HLMP-EH25-QT000 [BOARDCOM]
Precision Optical Performance AlInGaP II LED Lamps;
| 型号： | HLMP-EH25-QT000 |
| 厂家： | 
Broadcom Corporation. |
| 描述： | Precision Optical Performance AlInGaP II LED Lamps 光电 |
| 文件： | 总13页 (文件大小：280K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
HLMP-ELxx, HLMP-EHxx, HLMP-EDxx
Precision Optical Performance AlInGaP II LED Lamps
Data Sheet
Description
Features
• Well defined spatial radiation patterns
• Viewing angles: 15°, 23°, 30°
• High luminous output
Precision Optical Performance AlInGaP II (aluminum indi-
um gallium phosphide) LEDs offer superior light output
for excellent readability in sunlight and dependable per-
formance. The AlInGaP II technology provides extremely
stable light output over long periods of time.
• Colors:
592 nm Amber
617 nm Reddish-Orange
630 nm Red
3
These LED lamps are untinted, nondiffused, T-1 / pack-
4
ages incorporating second generation optics which pro-
duce well defined radiation patterns at specific viewing
cone angles.
• High operating temperature:
T
JLED
=+130°C
These lamps are made with an advanced optical grade
epoxy offering superior high temperature and high
moisture resistance performance in outdoor signal and
sign applications. The maximum LED junction tempera-
ture limit of +130°C enables high temperature operation
in bright sunlight conditions. The epoxy contains both
uv-a and uv-b inhibitors to reduce the effects of long
term exposure to direct sunlight.
• Superior resistance to moisture
Applications
• Traffic management:
Traffic signals
Work zone warning lights
Variable message signs
• Commercial outdoor advertising:
Signs
Marquees
Benefits
• Viewing angles match traffic management require-
ments
• Automotive:
Exterior and interior lights
• Colors meet automotive and traffic signal specifica-
tions
• Superior light output performance in outdoor environ-
ments
• Suitable for autoinsertion into PC boards
3
T-1 / (5 mm) Precision Optical Performance AlInGaP II LED Lamps
4
Selection Guide
Luminous
Intensity Iv (mcd)
@ I(f) = 20 mA
Typical Viewing Color and
[3,4,5]
Angle
Dominant
Wavelength
1
2q /
Lamps Without Standoffs
(Outline Drawing A)
Lamps With Standoffs
(Outline Drawing B)
2
[2]
[1]
(Deg.)
(nm), Typ.
Min.
Max.
15°
Amber 592
HLMP-EL16-S0000
HLMP-EL16-TW000
HLMP-EL16-UX000
HLMP-EL16-UXR00
HLMP-EL16-VW000
HLMP-EL16-VX400
HLMP-EL16-VY000
HLMP-EL16-VYR00
HLMP-EL16-VYK00
HLMP-EL16-VYS00
HLMP-EL18-S0000
1900
2500
3200
3200
4200
7200
4200
4200
4200
4200
2500
3200
4200
1900
2500
2500
3200
3200
4200
–
7200
9300
9300
7200
21000
12000
12000
12000
12000
7200
9300
9300
–
HLMP-EL18-UX000
HLMP-EL18-VY000
HLMP-EL18-VYR00
HLMP-EL18-VYS00
HLMP-EH18-UX000
Red-Orange 617 HLMP-EH16-TW000
HLMP-EH16-UX000
HLMP-EH16-VX0DD
Red 630
HLMP-ED16-S0000
HLMP-ED16-TW000
HLMP-ED18-S0000
HLMP-ED18-TW000
HLMP-ED18-TWT00
HLMP-ED18-UX000
HLMP-ED18-UXT00
HLMP-ED18-VX000
7200
7200
9300
9300
9300
HLMP-ED16-UX000
HLMP-ED16-UXT00
HLMP-ED16-VX000
Notes:
1. Dominant Wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d
2. ꢀq is the off-axis angle where the luminous intensity is one half the on-axis intensity.
1/2
3. The luminous intensity is measured on the mechanical axis of the lamp package.
4. The optical axis is closely aligned with the package mechanical axis.
5. Tolerance for each intensity bin limit is 15ꢀ.
2
3
T-1 / (5 mm) Precision Optical Performance AlInGaP II Led Lamps (Continued)
4
Selection Guide
Luminous
Intensity Iv (mcd)
@ I(f) = 20 mA
Typical Viewing Color and
[3,4,5]
Angle
Dominant
Wavelength
(nm), Typ.
1
2q /
Lamps Without Standoffs
(Outline Drawing A)
Lamps With Standoffs
(Outline Drawing B)
2
[2]
[1]
(Deg.)
Min.
Max.
–
23°
Amber 592
HLMP-EL25-Q0000
HLMP-EL27-Q0000
HLMP-EL27-QTR00
HLMP-EL27-RU000
1150
1150
1500
1900
1900
1900
1900
2500
2500
2500
2500
3200
1150
1900
2500
3200
3200
1900
2500
2500
3200
4200
4200
5500
5500
5500
7200
7200
7200
7200
9300
3200
5500
7200
9300
9300
5500
7200
7200
HLMP-EL25-RU000
HLMP-EL25-SU000
HLMP-EL25-SVK00
HLMP-EL25-SV000
HLMP-EL25-SVR00
HLMP-EL25-TW000
HLMP-EL25-TWR00
HLMP-EL25-TWK00
HLMP-EL25-TWS00
HLMP-EL25-UX000
HLMP-EL27-SV000
HLMP-EL27-SVR00
HLMP-EL27-TW000
HLMP-EL27-TWR00
Red-Orange 617 HLMP-EH25-QT000
HLMP-EH25-SV000
HLMP-EH27-QT000
HLMP-EH27-TW000
HLMP-EH25-TW000
Red 630
HLMP-ED25-RU000
HLMP-ED25-RUT00
HLMP-ED25-SV000
HLMP-ED25-TW000
HLMP-ED25-TWT00
HLMP-ED27-SV000
HLMP-ED27-TW000
HLMP-ED27-TWT00
Notes:
1. Dominant Wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d
2. ꢀq is the off-axis angle where the luminous intensity is one half the on-axis intensity.
1/2
3. The luminous intensity is measured on the mechanical axis of the lamp package.
4. The optical axis is closely aligned with the package mechanical axis.
5. Tolerance for each intensity bin limit is 15ꢀ.
3
3
T-1 / (5 mm) Precision Optical Performance AlInGaP II Led Lamps (Continued)
4
Selection Guide
Luminous
Intensity Iv (mcd)
@ I(f) = 20 mA
Typical Viewing Color and
[3,4,5]
Angle
Dominant
Wavelength
1
2q /
Lamps Without Standoffs
(Outline Drawing A)
Lamps With Standoffs
(Outline Drawing B)
2
[2]
[1]
(Deg.)
(nm), Typ.
Min.
Max.
30°
Amber 592
HLMP-EL31-P0000
HLMP-EL31-QT000
HLMP-EL31-QTR00
HLMP-EL31-SV000
HLMP-EL31-SVK00
HLMP-EL31-SVR00
HLMP-EL31-STR00
HLMP-EL31-SUK00
HLMP-EL31-SUS00
HLMP-EL31-SUR00
HLMP-EL31-SVK00
HLMP-EL31-SVS00
880
–
HLMP-EL33-QT000
HLMP-EL33-SV000
HLMP-EL33-SVR00
1150
1150
1900
1900
1900
1900
1900
1900
1900
1900
1900
1150
1500
1900
1150
1150
1900
1900
1500
1500
1900
1900
3200
3200
5500
5500
5500
3200
4200
4200
4200
5500
5500
3200
4200
5500
–
Red-Orange 617 HLMP-EH31-QT000
HLMP-EH33-RU000
HLMP-EH33-SV000
HLMP-ED33-Q0000
HLMP-EH31-SV000
Red 630
HLMP-ED31-Q0000
HLMP-ED31-QTT00
HLMP-ED31-ST000
HLMP-ED31-SUT00
HLMP-ED31-RU000
HLMP-ED31-RUT00
HLMP-ED31-SV000
HLMP-ED31-SVT00
3200
3200
4200
4200
4200
5500
5500
HLMP-ED33-RUT00
HLMP-ED33-SV000
HLMP-ED33-SVT00
Notes:
1. Dominant Wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
d
2. ꢀq is the off-axis angle where the luminous intensity is one half the on-axis intensity.
1/2
3. The luminous intensity is measured on the mechanical axis of the lamp package.
4. The optical axis is closely aligned with the package mechanical axis.
5. Tolerance for each intensity bin limit is 15ꢀ.
4
Part Numbering System
HLMP- x x xx - x x x xx
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
YY: Flexi-Bin, Bulk Packaging
ZZ: Flexi-Bin; Ammo Pack
Color Bin & V Selections
F
0: No color bin limitation
4: Amber color bin 4 only
K: Amber color bins 2 and 4 only
L: Color bins 4 and 6
R: Amber color bins 1, 2, 4, and 6 with V max of 2.6 V
F
S: Amber color bins 2 and 4 with V max of 2.6 V
F
T: Red color with V max of 2.6 V
F
U: Amber color bin 4 with V max of 2.6 V
F
W: Color bins 2, 4 and 6 with V max of 2.6 V
F
Y: Color bins 4 and 6 with V max of 2.6 V
F
Maximum Intensity Bin
0: No Iv bin limitation
Minimum Intensity Bin
Viewing Angle and Lead Standoffs
16: 15 degree without lead standoffs
18: 15 degree with lead standoffs
25: 23 degree without lead standoffs
27: 23 degree with lead standoffs
31: 30 degree without lead standoffs
33: 30 degree with lead standoffs
Color
D: 630 nm Red
H: 617 nm Red-Orange
L: 592 nm Amber
Package
E: 5 mm Round
Note: Please refer to AB 5337 for complete information on part numbering system.
5
Package Dimensions
A
B
5.00 0.20
(0.197 0.008)
5.00 0.20
(0.197 0.008)
1.14 0.20
(0.045 0.008)
8.71 0.20
(0.343 0.008)
8.71 0.20
(0.343 0.008
d
1.14 0.20
(0.045 0.008)
2.35 (0.093)
MAX.
31.60
(1.244)
31.60
MIN.
MIN.
0.70 (0.028)
MAX.
(1.244)
1.50 0.15
(0.059 0.006)
0.70 (0.028)
MAX.
PART NO.
d
HLMP-EX18-xxxxx
12.60 0.18
(0.496 0.007)
CATHODE
LEAD
CATHODE
LEAD
HLMP-EX27-xxxxx
HLMP-EX33-xxxxx
11.33 0.25
(0.446 0.010)
11.99 0.25
(0.472 0.010)
0.50 0.10
(0.020 0.004)
0.50 0.10
(0.020 0.004)
SQ. TYP.
SQ. TYP.
1.00
(0.039)
1.00
(0.039)
MIN.
MIN.
5.80 0.20
(0.228 0.008)
5.80 0.20
(0.228 0.008)
CATHODE
FLAT
CATHODE
FLAT
2.54 0.38
(0.100 0.015)
2.54 0.38
(0.100 0.015)
Absolute Maximum Ratings at T = 25°C
A
[1,2,3]
DC Forward Current
Peak Pulsed Forward Current
..................................................................................... 50 mA
[2,3]
.......................................................................100 mA
Average Forward Current ...................................................................................... 30 mA
Reverse Voltage (I = 100 µA)........................................................................................ 5 V
R
LED Junction Temperature....................................................................................... 130°C
Operating Temperature .........................................................................-40°C to +100°C
Storage Temperature ..............................................................................-40°C to +100°C
Notes:
1. Derate linearly as shown in Figure 4.
2. For long term performance with minimal light output degradation, drive currents between
10 mA and 30 mA are recommended. For more information on recommended drive condi-
tions, please refer to Application Brief I-024 (5966-3087E).
3. Please contact your sales representative about operating currents below 10 mA.
6
Electrical/Optical Characteristics at T = 25°C
A
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Forward Voltage
IF = 20 mA
Amber (λd = 592 nm)
Red-Orange (λd = 617 nm)
Red (λd = 630 nm)
2.3
2.35
2.4
VF
VR
2.6[1]
V
V
Reverse Voltage
5
20
IR = 100 µA
Peak Wavelength
Amber
Red-Orange
Red
Peak of Wavelength of
Spectral Distribution
at IF = 20 mA
594
623
639
λPEAK
∆λ1/2
ts
nm
nm
ns
Spectral Halfwidth
17
Wavelength Width at Spectral Distrib-
ution 1/2 Power Point at IF = 20 mA
Speed of Response
20
Exponential Time
Constant, e-t/t
s
Capacitance
C
40
pF
VF = 0, f = 1 MHz
Thermal Resistance
RQJ-PIN
240
°C/W
LED Junction-to-Cathode Lead
Luminous Efficacy[2]
Amber
Red-Orange
Red
Emitted Luminous
Power/Emitted Radiant Power
at If = 20 mA
500
235
155
hv
lm/W
mlm
Luminous Flux
j
V
1000
IF = 20 mA
Luminous Efficiency [3]
Amber
h
e
Emitted
Luminous Flux/
Electrical Power
22
22
21
Red-Orange
Red
lm/W
Notes:
1. For options -xxRxx, -xxSxx, -xxTxx, -xxUxx, -xxWxx, -xxYxx, max forward voltage (Vf) is 2.6 V. Refer to Vf bin table.
2. The radiant intensity, I , in watts per steradian, may be found from the equation I = I /h , where I is the luminous intensity in candelas and h
e
e
v
v
v
v
is the luminous efficacy in lumens/watt.
3. h = j / I x V , where j is the emitted luminous flux, I is electrical forward current and V is the forward voltage.
e
V
F
F
V
F
F
1.0
60
50
40
30
20
10
0
RED-ORANGE
RED
AMBER
0.5
AMBER
RED
2.5
0
550
600
650
700
0
0.5
1.0
1.5
2.0
3.0
WAVELENGTH – nm
FORWARD VOLTAGE – V
Figure 1. Relative Intensity vs. Peak Wavelength.
Figure 2a. Forward Current vs. Forward Voltage for
Option -xxRxx, -xxSxx, -xxTxx, -xxUxx, -xxWxx and
-xxYxx.
7
100
90
80
70
60
50
40
30
2.5
2.0
1.5
1.0
55
50
45
40
35
30
25
20
15
10
5
RED & RED-ORANGE
RED
AMBER
AMBER
2.5
0.5
0
20
10
0
0
0
10
20
30
40
50
0
20
40
60
80
100
120
1.0
1.5
2.0
3.0
FORWARD CURRENT – mA
T
– AMBIENT TEMPERATURE – C
V
– FORWARD VOLTAGE – V
A
F
Figure 2b. Forward Current vs. Forward Voltage.
Figure 3. Relative Luminous Intensity vs. Forward
Current.
Figure 4. Maximum Forward Current vs. Ambient Tem-
perature. Derating Based on T = 130°C.
JMAX
1.0
0.8
0.6
0.4
0.2
0
-100
-50
0
50
100
ANGULAR DISPLACEMENT – DEGREES
Figure 5. Representative Spatial Radiation Pattern for 15° Viewing Angle Lamps.
1.0
0.8
0.6
0.4
0.2
0
-100
-50
0
50
100
ANGULAR DISPLACEMENT – DEGREES
Figure 6. Representative Spatial Radiation Pattern for 23° Viewing Angle Lamps.
8
1.0
0.8
0.6
0.4
0.2
0
-100
-50
0
50
100
ANGULAR DISPLACEMENT – DEGREES
Figure 7. Representative Spatial Radiation Pattern for 30° Viewing Angle Lamps.
10
RED-ORANGE
1
RED
AMBER
0.1
-50
-25
0
25
50
75
100
125
150
JUNCTION TEMPERATURE – C
Figure 8. Relative light output vs. junction temperature
Amber Color Bin Limits
(nm at 20 mA)
Intensity Bin Limits
(mcd at 20 mA)
[2]
Vf Bin Table
Bin Name
Bin Name
Min.
Max.
Bin Name
Min.
Max.
Min.
2.0
2.2
2.4
Max.
2.2
1
2
4
6
584.5
587.0
589.5
592.0
587.0
589.5
592.0
594.5
P
880
1150
1500
1900
2500
3200
4200
5500
7200
9300
12000
16000
VA
VB
VC
Q
R
S
1150
1500
1900
2500
3200
4200
5500
7200
9300
12000
2.4
2.6
Tolerance for each bin limit is 0.05 V.
T
Tolerance for each bin limit is 0.5 nm.
U
V
W
X
Y
Z
Notes:
1. Bin categories are established for classifi-
cation of products. Products may not be
available in all bin categories.
2. Vf Bin table only available for those part
number with options -xxRxx, -xxSxx, -xx-
Txx, -xxUxx, -xxWxx, -xxYxx.
Tolerance for each bin limit is 15ꢀ.
9
Note:
Precautions:
Lead Forming:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
• The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
• For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
• If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms
a mechanical ground which prevents mechanical
stress due to lead cutting from traveling into LED
package. This is highly recommended for hand solder
operation, as the excess lead length also acts as small
heat sink.
Avago Technologies LED configuration
Soldering and Handling:
• CaremustbetakenduringPCBassemblyandsoldering
process to prevent damage to the LED component.
CATHODE
• LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The
closest manual soldering distance of the soldering
heat source (soldering iron’s tip) to the body is
1.59mm. Soldering the LED using soldering iron tip
closer than 1.59mm might damage the LED.
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
• Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
1.59mm
• At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of alignment fixture or pallet.
• ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
• If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
• Recommended soldering condition:
Wave
Soldering
Manual Solder
Dipping
[1, 2]
• Recommended PC board plated through holes (PTH)
Pre-heat temperature 105 °C Max.
-
size for LED component leads.
Preheat time
Peak temperature
Dwell time
60 sec Max
250 °C Max.
3 sec Max.
-
LED component
lead size
Plated through
hole diameter
260 °C Max.
5 sec Max
Diagonal
0.45 x 0.45 mm
0.636 mm
0.98 to 1.08 mm
(0.018x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm
(0.020x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)
• Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
• Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
10
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
Recommended solder:
LAMINAR WAVE
HOT AIR KNIFE
Sn63 (Leaded solder alloy)
TURBULENT WAVE
SAC305 (Lead free solder alloy)
250
200
150
100
50
Flux: Rosin ꢀux
Solder bath temperature:
245°C 5°C (maximum peaꢁ
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
suꢂciently cooled to room
temperature before exerting
mechanical force.
PREHEAT
0
90
100
30
40
80
10
20
60
70
50
TIME (SECONDS)
Ammo Pack Drawing
6.35 1.30
(0.25 0.0512)
12.70 1.00
(0.50 0.0394)
CATHODE
20.50 1.00
(0.807 0.039)
9.125 0.625
(0.3593 0.0246)
18.00 0.50
(0.7087 0.0197)
A
A
4.00 0.20
(0.1575 0.008)
12.70 0.30
(0.50 0.0118)
∅
TYP.
VIEW A–A
0.70 0.20
(0.0276 0.0079)
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
11
Packaging Box for Ammo Packs
LABEL ON
THIS SIDE
OF BOX.
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
O
+
N
G
L
A
O
S
E
A
C
V
N
E
I
D
A
H
O
G
O
A
E
D
O
C
E
H
T
A
–
T
C
ANODE LEAD LEAVES
THE BOX FIRST.
L
E
B
A
L
R
E
H
T
O
M
NOTE: THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
STANDARD LABEL LS0002
RoHS Compliant
(1P) Item: Part Number
e3
max temp 250C
(Q) QTY: Quantity
(1T) Lot: Lot Number
LPN:
CAT: Intensity Bin
BIN: Refer to below information
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
(9D) Date Code: Date Code
Made In: Country of Origin
DeptID:
12
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant
e3
max temp 250C
Lamps Baby Label
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
QUANTITY: Packing Quantity
C/O: Country of Origin
Customer P/N:
CAT: Intensity Bin
Supplier Code:
BIN: Refer to below information
DATECODE: Date Code
Acronyms and Definition:
BIN:
Example:
(i) Color bin only or VF bin only
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and
no color bin)
BIN: VB (represent VF bin “VB”only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
OR
(ii) Color bin incorporated with VF Bin
VB: VF bin “VB”
(Applicable for part number that have both color
bin and VF bin)
2: Color bin 2 only
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLE-
AR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO
MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2014 Avago Technologies. All rights reserved. Obsoletes AVO1-0701EN
AV02-342EN - July 18, 2014
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