HLMP-EG2H-XZ0DD [BOARDCOM]

T-1Â¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs;


型号：	HLMP-EG2H-XZ0DD
厂家：	Broadcom Corporation.
描述：	T-1Â¾ (5 mm) High Brightness AlInGaP Red and Amber LEDs
文件：	总14页 (文件大小：907K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Data Sheet

HLMP-EGxx, HLMP-ELxx

T-1¾ (5 mm) High Brightness AlInGaP

Red and Amber LEDs

Description

Features

The Broadcom Precision Optical Performance AlInGaP



Viewing angle: 15°, 23°, and 30°

Well-defined spatial radiation pattern

High brightness material

LEDs provide superior light output for excellent readability in

sunlight and are extremely reliable. AlInGaP LED

technology provides extremely stable light output over long

periods of time. Precision Optical Performance lamps utilize

the aluminum indium gallium phosphide (AlInGaP)

technology.

Available in Red and Amber

– Red AlInGaP 626 nm

– Amber AlInGaP 590 nm



Superior resistance to moisture

Standoff and non-standoff package

These LED lamps are untinted, T-1¾ packages

incorporating second-generation optics, producing well-

defined spatial radiation patterns at specific viewing cone

angles.

Applications



Traffic management:

These lamps are made with an advanced optical grade

epoxy offering superior high temperature and high moisture

resistance performance in outdoor signal and sign

application. The maximum LED junction temperature limit of

+130°C enables high temperature operation in bright

sunlight conditions. The epoxy contains UV inhibitor to

reduce the effects of long-term exposure to direct sunlight.

– Traffic signals

– Pedestrian signals

– Work zone warning lights

– Variable message signs

Solar power signs



Commercial outdoor advertising

– Signs

– Marquee

Benefits



Superior performance for outdoor environment



Suitable for auto-insertion onto PC board

Broadcom

AV02-3139EN

February 14, 2018

T-1¾ (5 mm) High Brightness AlInGaP

Red and Amber LEDs

HLMP-EGxx, HLMP-ELxx Data Sheet

Figure 1: Package Dimensions

Non-Standoﬀ

Standoﬀ

5.00 0.20

(0.197 0.00ꢀ8

5.00 0.20

(0.197 0.00ꢀ8

1.14 0.20

(0.045 0.00ꢀ8

ꢀ.71 0.20

(0.343 0.00ꢀ8

ꢀ.71 0.20

(0.343 0.00ꢀ8

1.14 0.20

(0.045 0.00ꢀ8

2.35 (0.0938

MAX.

0.70 (0.02ꢀ8

MAX.

1.50 0.15

(0.059 0.0068

31.60

(1.2448

31.60

(1.2448

MIN.

0.70 (0.02ꢀ8

MAX.

CATHODE

LEAD

CATHODE

LEAD

0.50 0.10

(0.020 0.0048

0.50 0.10

(0.020 0.0048

SQ. TYP.

1.00

MIN.

1.00

(0.0398

MIN.

(0.0398

5.ꢀ0 0.20

(0.22ꢀ 0.00ꢀ8

5.ꢀ0 0.20

(0.22ꢀ 0.00ꢀ8

CATHODE

FLAT

CATHODE

FLAT

2.54 0.3ꢀ

(0.100 0.0158

2.54 0.3ꢀ

(0.100 0.0158

NOTE:

Part Number

Dimension d

1. All dimensions in millimeters (inches).

2. Tolerance is ±0.20 mm unless other specified.

3. Leads are mild steel with tin plating.

4. The epoxy meniscus is 1.21 mm max.

HLMP-EG1H-xxxxx

HLMP-EL1H-xxxxx

HLMP-EG2H-xxxxx

HLMP-EL2H-xxxxx

12.30 ± 0.25 mm

12.64 ± 0.25 mm

12.10 ± 0.25 mm

12.14 ± 0.25 mm

12.10 ± 0.25 mm

5. For identification of polarity after the leads are

trimmed off, refer to the illustration:

HLMP-EG3H-xxxxx/HLMP-EL3H-xxxxx

CATHODE

ANODE

Broadcom

AV02-3139EN

T-1¾ (5 mm) High Brightness AlInGaP

Red and Amber LEDs

HLMP-EGxx, HLMP-ELxx Data Sheet

Device Selection Guide

Luminous Intensity, I_V(mcd)

at 20 mA^b,c,d

Color and Dominant

Wavelength, _d(nm)

Typical

Viewing Angle

Part Number

Typ^a

Min

Max

Standoff

(°)^e

HLMP-EG1G-Y10DD

HLMP-EG1H-Y10DD

HLMP-EL1G-130DD

HLMP-EL1H-130DD

HLMP-EG2G-XZ0DD

HLMP-EG2H-XZ0DD

HLMP-EL2G-XZKDD

HLMP-EL2H-XZKDD

HLMP-EG3G-VX0DD

HLMP-EG3H-VX0DD

HLMP-EL3G-VX0DD

HLMP-EL3H-VX0DD

Red 626

9300

16000

7200

4200

21000

35000

16000

9300

Yes

Amber 590

Red 626

Yes

Red 626

Yes

Amber 590

Red 626

Yes

Red 626

9300

Yes

Amber 590

9300

Yes

a. The dominant wavelength, _d, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.

b. The luminous intensity, I_V, is measured on the mechanical axis of the lamp package, and it is tested with pulsing condition.

c. The optical axis is closely aligned with the package mechanical axis.

d. Tolerance for each bin limit is ±15%.

e. θ is the off-axis angle where the luminous intensity is half the on-axis intensity.

Absolute Maximum Ratings (T = 25°C)

Parameter

Red/ Amber

Unit

DC Forward Current^a

Peak Forward Current^b

100

120

Power Dissipation

°C

LED Junction Temperature

Operating Temperature Range

Storage Temperature Range

a. Derate linearly as shown in Figure 6.

b. Duty Factor 30%, frequency 1 kHz.

130

–40 to +100

°C

Broadcom

AV02-3139EN

T-1¾ (5 mm) High Brightness AlInGaP

Red and Amber LEDs

HLMP-EGxx, HLMP-ELxx Data Sheet

Electrical/Optical Characteristics (T = 25°C)

Parameter

Symbol

Min.

Typ.

Max.

Unit

Test Conditions

Forward Voltage

Red and Amber

Reverse Voltage^a

Red and Amber

V_F

I_F= 20 mA

1.8

2.1

—

2.4

—

V_R

I_R= 100 A

Dominant Wavelength^b

_d

I_F= 20 mA

618.0

584.5

626.0

590.0

630.0

594.5

Red

Amber

Peak Wavelength

Red

_PEAK

Peak of Wavelength of Spectral

Distribution at I_F= 20 mA

—

634

594

240

—

Amber

Thermal Resistance

R_J-PIN

°C/W

lm/W

LED junction to pin

Luminous Efficacy^c

Red

_v

Emitted Luminous Power/

Emitted Radiant Power

—

190

490

—

Amber

Thermal Coefficient of _d

nm/°C

I_F= 20 mA;

+25° C ≤ T_J≤ +100° C

—

0.05

0.09

—

Red

Amber

a. Indicates product final testing condition; long-term reverse bias is not recommended.

b. The dominant wavelength is derived from the Chromaticity Diagram and represents the color of the lamp.

c. The radiant intensity, I_ein watts per steradian, can be found from the equation I_e= I_V/η_V, where I_Vis the luminous intensity in candela and η_V

is the luminous efficacy in lumens/watt.

Part Numbering System

x₁

x₂

x₃

x₄

x₅

x₆

x₇

x₈

x₉

Code

x₁

Description

Option

Package Type

Color

5-mm Standard Round AlInGaP

Red

x₂

Amber

x₃x₄

Viewing Angle and Lead Standoffs

15° without lead standoffs

15° with lead standoffs

23° without lead standoffs

23° with lead standoffs

30° without lead standoffs

30° with lead standoffs

x₅

x₆

x₇

Minimum Intensity Bin

Maximum Intensity Bin

Color Bin Selection

Refer to Device Selection Guide.

Full range

Color bin 2 and 4

Color bin 4 and 6

Ammopack

x₈x₉

Packaging Option

Broadcom

AV02-3139EN

T-1¾ (5 mm) High Brightness AlInGaP

Red and Amber LEDs

HLMP-EGxx, HLMP-ELxx Data Sheet

Amber Color Range

Bin Information

Min

Dom

Max

Dom

Intensity Bin Limit Table

(1.3 : 1 I_VBin Ratio)

Bin

X Min Y Min X Max Y Max

584.5

587.0

589.5

592.0

587.0 0.5420 0.4580 0.5530 0.4400

0.5370 0.4550 0.5570 0.4420

Intensity (mcd) at 20 mA

589.5 0.5570 0.4420 0.5670 0.4250

0.5530 0.4400 0.5720 0.4270

Bin

Min

Max

592.0 0.5720 0.4270 0.5820 0.4110

0.5670 0.4250 0.5870 0.4130

3200

4200

5500

594.5 0.5870 0.4130 0.5950 0.3980

0.5820 0.4110 0.6000 0.3990

5500

7200

9300

12000

16000

21000

27000

35000

Tolerance for each bin limit is ±0.5 nm.

12000

16000

21000

27000

NOTE: All bin categories are established for classification

of products. Products may not be available in all

bin categories. Please contact your Broadcom

representative for further information.

Tolerance for each bin limit is ±15%.

Figure 2: Color Bin on CIE 1931 Chromaticity Diagram

V_FBin Table (V at 20 mA)

0.4ꢀ0

0.460

Bin ID

Min

Max

0.440

1.8

2.0

2.2

2.0

2.2

2.4

Amber 2

0.420

0.400

0.3ꢀ0

0.360

0.340

0.320

0.300

0.2ꢀ0

Tolerance for each bin limit is ±0.05V.

Red Color Range

Min Dom Max Dom X Min

Y Min

X Max

Y Max

618.0

630.0

0.6872

0.6690

0.3126

0.3149

0.6890

0.7080

0.2943

0.2920

Red

Tolerance for each bin limit is ±0.5 nm.

0.500

0.550

0.600

0.650

0.700

0.750

0.ꢀ00

Broadcom

AV02-3139EN

T-1¾ (5 mm) High Brightness AlInGaP

Red and Amber LEDs

HLMP-EGxx, HLMP-ELxx Data Sheet

Figure 3: Relative Intensity vs Wavelength

Figure 4: Forward Current vs Forward Voltage

1.0

100

ꢀ0

0.ꢀ

Amber

Red

0.6

0.4

0.2

0.0

500

550

600

650

700

WAVELENGTH - nm

FORWARD VOLTAGE-V

Figure 5: Relative Intensity vs Forward Current

Figure 6: Maximum Forward Current vs Ambient Temperature

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

ꢀ0

100

ꢀ0

100

120

T_A- AMBIENT TEMPERATURE - ºC

DC FORWARD CURRENT - mA

Figure 7: Representative Radiation Pattern for 15° Viewing

Angle Lamp

Figure 8: Representative Radiation Pattern for 23° Viewing

Angle Lamp

0.9

0.ꢀ

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.9

0.ꢀ

0.7

0.6

0.5

0.4

0.3

0.2

0.1

-90

-60

-30

-90

-60

-30

ANGULAR DISPLACEMENT - DEGREES

Broadcom

AV02-3139EN

T-1¾ (5 mm) High Brightness AlInGaP

Red and Amber LEDs

HLMP-EGxx, HLMP-ELxx Data Sheet

Figure 9: Representative Radiation Pattern for 30° Viewing

Angle Lamp

Figure 10: Relative Light Output vs Junction Temperature

0.9

0.ꢀ

0.7

0.6

0.5

0.4

0.3

0.2

0.1

Amber

Red

0.1

-40 -20

ꢀ0 100 120 140

-90

-60

-30

T_J- JUNCTION TEMPERATURE

ANGULAR DISPLACEMENT - DEGREES

Figure 11: Forward Voltage Shift vs Junction Temperature

0.6

Amber

Red

0.5

0.4

0.3

0.2

0.1

-0.1

-0.2

-0.3

-40 -20

ꢀ0 100 120 140

T_J- JUNCTION TEMPERATURE

Broadcom

AV02-3139EN

T-1¾ (5 mm) High Brightness AlInGaP

Red and Amber LEDs

HLMP-EGxx, HLMP-ELxx Data Sheet



Wave soldering parameters must be set and maintained

according to the recommended temperature and dwell

time. The customer is advised to perform a daily check

on the soldering profile to ensure that it is always

conforming to recommended soldering conditions.

Precautionary Notes

Lead Forming



The leads of an LED lamp can be preformed or cut to

length prior to insertion and soldering on PC board.

NOTE:



For better control, use proper tool to precisely form and

cut the leads to applicable length rather than doing it

manually.



A PCB with different size and design

(component density) will have different heat

mass (heat capacity). This might cause a

change in temperature experienced by the

board if same wave soldering setting is used.

So, it is recommended to recalibrate the

soldering profile again before loading a new

type of PCB.



If manual lead cutting is necessary, cut the leads after

the soldering process. The solder connection forms a

mechanical ground, which prevents mechanical stress

due to lead cutting from traveling into LED package.

This is highly recommended for hand solder operation,

as the excess lead length also acts as small heat sink.



The Broadcom high brightness LEDs are using

high-efficiency LED die with single-wire bond

as shown in Figure 12. The customer is

advised to take extra precaution during wave

soldering to ensure that the maximum wave

temperature does not exceed 260°C and the

solder contact time does not exceeding 5 sec.

Overstressing the LED during soldering

process might cause premature failure to the

LED due to delamination.

Soldering and Handling



Care must be taken during PCB assembly and

soldering process to prevent damage to the LED

component.



The LED component can be effectively hand soldered

to PCB. However, it is only recommended under

unavoidable circumstances such as rework. The

closest manual soldering distance of the soldering heat

source (soldering iron’s tip) to the body is 1.59 mm.

Soldering the LED using soldering iron tip closer than

1.59 mm might damage the LED.

Figure 12: LED Configuration

1.59 mm



ESD precaution must be properly applied on the

soldering station and personnel to prevent ESD

damage to the LED component that is ESD sensitive.

Refer to Broadcom application note AN 1142 for details.

The soldering iron used should have grounded tip to

ensure electrostatic charge is properly grounded.

Anode

NOTE: Electrical connection between bottom surface of

LED die and the lead frame is achieved through

conductive paste.



Recommended soldering condition:

Manual Solder

Wave Soldering^a,b

Dipping



Any alignment fixture that is being applied during wave

soldering should be loosely fitted and should not apply

weight or force on the LED. Non-metal material is

recommended as it will absorb less heat during wave

soldering process.

Preheat Temperature

Preheat Time

105°C Max.

60 sec Max

260°C Max.

5 sec Max.

—

Peak Temperature

Dwell Time

260°C Max.

5 sec Max

a. These conditions refer to the measurement with

thermocouple mounted at the bottom of PCB.

NOTE: In order to further assist the customer in designing

jig accurately to fit the Broadcom product, a 3D

model of the product is available upon request.

b. Use only bottom preheaters to reduce thermal stress

experienced by LED.

Broadcom

AV02-3139EN

T-1¾ (5 mm) High Brightness AlInGaP

Red and Amber LEDs

HLMP-EGxx, HLMP-ELxx Data Sheet



At elevated temperature, the LED is more susceptible

to mechanical stress. Therefore, the PCB must be

allowed to cool down to room temperature prior to

handling, which includes removal of alignment fixture or

pallet.



The following table shows the recommended PC board

plated through holes (PTH) size for LED component

leads:

LED Component

Lead Size

Plated Through

Hole Diameter

Diagonal



If the PCB board contains both through-hole (TH) LED

and other surface mount components, it is

recommended that surface mount components be

soldered on the top side of the PCB. If surface mount

needs to be on the bottom side, these components

should be soldered using reflow soldering prior to

insertion the TH LED.

0.45 x 0.45 mm

0.636 mm

(0.025 inch)

0.707 mm

(0.028 inch)

0.98 to 1.08 mm

(0.018x 0.018 inch)

0.50 x 0.50 mm

(0.039 to 0.043 inch)

1.05 to 1.15 mm

(0.020x 0.020 inch)

(0.041 to 0.045 inch)



Oversizing the PTH can lead to twisted LED after

clinching. On the other hand, undersizing the PTH can

cause difficulty inserting the TH LED.

Refer to the Broadcom application note AN5334 for more

information about soldering and handling of high brightness

TH LED lamps.

Figure 13: Example of Wave Soldering Temperature Profile for TH LED

260 °C Max

Recommended solder:

Sn63 (Leaded solder alloy8

SAC305 (Lead free solder alloy8

Flux: Rosin ﬂux

Solder bath temperature: 255°C 5°C

(maximum peak temperature = 260°C8

105 °C Max

Dwell time: 3.0 sec - 5.0 sec

(maximum = 5sec8

60sec Max

Note: Allow for board to be suﬃciently

cooled to room temperature before

exerting mechanical force.

TIME (sec8

Broadcom

AV02-3139EN

T-1¾ (5 mm) High Brightness AlInGaP

Red and Amber LEDs

HLMP-EGxx, HLMP-ELxx Data Sheet

Figure 14: Ammo Packs Drawing

6.35 1.30

0.250 0.051

12.70 1.00

0.500 0.039

CATHODE

20.5 1.00

0.ꢀ070 0.0394

9.125 0.625

0.3595 0.0245

1ꢀ.00 0.50

0.70ꢀ5 0.0195

4.00 0.20

0.1575 0.0075

0.70 0.20

0.0275 0.0075

TYP.

12.70 0.30

0.500 0.012

VIEW A-A

NOTE: The ammo-packs drawing is applicable for packaging option -DD and -ZZ and regardless standoff or non-standoff.

Broadcom

AV02-3139EN

T-1¾ (5 mm) High Brightness AlInGaP

Red and Amber LEDs

HLMP-EGxx, HLMP-ELxx Data Sheet

Figure 15: Packaging Box for Ammo Packs

NOTE: The dimension for ammo pack is applicable for the device with standoff and without standoff.

Broadcom

AV02-3139EN

T-1¾ (5 mm) High Brightness AlInGaP

Red and Amber LEDs

HLMP-EGxx, HLMP-ELxx Data Sheet

Packaging Labels

Figure 16: (i) Mother Label (Available on packaging box of ammo pack and shipping box)

STANDARD LABEL LS0002

(1P) Item: Part Number

RoHS Compliant

max temp 260C

(Q) QTY: Quantity

(1T) Lot: Lot Number

LPN:

CAT: Intensity Bin

BIN: Refer to below information

(9D)MFG Date: Manufacturing Date

(P) Customer Item:

(V) Vendor ID:

(9D) Date Code: Date Code

Made In: Country of Origin

DeptID:

Figure 17: (ii) Baby Label (Only available on bulk packaging)

RoHS Compliant

max temp 260C

Lamps Baby Label

(1P) PART #: Part Number

(1T) LOT #: Lot Number

(9D)MFG DATE: Manufacturing Date

QUANTITY: Packing Quantity

C/O: Country of Origin

Customer P/N:

CAT: Intensity Bin

Supplier Code:

BIN: Refer to below information

DATECODE: Date Code

Broadcom

AV02-3139EN

T-1¾ (5 mm) High Brightness AlInGaP

Red and Amber LEDs

HLMP-EGxx, HLMP-ELxx Data Sheet

Acronyms and Definitions

BIN:

(i) Color bin only or V bin only

Applicable for part number with color bins but without V bin OR part number with V bins and no color bin.

(ii) Color bin incorporated with V Bin

Applicable for part number that have both color bin and V bin.

Example:

(i) Color bin only or V bin only

BIN: 2 (represent color bin 2 only)

BIN: VB (represent V bin VB only)

(ii) Color bin incorporate with V Bin

BIN: 2 VB

VB: V_Fbin VB

2: Color bin 2 only

Broadcom

AV02-3139EN

Disclaimer

Broadcom's products and software are not specifically designed, manufactured, or authorized for sale as parts, components,

or assemblies for the planning, construction, maintenance, or direct operation of a nuclear facility or for use in medical

devices or applications. The customer is solely responsible, and waives all rights to make claims against Broadcom or its

suppliers, for all loss, damage, expense, or liability in connection with such use.

Broadcom, the pulse logo, Connecting everything, Avago Technologies, Avago, and the A logo are among the trademarks

of Broadcom and/or its affiliates in the United States, certain other countries and/or the EU.

The term “Broadcom” refers to Broadcom Limited and/or its subsidiaries. For more information, please visit

www.broadcom.com.

Broadcom reserves the right to make changes without further notice to any products or data herein to improve reliability,

function, or design. Information furnished by Broadcom is believed to be accurate and reliable. However, Broadcom does

not assume any liability arising out of the application or use of this information, nor the application or use of any product or

circuit described herein, neither does it convey any license under its patent rights nor the rights of others.

HLMP-EG2H-XZ0DD [BOARDCOM]

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