BL-LS5050A0S3URUGUBC [BETLUX]
5.5mmx5.0mm SMD, 1.8mm THICKNESS PLCC6 package;
| 型号： | BL-LS5050A0S3URUGUBC |
| 厂家： | 
BETLUX ELECTRONICS |
| 描述： | 5.5mmx5.0mm SMD, 1.8mm THICKNESS PLCC6 package |
| 文件： | 总5页 (文件大小：335K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SMD LED LAMP
BL-LS5050A0S3xxx
Features:
5.5mmx5.0mm SMD, 1.8mm THICKNESS PLCC6 package
RGB type, Ultra brightness
Compatible with automatic placement equipment
WIDE VIEWING ANGLE.
IDEAL FOR BACKLIGHT AND INDICATOR.
PACKAGE: 500PCS/REEL
RoHs Compliance
Electrical-optical characteristics: (Ta=25°C)
(Test Condition: IF=20mA)
Chip
Luminous
Intensity
(Iv)
Forward
Voltage(VF)
Unit:V
Viewi
ng
Part Number
Lens
Type
Unit:mcd
P
(n
Emitted Color
Material
Angle
2θ1/2
(deg)
m)
Typ
2.10
2.20
3.10
2.10
3.10
3.10
Max
2.50
2.50
4.20
2.50
4.20
4.20
Min.
Typ.
Red
AlGaAs
GaP
660
574
470
630
525
470
110
28
180
50
BL-LS5050A0S3
RGBC
Green
Blue
InGaN
AlGaInP
InGaN
InGaN
70
120
420
1500
500
Water
Clear
120
Ultra Red
Ultra Pure Green
Ultra Blue
280
1300
450
BL-LS5050A0S3
URUGUBC
Absolute maximum ratings (Ta=25°C)
U
nit
mA
Parameter
R
G
B
UR
UG
UB
30
78
5
30
78
5
30
30
30
78
5
30
Forward Current IF
Power Dissipation Pd
Reverse Voltage VR
mW
V
78
5
78
5
78
5
Peak Forward Current IPF
(Duty 1/10 @1KHZ)
Operation Temperature TOPR
Storage Temperature TSTG
mA
100
100
100
100
100
100
°C
°C
-30 to +80
-40 to +85
Lead Soldering Temperature
TSOL
Max.260±5°C for 3 sec Max.
(1.6mm from the base of the epoxy bulb)
°C
APPROVED : XU L CHECKED :ZHANG WH DRAWN: LI FS
REV NO: V.3
Page 1 of 5
WWW.BETLUX.COM EMAIL: SALES@BETLUX.COM , BETLUX@BETLUX.COM
SMD LED LAMP
BL-LS5050A0S3xxx
Package configuration & Internal circuit diagram
Notes:
1. All dimensions are in millimeters (inches)
2. Tolerance is ±0.25(0.01")unless otherwise noted.
3. Specifications are subject to change without notice.
APPROVED : XU L CHECKED :ZHANG WH DRAWN: LI FS
REV NO: V.3
Page 2 of 5
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EMAIL: SALES@BETLUX.COM , BETLUX@BETLUX.COM
SMD LED LAMP
BL-LS5050A0S3xxx
Tape Specifications
Smt Reflow Solding Instructions
Number of reflow process shall be less than 2 times
and cooling process to normai temperature is required
between first and second soldering process
Recommended Soldering Pattern
(Units:mm)
Tape Specifications
(Units:mm)
APPROVED : XU L CHECKED :ZHANG WH DRAWN: LI FS
REV NO: V.3
Page 3 of 5
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SMD LED LAMP
BL-LS5050A0S3xxx
Typical electrical-optical characteristics curves:
(A)
(B)
(C)
(D)
(2) (3)
(8)
(4)
(1) (6)
(5)
(9)
(10)
1.0
0.5
0
350
400
450
500
550
600
650
Wavelength(nm)
RELATIVE INTENSITY Vs WAVELENGTH(λ p)
700
750
800
850
900
950
1000
(1) - GaAsP/GaAs 655nm/Red
(9) - GaAlAs 880nm
(2) - GaP 570nm/Yellow Green
(3) - GaAsP/GaP 585nm/Yellow
(10) - GaAs/GaAs & GaAlAs/GaAs 940nm
(A) - GaN/SiC 430nm/Blue
(4) - GaAsp/GaP 635nm/Orange & Hi-Eff Red
(5) - GaP 700nm/Bright Red
(B) - InGaN/SiC 470nm/Blue
(C) - InGaN/SiC 505nm/Ultra Green
(D) - InGaAl/SiC 525nm/Ultra Green
(6) - GaAlAs/GaAs 660nm/Super Red
(8) - GaAsP/GaP 610nm/Super Red
8
1
6 4 5 2 3
50
4.0
50
1
1
40
30
20
10
0
40
3.0
2.0
6
2,4,8,A
30
5
3
5
B
20
10
0
1.0
0
1.2
1.6
2.0
2.4
2.6 3.0
20
40
60
80
100
20
40
60
80
100
FORWARD VOLTAGE (Vf)
FORWARD CURRENT VS.
FORWARD VOLTAGE
FORWARD CURRENT (mA)
AMBIENT TEMPERATURE Ta(℃)
RELATIVE LUMINOUS
INTENSITY VS. FORWARD
CURRENT
FORWARD CURRENT VS. AMBIENT
TEMPERATURE
300KHz
1KHz 100KHz
3KHz
10KHz
3KHz
10KHz 1KHz
300Hz
100Hz
30KHz
100KHz
F-REFRESH RATE
10
10
9
8
7
9
8
7
6
5
4
3
3
2
1
5
6
5
4
2
1
3
4
3
0.5
0.2
0.1
2
1
2
1
-30 -20
-10
0
10
20
30
40
50
60
70
1
10
100
1000
10,000
10,000
1
10
100
1000
AMBIENT TEMPERATURE Ta(℃)
tp-PULSE DURATION uS
(1,2,3,4,6,8,B.D.J.K)
tp-PULSE DURATION uS
(5)
NOTE:25℃ free air temperature unless otherwise specified
APPROVED : XU L CHECKED :ZHANG WH DRAWN: LI FS
REV NO: V.3
Page 4 of 5
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SMD LED LAMP
BL-LS5050A0S3xxx
Packing and weighting
Maximum
Bags/Inner Box
10
500pcs/Reel
1 Reel/Bag
3
Inner
Box/Box
9
Inner
Box/Box
APPROVED : XU L CHECKED :ZHANG WH DRAWN: LI FS
REV NO: V.3
Page 5 of 5
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