HLMP-EL2B-XYKXX [BOARDCOM]

New T-1Â¾ (5mm) Extra High Brightness AlInGaP LED Lamps;


型号：	HLMP-EL2B-XYKXX
厂家：	Broadcom Corporation.
描述：	New T-1Â¾ (5mm) Extra High Brightness AlInGaP LED Lamps
文件：	总11页 (文件大小：385K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

HLMP-EGxx, HLMP-EHxx, HLMP-ELxx

New T-1¾ (5mm) Extra High Brightness AlInGaP LED Lamps

Data Sheet

Description

Features

These Precision Optical Performance AlInGaP LEDs

provide superior light output for excellent readability in

sunlight and are extremely reliable. AlInGaP LED tech-

nology provides extremely stable light output over long

periods of time. Precision Optical Performance lamps

utilize the aluminum indium gallium phosphide (AlInGaP)

technology.

• Viewing angle: 15°, 23°, 30°

• High luminous output

•ꢀ Colors:

590nm Amber

615nm Red Orange

626nm Red

•ꢀ Package options:

With or without lead standoﬀ

These LED lamps are untinted, T-1¾ packages incorpo-

rating second generation optics producing well deﬁned

spatial radiation patterns at speciﬁc viewing cone angles.

•ꢀ Superior resistance to moisture

These lamps are made with an advanced optical grade

epoxy oﬀering superior high temperature and high

moisture resistance performance in outdoor signal and

sign application. The maximum LED junction tempera-

ture limit of +130°C enables high temperature operation

in bright sunlight conditions. The epoxy contains both

uv-a and uv-b inhibitors to reduce the eﬀects of long

term exposure to direct sunlight.

•ꢀ Untinted for 15°, 23° and 30° lamps

Applications

•ꢀꢀ Traﬃc management:

Traﬃc signals

Pedestrian signals

Work zone warning lights

Variable message signs

Beneﬁts

• Solar Power signs

•ꢀꢀ Superior performance for outdoor environments

•ꢀꢀ Suitable for auto-insertion onto PC board

• Commercial outdoor advertising

Signs

Marquees

Package Dimension

A: Non-standoﬀ

5.00 0.20

(0.197 0.008)

5.00 0.20

(0.197 0.008)

1.14 0.20

(0.045 0.008)

8.71 0.20

(0.343 0.008)

8.71 0.20

(0.343 0.008)

1.14 0.20

(0.045 0.008)

2.35 (0.093)

MAX.

0.70 (0.028)

MAX.

1.50 0.15

(0.059 0.006)

31.60

MIN.

31.60

(1.244)

MIN.

(1.244)

0.70 (0.028)

MAX.

CATHODE

LEAD

CATHODE

LEAD

0.50 0.10

(0.020 0.004)

0.50 0.10

(0.020 0.004)

SQ. TYP.

1.00

MIN.

1.00

(0.039)

MIN.

(0.039)

5.80 0.20

(0.228 0.008)

5.80 0.20

(0.228 0.008)

CATHODE

FLAT

CATHODE

FLAT

2.54 0.38

(0.100 0.015)

2.54 0.38

(0.100 0.015)

Viewing Angle

15°

12.39 0.25

(0.476 0.010)

23° & 30°

11.96 0.25

(0.459 0.010)

Notes:

1. All dimensions are in millimeters (inches)

2. Leads are mild steel with tin plating.

3. The epoxy meniscus is 1.21mm max

4. For Identiﬁcation of polarity after the

leads are trimmed oﬀ, please refer to the

illustration below:

CATHODE

ANODE

Device Selection Guide

Typical viewing

Luminous Intensity

Color and Dominant

Wavelength (nm),

Lamps without Standoﬀ

on leads

(Package drawing A)

Lamps with Standoﬀ

on leads

(Package drawing B)

[1,2,5]

Iv (mcd)

at 20 mA

Angle

[4]

[3]

2θ (Deg)

Typ

Min

Max

1/2

15°

Amber 590

HLMP-EL1A-Z1Kxx

HLMP-EL1A-Z1LDD

HLMP-EG1A-Z10xx

HLMP-EH1A-Z10DD

HLMP-EL2A-XYKxx

HLMP-EL2A-XYLDD

HLMP-EG2A-XY0xx

HLMP-EH2A-XY0DD

HLMP-EL3A-WXKxx

HLMP-EL3A-WXLDD

HLMP-EG3A-WX0xx

HLMP-EH3A-WX0xx

HLMP-EL1B-Z1Kxx

HLMP-EL1B-Z1LDD

HLMP-EG1B-Z10DD

HLMP-EH1B-Z10DD

HLMP-EL2B-XYKxx

HLMP-EL2B-XYLDD

HLMP-EG2B-XY0xx

HLMP-EH2B-XY0DD

HLMP-EL3B-WXKxx

HLMP-EL3B-WXLDD

HLMP-EG3B-WX0xx

HLMP-EH3B-WX0DD

12000

7200

5500

21000

12000

9300

Red 626

Red Orange 615

Amber 590

23°

Red 626

Red Orange 615

Amber 590

30°

9300

Red 626

9300

Red Orange 615

9300

Notes:

1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.

2. The optical axis is closely aligned with the package mechanical axis.

3. Dominant wavelength, λ , is derived from the CIE Chromaticity Diagram and represents the color of the lamp.

θ is the oﬀ-axis angle where the luminous intensity is half the on-axis intensity.

5. Tolerance for each bin limit is 15ꢀ

Part Numbering System

HLMP – E x xx - x x x xx

Mechanical Options

00: Bulk packaging

DD : Ammo Pack

Color Bin Selections

0 : Full color distribution

K : Color Bin 2 & 4

L : Color Bin 4 & 6

Maximum Intensity Bin

Refer to Device Selection Guide

Minimum Intensity Bin

Refer to Device Selection Guide

Viewing Angle and Lead Standoꢀs

1A: 15° without lead standoꢀ

1B: 15° with lead standoꢀ

2A: 23° without lead standoꢀ

2B: 23° with lead standoꢀ

3A: 30° without lead standoꢀ

3B: 30° with lead standoꢀ

Color

G : Red 626nm

L : Amber 590nm

H: Red Orange 615nm

Note: Please refer to AB 5337 for complete information on part numbering system.

Absolute Maximum Ratings

T_J= 25°C

Parameter

Red/ Amber/ Red Orange

Unit

DC Forward Current ^[2]

Peak Forward Current

Average forward current

Power Dissipation

100 ^[1]

120

Reverse Voltage

Operating Temperature Range

Storage Temperature Range

-40 to +100

°C

Notes:

1. Duty Factor 30ꢀ, frequency 1KHz.

2. Derate linearly as shown in Figure 4

Electrical / Optical Characteristics

T = 25°C

Parameter

Symbol

Min

Typ.

Max

Units

Test Conditions

Forward Voltage

I_F= 20 mA

Amber/ Red / Red Orange

V_F

V_R

l_d

1.8

2.1

2.4

Reverse Voltage

Dominant Wavelength ^[1]

I_R= 100 μA

I_F= 20 mA

Amber

Red

Red Orange

584.5

618.0

612.0

590.0

626.0

615.0

594.5

630.0

619.0

Peak Wavelength

Amber

l_PEAK

Peak of Wavelength of

Spectral Distribution

at I_F= 20 mA

594

634

621

Red

Red Orange

Spectral Halfwidth

Amber

Δl_1/2

Red

Red Orange

Thermal resistance

Luminous Eﬃcacy ^[2]

Amber

Rq_J-PIN

240

°C/W

lm/W

LED junction to anode lead

η_v

Emitted Luminous Flux/

Emitted Radiant Flux

500

200

265

Red

Red Orange

Luminous Flux

Amber

Red

Red Orange

Luminous Eﬃciency ^[3]

Amber

Φ_v

η_e

mlm

I_F= 20 mA

2100

2300

lm/W

nm/°C

Emitted Luminous

Flux/Electrical Power

Red

Red Orange

Thermal coeﬃcient of ld

I_F= 20 mA ;

Amber

Red

Red Orange

0.08

0.05

0.07

+25°C ≤ T_J≤ +100°C

Notes:

1. The dominant wavelength, λ is derived from the CIE Chromaticity Diagram referenced to Illuminant E. Tolerance for each color of dominant

wavelength is +/- 0.5nm.

2. The radiant intensity, I in watts per steradian, maybe found from the equation I = I / η where Iv is the luminous intensity in candela and η is

the luminous eﬃcacy in lumens/ watt.

η = Φ /I x V where Φ is the emitted luminous ﬂux, I is electrical forward current and V is the forward voltage.

e v F F v F F

100

1.0

0.8

0.6

0.4

0.2

0.0

Red Orange

Red

Amber

500

550

600

WAVELENGTH - nm

650

FORWARD VOLTAGE-V

Figure 1. Relative Intensity vs Peak Wavelength

Figure 2. Forward Current vs Forward Voltage

5.0

4.5

4.0

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0.0

100

T_A- AMBIENT TEMPERATURE - C

DC FORWARD CURRENT - mA

Figure 3. Relative Luminous Intensity vs Forward Current

Figure 4. Maximum Forward Current vs Ambient Temperature

1.0

0.8

0.6

0.4

0.2

0.0

1.0

0.8

0.6

0.4

0.2

0.0

-90

-60

-30

-90

-60

-30

ANGULAR DISPLACEMENT-DEGREE

Figure 5.Radiation Pattern for 15° Viewing Angle Lamp

Figure 6. Radiation Pattern for 23° Viewing Angle Lamp

1.0

0.8

0.6

0.4

0.2

0.0

-90

-60

-30

ANGULAR DISPLACEMENT-DEGREE

Figure 7. Radiation Pattern for 30° Viewing Angle Lamp

Relative Light Output vs Junction Temperature

10.0

Red Orange

Red

Amber

1.0

0.1

-40

-20

100

120

140

T_J- JUNCTION TEMPERATURE - °C

Relative Forward Voltage vs Junction Temperature

0.20

0.15

Red Orange

Red

0.10

Amber

0.05

0.00

-0.05

-0.10

-0.15

-0.20

-0.25

-0.30

-40

-20

100

120

140

T_J- JUNCTION TEMPERATURE - °C

Intensity Bin Limit Table (1.3:1 Iv bin ratio)

Intensity (mcd) at 20mA

Red Color Range

Min

Dom

Max

Dom

X min

Y Min

X max

Y max

Bin

Min

Max

618

630

0.6872

0.6690

0.3126

0.3149

0.6890

0.7080

0.2943

0.2920

4200

5500

7200

9300

12000

16000

5500

7200

9300

12000

16000

21000

Tolerance for each bin limit is 0.5nm

Amber Color Range

Min

Dom

Max

Dom

Bin

Xmin

Ymin

Xmax Ymax

Tolerance for each bin limit is 15ꢀ

587

589.5

0.5570 0.4420 0.5670 0.4250

0.5530 0.4400 0.5720 0.4270

0.5720 0.4270 0.5820 0.4110

0.5670 0.4250 0.5870 0.4130

0.5870 0.4130 0.5950 0.3980

0.5820 0.4110 0.6000 0.3990

VF Bin Table (V at 20mA)

589.5

592

Bin ID

Min

1.8

2.0

2.2

Max

2.0

2.2

2.4

594.5

Tolerance for each bin limit is 0.5nm

Tolerance for each bin limit is 0.05V

Red Orange Color Range

Min

Dom

Max

Dom

Xmin

Ymin

Xmax

Ymax

612

619

0.6712

0.3280

0.6887

0.3109

0.6716

0.3116

0.6549

0.3282

Tolerance for each bin limit 0.5nm

Note:

All bin categories are established for classiﬁcation of products. Products

may not be available in all bin categories. Please contact Avago

representative for further information.

Avago Color Bin on CIE 1931 Chromaticity Diagram

0.460

0.440

0.420

Amber

0.400

0.380

0.360

0.340

0.320

0.300

0.280

Red Orange

Red

0.500

0.550

0.600

0.650

0.700

0.750

0.800

Precautions:

Lead Forming:

Note:

• The leads of an LED lamp may be preformed or cut to

1. PCB with diﬀerent size and design (component density) will have

diﬀerent heat mass (heat capacity). This might cause a change in

temperature experienced by the board if same wave soldering

setting is used. So, it is recommended to re-calibrate the soldering

proﬁle again before loading a new type of PCB.

2. Avago Technologies’ high brightness LED are using high eﬃciency

LED die with single wire bond as shown below. Customer is advised

to take extra precaution during wave soldering to ensure that the

maximum wave temperature does not exceed 260°C and the solder

contact time does not exceeding 5sec. Over-stressing the LED

during soldering process might cause premature failure to the LED

due to delamination.

length prior to insertion and soldering on PC board.

• For better control, it is recommended to use proper

tool to precisely form and cut the leads to applicable

length rather than doing it manually.

• If manual lead cutting is necessary, cut the leads after

the soldering process. The solder connection forms a

mechanical ground which prevents mechanical stress

due to lead cutting from traveling into LED package.

This is highly recommended for hand solder operation,

as the excess lead length also acts as small heat sink.

Avago Technologies LED Conﬁguration

Soldering and Handling:

• Care must be taken during PCB assembly and

soldering process to prevent damage to the LED

component.

• LED component may be eﬀectively hand soldered

to PCB. However, it is only recommended under

unavoidable circumstances such as rework. The closest

manual soldering distance of the soldering heat

source (soldering iron’s tip) to the body is 1.59mm.

Soldering the LED using soldering iron tip closer than

1.59mm might damage the LED.

Anode

Note: Electrical connection between bottom surface of LED die and

the lead frame is achieved through conductive paste.

• Any alignment ﬁxture that is being applied during

wave soldering should be loosely ﬁtted and should

not apply weight or force on LED. Non metal material

is recommended as it will absorb less heat during

wave soldering process.

1.59mm

• ESD precaution must be properly applied on the

soldering station and personnel to prevent ESD

damage to the LED component that is ESD sensitive.

Do refer to Avago application note AN 1142 for details.

The soldering iron used should have grounded tip to

ensure electrostatic charge is properly grounded.

Note: In order to further assist customer in designing jig accurately

that ﬁt Avago Technologies’ product, 3D model of the product is

available upon request.

• At elevated temperature, LED is more susceptible to

mechanical stress. Therefore, PCB must allowed to cool

down to room temperature prior to handling, which

includes removal of alignment ﬁxture or pallet.

• Recommended soldering condition:

• If PCB board contains both through hole (TH) LED and

other surface mount components, it is recommended

that surface mount components be soldered on the

top side of the PCB. If surface mount need to be on the

bottom side, these components should be soldered

using reﬂow soldering prior to insertion the TH LED.

Wave Soldering Manual Solder

[1, 2]

Dipping

Pre-heat temperature 105 °C Max.

Preheat time

Peak temperature

Dwell time

60 sec Max

260 °C Max.

5 sec Max.

260 °C Max.

5 sec Max

• Recommended PC board plated through holes (PTH)

size for LED component leads.

Note:

1) Above conditions refers to measurement with thermocouple

mounted at the bottom of PCB.

2) It is recommended to use only bottom preheaters in order to reduce

thermal stress experienced by LED.

LED component

lead size

Plated through

hole diameter

Diagonal

0.45 x 0.45 mm

0.636 mm

0.98 to 1.08 mm

(0.018x 0.018 inch) (0.025 inch)

0.50 x 0.50 mm 0.707 mm

(0.020x 0.020 inch) (0.028 inch)

(0.039 to 0.043 inch)

• Wave soldering parameters must be set and

maintained according to the recommended

temperature and dwell time. Customer is advised

to perform daily check on the soldering proﬁle to

ensure that it is always conforming to recommended

soldering conditions.

1.05 to 1.15 mm

(0.041 to 0.045 inch)

• Over-sizing the PTH can lead to twisted LED after

clinching. On the other hand under sizing the PTH can

cause diﬃculty inserting the TH LED.

Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.

Example of Wave Soldering Temperature Proﬁle for TH LED

260 °C Max

Recommended solder:

Sn63 (Leaded solder alloy)

SAC305 (Lead free solder alloy)

Flux: Rosin flux

Solder bath temperature: 255°C 5°C

(maximum peak temperature = 260°C)

105 °C Max

Dwell time: 3.0 sec - 5.0 sec

(maximum = 5sec)

60sec Max

Note: Allow for board to be sufficiently

cooled to room temperature before

exerting mechanical force.

TIME (sec)

Ammo Packs Drawing

Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoﬀ or non-standoﬀ

Packaging Box for Ammo Packs

Note: The dimension for ammo pack is applicable for the device with standoﬀ and without standoﬀ.

Packaging Label:

(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)

STANDARD LABEL LS0002

RoHS Compliant

(1P) Item: Part Number

max temp 260C

(Q) QTY: Quantity

(1T) Lot: Lot Number

LPN:

CAT: Intensity Bin

BIN: Refer to below information

(9D)MFG Date: Manufacturing Date

(P) Customer Item:

(V) Vendor ID:

(9D) Date Code: Date Code

Made In: Country of Origin

DeptID:

(ii) Avago Baby Label (Only available on bulk packaging)

RoHS Compliant

max temp 260C

Lamps Baby Label

(1P) PART #: Part Number

(1T) LOT #: Lot Number

(9D)MFG DATE: Manufacturing Date

QUANTITY: Packing Quantity

C/O: Country of Origin

Customer P/N:

CAT: Intensity Bin

Supplier Code:

BIN: Refer to below information

DATECODE: Date Code

Acronyms and Deﬁnition:

BIN:

Example:

(i) Color bin only or VF bin only

BIN: 2 (represent color bin 2 only)

(Applicable for part number with color bins but

without VF bin OR part number with VF bins and no

color bin)

BIN: VB (represent VF bin “VB”only)

(ii) Color bin incorporate with VF Bin

BIN: 2VB

(ii) Color bin incorporated with VF Bin

VB: VF bin “VB”

(Applicable for part number that have both color

bin and VF bin)

2: Color bin 2 only

DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE

AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR

FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE

CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.

For product information and a complete list of distributors, please go to our web site: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.

AV02-1687EN - November 5, 2014

HLMP-EL2B-XYKXX [BOARDCOM]

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