TLV3012AIDCKRG4 [BB]
Nanopower, 1.8V, SOT23 Comparator with Voltage Reference; 纳安级功耗， 1.8V ， SOT23比较器与电压基准
| 型号： | TLV3012AIDCKRG4 |
| 厂家： | 
BURR-BROWN CORPORATION |
| 描述： | Nanopower, 1.8V, SOT23 Comparator with Voltage Reference |
| 文件： | 总16页 (文件大小：462K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLV3011
TLV3012
SBOS300B – FEBRUARY 2004 – REVISED JUNE 2004
Nanopower, 1.8V, SOT23
Comparator with Voltage Reference
DESCRIPTION
FEATURES
The TLV3011 is a low-power, open-drain output comparator;
the TLV3012 is a push-pull output comparator. Both feature
an uncommitted on-chip voltage reference. Both have 5µA
(max) quiescent current, input common-mode range 200mV
beyond the supply rails, and single-supply operation from
1.8V to 5.5V. The integrated 1.242V series voltage reference
offers low 100ppm/°C (max) drift, is stable with up to 10nF
capacitive load, and can provide up to 0.5mA (typ) of output
current.
● LOW QUIESCENT CURRENT: 5µA (max)
● INTEGRATED VOLTAGE REFERENCE: 1.242V
● INPUT COMMON-MODE RANGE:
200mV Beyond Rails
● VOLTAGE REFERENCE INITIAL ACCURACY: 1%
● OPEN-DRAIN LOGIC COMPATIBLE OUTPUT:
TLV3011
● PUSH-PULL OUTPUT: TLV3012
The TLV3011 and TLV3012 are available in the tiny SOT23-6
package for space-conservative designs. It is also available in
the SC70 package for even greater board area savings. Both
versions are specified for the temperature range of –40°C to
+125°C.
● LOW-SUPPLY VOLTAGE: 1.8V to 5.5V
● FAST RESPONSE TIME: 6µs Propagation Delay
with 100mV Overdrive (TLV3011: RPULL-UP = 10kΩ)
● MicroSIZE PACKAGES: SOT23-6 and SC70-6
TLV3011 and TLV3012 RELATED PRODUCTS
APPLICATIONS
PRODUCT
FEATURES
● BATTERY-POWERED LEVEL DETECTION
TLV349x
TLV370x
TLV340x
1.2µA, 1.8V to 5.5V Push-Pull Comparator
560nA, 2.5V to 16V Push-Pull CMOS Output Comparator
550nA, 2.5V to 16V Open-Drain Comparator
● DATA ACQUISITION
● SYSTEM MONITORING
● OSCILLATORS
● SENSOR SYSTEMS:
Smoke Detectors, Light Sensors, Alarms
OUT
V−
1
2
3
6
5
4
V+
REF
IN−
IN+
TLV3011
TLV3012
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright © 2004, Texas Instruments Incorporated
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
Supply Voltage .................................................................................... +7V
Signal Input Terminals, Voltage(2) ........................... –0.5V to (V+) + 0.5V
Current(2) .................................................. ±10mA
Output Short-Circuit(3) .............................................................. Continuous
Operating Temperature ..................................................–55°C to +150°C
Storage Temperature .....................................................–55°C to +150°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) ............................................... +300°C
ESD Rating (Human Body Model) .................................................. 2000V
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may be
more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only,
and functional operation of the device at these or any other
conditions beyond those specified is not implied.
(2) Input terminals are diode-clamped to the power-supply rails. In
put signals that can swing more than 0.5V beyond the supply
rails should be current limited to 10mA or less.
(3) Short-circuit to ground.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information, see
the Package Option Addendum located at the end of this
data sheet.
PIN CONFIGURATIONS
Top View
TLV3011AIDBV
TLV3012AIDBV
OUT
V−
1
2
3
6
5
4
V+
OUT
V−
1
2
3
6
5
4
V+
REF
IN−
REF
IN−
IN+
IN+
SOT23-6
SOT23-6
TLV3011AIDCK
TLV3012AIDCK
OUT
V−
1
2
3
6
5
4
V+
OUT
1
2
3
6
5
4
V+
REF
V−
REF
IN+
IN−
IN+
IN−
SC70-6
SC70-6
NOTE: Pin 1 is determined by orienting package marking as shown.
TLV3011, TLV3012
2
www.ti.com
SBOS300B
ELECTRICAL CHARACTERISTICS: VS = +1.8V to +5.5V
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, VOUT = VS, unless otherwise noted; for TLV3011, RPULL-UP = 10kΩ connected to VS.
TLV3011, TLV3012
PARAMETER
CONDITION
MIN
TYP
MAX
UNITS
OFFSET VOLTAGE
Input Offset Voltage
vs Temperature
VOS
dVOS/dT
PSRR
VCM = 0V, IO = 0V
TA = –40°C to +125°C
0.5
±12
100
12
mV
µV/°C
µV/V
vs Power Supply
V
S = 1.8V to 5.5V
1000
INPUT BIAS CURRENT
Input Bias Current
Input Offset Current
IB
IOS
VCM = VS/2
VCM = VS/2
±1
±1
±10
±10
pA
pA
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
VCM
CMRR
(V–) – 0.2V
(V+) + 0.2V
V
dB
dB
V
V
CM = –0.2V to (V+) – 1.5V
CM = –0.2V to (V+) + 0.2V
60
54
74
62
INPUT IMPEDANCE
Common-Mode
Differential
1013
1013
2
4
Ω
Ω
pF
pF
SWITCHING CHARACTERISTICS
Propagation Delay Time, Low-to-High
f = 10kHz, VSTEP = 1V
Input Overdrive = 10mV
Input Overdrive = 100mV
Input Overdrive = 10mV
Input Overdrive = 100mV
t(PLH)
t(PHL)
tR
12
µs
6
13.5
6.5
µs
µs
µs
Propagation Delay Time, High-to-Low
Rise Time, TLV3011
Rise Time, TLV3012
Fall Time
See Note 1
100
CL = 10pF
CL = 10pF
ns
ns
tF
100
OUTPUT
VS = 5V
Voltage Output Low from Rail
Voltage Output High From Rail, TLV3012
Short-Circuit Current, TLV3012
VOL
IOUT = –5mA
160
90
200
200
mV
mV
IOUT = 5mA
See Typical Characteristics
VOLTAGE REFERENCE
VIN = 5V
Initial Accuracy
VOUT
1.230
1.242
40
1.254
±1
100
V
%
ppm/°C
Temperature Drift
Load Regulation
Sourcing
Sinking
Output Current
Line Regulation
dVOUT/dT
–40°C ≤ TA ≤ 125°C
dVOUT/dILOAD
0mA < ISOURCE ≤ 0.5mA
0mA < ISINK ≤ 0.5mA
0.36
6.6
0.5
10
1
mV/mA
mV/mA
mA
ILOAD
dVOUT/dVIN
1.8V ≤ VIN ≤ 5.5V
100
µV/V
NOISE
Reference Voltage Noise
f = 0.1Hz to 10Hz
0.2
mVPP
POWER SUPPLY
Specified Voltage
Operating Voltage Range
Quiescent Current
VS
IQ
1.8
1.8
5.5
5.5
5
V
V
µA
VS = 5V, VO = High
2.8
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance, θJA
SOT23-6
–40
–55
–55
+125
+150
+150
°C
°C
°C
200
250
°C/W
°C/W
SC70-6
NOTE: (1) tR dependent on RPULL-UP and CLOAD
.
TLV3011, TLV3012
3
SBOS300B
www.ti.com
TYPICAL CHARACTERISTICS
At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted.
QUIESCENT CURRENT
QUIESCENT CURRENT vs TEMPERATURE
vs OUTPUT SWITCHING FREQUENCY
3.8
3.6
3.4
3.2
3.0
2.8
2.6
2.4
2.2
2.0
8
7
6
5
4
3
2
1
0
TLV3011
RPULL-UP = 1MΩ
VS = 5V
VS = 3V
VS = 1.8V
–50
–25
0
25
50
75
100
125
1
–50
0
10
100
1k
10k
125
12
Temperature (°C)
Output Transition Frequency (Hz)
QUIESCENT CURRENT
vs OUTPUT SWITCHING FREQUENCY
INPUT BIAS CURRENT vs TEMPERATURE
45
40
35
30
25
20
15
10
5
14
12
10
8
TLV3012
VS = 5V
VS = 3V
6
4
VS = 1.8V
2
0
0
–5
–25
0
25
50
75
100
1
10
100
1k
10k
100k
Temperature (°C)
Output Transition Frequency (Hz)
OUTPUT LOW vs OUTPUT CURRENT
OUTPUT HIGH vs OUTPUT CURRENT
TLV3012
0.25
0.20
0.15
0.10
0.05
0
0.25
0.20
0.15
0.10
0.05
0
VDD = 3V
VS = 1.8V
VDD = 1.8V
VS = 3V
V
S = 5V
VDD = 5V
0
2
4
6
8
10
12
2
4
6
8
10
Output Current (mA)
Output Current (mA)
TLV3011, TLV3012
4
www.ti.com
SBOS300B
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted.
PROPAGATION DELAY (tPHL) vs CAPACITIVE LOAD
PROPAGATION DELAY (tPLH) vs CAPACITIVE LOAD
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
TLV3012
VS = 3V
VS = 5V
VS = 3V
VS = 5V
VS = 1.8V
VS = 1.8V
0.01
0.1
1
10
100
1k
0.01
0.1
1
10
100
1k
Capacitive Load (nF)
Capacitive Load (nF)
PROPAGATION DELAY (tPLH) vs INPUT OVERDRIVE
PROPAGATION DELAY (tPHL) vs INPUT OVERDRIVE
20
18
16
14
12
10
8
20
18
16
14
12
10
8
VS = 5V
VS = 1.8V
VS = 3V
VS = 3V
VS = 1.8V
6
6
VS = 5V
4
4
0
10
20
30
40
50 60
70
80
90 100
0
10
20
30
40
50 60
70
80
90 100
Input Overdrive (mV)
Input Overdrive (mV)
PROPAGATION DELAY (tPLH) vs TEMPERATURE
PROPAGATION DELAY (tPHL) vs TEMPERATURE
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
8.0
7.5
7.0
6.5
6.0
5.5
5.0
4.5
4.0
VS = 1.8V
VS = 1.8V
VS = 3V
VS = 3V
VS = 5V
VS = 5V
–50
–25
0
25
50
75
100
125
–50
–25
0
25
50
75
100
125
Temperature (°C)
Temperature (°C)
TLV3011, TLV3012
5
SBOS300B
www.ti.com
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted.
PROPAGATION DELAY (tPLH
)
PROPAGATION DELAY (tPHL)
VS = ±2.5V
VS = ±2.5V
VIN+
VIN–
VIN–
VIN+
TLV3012
VOUT
TLV3011
VOUT
2µs/div
2µs/div
PROPAGATION DELAY (tPLH
)
PROPAGATION DELAY (tPHL)
VIN+
VS = ±0.9V
VS = ±0.9V
VIN–
VIN–
VIN+
VOUT
VOUT
2µs/div
2µs/div
REFERENCE VOLTAGE vs OUTPUT LOAD CURRENT
(Sourcing)
REFERENCE VOLTAGE vs OUTPUT LOAD CURRENT
(Sinking)
1.24205
1.24200
1.24195
1.24190
1.24185
1.24180
1.24175
1.24170
1.24165
1.24160
1.250
1.249
1.248
1.247
1.246
1.245
1.244
1.243
1.242
1.241
0
0.2
0.4
0.6
0.8
1.0
1.2
0
0.2
0.4
0.6
0.8
1.0
1.2
Output Load Current, Sourcing (mA)
Output Load Current, Sinking (mA)
TLV3011, TLV3012
6
www.ti.com
SBOS300B
TYPICAL CHARACTERISTICS (Cont.)
At TA = +25°C, VS = +1.8V to +5.5V, RPULL-UP = 10kΩ, and Input Overdrive = 100mV, unless otherwise noted.
REFERENCE VOLTAGE vs TEMPERATURE
SHORT-CIRCUIT CURRENT vs SUPPLY VOLTAGE
TLV3012
1.250
1.245
1.240
1.235
1.230
1.225
1.220
1.215
1.210
140
120
100
80
Sink
60
Source
40
20
0
–100
–50
0
50
100
150
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Temperature (°C)
Supply Voltage (V)
REFERENCE VOLTAGE DISTRIBUTION
500
450
400
350
300
250
200
150
100
50
0
Volts
TLV3011, TLV3012
7
SBOS300B
www.ti.com
may be added by connecting a small amount of feedback to
the positive input. Figure 2 shows a typical topology used to
introduce hysteresis, described by the equation:
APPLICATIONS INFORMATION
The TLV3011 is a low-power, open-drain comparator with
on-chip 1.242V series reference. The open-drain output
allows multiple devices to be driven by a single pull-up
resistor to accomplish an OR function, making the TLV3011
useful for logic applications.
V+ × R1
VHYST
=
R1 + R2
The TLV3012 comparator with on-chip 1.242V series refer-
ence has a push-pull output stage optimal for reduced power
budget applications and features no shoot-through current.
V+
5.0V
A typical supply current of 2.8µA and tiny packaging combine
with 1.8V supply requirements to make the TLV3011 and
TLV3012 optimal for battery and portable designs.
(1)
RPULL-UP
VIN
TLV301x
VOUT
BOARD LAYOUT
REF
R2
560kΩ
Typical connections for the TLV3011 and TLV3012 are
shown in Figure 1. The TLV3011 is an open-drain output
device. A pull-up resistor must be connected between the
comparator output and supply to enable operation.
R1
39kΩ
VHYST = 0.38V
NOTE: (1) Use RPULL-UP with the TLV3011 only.
VREF
To minimize supply noise, power supplies should be capaci-
tively decoupled by a 0.01µF ceramic capacitor in parallel
with a 10µF electrolytic capacitor. Comparators are sensitive
to input noise, and precautions such as proper grounding
(use of ground plane), supply bypassing, and guarding of
high-impedance nodes will minimize the effects of noise and
help to ensure specified performance.
FIGURE 2. Adding Hysteresis.
VHYST will set the value of the transition voltage required to
switch the comparator output by increasing the threshold
region, thereby reducing sensitivity to noise.
V+
APPLICATIONS
BATTERY LEVEL DETECT
0.01µF
10µF
(1)
RPULL-UP
The low power consumption and 1.8V supply voltage of the
TLV3011 make it an excellent candidate for battery-powered
applications. Figure 3 shows the TLV3011 configured as a
low battery level detector for a 3V battery.
4
3
10kΩ
6
VIN–
1
TLV301x
VOUT
V–
2
VIN+
5
REF
NOTE: (1) Use RPULL-UP with the TLV3011 only.
R1 + R2
Battery−Okay Trip Voltage = 1.242
R2
FIGURE 1. Basic Connections of the TLV3011 and TLV3012.
OPEN-DRAIN OUTPUT (TLV3011)
R1
(1)
The open-drain output of the TLV3011 is useful in logic
applications. The value of the pull-up resistor and supply
voltage used will affect current consumption due to additional
current drawn when the output is in a low state. This effect
can be seen in the typical curve Quiescent Current vs Output
Switching Frequency.
RPULL-UP
1MΩ
+
TLV301x
Battery
Okay
−
R2
2MΩ
REF
1.242V
EXTERNAL HYSTERESIS
Comparator inputs have no noise immunity within the range
of specified offset voltage (±12mV). For noisy input signals,
the comparator output may display multiple switching as
input signals move through the switching threshold. The
typical comparator threshold of the TLV3011 and TLV3012 is
±0.5mV. To prevent multiple switching within the comparator
threshold of the TLV3011 or TLV3012, external hysteresis
When the battery voltage drops below 1.9V,
the battery-okay output will go low.
NOTE: (1) Use RPULL-UP with the TLV3011 only.
FIGURE 3. TLV3011 Configured as a Low Battery Level Detector.
TLV3011, TLV3012
8
www.ti.com
SBOS300B
The reset delay needed depends on the power-up character-
istics of the system power supply. R1 and C1 are selected to
allow enough time for the power supply to stabilize. D1
provides rapid reset if power is lost. In this example, the
R1 • C1 time constant is 10mS.
POWER-ON RESET
The reset circuit shown in Figure 4 provides a time delayed
release of reset to the MSP430 microcontroller. Operation of
the circuit is based on a stabilization time constant of the
supply voltage, rather than on a predetermined voltage
value. The negative input is a reference voltage created by
the internal voltage reference. The positive input is an RC
circuit that provides a power-up delay. When power is ap-
plied, the output of the comparator is low, holding the
processor in the reset condition. Only after allowing time for
the supply voltage to stabilize does the positive input of the
comparator become higher than the negative input, resulting
in a high output state, releasing the processor for operation.
The stabilization time required for the supply voltage is
adjustable by the selection of the RC component values. Use
of a lower-valued resistor in this portion of the circuit will not
increase current consumption because no current flows
through the RC circuit after the supply has stabilized.
RELAXATION OSCILLATOR
The TLV3012 can be configured as a relaxation oscillator as
in Figure 5 to provide a simple and inexpensive clock output.
The capacitor is charged at a rate of T = 0.69RC. It also
discharges at a rate of 0.69RC. Therefore, the period is
T = 1.38RC. R1 may be a different value than R2.
VC
2/3 (V+)
1/3 (V+)
t
T1 T2
V+
V+
V+
C
R1
1000pF
1MΩ
VOUT
R1
1MΩ
DI
(1)
RPULL-UP
MSP430
10kΩ
TLV3012
C1
10nF
t
R2
1MΩ
R2
1MΩ
RESET
TLV301x
F = 724Hz
1.242V
V+
REF
R2
1MΩ
NOTE: (1) Use RPULL-UP with the TLV3011 only.
FIGURE 5. TLV3012 Configured as a Relaxation Oscillator.
FIGURE 4. The TLV3011 or TLV3012 Configured as a
Power Up Reset Circuit for the MSP430.
TLV3011, TLV3012
9
SBOS300B
www.ti.com
PACKAGE OPTION ADDENDUM
www.ti.com
16-Mar-2007
PACKAGING INFORMATION
Orderable Device
TLV3011AIDBVR
TLV3011AIDBVRG4
TLV3011AIDBVT
TLV3011AIDBVTG4
TLV3011AIDCKR
TLV3011AIDCKRG4
TLV3011AIDCKT
TLV3011AIDCKTG4
TLV3012AIDBVR
TLV3012AIDBVRG4
TLV3012AIDBVT
TLV3012AIDBVTG4
TLV3012AIDCKR
TLV3012AIDCKRG4
TLV3012AIDCKT
TLV3012AIDCKTG4
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SC70
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
16-Mar-2007
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
180
180
180
180
(mm)
TLV3011AIDBVR
TLV3011AIDBVT
TLV3012AIDBVR
TLV3012AIDBVT
DBV
DBV
DBV
DBV
6
6
6
6
SITE 21
SITE 21
SITE 21
SITE 21
8
8
8
8
3.23
3.23
3.23
3.23
3.17
3.17
3.17
3.17
1.37
1.37
1.37
1.37
4
4
4
4
8
8
8
8
Q3
Q3
Q3
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Oct-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
TLV3011AIDBVR
TLV3011AIDBVT
TLV3012AIDBVR
TLV3012AIDBVT
DBV
DBV
DBV
DBV
6
6
6
6
SITE 21
SITE 21
SITE 21
SITE 21
214.0
214.0
214.0
214.0
199.0
199.0
199.0
199.0
55.0
55.0
55.0
55.0
Pack Materials-Page 2
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Wireless
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Copyright © 2007, Texas Instruments Incorporated
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