AEMD-LL3K-XZ002 [BOARDCOM]

High Brightness Red and Amber SMT Oval Lamps;


型号：	AEMD-LL3K-XZ002
厂家：	Broadcom Corporation.
描述：	High Brightness Red and Amber SMT Oval Lamps
文件：	总12页 (文件大小：996K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Data Sheet

AEMD-LG3K, AEMD-LL3K

High Brightness Red and Amber SMT Oval Lamps

Description

Features

The new Broadcom series is essentially like a conventional

high brightness though hole LED in the form of a surface

mount device. It can be assembled using common SMT

assembly processes and is compatible with the industrial

reflow soldering process.



High brightness AlInGaP

Available in Red and Amber

Typical viewing angle: 95° × 45°

Tinted and diffused appearance

Surface mountable

Compatible with industrial reflow soldering process

MSL 3

The LEDs are made with an advanced optical grade epoxy

for superior performance in outdoor sign applications. For

easy pick-and-place assembly, the LEDs are shipped in

tape and reel. Every reel is shipped from a single intensity

and color bin for better uniformity.

Applications



Gas price signs

Monocolor signs

Full color signs

CAUTION! This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to

application note AN-1142 for additional details.

CAUTION! Keep the LED in a moisture barrier bag is < 5% RH when not in use because prolonged exposure to the

environment might cause the leads to tarnish or rust, which might cause difficulties in soldering.

Broadcom

AEMD-LX3K-DS101

March 29, 2018

AEMD-LG3K, AEMD-LL3K Data Sheet

High Brightness Red and Amber SMT Oval Lamps

Figure 1: Package Drawing

Lead Configuration

Pin 1

Pin 2

Pin 3

Anode

Cathode

Anode

NOTE:

1. All dimensions in millimeters (mm).

2. Tolerance is ±0.50 mm unless otherwise specified.

Device Selection Guide

T = 25°C, I = 20 mA.

Luminous Intensity, I_V(mcd)^{a, b}

Dominant Wavelength, _d(nm)^c

Part Number

Color

Min.

Max.

Min.

Max.

AEMD-LG3K-XZ002

AEMD-LG3K-XY002

AEMD-LL3K-XZ002

AEMD-LL3K-XYK02

AEMD-LL3K-XYL02

Red

1660

2900

2400

2900

2400

618.0

584.5

587.0

589.5

630.0

594.5

592.0

594.5

Amber

a. The luminous intensity, I_Vis measured at the mechanical axis of the package and it is tested with a single current pulse condition. The actual

peak of the spatial radiation pattern may not be aligned with the axis.

b. Tolerance is ±15%.

c. The dominant wavelength, _dis derived from the CIE Chromaticity Diagram and represents the perceived color of the device.

Broadcom

AEMD-LX3K-DS101

AEMD-LG3K, AEMD-LL3K Data Sheet

High Brightness Red and Amber SMT Oval Lamps

Absolute Maximum Ratings

Parameters

Red/Amber

Units

DC Forward Current^a

Peak Forward Current^b

100

120

Power Dissipation

Reverse Voltage

Not recommended for reverse bias

LED Junction Temperature

Operating Temperature Range

Storage Temperature Range

a. Derate linearly as shown in Figure 9.

b. Duty factor = 10%, frequency = 1 kHz.

110

°C

–40 to +85

–40 to +100

°C

Optical and Electrical Characteristics

T = 25°C.

Parameters

Min.

Typ.

Max.

Units

Test Condition

I_F= 20 mA

—

95 × 45

—

Viewing Angle, 2θ

I_F= 20 mA

Dominant Wavelength, _d

618.0

584.5

621.0

590.0

630.0

594.5

Red

Amber

Peak Wavelength, _p

I_F= 20 mA

—

630

594

—

Red

Amber

Forward Voltage, V_F

1.8

2.1

2.4

Red

Amber

I_R= 100 µA

Reverse Voltage, V_R

—

Red

Amber

°C/W

LED junction to pin

Thermal Resistance, Rθ_J-P

—

270

—

Red

Amber

a. θ is the off-axis angle where the luminous intensity is ½ the peak intensity.

b. The dominant wavelength, _dis derived from the CIE Chromaticity Diagram and represents the perceived color of the device.

c. Forward voltage tolerance is ±0.1V.

d. Indicates product final test condition. Long-term reverse bias is not recommended.

e. Thermal resistance from LED junction to pin.

Broadcom

AEMD-LX3K-DS101

AEMD-LG3K, AEMD-LL3K Data Sheet

High Brightness Red and Amber SMT Oval Lamps

Part Numbering System

x₁

x₂

x₃

x₄

x₅

x₆

x₇

x₈

Code

x₁

Description

Package Type

Color

Option

Oval AlInGaP

x₂

Red

Amber

95° × 45°

x₃

x₄

x₅

x₆

Viewing Angle

Minimum Intensity Bin

Maximum Intensity Bin

Color Bin Option

Refer to Intensity Bin Limits (CAT) table

Full distribution

Color bins 2 and 4

Color bins 4 and 6

Tested at 20 mA

x₇x₈

Packaging Option

Part Number Example

AEMD-LL3K-XYK02

x : L

–

Oval AlInGaP

Amber color

x : L

x : 3

95° × 45° viewing angle

Minimum intensity bin X

Maximum intensity binY

Color bins 2 and 4

x : X

x : Y

x : K

x x : 02

Tested at 20 mA

Broadcom

AEMD-LX3K-DS101

AEMD-LG3K, AEMD-LL3K Data Sheet

High Brightness Red and Amber SMT Oval Lamps

Bin Information

Intensity Bin Limits (CAT)

Forward Voltage Bin Limits (VF)

Luminous Intensity, Iv (mcd)

Forward Voltage, V_F(V)

Bin ID

Min.

Max.

Bin ID

Min.

Max.

1660

1990

2400

1990

2400

2900

1.8

2.0

2.2

2.0

2.2

2.4

Tolerance = ±15%

Tolerance = ±0.1V

Color Bin Limits (BIN)

Dominant Wavelength, _d(nm)

Bin ID

Min.

Max.

Red

—

618.0

630.0

Amber

584.5

587.0

589.5

592.0

587.0

589.5

592.0

594.5

Tolerance = ±1.0 nm

Example of bin information on reel and packaging label:

CAT : Y

BIN : 2

VF: VA

–

Intensity bin Y

Color bin 2

Forward voltage bin VA

Broadcom

AEMD-LX3K-DS101

AEMD-LG3K, AEMD-LL3K Data Sheet

High Brightness Red and Amber SMT Oval Lamps

Figure 2: Spectral Power Distribution

Figure 3: Forward Current vs. Forward Voltage

Figure 4: Relative Luminous Intensity vs. Mono Pulse Current

Figure 5: Dominant Wavelength Shift vs. Mono Pulse Current

Figure 6: Relative Light Output vs. Junction Temperature

Figure 7: Forward Voltage Shift vs. Junction Temperature

Broadcom

AEMD-LX3K-DS101

AEMD-LG3K, AEMD-LL3K Data Sheet

High Brightness Red and Amber SMT Oval Lamps

Figure 8: Radiation Pattern

Figure 9: Maximum Forward Current vs. Ambient

Temperature. Derated based on T_JMAX= 110°C

Figure 10: Recommended Soldering Land Pattern

NOTE: All dimensions are in millimeters (mm).

Broadcom

AEMD-LX3K-DS101

AEMD-LG3K, AEMD-LL3K Data Sheet

High Brightness Red and Amber SMT Oval Lamps

Figure 11: Carrier Tape Dimensions

NOTE:

1. All dimensions in millimeters (mm).

2. Tolerance is ±0.10 mm unless otherwise specified.

Figure 12: Reel Dimensions

NOTE: All dimensions are in millimeters (mm).

Broadcom

AEMD-LX3K-DS101

AEMD-LG3K, AEMD-LL3K Data Sheet

High Brightness Red and Amber SMT Oval Lamps

Precautionary Notes

Figure 14: Recommended Nozzle Dimension

PICK AND PLACE NOZZLE

Soldering



Do not perform reflow soldering more than twice.

Observe necessary precautions of handling moisture-

sensitive devices as stated in the following section.



Do not apply any pressure or force on the LED during

reflow and after reflow when the LED is still hot.

>3.90

Use reflow soldering to solder the LED. Use hand

soldering only for rework if unavoidable, but it must be

strictly controlled to following conditions:

LED FLANGE

– Soldering iron tip temperature = 315°C max.

– Soldering duration = 3s max.

– Number of cycles = 1 only

– Power of soldering iron = 50W max.

> 3.90



Do not touch the LED package body with the soldering

iron except for the soldering terminals, as it may cause

damage to the LED.

4.96

NOTE:

Confirm beforehand whether the functionality and

performance of the LED is affected by soldering with

hand soldering.

1. The nozzle tip must touch the LED flange

during pick and place.

2. The outer dimensions of the nozzle tip must be

able to fit into the carrier tape pocket until it

touches the LED flange.

Figure 13: Recommended Lead-Free Reflow Soldering Profile

10 to 30 SEC.

3. All dimensions are in millimeters (mm).

255 – 260°C

3°C/SEC. MAX.

217°C

200°C

Handling of Moisture-Sensitive Devices

6°C/SEC. MAX.

This product has a Moisture Sensitive Level 3 rating per

JEDEC J-STD-020. Refer to Broadcom Application Note

AN5305, Handling of Moisture Sensitive Surface Mount

Devices, for additional details and a review of proper

handling procedures.

150°C

3°C/SEC. MAX.

60 – 120 SEC.

100 SEC. MAX.

TIME



Before use:

– An unopened moisture barrier bag (MBB) can be

stored at < 40°C/90% RH for 12 months. If the actual

shelf life has exceeded 12 months and the humidity

indicator card (HIC) indicates that baking is not

required, it is safe to reflow the LEDs per the original

MSL rating.

Handling Precautions

For automated pick-and-place, Broadcom has tested the

following nozzle size to work well with this LED. However,

due to the possibility of variations in other parameters, such

as pick-and-place machine maker/model, and other settings

of the machine, verify that the selected nozzle performs as

per requirements.

– Do not open the MBB prior to assembly (for

example, for IQC). If unavoidable, MBB must be

properly resealed with fresh desiccant and HIC. The

exposed duration must be taken in as floor life.

Broadcom

AEMD-LX3K-DS101

AEMD-LG3K, AEMD-LL3K Data Sheet

High Brightness Red and Amber SMT Oval Lamps



Control after opening the MBB:



The LED is not intended for reverse bias. Use other

appropriate components for such purposes. When

driving the LED in matrix form, ensure that the reverse

bias voltage does not exceed the allowable limit of the

LED.

– Read the HIC immediately upon opening of MBB.

– Keep the LEDs at < 30°/60% RH at all times, and

complete all high temperature-related processes,

including soldering, curing or rework within

168 hours.

As the actual application might not be exactly similar to

the test conditions, verify that the LED will not be

damaged by prolonged exposure in the intended

environment.



Control for unfinished reel:

Store unused LEDs in a sealed MBB with desiccant or a

desiccator at < 5% RH.



Avoid rapid change in ambient temperatures, especially

in high-humidity environments, because they cause

condensation on the LED.

Control of assembled boards:

If the PCB soldered with the LEDs is to be subjected to

other high-temperature processes, store the PCB in a

sealed MBB with desiccant or desiccator at < 5% RH to

ensure that all LEDs have not exceeded their floor life of

168 hours.

If the LED is intended to be used in harsh or outdoor

environments, protect the LED against damage caused

by rain water, water, dust, oil, corrosive gases, external

mechanical stresses, and so on.



The number of reflow cycles and reflow temperature

condition used may affect optical characteristics of the

LED. Use LEDs with the same number of reflow cycle

and same reflow temperature condition within the same

finished good.



Baking is required if the following conditions exist:

– The HIC indicator indicates a change in color for

10% and 5%, as stated on the HIC.

– The LEDs are exposed to conditions of > 30°C/60%

RH at any time.

– The LED's floor life exceeded 168 hours.

Thermal Management

The recommended baking condition is: 60°C ± 5ºC for

20 hours.

The optical, electrical, and reliability characteristics of the

LED are affected by temperature. Keep the junction

Baking can only be done once.

temperature (T ) of the LED below the allowable limit at all



Storage:

times. T can be calculated as follows:

The soldering terminals of these Broadcom LEDs are

silver plated. If the LEDs are exposed in an ambient

environment for too long, the silver plating might be

oxidized, thus affecting its solderability performance.

Therefore, keep unused LEDs in a sealed MBB with

desiccant or in a desiccator at < 5% RH.

T = T + R

× I × V

F Fmax

θJ-A

where;

T = Ambient temperature (°C)

= Thermal resistance from LED junction to

θJ-A

ambient (°C/W)

Application Precautions

I = Forward current (A)



The drive current of the LED must not exceed the

maximum allowable limit across temperature as stated

in the data sheet. Constant current driving is

= Maximum forward voltage (V)

Fmax

The complication of using this formula lies in T and R

θJ-A

recommended to ensure consistent performance.

Actual T is sometimes subjective and hard to determine.



Circuit design must cater to the whole range of forward

varies from system to system depending on design

θJ-A

voltage (V ) of the LEDs to ensure the intended drive

and is usually not known.

current can always be achieved.

The LED exhibits slightly different characteristics at

different drive currents, which may result in a larger

variation of performance (meaning: intensity,

wavelength, and forward voltage). Set the application

current as close as possible to the test current to

minimize these variations.

Broadcom

AEMD-LX3K-DS101

AEMD-LG3K, AEMD-LL3K Data Sheet

High Brightness Red and Amber SMT Oval Lamps

Another way of calculating T is by using the solder point

Eye Safety Precautions

temperature, T as follows:

LEDs may pose optical hazards when in operation. Do not

look directly at operating LEDs because it might be harmful

to the eyes. For safety reasons, use appropriate shielding or

personal protective equipment.

T = T + R

× I × V

F Fmax

θJ-S

where;

T = LED solder point temperature as shown in the

following figure (°C)

= Thermal resistance from junction to solder point

θJ-S

(°C/W)

I = Forward current (A)

= Maximum forward voltage (V)

Fmax

Figure 15: Solder Point Temperature on PCB

T can be easily measured by mounting a thermocouple on

the soldering joint as shown in preceding figure, while R

θJ-S

is provided in the data sheet. Verify the T of the LED in the

final product to ensure that the LEDs are operating within all

maximum ratings stated in the data sheet.

Broadcom

AEMD-LX3K-DS101

Disclaimer

Broadcom's products and software are not specifically designed, manufactured, or authorized for sale as parts, components,

or assemblies for the planning, construction, maintenance, or direct operation of a nuclear facility or for use in medical

devices or applications. The customer is solely responsible, and waives all rights to make claims against Broadcom or its

suppliers, for all loss, damage, expense, or liability in connection with such use.

Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks

of Broadcom and/or its affiliates in the United States, certain other countries, and/or the EU.

The term “Broadcom” refers to Broadcom Limited and/or its subsidiaries. For more information, please visit

www.broadcom.com.

Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability,

function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does

not assume any liability arising out of the application or use of this information, nor the application or use of any product or

circuit described herein, neither does it convey any license under its patent rights nor the rights of others.

AEMD-LL3K-XZ002 [BOARDCOM]

相关型号：

SI9130DB

SI9135LG-T1

SI9135LG-T1-E3

SI9135_11

SI9136_11

SI9130CG-T1-E3

SI9130LG-T1-E3

SI9130_11

SI9137

SI9137DB

SI9137LG

SI9122E