TLV3012AQDBVRQ1 [TI]
具有集成基准和推挽输出的汽车类微功耗比较器 | DBV | 6 | -40 to 125;
| 型号： | TLV3012AQDBVRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有集成基准和推挽输出的汽车类微功耗比较器 | DBV | 6 | -40 to 125 比较器 |
| 文件： | 总17页 (文件大小：504K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLV3011-Q1
TLV3012A-Q1
www.ti.com
SBOS551 –MARCH 2011
NANOPOWER 1.8-V COMPARATOR WITH VOLTAGE REFERENCE
Check for Samples: TLV3012A-Q1
1
FEATURES
DESCRIPTION
2
•
•
•
•
Qualified for Automotive Applications
Low Quiescent Current = 5 μA (Max)
Integrated Voltage Reference = 1.242 V
The TLV3011-Q1 is a low-power, open-drain output
comparator. The TLV3012A-Q1 is a push-pull output
comparator. Both feature an uncommitted on-chip
voltage reference, have 5-μA (max) quiescent
current, input common-mode range 200 mV beyond
the supply rails, and single-supply operation from
1.8 V to 5.5 V. The integrated 1.242-V series voltage
reference offers low 100-ppm/°C (max) drift, is stable
with up to 10-nF capacitive load, and can provide up
to 0.5 mA (typ) of output current.
Input Common-Mode Range = 200 mV Beyond
Rails
•
•
Voltage Reference Initial Accuracy = 1%
Open-Drain Logic Compatible Output
(TLV3011-Q1)
•
•
•
Push-Pull Output (TLV3012A-Q1)
Low Supply Voltage = 1.8 V to 5.5 V
The TLV3012A-Q1 is available in the SC-70 package.
The devices are specified for the temperature range
of –40°C to 125°C.
Fast Response Time = 6-μs Propagation Delay
With 100-mV Overdrive
(TLV3011-Q1: RPULL-UP = 10 kΩ)
DCK PACKAGE
(TOP VIEW)
APPLICATIONS
OUT
V
1
2
3
6
5
4
V+
•
•
•
•
Battery-Powered Level Detection
Data Acquisition
REF
IN-
System Monitoring
Oscillators
IN+
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
TLV3011-Q1
TLV3012A-Q1
SBOS551 –MARCH 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE ORDERING INFORMATION
Table 1.
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TLV3011AQDCKRQ1(2)
TLV3012AQDCKRQ1
TOP SIDE MARKING
SOT (SC-70), DCK
SOT (SC-70), DCK
TBD
BPF
-40°C TO 125°C
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) Product preview device.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range (unless otherwise noted).
MIN
MAX
UNIT
V
Supply voltage
7
(V+) +0.5
±10
Voltage(2)
Current(2)
–0.5
V
Signal input terminals
mA
Output short circuit(3)
Continous
125
Operating temperature range
Storage temperature range
Junction temperature
–40
–65
°C
°C
°C
Tstg
TJ
150
150
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the network ground terminal.
(3) Short circuit to ground
2
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Product Folder Link(s): TLV3012A-Q1
TLV3011-Q1
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SBOS551 –MARCH 2011
ELECTRICAL CHARACTERISTICS: VS = +1.8 V to +5.5 V
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, VOUT = VS, unless otherwise noted; for TLV3011-Q1, RPULL-UP = 10 kΩ connected to VS.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
15
UNIT
Offset Voltage
VOS
Input offset voltage
VCM = 0 V, IO = 0 V
0.5
±12
100
mV
dVOS/dT
Input offset voltage vs temperature
Power supply rejection ratio
TA = –40°C to 125°C
μV/°C
μV/V
PSRR
VS = 1.8 V to 5.5 V
1000
Input Bias Current
IB
Input bias current
Input offset current
VCM = VS/2
VCM = VS/2
±10
±10
pA
pA
IOS
Input Voltage Range
VCM
Common-mode voltage range
(V–) – 0.2
(V+) + 0.2
V
VCM = –0.2 V to (V+) – 1.5 V
VCM = –0.2 V to (V+) + 0.2 V
60
54
74
62
CMRR
Common-mode rejection ratio
dB
Input Impedance
1013 ∥ 2
1013 ∥ 4
Common mode
Differential
Ω ∥ pF
Ω ∥ pF
Switching Characteristics
f = 10 kHz, VSTEP = 1 V,
input overdrive = 10 mV
12
6
Low to high
High to low
f = 10 kHz, VSTEP = 1 V,
input overdrive = 100 mV
Propagation delay time
μs
f = 10 kHz, VSTEP = 1 V,
input overdrive = 10 mV
13.5
6.5
f = 10 kHz, VSTEP = 1 V,
input overdrive = 100 mV
(2)
TLV3011-Q1(1)
TLV3012A-Q1
See
tr
Rise time
CL = 10 pF
CL = 10 pF
100
100
ns
ns
tf
Fall time
Output
VOL
Voltage output low from rail
VS = 5 V, IOUT = –5 mA
160
90
200
200
mV
mV
Voltage output high from
rail
TLV3012A-Q1
TLV3012A-Q1
VS = 5 V, IOUT = 5 mA
Short-circuit current
See Typical Characteristics
Voltage Reference
VOUT
Output voltage
Initial accuracy
Temperature drift
1.208
1.242
1.276
±1%
100
1
V
dVOUT/dT
–40°C ≤ TA ≤ 125°C
40
0.36
6.6
ppm/°C
Sourcing
Sinking
0 mA < ISOURCE ≤ 0.5 mA
0 mA < ISINK ≤ 0.5 mA
dVOUT/dILOAD
Load regulation
mV/mA
ILOAD
Output current
Line regulation
0.5
mA
dVOUT/dVIN
Noise
1.8 V ≤ VIN ≤ 5.5 V
10
100
μV/V
Reference voltage noise
f = 0.1 Hz to 10 Hz
0.2
2.8
mVPP
Power Supply
VS
Specified voltage
1.8
1.8
5.5
5.5
5
V
V
Operating voltage range
Quiescent current
IQ
VS = 5 V, VO = High
μA
Temperature
Operating range
Storage range
–40
–65
125
150
°C
°C
Thermal resistance
DCK package
259
°C/W
(1) Product preview device.
(2) tr depends on RPULL-UP and CLOAD
.
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SBOS551 –MARCH 2011
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TYPICAL CHARACTERISTICS
At TA = +25°C, VS = +1.8 V to +5.5 V, RPULL-UP = 10 kΩ, and Input Overdrive = 100 mV, unless otherwise noted.
QUIESCENT CURRENT
vs
QUIESCENT CURRENT
vs
TEMPERATURE
OUTPUT SWITCHING FREQUENCY
3.8
3.6
3.4
3.2
3
8
7
6
5
4
3
2
1
0
TLV3011
RPULLUP = 1 MΩ
VS = 5 V
VS = 3 V
2.8
2.6
2.4
2.2
2
VS = 1.8 V
1
10
100
1k
10k
-50
-25
0
25
50
75
100
125
Temperature – °C
Output Transition Frequency – Hz
Figure 1.
Figure 2.
QUIESCENT CURRENT
vs
INPUT BIAS CURRENT
vs
OUTPUT SWITCHING FREQUENCY
TEMPERATURE
14
45
40
35
30
25
20
15
10
5
TLV3012
VS = 5 V
12
10
8
VS = 3 V
6
4
VS = 1.8 V
2
0
0
-5
1
10
100
1k
10k
100k
-50
-25
0
25
50
75
100
125
Output Switching Frequency – Hz
Temperature – °C
Figure 3.
Figure 4.
4
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TLV3011-Q1
TLV3012A-Q1
www.ti.com
SBOS551 –MARCH 2011
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = +1.8 V to +5.5 V, RPULL-UP = 10 kΩ, and Input Overdrive = 100 mV, unless otherwise noted.
OUTPUT LOW
vs
OUTPUT HIGH
vs
OUTPUT CURRENT
OUTPUT CURRENT
0.25
0.20
0.15
0.10
0.05
0
0.25
0.20
0.15
0.10
0.05
0
TLV3012
VDD = 1.8 V
VDD = 3 V
VS = 1.8 V
VS = 3 V
VS = 5 V
VDD = 5 V
0
2
4
6
8
10
12
0
2
4
6
8
10
12
Output Current – mA
Output Current – mA
Figure 5.
Figure 6.
PROPAGATION DELAY (tPLH
)
PROPAGATION DELAY (tPHL
vs
)
vs
CAPACITIVE LOAD
CAPACITIVE LOAD
80
70
60
50
40
30
20
10
0
80
70
60
50
40
30
20
10
0
TLV3012
VS = 3 V
VS = 5 V
VS = 3 V
VS = 1.8 V
VS = 5 V
VS = 1.8 V
0.01
0.1
1
10
100
1k
0.01
0.1
1
10
100
1k
Capacitive Load – nF
Capacitive Load – nF
Figure 7.
Figure 8.
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TLV3012A-Q1
SBOS551 –MARCH 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = +1.8 V to +5.5 V, RPULL-UP = 10 kΩ, and Input Overdrive = 100 mV, unless otherwise noted.
PROPAGATION DELAY (tPLH
)
PROPAGATION DELAY (tPHL
vs
)
vs
INPUT OVERDRIVE
INPUT OVERDRIVE
20
18
16
14
12
10
8
20
18
16
14
12
10
8
VS = 5 V
VS = 1.8 V
VS = 3 V
VS = 3 V
VS = 1.8 V
6
6
VS = 5 V
4
4
0
10 20 30 40 50 60 70 80 90 100
Input Overdrive – mV
0
10 20 30 40 50 60 70 80 90 100
Input Overdrive – mV
Figure 9.
Figure 10.
PROPAGATION DELAY (tPLH
)
PROPAGATION DELAY (tPHL)
vs
vs
TEMPERATURE
TEMPERATURE
8
8
7.5
7
7.5
7
VS = 1.8 V
VS = 3 V
VS = 1.8 V
6.5
6
6.5
6
VS = 3 V
5.5
5
5.5
5
VS = 5 V
VS = 5 V
4.5
4
4.5
4
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Temperature – °C
Temperature – °C
Figure 11.
Figure 12.
PROPAGATION DELAY (tPLH
)
PROPAGATION DELAY (tPHL
)
VS = 2.5 V
VS = 2.5 V
VIN+
VIN–
VIN+
VIN–
TLV3012
VOUT
TLV3011
VOUT
2 µs/div
Figure 13.
2 µs/div
Figure 14.
6
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TLV3011-Q1
TLV3012A-Q1
www.ti.com
SBOS551 –MARCH 2011
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = +1.8 V to +5.5 V, RPULL-UP = 10 kΩ, and Input Overdrive = 100 mV, unless otherwise noted.
PROPAGATION DELAY (tPLH
)
PROPAGATION DELAY (tPHL)
VIN+
VIN–
VS = 0.9 V
VS = 0.9 V
VIN–
VIN+
VOUT
VOUT
2 µs/div
2 µs/div
Figure 15.
Figure 16.
REFERENCE VOLTAGE
vs
REFERENCE VOLTAGE
vs
OUTPUT LOAD CURRENT (SOURCING)
OUTPUT LOAD CURRENT (SINKING)
1.24205
1.24200
1.24195
1.24190
1.24185
1.24180
1.24175
1.24170
1.24165
1.24160
1.250
1.249
1.248
1.247
1.246
1.245
1.244
1.243
1.242
1.241
0
0.2
0.4
0.6
0.8
1
1.2
0
0.2
0.4
0.6
0.8
1
1.2
Output Load Current, Sourcing – mA
Output Load Current, Sinking – mA
Figure 17.
Figure 18.
REFERENCE VOLTAGE
vs
SHORT-CIRCUIT CURRENT
vs
TEMPERATURE
SUPPLY VOLTAGE
1.250
1.245
1.240
1.235
1.230
1.225
1.220
1.215
1.210
140
120
100
80
TLV3012
Sink
60
Source
40
20
0
1.5
2
2.5
3
3.5
4
4.5
5
5.5
-100
-50
0
50
100
150
Temperature – °C
Supply Voltage – V
Figure 19.
Figure 20.
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SBOS551 –MARCH 2011
www.ti.com
TYPICAL CHARACTERISTICS (continued)
At TA = +25°C, VS = +1.8 V to +5.5 V, RPULL-UP = 10 kΩ, and Input Overdrive = 100 mV, unless otherwise noted.
REFERENCE VOLTAGE DISTRIBUTION
500
450
400
350
300
250
200
150
100
50
0
Reference Voltage – V
Figure 21.
8
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SBOS551 –MARCH 2011
APPLICATION INFORMATION
The TLV3011-Q1is a low-power, open-drain comparator with on-chip 1.242-V series reference. The open-drain
output allows multiple devices to be driven by a single pullup resistor to accomplish an OR function, making the
TLV3011-Q1useful for logic applications.
The TLV3012A-Q1 comparator with on-chip 1.242-V series reference has a push-pull output stage optimal for
reduced power budget applications and features no shoot-through current.
A typical supply current of 2.8 μA and small packaging combine with 1.8-V supply requirements to make the
TLV3011-Q1and TLV3012A-Q1 optimal for battery and portable designs.
Board Layout
Typical connections for the TLV3011-Q1and TLV3012A-Q1 are shown in Figure 22. The TLV3011-Q1is an
open-drain output device. A pull-up resistor must be connected between the comparator output and supply to
enable operation.
To minimize supply noise, power supplies should be capacitively decoupled by a 0.01-μF ceramic capacitor in
parallel with a 1-μF electrolytic capacitor. Comparators are sensitive to input noise and precautions such as
proper grounding (use of ground plane), supply bypassing, and guarding of high-impedance nodes minimize the
effects of noise and help to ensure specified performance.
V+
(1)
0.01 mF
10 mF
RPULL-UP
4
3
10 kW
6
VIN-
1
VOUT
TLV301x
V-
VIN+
2
5
REF
(1) Use RPULL-UP with TLV3011-Q1 only.
Figure 22. Basic Connections of the TLV3011-Q1 and TLV3012A-Q1
Open-Drain Output (TLV3011-Q1)
The open-drain output of the TLV3011-Q1is useful in logic applications. The value of the pull-up resistor and
supply voltage used affects current consumption because of the additional current drawn when the output is in a
low state. This effect can be seen in Figure 3.
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SBOS551 –MARCH 2011
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External Hysteresis
Comparator inputs have no noise immunity within the range of specified offset voltage (±12 mV). For noisy input
signals, the comparator output may display multiple switching as input signals move through the switching
threshold. The typical comparator threshold of the TLV3011-Q1and TLV3012A-Q1 is ±0.5 mV. To prevent
multiple switching within the comparator threshold of the TLV3011-Q1or TLV3012A-Q1, external hysteresis may
be added by connecting a small amount of feedback to the positive input. Figure 23 shows a typical topology
used to introduce hysteresis, described by this equation:
V+ × R1
VHYST
=
R1 + R2
V+
5 V
(1)
RPULL-UP
VIN
–
VOUT
TLV301x
+
REF
R2
560 kW
R1
VHYST = 0.38 V
39 kW
VREF
(1) Use RPULL-UP with TLV3011-Q1 only.
Figure 23. Adding Hysteresis
VHYST sets the value of the transition voltage required to switch the comparator output by increasing the threshold
region, thereby reducing sensitivity to noise.
Applications
Battery-Level Detect
The low power consumption and 1.8-V supply voltage of the TLV3011-Q1make it an excellent candidate for
battery-powered applications. Figure 24 shows the TLV3011-Q1configured as a low battery level detector for a
3-V battery.
R1 + R2
Battery Okay trip voltage = 1.242
R2
R1
(1)
RPULL-UP
1 MW
+
Battery
Okay
+
–
TLV301x
–
R2
1.242 V
REF
2 MW
When the battery voltage drops below 1.9 V,
the Battery Okay output goes low.
(1) Use RPULL-UP with TLV3011-Q1 only.
Figure 24. TLV3011-Q1 Configured as Low Battery Level Detector
10
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SBOS551 –MARCH 2011
Power-On Reset
The reset circuit shown in Figure 25 provides a time-delayed release of reset to the MSP430 microcontroller.
Operation of the circuit is based on a stabilization time constant of the supply voltage, rather than on a
predetermined voltage value. The negative input is a reference voltage created by the internal voltage reference.
The positive input is an RC circuit that provides a power-up delay. When power is applied, the output of the
comparator is low, holding the processor in the reset condition. Only after allowing time for the supply voltage to
stabilize does the positive input of the comparator become higher than the negative input, resulting in a high
output state, releasing the processor for operation. The stabilization time required for the supply voltage is
adjustable by the selection of the RC component values. Use of a lower-valued resistor in this portion of the
circuit does not increase current consumption, because no current flows through the RC circuit after the supply
has stabilized.
V+
R1
(1)
RPULLUP
10 kW
DI
1 MW
MSP430
+
C1
TLV301x
RESET
10 nF
1.242 V
–
REF
(1) Use RPULL-UP with TLV3011-Q1 only.
Figure 25. TLV3011-Q1 or TLV3012A-Q1 Configured as Power-Up Reset Circuit for the MSP430
The reset delay needed depends on the power-up characteristics of the system power supply. R1 and C1 are
selected to allow enough time for the power supply to stabilize. D1 provides rapid reset if power is lost. In this
example, the R1 × C1 time constant is 10 ms.
Relaxation Oscillator
The TLV3012A-Q1 can be configured as a relaxation oscillator to provide a simple and inexpensive clock output
(see Figure 26). The capacitor is charged at a rate of T = 0.69RC and discharges at a rate of 0.69RC. Therefore,
the period is T = 1.38RC. R1 may be a different value than R2.
VC
2/3 (V+)
1/3 (V+)
t
T1 T2
V+
V+
C
R1
1 MΩ
1000 pF
VOUT
TLV3012
t
R2
1 MΩ
R2
1 MΩ
F = 724 Hz
V+
R2
1 MΩ
Figure 26. TLV3012A-Q1 Configured as Relaxation Oscillator
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PACKAGE OPTION ADDENDUM
www.ti.com
3-Jun-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TLV3012AQDCKRQ1
ACTIVE
SC70
DCK
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TLV3012-Q1 :
Catalog: TLV3012
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Jun-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLV3012AQDCKRQ1
SC70
DCK
6
3000
179.0
8.4
2.2
2.5
1.2
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Jun-2011
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SC70 DCK
SPQ
Length (mm) Width (mm) Height (mm)
203.0 203.0 35.0
TLV3012AQDCKRQ1
6
3000
Pack Materials-Page 2
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