ACMD-7403-BLK [BOARDCOM]

Miniature UMTS Band II / PCS Duplexer;


型号：	ACMD-7403-BLK
厂家：	Broadcom Corporation.
描述：	Miniature UMTS Band II / PCS Duplexer PCS 过程控制系统
文件：	总11页 (文件大小：1279K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ACMD-7403

Miniature UMTS Band II / PCS Duplexer

Data Sheet

Description

Features

The Avago Technologies’ ACMD-7403 is a miniature • Miniature Size

duplexer designed for use in UMTS Band II and PCS

(Blocks A–F) handsets.

• 3.0 x 3.0 mm Max footprint

• 1.2 mm Max height

• High Power Rating

The ACMD-7403 enhances the sensitivity and dynamic

range of handset receivers by providing more than 54 dB

attenuation of the transmitted signal at the receiver input

and more than 44 dB rejection of transmit-generated

noise in the receive band.

• 33 dBm Abs Max Tx Power

• Lead-Free Construction

Maximum Insertion Loss in the Tx channel is only 2.7 dB,

which minimizes current drain from the power ampliﬁer.

Insertion Loss in the Rx channel is a maximum of 3.2 dB,

thus improving receiver sensitivity.

Speciﬁcations

• Rx Band Performance, 1930.5-1989.5 MHz, – 30 to +85°C

• Rx Noise Blocking: 44 dB min

• Insertion Loss: 3.2 dB max

The ACMD-7403 is designed with Avago Technologies’

Film Bulk Acoustic Resonator (FBAR) technology, which

makes possible ultra-small, high-Q ﬁlters at a fraction

of their usual size. The excellent power handling capa-

bility of the FBAR bulk-mode resonators supports the

high output power levels needed in PCS handsets while

adding virtually no distortion.

• Tx Band Performance, 1850.5-1909.5 MHz, – 30 to +85°C

• Tx Interferer Blocking: 52 dB min

• Insertion Loss: 2.7 dB max

Applications

The ACMD-7403 also utilizes Avago Technologies’ innova-

tive Microcap bonded-wafer, chip scale packaging tech-

nology. This process allows the ﬁlters to be assembled in

a molded chip-on-board module that is less than 1.2 mm

high with a footprint of only 3.0 mm x 3.0 mm.

Handsets or data terminals operating in the PCS (A–F)

frequency band.

Functional Block Diagram

[2,3]

[1]

ACMD-7403 Electrical Speciﬁcations , Z =50 Ω, T as indicated,

– 30°C

Typ Max Min

+25°C

Typ Max Min

+85°C

Typ Max

Symbol Parameter

Antenna Port to Receive Port

Units

Min

S23

Insertion Loss in Receive Band

1930.5 – 1931.5 MHz

1931.5 – 1989.5 MHz

3.2

3.0

1.9

1.3

3.1

3.0

3.2

∆S23

S22

Ripple (p-p) in Receive Band

1.7

Return Loss of Receive Port

in Receive Band

9.5

S23

Attenuation in Transmit Band

(1850.5 – 1909.5 MHz)

S23

Attenuation 0 – 1600 MHz

Attenuation in Receive 2nd Harmonic

Band (3861 – 3979 MHz)

Transmit Port to Antenna Port

S31

Insertion Loss in Transmit Band

1850.5 – 1908.5 MHz

1908.5 – 1909.5 MHz

2.5

1.0

1.4

2.1

2.3

2.5

2.7

∆S31

S11

Ripple (p-p) in Transmit Band

1.3

Return Loss of Transmit Port

in Transmit Band

9.5

S31

Attenuation in Receive Band

(1930.5 – 1989.5 MHz)

S31

Attenuation 0 – 1600 MHz

Attenuation in GPS Rx Band

(1574.42 – 1576.42 MHz)

S31

Attenuation in Transmit 2nd Harmonic

Band (3701 – 3819 MHz)

Antenna Port

S33

Return Loss of Antenna Port in Receive

Band (1930.5 – 1989.5 MHz)

Return Loss of Antenna Port in Transmit

Band (1850.5 – 1909.5 MHz)

Isolation Transmit Port to Receive Port

S21

Tx-Rx Isolation in Receive Band

(1930.5 – 1989.5 MHz)

Tx-Rx Isolation in Transmit Band

(1850.5 – 1909.5 MHz)

Notes:

is the case temperature and is deﬁned as the temperature of the underside of the Duplexer where it makes contact with the circuit board.

Min/Max speciﬁcations are guaranteed at the indicated temperature with the input power to the Tx ports equal to or less than +29 dBm over all Tx

frequencies unless otherwise noted. Typical data is the average value of the parameter over the indicated band at the speciﬁed temperature. Typical

values may vary over time.

ꢀ

ACMD-7403

[1]

Absolute Maximum Ratings

Characterization

A test circuit similar to the one shown in Figure 1 was

used to measure typical device performance. This circuit

is designed to interface with Air Coplanar (ACP), Ground-

Signal-Ground (GSG) RF probes of the type commonly

used to test semiconductor wafers.The PCB test circuit

uses multiple vias to create a well-grounded pad to

which the device under test (DUT) is solder-attached.

Short lengths of 50-ohm microstripline connect the DUT

to ACP probe patterns on the board.

Parameter

Unit Value

Storage temperature

°C

–65 to +125

Maximum RF Input Power to Tx Port

dBm +33

[2]

Maximum Recommended Operating Conditions

Parameter

Unit Value

[3]

Operating temperature, T_c

Tx Power ≤ 29 dBm

°C

–40 to +100

Operating temperature, T_c

Tx Power ≤ 30 dBm

°C

–40 to +85

A test circuit with ACMD-7403 mounted in place is shown

in Figure 2. S-parameters are then measured using a

network analyzer and calibrated ACP probe set.

Notes:

1. Operation in excess of any one of these conditions may result in

permanent damage to the device.

2. The device will function over the recommended range without

degradation in reliability or permanent change in performance, but

is not guaranteed to meet electrical speciﬁcations.

Phase data for s-parameters measured with ACP probe

circuits are adjusted to place the reference plane at the

edge of the duplexer.

T is deﬁned as case temperature, the temperature of the underside

of the duplexer where it makes contact with the circuit board.

Figure 2. Test Circuit with Duplexer.

Figure 1. ACP Probe Test Circuit.

ꢁ

ACMD-7403 Typical Performance at T = 25°C

0.0

-1.0

-2.0

-3.0

0.0

-1.0

-2.0

-3.0

1930

1940

1950

1960

1970

1980

1990

1850

1860

1870

1880

1890

1900

1910

Frequency (MHz)

Figure 3. T_x–Ant Insertion Loss

Figure 4. Ant–R_xInsertion Loss

-5

-10

-20

-30

-40

-50

-60

-10

-15

-20

-25

1750 1800 1850 1900 1950 2000 2050 2100

1750

1800

1850

1900

1950

2000

2050

2100

Frequency (MHz)

Figure 6. T_xRejection in R_xBand and R_xRejection in T_xBand

Figure 5. T_xand R_xPort Return Loss

-5

-35

-40

-45

-50

-55

-60

-65

-70

-75

-80

-10

-15

-20

-25

1750 1800 1850 1900 1950 2000 2050 2100

1750 1800

1850 1900 1950 2000

Frequency (MHz)

2050 2100

Frequency (MHz)

Figure 8. Antenna Port Return Loss

Figure 7. T_x–R_xIsolation

ꢂ

ACMD-7403 Typical Performance at T = 25°C

-5

-10

-20

-30

-40

-50

-60

-10

-15

-20

0.0

1.0

2.0

3.0

4.0

5.0

6.0

3700

3720

3740

3760

3780

3800

3820

Frequency (GHz)

Frequency (MHz)

Figure 9. T_x–Ant and Ant–R_xWideband Insertion Loss

Figure 10. T_x–Ant Rejection at T_xSecond Harmonic

-10

-20

-30

-40

-50

-60

-10

-20

-30

-40

-50

-60

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

Frequency (GHz)

Figure 11. T_x–Ant Low Frequency Rejection

Figure 12. Ant–R_xLow Frequency Rejection

ꢃ

0.8

1.5

0.6

0.4

0.2

0.4

0.6

0.8

1.5

10 20 50

0.2

0.4

0.6

0.8

1.5

10 20 50

-50

-20

-50

-20

-10

-5

-4

-5

-4

-3

-0.4

-2

-0.6

-1.5

-0.8

-1

Figure 14. R_xPort Impedance in R_xBand

Figure 13. T_xPort Impedance in T_xBand

0.8

1.5

0.6

0.4

0.2

0.4

0.6

0.8

1.5

10 20 50

0.2

0.4

0.6

0.8

1.5

10 20 50

-50

-20

-50

-20

-10

-5

-4

-5

-4

-3

-0.4

-2

-0.6

-1.5

-0.8

-1

Figure 15. Ant Port Impedance in T_xBand

Figure 16. Ant Port Impedance in R_xBand

ꢄ

2.80

3.0

MAX

1.2

MAX

1.40

0.33

ANT

0.25

PRODUCT

MARKING

SIGNAL VIA

(2 PLS)

3.0

MAX

0.35

PACKAGE

ORIENTATION

2.45

0.43

TOP VIEW

SIDE VIEW

BOTTOM VIEW

Notes:

0.25

0.30

1. Dimensions in millimeters

Tolerance: X.X ± 0.1 mm

X.XX ± 0.05 mm

0.075

0.25

Angles 45°, unless otherwise noted

2. Dimensions nominal unless otherwise noted

3. I/O Pads (3 ea)

Size: 0.35 X 0.35 mm

Spacing to ground metal: 0.30 mm

4. Signal Vias (2 ea), Ø 0.25; covered with 0.40 Ø solder mask.

Shown for reference only. PCB metal under

signal via does not need to be voided.

0.05

0.30

0.05

5. Contact areas are gold plated

0.075

DETAIL OF IO PAD AREA

Figure 17. Package Outline Drawing

PACKAGE

ORIENTATION

H = ACMD 7403

FB = Avago ID

Y = Year

WW = Work Week

DC = Date Code

NNNN = Lot Number

ANT

Figure 18. Product Marking

ꢅ

Ø 0.30 VIA ARRAY

HORIZ PITC H = 0.40

VERT PITC H = 0.40

0.25

0.30

Ant

0.25 0.30

2.28

0.35

2.10

Figure 20. ACMD-7403 Superposed on PCB Layout

Notes:

1. Dimensions in mm

2. Transmission line Gap (G) adjusted for Zo = 50 ohms

3. I/O Pads (3 ea) 0.35 X 0.35, corner chamfer 0.03

4. Ground vias positioned to maximize port-to-port isolation

5. Preferred Tx connection on buried metal layer

Figure 19. PCB Layout

> 0.30

TYP

0.45

2.90

0.20

2.90

Figure 22. ACMD-7403 Superposed on Solder Mask

> 0.30

TYP

Figure 21. Recommended Solder Mask

A PCB layout using the principles illustrated in Figure 19

is recommended to optimize performance of the ACMD-

7403.

The latter is especially useful, not only to maintain Tx-Rx

isolation of the duplexer, but also to prevent leakage of

the Tx signal into other components that could result in

the creation of intermodulation products and degrada-

tion of overall system performance.

It is particularly important to maximize isolation between

the Tx connection to the duplexer and the Rx port. High

isolation is achieved by: (1) maintaining a continuous

ground plane around the duplexer mounting area, (2)

surrounding the I/O ports with suﬃcient ground vias to

enclose the connections in a “Faraday cage”, and (3) pref-

erably routing the Tx trace in a diﬀerent metal layer than

the Rx.

A suﬃcient number of vias should be used to ensure

excellent RF grounding as well as good heat sinking for

the device.

Note:

The two signal vias shown in Fig 17 are covered with solder mask and it

is not necessary to void the ground plane under them.

ꢆ

STENCIL

BOUNDARY

0.20

0.10

2.80

Figure 24. Solder Stencil Overlaid on ACMD-7403 Bottom Metal Pattern

2.80

Stencil Opening ID

I/O pad areas

All other openings

Notes:

Qty

Width (mm) Length (mm)

0.35

0.50

0.35

0.50

1. Chamfer or radius all corners 0.05 mm min

2. Stencil openings aligned to Boundary rectangle or center lines

3. Non-I/O pad stencil openings aligned to 0.52 x 0.55 grid

(i.e., spacing between openings: 0.2 vertical, 0.5 horizontal)

Figure 23. Recommended Solder Stencil

Figure 25. SMD Tape Packing

ꢇ

Figure 26. Unit Orientation in Tape

Figure 27. Reel Drawing, Front View

Figure 28. Reel Drawing, Back View

300

250

200

150

100

Package Moisture Sensitivity

Feature

Test Method

Performance

Moisture Sensitivity Level

(MSL) at 260°C

JESD22-A113D Level 3

Tested profile shown.

100

150

200

250

300

Time, seconds

Figure 29. Veriﬁed SMT Solder Proﬁle

Ordering Information

Part Number

No. of Devices

Container

ACMD-7403-BLK

ACMD-7403-TR1

Anti-static Bag

7-inch Reel

1000

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.

AV0ꢀ-0ꢄꢀꢅEN - April 10, ꢀ00ꢆ

ACMD-7403-BLK [BOARDCOM]

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