ACMD-7403-TR1 [BOARDCOM]
Miniature UMTS Band II / PCS Duplexer;型号: | ACMD-7403-TR1 |
厂家: | Broadcom Corporation. |
描述: | Miniature UMTS Band II / PCS Duplexer PCS 过程控制系统 |
文件: | 总11页 (文件大小:1279K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ACMD-7403
Miniature UMTS Band II / PCS Duplexer
Data Sheet
Description
Features
The Avago Technologies’ ACMD-7403 is a miniature • Miniature Size
duplexer designed for use in UMTS Band II and PCS
(Blocks A–F) handsets.
• 3.0 x 3.0 mm Max footprint
• 1.2 mm Max height
• High Power Rating
The ACMD-7403 enhances the sensitivity and dynamic
range of handset receivers by providing more than 54 dB
attenuation of the transmitted signal at the receiver input
and more than 44 dB rejection of transmit-generated
noise in the receive band.
• 33 dBm Abs Max Tx Power
• Lead-Free Construction
Maximum Insertion Loss in the Tx channel is only 2.7 dB,
which minimizes current drain from the power amplifier.
Insertion Loss in the Rx channel is a maximum of 3.2 dB,
thus improving receiver sensitivity.
Specifications
• Rx Band Performance, 1930.5-1989.5 MHz, – 30 to +85°C
• Rx Noise Blocking: 44 dB min
• Insertion Loss: 3.2 dB max
The ACMD-7403 is designed with Avago Technologies’
Film Bulk Acoustic Resonator (FBAR) technology, which
makes possible ultra-small, high-Q filters at a fraction
of their usual size. The excellent power handling capa-
bility of the FBAR bulk-mode resonators supports the
high output power levels needed in PCS handsets while
adding virtually no distortion.
• Tx Band Performance, 1850.5-1909.5 MHz, – 30 to +85°C
• Tx Interferer Blocking: 52 dB min
• Insertion Loss: 2.7 dB max
Applications
The ACMD-7403 also utilizes Avago Technologies’ innova-
tive Microcap bonded-wafer, chip scale packaging tech-
nology. This process allows the filters to be assembled in
a molded chip-on-board module that is less than 1.2 mm
high with a footprint of only 3.0 mm x 3.0 mm.
Handsets or data terminals operating in the PCS (A–F)
frequency band.
Functional Block Diagram
[2,3]
[1]
ACMD-7403 Electrical Specifications , Z =50 Ω, T as indicated,
0
C
– 30°C
Typ Max Min
+25°C
Typ Max Min
+85°C
Typ Max
Symbol Parameter
Antenna Port to Receive Port
Units
Min
S23
Insertion Loss in Receive Band
1930.5 – 1931.5 MHz
1931.5 – 1989.5 MHz
dB
3.2
3.0
1.9
1.3
3.1
3.0
3.0
3.2
∆S23
S22
Ripple (p-p) in Receive Band
dB
dB
1.7
15
Return Loss of Receive Port
in Receive Band
9.5
52
9.5
52
9.5
52
S23
Attenuation in Transmit Band
(1850.5 – 1909.5 MHz)
dB
59
S23
S23
Attenuation 0 – 1600 MHz
dB
dB
20
14
29
18
Attenuation in Receive 2nd Harmonic
Band (3861 – 3979 MHz)
Transmit Port to Antenna Port
S31
Insertion Loss in Transmit Band
1850.5 – 1908.5 MHz
1908.5 – 1909.5 MHz
dB
2.5
2.5
1.0
1.4
2.1
2.3
2.5
2.7
∆S31
S11
Ripple (p-p) in Transmit Band
dB
dB
1.3
20
Return Loss of Transmit Port
in Transmit Band
9.5
40
9.5
40
9.5
40
S31
Attenuation in Receive Band
(1930.5 – 1989.5 MHz)
dB
49
S31
S31
Attenuation 0 – 1600 MHz
dB
dB
22
23
32
27
Attenuation in GPS Rx Band
(1574.42 – 1576.42 MHz)
S31
Attenuation in Transmit 2nd Harmonic
Band (3701 – 3819 MHz)
dB
5
9
Antenna Port
S33
S33
Return Loss of Antenna Port in Receive
Band (1930.5 – 1989.5 MHz)
dB
dB
9
9
9
9
16
17
9
9
Return Loss of Antenna Port in Transmit
Band (1850.5 – 1909.5 MHz)
Isolation Transmit Port to Receive Port
S21
S21
Tx-Rx Isolation in Receive Band
(1930.5 – 1989.5 MHz)
dB
dB
44
54
44
54
51
61
44
54
Tx-Rx Isolation in Transmit Band
(1850.5 – 1909.5 MHz)
Notes:
T
is the case temperature and is defined as the temperature of the underside of the Duplexer where it makes contact with the circuit board.
C
Min/Max specifications are guaranteed at the indicated temperature with the input power to the Tx ports equal to or less than +29 dBm over all Tx
frequencies unless otherwise noted. Typical data is the average value of the parameter over the indicated band at the specified temperature. Typical
values may vary over time.
ꢀ
ACMD-7403
[1]
Absolute Maximum Ratings
Characterization
A test circuit similar to the one shown in Figure 1 was
used to measure typical device performance. This circuit
is designed to interface with Air Coplanar (ACP), Ground-
Signal-Ground (GSG) RF probes of the type commonly
used to test semiconductor wafers.The PCB test circuit
uses multiple vias to create a well-grounded pad to
which the device under test (DUT) is solder-attached.
Short lengths of 50-ohm microstripline connect the DUT
to ACP probe patterns on the board.
Parameter
Unit Value
Storage temperature
°C
–65 to +125
Maximum RF Input Power to Tx Port
dBm +33
[2]
Maximum Recommended Operating Conditions
Parameter
Unit Value
[3]
[3]
Operating temperature, Tc
Tx Power ≤ 29 dBm
,
,
°C
–40 to +100
Operating temperature, Tc
Tx Power ≤ 30 dBm
°C
–40 to +85
A test circuit with ACMD-7403 mounted in place is shown
in Figure 2. S-parameters are then measured using a
network analyzer and calibrated ACP probe set.
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. The device will function over the recommended range without
degradation in reliability or permanent change in performance, but
is not guaranteed to meet electrical specifications.
Phase data for s-parameters measured with ACP probe
circuits are adjusted to place the reference plane at the
edge of the duplexer.
3.
T is defined as case temperature, the temperature of the underside
of the duplexer where it makes contact with the circuit board.
C
Figure 2. Test Circuit with Duplexer.
Figure 1. ACP Probe Test Circuit.
ꢁ
ACMD-7403 Typical Performance at T = 25°C
c
0.0
-1.0
-2.0
-3.0
0.0
-1.0
-2.0
-3.0
1930
1940
1950
1960
1970
1980
1990
1850
1860
1870
1880
1890
1900
1910
Frequency (MHz)
Frequency (MHz)
Figure 3. Tx–Ant Insertion Loss
Figure 4. Ant–Rx Insertion Loss
0
0
-5
-10
-20
-30
-40
-50
-60
-10
-15
-20
-25
1750 1800 1850 1900 1950 2000 2050 2100
1750
1800
1850
1900
1950
2000
2050
2100
Frequency (MHz)
Frequency (MHz)
Figure 6. Tx Rejection in Rx Band and Rx Rejection in Tx Band
Figure 5. Tx and Rx Port Return Loss
0
-5
-35
-40
-45
-50
-55
-60
-65
-70
-75
-80
-10
-15
-20
-25
1750 1800 1850 1900 1950 2000 2050 2100
1750 1800
1850 1900 1950 2000
Frequency (MHz)
2050 2100
Frequency (MHz)
Figure 8. Antenna Port Return Loss
Figure 7. Tx–Rx Isolation
ꢂ
ACMD-7403 Typical Performance at T = 25°C
c
0
-5
0
-10
-20
-30
-40
-50
-60
-10
-15
-20
0.0
1.0
2.0
3.0
4.0
5.0
6.0
3700
3720
3740
3760
3780
3800
3820
Frequency (GHz)
Frequency (MHz)
Figure 9. Tx–Ant and Ant–Rx Wideband Insertion Loss
Figure 10. Tx–Ant Rejection at Tx Second Harmonic
0
-10
-20
-30
-40
-50
-60
0
-10
-20
-30
-40
-50
-60
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
Frequency (GHz)
Frequency (GHz)
Figure 11. Tx–Ant Low Frequency Rejection
Figure 12. Ant–Rx Low Frequency Rejection
ꢃ
1
1
0.8
0.8
1.5
1.5
0.6
0.6
2
2
0.4
0.4
3
3
4
4
5
5
10
20
10
20
50
50
0.2
0.4
0.6
0.8
1
1.5
2
3
4
5
10 20 50
0.2
0.4
0.6
0.8
1
1.5
2
3
4
5
10 20 50
-50
-20
-50
-20
-10
-10
-5
-4
-5
-4
-3
-3
-0.4
-0.4
-2
-2
-0.6
-0.6
-1.5
-1.5
-0.8
-0.8
-1
-1
Figure 14. Rx Port Impedance in Rx Band
Figure 13. Tx Port Impedance in Tx Band
1
1
0.8
0.8
1.5
1.5
0.6
0.6
2
2
0.4
0.4
3
3
4
5
4
5
10
20
10
20
50
50
0.2
0.4
0.6
0.8
1
1.5
2
3
4
5
10 20 50
0.2
0.4
0.6
0.8
1
1.5
2
3
4
5
10 20 50
-50
-20
-50
-20
-10
-10
-5
-4
-5
-4
-3
-3
-0.4
-0.4
-2
-2
-0.6
-0.6
-1.5
-1.5
-0.8
-0.8
-1
-1
Figure 15. Ant Port Impedance in Tx Band
Figure 16. Ant Port Impedance in Rx Band
ꢄ
2.80
3.0
MAX
1.2
MAX
1.40
0.33
ANT
+
0.25
PRODUCT
MARKING
SIGNAL VIA
(2 PLS)
3.0
MAX
0.35
0.35
TX
RX
PACKAGE
ORIENTATION
2.45
0.43
TOP VIEW
SIDE VIEW
BOTTOM VIEW
Notes:
0.25
0.30
1. Dimensions in millimeters
Tolerance: X.X ± 0.1 mm
X.XX ± 0.05 mm
0.075
0.25
Angles 45°, unless otherwise noted
2. Dimensions nominal unless otherwise noted
3. I/O Pads (3 ea)
Size: 0.35 X 0.35 mm
Spacing to ground metal: 0.30 mm
4. Signal Vias (2 ea), Ø 0.25; covered with 0.40 Ø solder mask.
Shown for reference only. PCB metal under
signal via does not need to be voided.
0.05
0.30
0.05
5. Contact areas are gold plated
0.075
DETAIL OF IO PAD AREA
Figure 17. Package Outline Drawing
PACKAGE
ORIENTATION
-
H = ACMD 7403
FB = Avago ID
Y = Year
RX
TX
WW = Work Week
DC = Date Code
NNNN = Lot Number
ANT
Figure 18. Product Marking
ꢅ
Ø 0.30 VIA ARRAY
HORIZ PITC H = 0.40
VERT PITC H = 0.40
0.25
0.30
Ant
0.25 0.30
2.28
G
0.35
Tx
Rx
G
0.35
2.10
Figure 20. ACMD-7403 Superposed on PCB Layout
Notes:
1. Dimensions in mm
2. Transmission line Gap (G) adjusted for Zo = 50 ohms
3. I/O Pads (3 ea) 0.35 X 0.35, corner chamfer 0.03
4. Ground vias positioned to maximize port-to-port isolation
5. Preferred Tx connection on buried metal layer
Figure 19. PCB Layout
> 0.30
TYP
0.45
0.45
2.90
0.20
0.20
2.90
Figure 22. ACMD-7403 Superposed on Solder Mask
> 0.30
TYP
Figure 21. Recommended Solder Mask
A PCB layout using the principles illustrated in Figure 19
is recommended to optimize performance of the ACMD-
7403.
The latter is especially useful, not only to maintain Tx-Rx
isolation of the duplexer, but also to prevent leakage of
the Tx signal into other components that could result in
the creation of intermodulation products and degrada-
tion of overall system performance.
It is particularly important to maximize isolation between
the Tx connection to the duplexer and the Rx port. High
isolation is achieved by: (1) maintaining a continuous
ground plane around the duplexer mounting area, (2)
surrounding the I/O ports with sufficient ground vias to
enclose the connections in a “Faraday cage”, and (3) pref-
erably routing the Tx trace in a different metal layer than
the Rx.
A sufficient number of vias should be used to ensure
excellent RF grounding as well as good heat sinking for
the device.
Note:
The two signal vias shown in Fig 17 are covered with solder mask and it
is not necessary to void the ground plane under them.
ꢆ
STENCIL
BOUNDARY
0.20
0.10
0.10
2.80
Figure 24. Solder Stencil Overlaid on ACMD-7403 Bottom Metal Pattern
2.80
Stencil Opening ID
I/O pad areas
All other openings
Notes:
Qty
3
Width (mm) Length (mm)
0.35
0.50
0.35
0.50
9
1. Chamfer or radius all corners 0.05 mm min
2. Stencil openings aligned to Boundary rectangle or center lines
3. Non-I/O pad stencil openings aligned to 0.52 x 0.55 grid
(i.e., spacing between openings: 0.2 vertical, 0.5 horizontal)
Figure 23. Recommended Solder Stencil
Figure 25. SMD Tape Packing
ꢇ
Figure 26. Unit Orientation in Tape
Figure 27. Reel Drawing, Front View
10
Figure 28. Reel Drawing, Back View
300
250
200
150
100
50
Package Moisture Sensitivity
Feature
Test Method
Performance
Moisture Sensitivity Level
(MSL) at 260°C
JESD22-A113D Level 3
Tested profile shown.
0
0
50
100
150
200
250
300
Time, seconds
Figure 29. Verified SMT Solder Profile
Ordering Information
Part Number
No. of Devices
Container
ACMD-7403-BLK
ACMD-7403-TR1
25
Anti-static Bag
7-inch Reel
1000
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © ꢀ00ꢃ-ꢀ00ꢆ Avago Technologies Limited. All rights reserved.
AV0ꢀ-0ꢄꢀꢅEN - April 10, ꢀ00ꢆ
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