HLMP-CM1G-350DD [BOARDCOM]

T-1Â¾ (5 mm) InGaN Blue and Green LEDs;


型号：	HLMP-CM1G-350DD
厂家：	Broadcom Corporation.
描述：	T-1Â¾ (5 mm) InGaN Blue and Green LEDs 光电
文件：	总14页 (文件大小：977K)
中文：	中文翻译
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Data Sheet

HLMP-CBxx, HLMP-CMxx

T-1¾ (5 mm) InGaN Blue and Green LEDs

Description

Features

These high-intensity blue and green LEDs are based on the

most efficient and cost-effective InGaN material technology.



Viewing angle: 15°, 23°, and 30°

Well-defined spatial radiation pattern

High luminous output

These LED lamps are untinted and non-diffused T-1¾

packages incorporating second generation optics producing

well-defined spatial radiation patterns at specific viewing

cone angles.

Available in blue and green

– Blue 470 nm

– Green 525 nm



Superior resistance to moisture

Standoff and non-standoff package

These lamps are made with an advanced optical grade

epoxy offering superior high temperature and high moisture

resistance performance in outdoor signal and sign

applications. The epoxy contains UV inhibitors to reduce the

effects of long term exposure to direct sunlight.

Applications



Traffic signs

Variable message signs

Commercial outdoor advertising

CAUTION! INGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate

precautions during handling and processing. Refer to Application Note AN–1142 for additional details.

Broadcom

AV02-3140EN

March 12, 2018

HLMP-CBxx, HLMP-CMxx Data Sheet

T-1¾ (5 mm) InGaN Blue and Green LEDs

Figure 1: Package Dimensions

Drawing A (Non-standoff)

1.00 0.20

0.039 0.008

5.80 0.20

8.70 0.20

0.343 0.008

0.228 0.008

0.70 max

0.028

0.50 0.10 sq. typ.

0.020 0.004

5.00 0.20

2.54 0.38

0.197 0.008

0.100 0.015

Cathode

31.60 min

1.244

1.00 min

0.039

cathode

ﬂat

Drawing B (Standoff)

1.00 0.20

0.039 0.008

1.30 0.15

0.051 0.006

5.80 0.20

0.228 0.008

8.70 0.20

0.343 0.008

0.70 max

0.028

0.50 0.10 sq. typ.

0.020 0.004

5.00 0.20

0.197 0.008

2.54 0.38

0.100 0.015

Cathode

1.00 min

0.039

cathode

ﬂat

31.60 min

1.244

Part Number

Dimension ‘d’

HLMP-Cx1H

HLMP-Cx2H

HLMP-Cx3H

12.39 mm ± 0.25 mm

12.35 mm ± 0.25 mm

11.93 mm ± 0.25 mm

NOTE:

1. All dimensions in millimeters (inches).

2. Tolerance is ± 0.20 mm unless other specified.

3. Leads are mild steel with tin plating.

4. The epoxy meniscus is 1.5 mm maximum.

Broadcom

AV02-3140EN

HLMP-CBxx, HLMP-CMxx Data Sheet

T-1¾ (5 mm) InGaN Blue and Green LEDs

Device Selection Guide

Luminous Intensity Iv (mcd) at 20 mA^{b c d}

Color and Dominant

Wavelength _d(nm)

Typical Viewing

Part Number

Typ.^a[3]

Min

Max

Standoff

Angle (°)^e

HLMP-CB1G-XZ0DD

HLMP-CB1H-XZ0DD

HLMP-CM1G-350DD

HLMP-CM1H-350DD

HLMP-CB2G-UW0DD

HLMP-CB2H-UW0DD

HLMP-CM2G-130DD

HLMP-CM2H-130DD

HLMP-CB3G-TV0DD

HLMP-CB3H-TV0DD

HLMP-CM3G-Y10DD

HLMP-CM3H-Y10DD

Blue 470

7200

27000

3200

16000

2500

9300

16000

59000

7200

Yes

Blue 470

Green 525

Blue 470

Yes

Blue 470

7200

Yes

Green 525

Blue 470

35000

5500

Yes

Blue 470

5500

Yes

Green 525

21000

Yes

a. Dominant wavelength, _d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.

b. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.

c. The optical axis is closely aligned with the package mechanical axis.

d. Tolerance for each bin limit is ± 15%.

e. θ is the off-axis angle where the luminous intensity is half the on-axis intensity.

Absolute Maximum Ratings

T = 25°C

Parameter

Blue/Green

Unit

DC Forward Current^a

Peak Forward Current^b

Power Dissipation

100

110

°C

LED Junction Temperature

Operating Temperature Range

Storage Temperature Range

–40 to +85

–40 to +100

°C

a. Derate linearly as shown in Figure 5.

b. Duty factor 10%, frequency 1 kHz.

Broadcom

AV02-3140EN

HLMP-CBxx, HLMP-CMxx Data Sheet

T-1¾ (5 mm) InGaN Blue and Green LEDs

Electrical/Optical Characteristics

T = 25°C

Parameter

Symbol

Min.

Typ.

Max.

Units Test Conditions

Forward Voltage

Blue and Green

V_F

2.8

3.1

3.6

I_F= 20 mA

Reverse Voltage^a

Blue and Green

V_R

—

I_R= 10 µA

Dominant Wavelength^b

_d

I_F= 20 mA

460

520

470

525

480

540

Blue

Green

Peak Wavelength

Blue

_PEAK

Peak of Wavelength of Spectral Distribution

at I_F= 20 mA

—

461

517

240

—

Green

Thermal resistance

Rθ_J-PIN

°C/W

lm/W

LED junction to pin

Luminous Efficacy^c

_v

Emitted Luminous Power/Emitted Radiant

Power

—

Blue

Green

475

Thermal coefficient of _d

nm/°C I_F= 20 mA; +25° C ≤ T_J≤ +100° C

—

0.02

0.03

—

Blue

Green

a. Indicates product final testing condition, long-term reverse bias is not recommended.

b. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp.

c. The radiant intensity, I_ein watts per steradian, maybe found from the equation I_e= I_v/ _Vwhere I_vis the luminous intensity in candelas and



_Vis the luminous efficacy in lumens/ watt.

Broadcom

AV02-3140EN

HLMP-CBxx, HLMP-CMxx Data Sheet

T-1¾ (5 mm) InGaN Blue and Green LEDs

Part Numbering System

x₁

x₂

x₃

x₄

x₅

x₆

x₇

x₈

x₉

Code

x₁

Description

Package type

Color

Option

5-mm Standard Round InGaN

x₂

Blue

Green

x₃x₄

Viewing Angle and Lead Standoffs

15° without lead standoffs

15° with lead standoffs

23° without lead standoffs

23° with lead standoffs

30° without lead standoffs

30° with lead standoffs

See Device Selection Guide

x₅

Minimum intensity bin

Maximum intensity bin

Color bin selection

Packaging option

x₆

See Device Selection Guide

Full range

x₇

x₈x₉

Ammopack

Broadcom

AV02-3140EN

HLMP-CBxx, HLMP-CMxx Data Sheet

T-1¾ (5 mm) InGaN Blue and Green LEDs

Bin Information

ntensity Bin Limit Table (1.3:1 Iv Bin Ratio) Blue Color Bin Table

Intensity (mcd) at 20 mA

Min

Dom

Max

Dom

Bin

Xmin

Ymin

Xmax Ymax

Bin

Max

460.0

464.0

468.0

472.0

476.0

464.0

468.0

472.0

476.0

480.0

0.1440 0.0297 0.1766 0.0966

0.1818 0.0904 0.1374 0.0374

0.1374 0.0374 0.1699 0.1062

0.1766 0.0966 0.1291 0.0495

0.1291 0.0495 0.1616 0.1209

0.1699 0.1062 0.1187 0.0671

0.1187 0.0671 0.1517 0.1423

0.1616 0.1209 0.1063 0.0945

0.1063 0.0945 0.1397 0.1728

0.1517 0.1423 0.0913 0.1327

2500

3200

4200

5500

7200

9300

12000

16000

21000

27000

35000

45000

59000

12000

16000

21000

27000

35000

45000

Tolerance for each bin limit is ± 0.5 nm.

NOTE: All bin categories are established for classification

Tolerance for each bin limit is ± 15%.

of products. Products may not be available in all

bin categories. Contact your Broadcom

representative for further information.

Green Color Bin Table

Broadcom Color Bin on CIE 1931

Chromaticity Diagram

Min

Dom

Max

Dom

Bin

Xmin

Ymin

Xmax Ymax

520.0

524.0

528.0

532.0

536.0

524.0

528.0

532.0

536.0

540.0

0.0743 0.8338 0.1856 0.6556

0.1650 0.6586 0.1060 0.8292

0.1060 0.8292 0.2068 0.6463

0.1856 0.6556 0.1387 0.8148

0.1387 0.8148 0.2273 0.6344

0.2068 0.6463 0.1702 0.7965

0.1702 0.7965 0.2469 0.6213

0.2273 0.6344 0.2003 0.7764

0.2003 0.7764 0.2659 0.6070

0.2469 0.6213 0.2296 0.7543

0.9

0.8

Green

0.7

0.6

0.5

0.4

0.3

0.2

0.1

Tolerance for each bin limit is ± 0.5 nm.

Blue

0.05

0.1

0.15

0.2

0.25

0.3

Broadcom

AV02-3140EN

HLMP-CBxx, HLMP-CMxx Data Sheet

T-1¾ (5 mm) InGaN Blue and Green LEDs

Figure 2: Relative Intensity vs. Wavelength

Figure 3: Forward Current vs. Forward Voltage

1.0

0.9

0.8

Blue

Green

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

380

430

480

530

580

630

WAVELENGTH - nm

FORWARD VOLTAGE - V

Figure 4: Relative Intensity vs. Forward Current

Figure 5: Maximum Forward Current vs. Ambient

Temperature

1.4

1.2

0.8

0.6

0.4

0.2

100

DC FORWARD CURRENT - mA

T_A- AMBIENT TEMPERATURE - C

Figure 6: Relative Dominant Wavelength Shift vs. Forward

Current

Figure 7: Representative Radiation Pattern for 15° Viewing

Angle Lamp

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

Green

Blue

-2

-4

-90

-60

-30

FORWARD CURRENT - mA

ANGULAR DISPLACEMENT - DEGREES

Broadcom

AV02-3140EN

HLMP-CBxx, HLMP-CMxx Data Sheet

T-1¾ (5 mm) InGaN Blue and Green LEDs

Figure 8: Representative Radiation Pattern for 23° Viewing

Angle Lamp

Figure 9: Representative Radiation Pattern for 30° Viewing

Angle Lamp

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

-90

-60

-30

-90

-60

-30

ANGULAR DISPLACEMENT - DEGREES

Figure 10: Relative Light Output vs. Junction Temperature

Figure 11: Forward Voltage Shift vs. Junction Temperature

0.3

BLUE

GREEN

BLUE

GREEN

0.2

0.1

-0.1

-0.2

-0.3

0.1

-40

-20

100 120

-40

-20

100 120

T_J- JUNCTION TEMPERATURE

T - JUNCTION TEMPERATURE

Broadcom

AV02-3140EN

HLMP-CBxx, HLMP-CMxx Data Sheet

T-1¾ (5 mm) InGaN Blue and Green LEDs



Set and maintain wave soldering parameters according

to the recommended temperature and dwell time.

Perform a daily check on the soldering profile to ensure

that it is always conforming to recommended soldering

conditions.

Precautions

Lead Forming



The leads of an LED lamp may be preformed or cut to

length prior to insertion and soldering on PC board.

NOTE: PCBs with different sizes and design (component

density) have different heat masses (heat

capacities). This might cause a change in

temperature experienced by the board if the same

wave soldering setting is used. Recalibrate the

soldering profile again before loading a new type

of PCB.



For better control, use the proper tool to precisely form

and cut the leads to applicable length rather than doing

it manually.



If manual lead cutting is necessary, cut the leads after

the soldering process. The solder connection forms a

mechanical ground that prevents mechanical stress

due to lead cutting from traveling into LED package.

Use this method for hand soldering operatiosn, as the

excess lead length also acts as a small heat sink.

Broadcom LED Configuration

Figure 12: LED Configuration

Soldering and Handling



Take care during PCB assembly and soldering process

to prevent damage to the LED component.



The LED component may be effectively hand-soldered

to PCB; however, do this only under unavoidable

circumstances, such as rework. The closest manual

soldering distance of the soldering heat source

(soldering iron’s tip) to the body is 1.59 mm. Soldering

the LED using soldering iron tip closer than 1.59 mm

might damage the LED.

Cathode

1.59 mm

InGaN device



Any alignment fixture that is applied during wave

soldering must be loosely fitted and must not apply

weight or force on LED. Use nonmetal material

because it absorbs less heat during the wave soldering

process.



Apply ESD precautions on the soldering station and

personnel to prevent ESD damage to the LED

component, which is ESD sensitive. Refer to Broadcom

application note AN-1142 for details. The soldering iron

used must have a grounded tip to ensure electrostatic

charge is properly grounded.



At elevated temperatures, the LED is more susceptible

to mechanical stress. Therefore, allow the PCB to cool

down to room temperature prior to handling, which

includes removal of alignment fixture or pallet.



Recommended soldering condition:

If PCB board contains both through hole (TH) LED and

other surface-mount components, solder the

surface-mount components on the top side of the PCB.

If surface mount must be on the bottom side, solder

these components using reflow soldering prior to the

insertion of the TH LED.

Wave

Soldering^{a, b}

Manual Solder

Dipping

Pre-heat temperature

Preheat time

105°C max.

60s max.

–

Peak temperature

Dwell time

260°C max.

5s max.

260°C max.

5s max.

a. The above conditions refer to measurement with a

thermocouple mounted at the bottom of the PCB.

b. Use only bottom preheaters to reduce thermal stress

experienced by the LED.

Broadcom

AV02-3140EN

HLMP-CBxx, HLMP-CMxx Data Sheet

T-1¾ (5 mm) InGaN Blue and Green LEDs



The recommended PC board plated through holes

(PTH) size for LED component leads follows.

LED Component Lead

Size

Plated Through-Hole

Diameter

Diagonal

0.45 × 0.45 mm

0.636 mm

0.98 mm to 1.08 mm

(0.018 in. × 0.018 in.)

(0.025 inch) (0.039 in. to 0.043 in.)

0.707 mm 1.05 mm to 1.15 mm

(0.028 inch) (0.041 in. to 0.045 in.)

0.50 mm × 0.50 mm

(0.020 in. × 0.020 in.)



Over-sizing the PTH can lead to a twisted LED after

clinching. However, undersizing the PTH can cause

difficulty inserting the TH LED.

Refer to application note AN-5334 for more information

about soldering and handling of high brightness TH LED

lamps.

Figure 13: Example of Wave Soldering Temperature Profile for TH LED

260°C Max

Recommended solder:

Sn63 (Leaded solder alloy)

SAC305 (Lead free solder alloy)

Flux: Rosin ﬂux

Solder bath temperature: 255°C 5°C

(maximum peak temperature = 260°C)

105°C Max

60 sec Max

Dwell time: 3.0 sec - 5.0 sec

(maximum = 5sec)

Note: Allow for board to be suﬃciently

cooled to room temperature before

exerting mechanical force.

TIME (sec)

Broadcom

AV02-3140EN

HLMP-CBxx, HLMP-CMxx Data Sheet

T-1¾ (5 mm) InGaN Blue and Green LEDs

Figure 14: Ammo Packs Drawing

6.35 1.30

0.250 0.051

12.70 1.00

0.500 0.039

CATHODE

20.5 1.00

0.8070 0.0394

9.125 0.625

0.3595 0.0245

18.00 0.50

0.7085 0.0195

4.00 0.20

0.1575 0.0075

0.70 0.20

0.0275 0.0075

TYP.

12.70 0.30

0.500 0.012

VIEW A–A

NOTE: The ammo-packs drawing is applicable for packaging option –DD and -ZZ and regardless standoff or non-standoff.

Broadcom

AV02-3140EN

HLMP-CBxx, HLMP-CMxx Data Sheet

T-1¾ (5 mm) InGaN Blue and Green LEDs

Figure 15: Packaging Box for Ammo Packs

FROM LEFT SIDE OF BOX

ADHESIVE TAPE MUST BE

FACING UPWARDS.

LABEL ON THIS

SIDE OF BOX

ANODE LEAD LEAVES

THE BOX FIRST.

NOTE: For InGaN devices, the ammo pack packaging box contains an ESD logo.

Broadcom

AV02-3140EN

HLMP-CBxx, HLMP-CMxx Data Sheet

T-1¾ (5 mm) InGaN Blue and Green LEDs

Packaging Label

Figure 16: Mother Label (Available on packaging box of ammo pack and shipping box)

STANDARD LABEL LS0002

(1P) Item: Part Number

RoHS Compliant

max temp 260C

(Q) QTY: Quantity

CAT: Intensity Bin

BIN: Color Bin

(1T) Lot: Lot Number

LPN:

(9D)MFG Date: Manufacturing Date

(P) Customer Item:

(V) Vendor ID:

(9D) Date Code: Date Code

Made In: Country of Origin

DeptID:

Figure 17: Baby Label (Only available on bulk packaging)

RoHS Compliant

e3 max temp 260C

Lamps Baby Label

(1P) PART #: Part Number

(1T) LOT #: Lot Number

(9D)MFG DATE: Manufacturing Date

QUANTITY: Packing Quantity

C/O: Country of Origin

Customer P/N:

CAT: Intensity Bin

BIN: Color Bin

Supplier Code:

DATECODE: Date Code

Broadcom

AV02-3140EN

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www.broadcom.com.

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HLMP-CM1G-350DD [BOARDCOM]

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