ACMD-7612 [BOARDCOM]
Miniature UMTS Band I Duplexer;型号: | ACMD-7612 |
厂家: | Broadcom Corporation. |
描述: | Miniature UMTS Band I Duplexer |
文件: | 总12页 (文件大小:748K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ACMD-7612
Miniature UMTS Band I Duplexer
Data Sheet
Description
Features
• Miniature size
- 2.5 x 3.0 mm max footprint
- 1.2 mm max height
The Avago ACMD-7612 is a miniature duplexer designed
for use in UMTS Band I handsets.
Maximum Insertion Loss in the Tx channel is only 1.5 dB,
which minimizes current drain from the power amplifier.
Insertion Loss in the Rx channel is a maximum of 2.0 dB,
improving receiver sensitivity.
• High power rating
- +33 dBm Abs Max Tx Power
• Lead-free construction
The ACMD-7612 enhances the sensitivity and dynamic
range of WCDMA receivers by providing more than
53 dB attenuation of the transmitted signal at the
receiver input and more than 43 dB rejection of trans-
mit-generated noise in the receive band.
Specifications
• Performance guaranteed –30 to +85°C
• Rx band performance (2110 – 2170 mHz)
- Insertion loss: 2.0 dB max
- Noise blocking: 43 dB min
The ACMD-7612 is designed with Avago Technologies’
Film Bulk Acoustic Resonator (FBAR) technology, which
makes possible ultra-small, high-Q filters at a fraction of
their usual size. The excellent power handling capabil-
ity of the FBAR bulk-mode resonators supports the high
output power levels needed in handsets while adding
virtually no distortion.
• Tx band performance (1920 – 1980 mHz)
- Insertion loss: 1.5 dB max
- Interferer blocking: 53 dB min
Applications
• Handsets or data terminals operating in the UMTS
Band I frequency range
The ACMD-7612 also utilizes Avago Technologies’ in-
novative Microcap bonded-wafer, chip scale packaging
technology. This process allows the filters to be assem-
bled in a molded chip-on-board module that is less than
1.2 mm high with a maximum footprint of only 2.5 mm
x 3.0mm.
Functional Block Diagram
ANT
PORT 3
Tx
PORT 1
Rx
PORT 2
[1]
ACMD-7612 Specifications, Z = 50 Ω, T as Indicated
0
C
[2]
–30 to +85°C
[3]
Symbol
Parameter
Antenna Port to Receive Port
Units
Min
Typ
Max
S23
Insertion Loss in Receive Band (2110 – 2170 MHz)
Ripple (p-p) in Receive Band
dB
dB
dB
dB
dB
dB
dB
1.1
0.6
–
2.0
1.0
0.5
∆S23
∆S23
S22
Ripple (p-p) in Any 5 MHz Channel within Receive Band
Return Loss of Receive Port in Receive Band
Attenuation 0 – 1900 mHz
10
30
53
40
16
50
61
54
S23
S23
Attenuation in Transmit Band (1920 – 1980 mHz)
Attenuation in Bluetooth Band (2400 – 2500 mHz)
Transmit Port to Antenna Port
S23
S31
S31
∆S31
∆S31
S11
S31
S31
S31
S31
S31
Insertion Loss in Transmit Band (1920 – 1980 mHz) -30° to +25°C
Insertion Loss in Transmit Band (1920 – 1980 mHz) +25° to +85°C
Ripple (p-p) in Transmit Band
dB
dB
dB
dB
dB
dB
dB
dB
dB
dB
1.1
1.1
0.4
–
1.5
1.6
1.0
0.5
Ripple (p-p) in Any 5 mHz Channel within Transmit Band
Return Loss of Transmit Port in Transmit Band
Attenuation 0 – 1800 mHz
10
30
41
25
25
15
20
44
52
31
36
17
Attenuation in Receive Band (2110 – 2170 mHz)
Attenuation in Bluetooth Band (2400 – 2500 mHz)
Attenuation in Transmit 2nd Harmonic Band (3840 – 3960 mHz)
Attenuation in Transmit 3rd Harmonic Band (5760 – 5940 mHz)
Antenna Port
S33
Return Loss of Antenna Port in Transmit and Receive Bands
Isolation Transmit Port to Receive Port
dB
10
17
S21
S21
Tx-Rx Isolation in Transmit Band (1920 – 1980 mHz)
Tx-Rx Isolation in Receive Band (2110 – 2170 mHz)
dB
dB
53
43
62
52
Notes:
1. T is the case temperature and is defined as the temperature of the underside of the duplexer where it makes contact with the circuit board.
C
2. Specifications guaranteed over the given temperature range (unless otherwise noted) with the input power to the Tx port equal to or less than
+29 dBm over all Tx frequencies.
3. Typical data is the arithmetic mean value of the parameter over its indicated frequency range at the specified temperature. Typical values may
vary from part to part and over time.
2
[1]
Absolute Maximum Ratings
Parameter
Unit
°C
Value
Storage Temperature
-65 to +125
+33
Maximum RF Input Power to Tx Port
dBm
[2]
Maximum Recommended Operating Conditions
Parameter
Unit
°C
Value
[3]
Operating Temperature, T
, Tx Power ≤ 29 dBm
-40 to +100
-40 to +85
C
[3]
Operating Temperature, T
, Tx Power ≤ 30 dBm
°C
C
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. The device will function over the recommended range without degradation in reliability or permanent change in performance, but is not
guaranteed to meet electrical specifications.
3. T is defined as case temperature, the temperature of the underside of the duplexer where it makes contact with the circuit board.
C
ACMD-7612 Typical Performance at T = 25°C
C
0
0
-0.5
-1.0
-1.5
-2.0
-2.5
-0.5
-1.0
-1.5
-2.0
-2.5
1920
1930
1940
1950
1960
1970
1980
2110
2120
2130
2140
2150
2160
2170
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 1. Tx band insertion loss
Figure 2. Rx band insertion loss
0
0
-10
-5
Tx
Rx
-20
-30
-40
-50
-60
-10
Tx
Rx
-15
-20
-25
1800
1900
2000
2100
2200
2300
1800
1900
2000
2100
2200
2300
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 4. Tx rejection in Rx band and Rx rejection in Tx band
Figure 3. Tx and Rx port return loss
3
-40
-50
-60
-70
-80
0
-5
-10
-15
-20
-25
1800
1900
2000
2100
2200
2300
1800
1900
2000
2100
2200
2300
FREQUENCY (MHz)
FREQUENCY (MHz)
Figure 6. Antenna port return loss
Figure 5. Tx to Rx isolation
-20
-30
-40
-50
-60
0
-10
-20
-30
-40
3.80
3.85
3.90
3.95
4.00
5.7
5.8
5.8
5.9
5.9
6.0
6.0
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 7. Tx second harmonic rejection
Figure 8. Tx third harmonic rejection
-20
-30
-40
-50
-40
-50
-60
-70
2.40
2.42
2.44
2.46
2.48
2.50
2.40
2.42
2.44
2.46
2.48
2.50
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 10. Rx rejection in bluetooth band (2400 – 2500 mHz)
Figure 9. Tx rejection in bluetooth band (2400 – 2500 mHz)
4
-20
-30
-40
-50
-60
-70
-80
-20
-30
-40
-50
-60
-70
-80
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 12. Rx low frequency rejection
Figure 11. Tx low frequency rejection
0
-10
Tx
-20
Rx
-30
Rx
-40
Tx
-50
-60
0
1
2
3
4
5
6
FREQUENCY (MHz)
Figure 13. Tx and Rx wideband response
5
1.0
1.0
0.8
0.8
1.5
1.5
0.6
0.6
2
2
0.4
0.4
3
3
4
4
5
5
10
20
10
20
50
-50
50
-50
0.2
0.4
0.6 0.8
1.0
1.5
2
3
4
5
10 20 50
0.2
0.4
0.6 0.8
1.0
1.5
2
3
4
5
10 20 50
-20
-20
-10
-10
-5
-4
-5
-4
-3
-3
-0.4
-0.4
-2
-2
-0.6
-0.6
-1.5
-1.5
-0.8
-0.8
-1.0
-1.0
Figure 14. Tx impedance (S11) in Tx band
Figure 15. Rx impedance (S22) in Rx band
1.0
0.8
1.0
0.8
1.5
1.5
0.6
0.6
2
2
0.4
0.4
3
3
4
5
4
5
10
20
10
20
50
-50
50
-50
0.2
0.4
0.6 0.8
1.0
1.5
2
3
4
5
10 20 50
0.2
0.4
0.6 0.8
1.0
1.5
2
3
4
5
10 20 50
-20
-20
-10
-10
-5
-4
-5
-4
-3
-3
-0.4
-0.4
-2
-2
-0.6
-0.6
-1.5
-1.5
-0.8
-0.8
-1.0
-1.0
Figure 16. Ant impedance (S33) in Tx band
Figure 17. Ant impedance (S33) in Rx band
6
0.34
0.53
0.34
ANT
0.53
0.34
0.20
0.20
PRODUCT
MARKING
0.34
0.53
Tx
Rx
1.2
MAX
3.0
MAX
0.53
0.34 0.34
2.27
0.53
PACKAGE
ORIENTATION
2.80
Notes:
1. Dimensions in millimeters
2. Dimensions nominal unless otherwise noted
3. All chamfers 45°
4. I/O pads (3 ea)
Size: 0.53 x 0.53, corner chamfers: 0.03 x 0.03
Spacing to ground plane: 0.34
Inside ground plane chamfer: 0.20 x 0.20
5. Tolerance:
X.X = ± 0.1
X.XX = ±0.05
6. Contact areas are gold plated
Figure 18. Package drawing
PACKAGE
ORIENTATION
P = ACMD-7612
FB = Avago ID
Y = Year
RX
TX
P
WW = Work Week
DC = Date Code
NNNN = Lot Number
ANT
Figure 19. Package marking
7
Ø 0.20 VIA ARRAY
HORIZ PITCH = 0.33
VERT PITCH = 0.38
0.10
Ant
Ø 0.20 VIA ARRAY
HORIZ PITCH = 0.38
0.10
1.78
W
Tx
R x
G
Ø 0.20 VIA ARRAY
HORIZ PITCH = 0.38
VERT PITCH = 0.33
Ø 0.20 VIA ARRAY
HORIZ PITCH = 0.33
VERT PITCH = 0.38
2.27
Notes:
1. Dimensions in mm.
2. Transmission line Gap (G) and Width (W) adjusted for Zo = 50 ohms.
3. I/O Pads (3 ea) 0.53 x 0.53, corner chamfer 0.30.
4. I/O Pad to Ground plane gap = 0.34, corner chamfer 0.30.
5. Ground vias positioned to maximize port-to-port isolation.
Figure 20. PCB layout
A PCB layout implementing design principles similar to
those illustrated in Figure 16 is recommended to optimize
performance of the ACMD-7612.
It is particularly important to maximize isolation between
the Tx connection to the duplexer and the Rx port. High
isolation is achieved by (1) maintaining a continuous
ground plane around the duplexer mounting area,
(2) surrounding the I/O ports with sufficient ground
vias to enclose the connections in a “Faraday cage”, and
(3) preferably routing the Tx trace in a different metal
layer than the Rx.
The latter is especially useful, not only to maintain Tx-
Rx isolation of the duplexer, but also to prevent leakage
of the Tx signal into other components that could
result in the creation of intermodulation products and
degradation of overall system performance.
Figure 21. ACMD-7612 superposed on PCB layout
8
0.63
> 0.30 TYP.
0.63
0.24
2.40
0.24
2.90
> 0.30 TYP.
Note:
Dimensions in mm.
Figure 23. ACMD-7612 superposed on solder mask
Figure 22. Recommended solder mask
STENCIL
BOUNDARY
0.15
0.15
A
B
B
2.30
C
A
A
2.80
Figure 25. Solder stencil overlaid on ACMD-7612 bottom metal pattern
STENCIL OPENING ID QTY
WIDTH (mm)
0.43
LENGTH (mm)
A (I/O pad areas)
3
2
1
0.43
1.24
1.24
B
C
0.50
0.77
Notes:
1. Chamfer or radius all corners 0.05 mm min.
2. Stencil openings aligned to Boundary rectangle or center lines.
Figure 24. Recommended solder stencil
9
4.00 ± 0.10
(SEE NOTE #2)
2.00 ± 0.05
∅ 1.55 ± 0.05
1.75 ± 0.10
R0.60 TYP.
5.50 ± 0.05
12.00 ± 0.10
Bo
Ko
SECTION B – B
∅ 1.50 (MIN.)
8.00 ± 0.10
5° (MAX.)
Ao
0.30 ± 0.05
SECTION A – A
NOTES:
Ao
Bo
Ko
= 2.80
= 3.30
= 1.50
1. Ao and Bo measured at 0.3 mm above base of pocket.
2. 10 pitches cumulative tolerance ± 0.2 mm.
3. ( ) Reference dimensions only.
Pitch = 8.00
Width = 12.00
Figure 26. SMD tape packing
SPROCKET HOLES
PACKAGE PIN 1
ORIENTATION
TAPE
WIDTH
POCKET
CAVITY
Figure 27. Unit orientation in tape
10
Figure 28. Reel drawing, back view
Reel Component
Resistivity
Reel (coated with proprietary antistatic agent)
Carrier Tape (carbon polystyrene)
10^9 to 10^11 Ohm/Sq
10^9 Ohm/Sq
Cover Tape
10^9 to 10^11 Ohm/Sq
Top Layer – transparent PET film
Bonding Layer – adhesive Polyolefin
Sealing Layer – peelable, special film
Notes:
1. Reel shall be labeled with the following
information (as a minimum):
a. Manufactures name or symbol
b. Avago Technologies part number
c. Purchase order number
d. Date code
e. Quantity of units
2. A certificate of compliance © of C) shall
be issued and accompany each shipment
of product.
3. Reel must not be made with or contain
ozone depleting materials.
4. All dimensions in millimeters (mm).
Figure 29. Reel drawing, front view
Package Moisture Sensitivity
Feature
Test Method
J-STD-020C
Performance
Moisture Sensitivity
Level (MSL) at 260°C
Level 3
300
250
200
150
100
50
Tested profile shown.
0
0
50
100
150
200
250
300
TIME (SECONDS)
Figure 30. Verified SMT solder profile
ACMD-7612 Ordering Information
Part Number
No. of Devices
25
Container
ACMD-7612-BLK
ACMD-7612-TR1
Anti-static Bag
1000
178 mm
(7-inch) Reel
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved.
AV02-0473EN - September 25, 2007
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