capacitor values as low as 0.1µF will

assure stable operation in most applications, but high output

current and fast output slewing can demand large current

transients from the power supplies. Solid tantalum 10µF

capacitors are recommended.

The thermal protection circuit is designed to prevent damage

during abnormal conditions. Any tendency to activate the

thermal protection circuit during normal operation is a sign

of an inadequate heat sink or excessive power dissipation for

the package type.

TO-220 package provides the best thermal performance.

When the TO-220 is used with a properly sized heat sink,

output is not limited by thermal performance. See Applica-

tion Bulletin AB-037 for details on heat sink calculations.

The DDPAK also has excellent thermal characteristics. Its

mounting tab should be soldered to a circuit board copper

area for good heat dissipation. Figure 3 shows typical

thermal resistance from junction to ambient as a function of

the copper area. The mounting tab of the TO-220 and

DDPAK packages is electrically connected to the V– power

supply.

High frequency open-loop applications may benefit from

special bypassing and layout considerations—see “High

Frequency Applications” at end of applications discussion.

V+

10µF

DIP/SO-8

Pinout shown

7

R_S

V_IN

3

6

The DIP and SO-8 surface-mount packages are excellent for

applications requiring high output current with low average

power dissipation. To achieve the best possible thermal

performance with the DIP or SO-8 packages, solder the

device directly to a circuit board. Since much of the heat is

dissipated by conduction through the package pins, sockets

will degrade thermal performance. Use wide circuit board

traces on all the device pins, including pins that are not

connected. With the DIP package, use traces on both sides

of the printed circuit board if possible.

V_O

BUF634

1

R_L

4

10µF

Optional connection for

wide bandwidth — see text.

V–

FIGURE 2. Buffer Connections.

®

7

BUF634

THERMAL RESISTANCE vs

CIRCUIT BOARD COPPER AREA

60

50

40

30

20

10

Circuit Board Copper Area

BUF634F

Surface Mount Package

1oz copper

BUF634F

Surface Mount Package

0

1

2

3

4

5

Copper Area (inches²)

FIGURE 3. Thermal Resistance vs Circuit Board Copper Area.

POWER DISSIPATION

the quiescent current to approximately 15mA. Intermediate

bandwidths can be set by connecting a resistor in series with

the bandwidth control pin—see typical curve "Quiescent

Current vs Resistance" for resistor selection. Characteristics

of the bandwidth control pin can be seen in the simplified

circuit diagram, Figure 1.

Power dissipation depends on power supply voltage, signal

and load conditions. With DC signals, power dissipation is

equal to the product of output current times the voltage

across the conducting output transistor, V_S– V_O. Power

dissipation can be minimized by using the lowest possible

power supply voltage necessary to assure the required output

voltage swing.

The rated output current and slew rate are not affected by the

bandwidth control, but the current limit value changes slightly.

Output voltage swing is somewhat improved in the wide

bandwidth mode. The increased quiescent current when in

wide bandwidth mode produces greater power dissipation

during low output current conditions. This quiescent power

is equal to the total supply voltage, (V+) + |(V–)|, times the

quiescent current.

For resistive loads, the maximum power dissipation occurs

at a DC output voltage of one-half the power supply voltage.

Dissipation with AC signals is lower. Application Bulletin

AB-039 explains how to calculate or measure power dissi-

pation with unusual signals and loads.

Any tendency to activate the thermal protection circuit

indicates excessive power dissipation or an inadequate heat

sink. For reliable operation, junction temperature should be

limited to 150°C, maximum. To estimate the margin of

safety in a complete design, increase the ambient tempera-

ture until the thermal protection is triggered. The thermal

protection should trigger more than 45°C above the maxi-

mum expected ambient condition of your application.

BOOSTING OP AMP OUTPUT CURRENT

The BUF634 can be connected inside the feedback loop of

most op amps to increase output current—see Figure 4.

When connected inside the feedback loop, the BUF634’s

offset voltage and other errors are corrected by the feedback

of the op amp.

To assure that the op amp remains stable, the BUF634’s

phase shift must remain small throughout the loop gain of

the circuit. For a G=+1 op amp circuit, the BUF634 must

contribute little additional phase shift (approximately 20° or

less) at the unity-gain frequency of the op amp. Phase shift

is affected by various operating conditions that may affect

stability of the op amp—see typical Gain and Phase curves.

INPUT CHARACTERISTICS

Internal circuitry is protected with a diode clamp connected

from the input to output of the BUF634—see Figure 1. If the

output is unable to follow the input within approximately 3V

(such as with an output short-circuit), the input will conduct

increased current from the input source. This is limited by

the internal 200Ω resistor. If the input source can be dam-

aged by this increase in load current, an additional resistor

can be connected in series with the input.

Most general-purpose or precision op amps remain unity-

gain stable with the BUF634 connected inside the feedback

loop as shown. Large capacitive loads may require the

BUF634 to be connected for wide bandwidth for stable

operation. High speed or fast-settling op amps generally

require the wide bandwidth mode to remain stable and to

assure good dynamic performance. To check for stability

with an op amp, look for oscillations or excessive ringing on

signal pulses with the intended load and worst case condi-

tions that affect phase response of the buffer.

BANDWIDTH CONTROL PIN

The –3dB bandwidth of the BUF634 is approximately 30MHz

in the low quiescent current mode (1.5mA typical). To select

this mode, leave the bandwidth control pin open (no connec-

tion).

Bandwidth can be extended to approximately 180MHz by

connecting the bandwidth control pin to V–. This increases

®

8

BUF634

HIGH FREQUENCY APPLICATIONS

capacitors at the device pins in parallel with solid tantalum

10µF capacitors. Source resistance will affect high-frequency

peaking and step response overshoot and ringing. Best

response is usually achieved with a series input resistor of

25Ω to 200Ω, depending on the signal source. Response

with some loads (especially capacitive) can be improved

with a resistor of 10Ω to 150Ω in series with the output.

The BUF634’s excellent bandwidth and fast slew rate make it

useful in a variety of high frequency open-loop applications.

When operated open-loop, circuit board layout and bypassing

technique can affect dynamic performance.

For best results, use a ground plane type circuit board layout

and bypass the power supplies with 0.1µF ceramic chip

V+

OP AMP

RECOMMENDATIONS

OPA177, OPA1013

OPA111, OPA2111

OPA121, OPA234⁽¹⁾

OPA130⁽¹⁾

Use Low I_Qmode. G = 1 stable.

(1)

C₁

,

V_O

OPA27, OPA2107

OPA602, OPA131⁽¹⁾

Low I_Qmode is stable. Increasing C_Lmay cause

excessive ringing or instability. Use Wide BW mode.

OPA

BUF634

V_IN

BW

OPA627, OPA132⁽¹⁾

OPA637, OPA37

Use Wide BW mode, C₁= 200pF. G = 1 stable.

Use Wide BW mode. These op amps are not G = 1

stable. Use in G > 4.

NOTE: (1) C₁not required

for most common op amps.

Use with unity-gain stable

high speed op amps.

Wide BW mode

(if required)

V–

NOTE: (1) Single, dual, and quad versions.

FIGURE 4. Boosting Op Amp Output Current.

V+

G = +21

250Ω

5kΩ

Drives headphones

or small speakers.

1µF

OPA132

BUF634

V_IN

BW

R_L= 100Ω

THD+N

0.015%

0.02%

f

100kΩ

1kHz

20kHz

V–

FIGURE 5. High Performance Headphone Driver.

I_O= ±200mA

V_IN

±2V

C⁽¹⁾

+24V

+

12V

–

10kΩ

OPA177

BUF634

+

pseudo

ground

Valve

10µF

BUF634

C⁽¹⁾

+

12V

–

10Ω

NOTE: (1) System bypass capacitors.

FIGURE 6. Pseudo-Ground Driver.

FIGURE 7. Current-Output Valve Driver.

10kΩ

1kΩ

9kΩ

1/2

OPA2234

1/2

OPA2234

BUF634

Motor

BUF634

V_IN

±1V

±20V

at 250mA

FIGURE 8. Bridge-Connected Motor Driver.

®

9

BUF634

PACKAGE OPTION ADDENDUM

www.ti.com

25-Oct-2005

PACKAGING INFORMATION

Orderable Device

BUF634F

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

OBSOLETE DDPAK/

TO-263

KTT

5

TBD

Call TI

BUF634F/500

BUF634FKTTT

ACTIVE

DDPAK/

TO-263

KTT

500

50

CU SNPB

Level-3-220C-168 HR

Level-NA-NA-NA

ACTIVE

DDPAK/

TO-263

BUF634P

BUF634T

ACTIVE

PDIP

P

8

5

50

TO-220

KC

49 Green (RoHS & TAMAC2-1/2H Level-NC-NC-NC

no Sb/Br)

SN

BUF634U

ACTIVE

SOIC

D

8

100

TBD

CU NIPDAU Level-3-220C-168 HR

BUF634U/2K5

2500

TBD

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan

-

The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS

&

no Sb/Br)

-

please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 1

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,

enhancements, improvements, and other changes to its products and services at any time and to discontinue

any product or service without notice. Customers should obtain the latest relevant information before placing

orders and should verify that such information is current and complete. All products are sold subject to TI’s terms

and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in

accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

deems necessary to support this warranty. Except where mandated by government requirements, testing of all

parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for

their products and applications using TI components. To minimize the risks associated with customer products

and applications, customers should provide adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,

copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process

in which TI products or services are used. Information published by TI regarding third-party products or services

does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.

Use of such information may require a license from a third party under the patents or other intellectual property

of the third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of information in TI data books or data sheets is permissible only if reproduction is without

alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction

of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for

such altered documentation.

Resale of TI products or services with statements different from or beyond the parameters stated by TI for that

product or service voids all express and any implied warranties for the associated TI product or service and

is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.

Following are URLs where you can obtain information on other Texas Instruments products and application

solutions:

Products

Applications

Audio

Amplifiers

amplifier.ti.com

www.ti.com/audio

Data Converters

dataconverter.ti.com

Automotive

www.ti.com/automotive

DSP

dsp.ti.com

Broadband

Digital Control

Military

www.ti.com/broadband

www.ti.com/digitalcontrol

www.ti.com/military

Interface

Logic

interface.ti.com

logic.ti.com

Power Mgmt

Microcontrollers

power.ti.com

Optical Networking

Security

www.ti.com/opticalnetwork

www.ti.com/security

www.ti.com/telephony

www.ti.com/video

microcontroller.ti.com

Telephony

Video & Imaging

Wireless

www.ti.com/wireless

Mailing Address:

Texas Instruments

Post Office Box 655303 Dallas, Texas 75265


型号：	BUF634P
厂家：	BURR-BROWN CORPORATION
描述：	250mA HIGH-SPEED BUFFER 250mA高速缓冲器缓冲放大器放大器电路光电二极管
文件：	总11页 (文件大小：200K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BUF634P [BB]

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