ASMW-LG00-NY10E [BOARDCOM]
0.5W 2835 Surface-Mount LED;
| 型号： | ASMW-LG00-NY10E |
| 厂家： | 
Broadcom Corporation. |
| 描述： | 0.5W 2835 Surface-Mount LED |
| 文件： | 总13页 (文件大小：974K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Data Sheet
ASMW-LG00, ASMW-LM00
0.5W 2835 Surface-Mount LED
Description
Features
®
The Broadcom ASMW-LG00 and ASMW-LM00
High reliability package with enhanced silicone resin
encapsulation
surface-mount LEDs use InGaN chip technology with
superior package design to enable them to produce higher
light output with better flux performance. They can be driven
at high current and are able to dissipate heat more efficiently
resulting in better performance with higher reliability.
Moisture sensitivity level 3
Available in green and deep blue colors
Low package profile and large emitting area
Enhanced corrosion resistance
These LEDs operate under a wide range of environmental
conditions, making them ideal for various applications,
applications including fluorescent replacement,
under-cabinet lighting, retail display lighting and panel
lights.
Applications
Specialty and architectural lighting
Gaming and vending machine backlighting
Industrial lighting; for example, tower light
Industrial equipment indicator
To facilitate easy pick-and-place assembly, the LEDs are
packed in tape and reel. Every reel is shipped in single flux
and color bin to provide close uniformity.
CAUTION! This LED is Class 1A ESD sensitive per ANSI/ESDA/JEDEC JS-001. Observe appropriate precautions during
handling and processing. Refer to Application Note AN-1142 for additional details.
Broadcom
ASMW-Lx00-DS102
October 1, 2020
ASMW-LG00, ASMW-LM00 Data Sheet
0.5W 2835 Surface-Mount LED
Figure 1: Package Dimensions
3.50
(2.95)
2.80
(2.50)
2.10
2.06
0.99
ANODE MARK
0.70
NOTE:
All dimensions are in millimeters (inches).
Tolerance is ±0.20 mm unless otherwise specified.
Encapsulation = silicone.
Terminal finish = silver plating.
Dimensions in brackets are for reference only.
Device Selection Guide (T = 25°C, I = 150 mA)
J
F
Luminous Flux V (lm)a, b
Luminous Intensity, lV (cd)c
Typ.
Part Number
Color
Min.
Typ.
Max.
ASMW-LG00-NY10E
ASMW-LM00-NGJ0E
Green
38.0
8.0
43.0
8.6
47.0
11.0
15.4
2.7
Deep blue
a. Luminous flux, V, is measured at the mechanical axis of the package, and it is tested with a single current pulse condition.
b. Tolerance is ± 12%.
c. For reference only.
Broadcom
ASMW-Lx00-DS102
2
ASMW-LG00, ASMW-LM00 Data Sheet
0.5W 2835 Surface-Mount LED
Absolute Maximum Ratings
Parameter
Green/Deep Blue
Units
mA
DC Forward Currenta
200
300
740
Peak Forward Currentb
mA
Power Dissipation
mW
Reverse Voltage
Not designed for reverse bias operation
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
a. Derate linearly as shown in Figure 10 and Figure 11.
b. Duty factor = 10%, frequency = 1 kHz.
125
°C
°C
°C
–40 to +100
–40 to +100
Optical and Electrical Characteristics (T = 25°C, I = 150 mA)
J
F
Parameter
Min.
Typ.
Max.
Units
a
—
120
—
Deg
Viewing Angle, 2θ
½
b
Forward Voltage, VF
Green
Deep Blue
2.9
2.9
3.16
3.08
3.7
3.7
V
V
Reverse Current, IR at VR = 4Vc
—
—
10
µA
d
Dominant Wavelength, d
Green
Deep Blue
515.0
450.0
529.0
456.0
535.0
460.0
nm
nm
Peak Wavelength, p
Green
Deep Blue
—
—
522
451
—
—
nm
nm
e
Thermal Resistance, RθJ-S
Green
Deep Blue
—
—
60
36
—
—
°C/W
°C/W
a. θ is the off axis angle where the luminous intensity is half of the peak intensity.
½
b. Forward voltage tolerance = ± 0.1V.
c. Indicates production final test condition only. Long-term reverse biasing is not recommended.
d. The dominant wavelength, d is derived from the CIE Chromaticity diagram and represents the color of the lamp.
e. Thermal resistance from LED junction to solder point.
Broadcom
ASMW-Lx00-DS102
3
ASMW-LG00, ASMW-LM00 Data Sheet
0.5W 2835 Surface-Mount LED
Part Numbering System
L
x1
0
0
N
x2
x3
x4
x5
A
S
M
W
-
-
Code
x1
Description
Option
Color
G
M
Green
Deep blue
x2
x3
x4
x5
Minimum Flux Bin
Maximum Flux Bin
Color Bin
Refer to the Flux Bin Limits (CAT) table
0
Full color distribution
Test current = 150 mA
Test Option
E
Part Number Example:
ASMW-LG00-NY10E
x1 =
x2 =
x3 =
x4 =
x5 =
G
Y
1
Green color
Minimum flux bin Y
Maximum flux bin 1
Full color distribution
Test current = 150 mA
0
E
Broadcom
ASMW-Lx00-DS102
4
ASMW-LG00, ASMW-LM00 Data Sheet
0.5W 2835 Surface-Mount LED
Bin Information
Flux Bin Limits (CAT)
Color Bin Limits (BIN)
Luminous Flux, V (lm)
Dominant Wavelength, d (nm)
Bin ID
Min.
Max.
Bin ID
Min.
Max.
Green
Green
Y
Z
1
38.0
41.0
44.0
41.0
44.0
47.0
1
2
3
4
515.0
520.0
525.0
530.0
520.0
525.0
530.0
535.0
Deep Blue
Deep Blue
G
H
J
8.0
9.0
9.0
10.0
11.0
8
9
450.0
455.0
455.0
460.0
10.0
Tolerance: ± 12%.
Tolerance: ± 1.0 nm.
Forward Voltage Bin Limits (VF)
Example of bin information on reel and packaging label:
Forward Voltage, VF (V)
CAT: W
BIN: 2
Flux bin Y
Color bin 2
VF bin G05
Bin ID
Min.
Max.
G04
G05
G06
G07
G08
G09
G10
G11
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
VF: G05
Tolerance: ± 0.1V.
Broadcom
ASMW-Lx00-DS102
5
ASMW-LG00, ASMW-LM00 Data Sheet
0.5W 2835 Surface-Mount LED
Figure 2: Spectral Power Distribution
Figure 3: Forward Current vs. Forward Voltage
1
320
280
240
200
160
120
80
0.9
DEEP BLUE
GREEN
DEEP BLUE
GREEN
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
40
0
380
480
580
WAVELENGTH - nm
680
780
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
FORWARD VOLTAGE - V
Figure 4: Relative Lumunious Flux vs. Mono Pulse Current
Figure 5: Radiation Pattern
1.4
1.2
1.0
1.00
0.75
0.50
0.25
0.00
GREEN
0.8
DEEP BLUE
0.6
0.4
0.2
0.0
0
40
80
120
160
200
-90
-60
-30
0
30
60
90
ANGULAR DISPLACEMENT - DEGREES
DC FORWARD CURRENT - mA
Figure 6: Dominant Wavelength Shift vs. Mono Pulse Current
Figure 7: Forward Voltage Shift vs. Junction Temperature
14
12
10
8
0.30
0.20
0.10
DEEP BLUE
6
0.00
DEEP BLUE
GREEN
GREEN
4
2
-0.10
-0.20
-0.30
0
-2
-4
0
50
100
150
200
250
-40
-20
0
20
40
60
80
100 120 140
JUNCTION TEMPERATURE, TJ - °C
FORWARD CURRENT - mA
Broadcom
ASMW-Lx00-DS102
6
ASMW-LG00, ASMW-LM00 Data Sheet
0.5W 2835 Surface-Mount LED
Figure 8: Relative Light Output vs. Junction Temperature
Figure 9: Dominant Wavelength Shift vs. Junction Temperature
1.6
6.0
5.0
1.4
DEEP BLUE
4.0
GREEN
GREEN
1.2
3.0
2.0
DEEP BLUE
1.0
0.8
0.6
0.4
0.2
0.0
1.0
0.0
-1.0
-2.0
-3.0
-4.0
-40
-20
0
20
40
60
80
100
120
140
-40
-20
0
20
40
60
80
100
120
140
JUNCTION TEMPERATURE, TJ -°C
JUNCTION TEMPERATURE, TJ -°C
Figure 10: Maximum Forward Current vs. Ambient
Temperature. Derated based on TJMAX = 125°C
Figure 11: Maximum Forward Current vs. Solder Point
Temperature. Derated based on TJMAX = 125°C, RθJ-S = 60°C/
W (Green), RθJ-S = 36°C/W (Deep Blue)
240
200
160
240
200
DEEP BLUE
160
R
R
R
TJ-A = 110qC/W
TJ-A = 120qC/W
TJ-A = 130qC/W
GREEN
120
80
40
0
120
80
40
0
0
20
40
60
80
100
120
0
20
40
60
80
100
120
AMBIENT TEMPERATURE, TA - °C
SOLDER POINT TEMPERATURE, TS - °C
Figure 12: Pulse Handling Capability at TS ≤ 100 °C (Deep Blue)
Figure 13: Pulse Handling Capability at TS ≤ 76 °C (Green)
0.35
0.35
D =
D =
0.30
0.25
0.20
0.15
0.30
0.25
0.20
0.15
0.05
0.10
0.25
0.50
1.00
0.05
0.10
0.25
0.50
1.00
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E-03
1.0E-02
1.0E-01
1.0E+00
PULSE DURATION, tP- sec
PULSE DURATION, tP - sec
Broadcom
ASMW-Lx00-DS102
7
ASMW-LG00, ASMW-LM00 Data Sheet
0.5W 2835 Surface-Mount LED
Figure 14: Pulse Handling Capability at TS =100 °C (Green)
0.35
0.30
0.25
0.20
D =
0.05
0.10
0.25
0.50
1.00
0.15
0.10
0.05
1.0E-03
1.0E-02
1.0E-01
1.0E+00
PULSE DURATION, tP - sec
Figure 15: Recommended Soldering Land Pattern
4.50
2.49
1.42
2.10
2.01
MAXIMIZE ANODE COPPER
PAD AREA FOR BETTER HEAT
DISSIPATION
COPPER PAD
SOLDER MASK
NOTE: All dimensions are in millimeters (mm).
Broadcom
ASMW-Lx00-DS102
8
ASMW-LG00, ASMW-LM00 Data Sheet
0.5W 2835 Surface-Mount LED
Figure 16: Carrier Tape Dimensions
P2
P0
E1
T
D0
F
W
B0
K0
A0
P1
POLARITY
MARK
USER DIRECTION OF UNREELING
F
P0
P1
P2
D0
E1
W
T
B0
K0
A0
3.5 ± 0.05 4.0 ± 0.1 4.0 ± 0.1 2.0 ± 0.05 1.55 ± 0.05 1.75 ± 0.1 8.0 ± 0.2 0.2 ± 0.05 3.8 ± 0.1 1.05 ± 0.1 3.1 ± 0.1
NOTE: All dimensions are in millimeters (mm).
Figure 17: Reel Dimensions
9.0
PRODUCT LABEL
USER FEED DIRECTION
NOTE: All dimensions are in millimeters (mm).
Broadcom
ASMW-Lx00-DS102
9
ASMW-LG00, ASMW-LM00 Data Sheet
0.5W 2835 Surface-Mount LED
Precautionary Notes
Soldering
Handling Precautions
Do not perform reflow soldering more than twice.
Observe necessary precautions of handling
moisture-sensitive devices as stated in the following
section.
The encapsulation material of the LED is made of silicone
for better product reliability. Compared to epoxy
encapsulant, which is hard and brittle, silicone is softer and
flexible. Observe special handling precautions during
assembly of silicone encapsulated LED products. Failure to
comply might lead to damage and premature failure of the
LED. Refer to Broadcom Application Note AN5288, Silicone
Encapsulation for LED: Advantages and Handling
Precautions, for additional information.
Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
Use reflow soldering to solder the LED. Use hand
soldering only for rework if unavoidable, but it must be
strictly controlled to following conditions:
– Soldering iron tip temperature = 315°C maximum
– Soldering duration = 3 seconds maximum
– Number of cycles = 1 only
Do not poke sharp objects into the silicone encapsulant.
Sharp objects, such as tweezers or syringes, might
apply excessive force or even pierce through the
silicone and induce failures to the LED die or wire bond.
– Power of soldering iron = 50W maximum
Do not touch the LED package body with the soldering
iron except for the soldering terminals, because it may
cause damage to the LED.
Do not touch the silicone encapsulant. Uncontrolled
force acting on the silicone encapsulant might result in
excessive stress on the wire bond. Hold the LED only
by the body.
Confirm beforehand whether the functionality and
performance of the LED is affected by soldering with
hand soldering.
Do not stack assembled PCBs together. Use an
appropriate rack to hold the PCBs.
The surface of silicone material attracts dust and dirt
easier than epoxy due to its surface tackiness. To
remove foreign particles on the surface of silicone, use
a cotton bud with isopropyl alcohol (IPA). During
cleaning, rub the surface gently without putting too
much pressure on the silicone. Ultrasonic cleaning is
not recommended.
Figure 18: Recommended Lead-Free Reflow Soldering Profile
10 to 30 SEC.
255 – 260°C
3°C/SEC. MAX.
217°C
200°C
For automated pick-and-place, Broadcom has tested a
nozzle size with an outer diameter of 3.5 mm to work
with this LED. However, due to the possibility of
variations in other parameters, such as pick-and-place
machine maker/model, and other settings of the
machine, verify that the selected nozzle will not cause
damage to the LED.
6°C/SEC. MAX.
150°C
3°C/SEC. MAX.
100 SEC. MAX.
60 – 120 SEC.
TIME
Figure 19: Recommended Board Reflow Direction
REFLOW DIRECTION
Broadcom
ASMW-Lx00-DS102
10
ASMW-LG00, ASMW-LM00 Data Sheet
0.5W 2835 Surface-Mount LED
Storage
Handling of Moisture-Sensitive Devices
The soldering terminals of these Broadcom LEDs are silver
plated. If the LEDs are exposed in an ambient environment
for too long, the silver plating might be oxidized, thus
affecting its solderability performance. As such, keep
unused LEDs in a sealed MBB with desiccant or in a
desiccator at <5% RH.
This product has a Moisture Sensitive Level 3 rating per
JEDEC J-STD-020. Refer to Broadcom Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices for additional details and a review of proper
handling procedures.
Before use
Store an unopened moisture barrier bag (MBB) at
<40°C/90% RH for 12 months. If the actual shelf life has
exceeded 12 months and the humidity indicator card
(HIC) indicates that baking is not required, it is safe to
reflow the LEDs per the original MSL rating.
Application Precautions
The drive current of the LED must not exceed the
maximum allowable limit across temperature as stated
in the data sheet. Constant current driving is
recommended to ensure consistent performance.
Do not open the MBB prior to assembly (for example,
for IQC). If unavoidable, properly reseal the MBB with
fresh desiccant and HIC. The exposed duration must be
taken in as floor life.
The circuit design must cater to the entire range of
forward voltage (V ) of the LEDs to ensure the intended
F
drive current can always be achieved.
The LED exhibits slightly different characteristics at
different drive currents, which may result in a larger
variation of performance (such as intensity, wavelength,
and forward voltage). Set the application current as
close as possible to the test current to minimize these
variations.
Control after opening the MBB
Read the HIC immediately upon opening the MBB.
Keep the LEDs at <30°/60% RH at all times, and
complete all hightemperature-related processes,
including soldering, curing, or rework, within 168 hours.
The LED is not intended for reverse bias. Use other
appropriate components for such purposes. When
driving the LED in matrix form, ensure that the reverse
bias voltage does not exceed the allowable limit of the
LED.
Control for unfinished reel
Store unused LEDs in a sealed MBB with desiccant or a
desiccator at <5% RH.
This LED is designed to have enhanced gas corrosion
resistance. Its performance has been tested according
to the following conditions:
Control of assembled boards
If the PCB soldered with the LEDs is to be subjected to other
high-temperature processes, store the PCB in a sealed
MBB with desiccant or desiccator at <5% RH to ensure that
all LEDs have not exceeded their floor life of 168 hours.
– IEC 60068-2-43: 25°C/75% RH, H S 15 ppm,
2
21 days.
– IEC 60068-2-42: 25°C/75% RH, SO 25 ppm,
2
21 days.
– IEC 60068-2-60: 25°C/75% RH, SO 200 ppb, NO
Baking is required if the following conditions exist
2
2
200 ppb, H S 10 ppb, Cl 10 ppb, 21 days.
2
2
The HIC indicator indicates a change in color for 10%
and 5%, as stated on the HIC.
Because the actual application might not be exactly
similar to the test conditions, verify that the LED will not
be damaged by prolonged exposure in the intended
environment.
The LEDs are exposed to conditions of >30°C/60% RH
at any time.
The LED's floor life exceeded 168 hours.
Avoid rapid changes in ambient temperatures,
especially in high-humidity environments, because they
cause condensation on the LED.
The recommended baking condition is: 60°C ± 5°C for
20 hours.
If the LED is intended to be used in a harsh or an
outdoor environment, protect the LED by means of a
protective cover against damages caused by rain water,
water, dust, oil, corrosive gases, external mechanical
stresses, and so on.
Baking can only be done once.
Broadcom
ASMW-Lx00-DS102
11
ASMW-LG00, ASMW-LM00 Data Sheet
0.5W 2835 Surface-Mount LED
T can be easily measured by mounting a thermocouple on
Thermal Management
S
the soldering joint as shown in preceding figure, while R
θJ-S
The optical, electrical, and reliability characteristics of the
LED are affected by temperature. Keep the junction
is provided in the data sheet. Verify the T of the LED in the
final product to ensure that the LEDs are operating within all
maximum ratings stated in the data sheet.
S
temperature (T ) of the LED below the allowable limit at all
J
times. T can be calculated as follows:
J
Eye Safety Precautions
T = T + R
× I × V
F Fmax
J
A
θJ-A
LEDs may pose optical hazards when in operation. Do not
look directly at operating LEDs because it might be harmful
to the eyes. For safety reasons, use appropriate shielding or
personal protective equipment
where:
T = Ambient temperature (°C)
A
R
= Thermal resistance from LED junction to
θJ-A
ambient (°C/W)
I = Forward current (A)
F
V
= Maximum forward voltage (V)
Fmax
The complication of using this formula lies in T and R
.
θJ-A
A
Actual T is sometimes subjective and hard to determine.
A
R
varies from system to system depending on design
θJ-A
and is usually not known.
Another way of calculating T is by using the solder point
J
temperature, T as follows:
S
T = T + R
× I × V
F Fmax
J
S
θJ-S
where:
T = LED solder point temperature as shown in the
S
following figure (°C)
R
= Thermal resistance from junction to solder point
θJ-S
(°C/W)
I = Forward current (A)
F
V
= Maximum forward voltage (V)
Fmax
Figure 20: Solder Point Temperature on PCB
PRINTED CIRCUIT BOARD
TS POINT
LED ANODE MARK
Broadcom
ASMW-Lx00-DS102
12
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