CE201210-39NJ [BOURNS]

Multi-Layer Chip Inductors; 多层片状电感器
CE201210-39NJ
型号: CE201210-39NJ
厂家: BOURNS ELECTRONIC SOLUTIONS    BOURNS ELECTRONIC SOLUTIONS
描述:

Multi-Layer Chip Inductors
多层片状电感器

电感器
文件: 总2页 (文件大小:205K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
0ꢀ05 size  
Applications  
Mobil phones  
Available in E12 Series  
High frequency  
Nickel barrier  
Lead free  
Cellular phones  
CTV, VCR, HIC, FDD  
Automotive electronics  
CE201210 Series - Multi-Layer Chip Inductors  
General Specifications  
Electrical Specifications  
Temperature Rise  
Inductance  
nH Tol. %  
Q typ.  
Test Freq. SRF MHz  
DCR  
I rms  
...................30 ˚C max. at rated current  
Operating Temperature .-55 °C to +125 °C  
Storage Temperature..-55 °C to +125 °C  
Reflow Soldering ...230 °C, 50 sec. max.  
Resistance to Soldering Heat  
Bourns Part No.  
(@ 100 MHz) L MHz  
min.  
4000  
4000  
4000  
4000  
4000  
4000  
3500  
3200  
2800  
2400  
2100  
1900  
1600  
1500  
1400  
1300  
1200  
1000  
900  
mohm max. mA max.  
CE201210-1N5D  
CE201210-1N8D  
CE201210-2N2D  
CE201210-2N7D  
CE201210-3N3J  
CE201210-3N9J  
CE201210-4N7J  
CE201210-5N6J  
CE201210-6N8J  
CE201210-8N2J  
CE201210-10NJ  
CE201210-12NJ  
CE201210-15NJ  
CE201210-18NJ  
CE201210-22NJ  
CE201210-27NJ  
CE201210-33NJ  
CE201210-39NJ  
CE201210-47NJ  
CE201210-56NJ  
CE201210-68NJ  
CE201210-82NJ  
CE201210-R10J  
CE201210-R12J  
CE201210-R15J  
CE201210-R18J  
CE201210-R22J  
CE201210-R27J  
CE201210-R33J  
CE201210-R39J  
CE201210-R47J  
1.5  
1.8  
2.2  
2.7  
3.3  
3.9  
4.7  
5.6  
6.8  
8.2  
10  
0.3 nH  
0.3 nH  
0.3 nH  
0.3 nH  
21  
18  
18  
19  
16  
18  
18  
20  
20  
21  
20  
21  
22  
24  
23  
23  
24  
23  
23  
23  
25  
24  
23  
22  
22  
23  
20  
20  
22  
17  
17  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
50  
100  
100  
100  
100  
130  
150  
200  
230  
250  
280  
300  
350  
400  
450  
500  
550  
600  
650  
700  
750  
800  
900  
900  
950  
1000  
1100  
1200  
1300  
1400  
1300  
1500  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
300  
...............................260 ˚C, 10 seconds  
Materials  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
Base Material .............................Ceramic  
Terminal.....................................Ag/Ni/Sn  
Packaging:  
0.85 mm product height  
................................4,000 pcs. per reel  
1.00 mm product height  
................................4,000 pcs. per reel  
1.25 mm product height  
................................2,000 pcs. per reel  
12  
15  
18  
22  
27  
33  
39  
47  
Product Dimensions  
A
0.20  
(A 0.00ꢀ)  
56  
68  
82  
800  
700  
600  
600  
0.5 0.3  
(0.02 0.00ꢀ)  
1.0 0.2  
(.039 0.0ꢀ)  
2.0 0.2  
(.079 .00ꢀ)  
100  
120  
150  
180  
220  
270  
330  
390  
470  
MM  
(INCHES)  
500  
DIMENSIONS:  
50  
500  
50  
400  
Model  
Dimension A  
50  
350  
0.ꢀ5  
CE201210-1N5D through  
50  
300  
(0.033)  
CE201210-82NJ  
CE201210-R10J through  
CE201210-R39J  
50  
250  
1.00  
50  
250  
(0.039)  
50  
200  
1.25  
CE201210-R47J  
(0.050)  
Packaging Specifications  
Recommended Layout  
17ꢀ.0  
(7.00)  
DIA.  
2.0 0.ꢀ  
(.079 .031)  
12.0  
(.472)  
3.0  
(.11ꢀ)  
13.0 0.5  
21.0 0.ꢀ  
(.ꢀ27 .031)  
(.512 .020)  
DIA.  
1.0  
(.039)  
60.0  
(2.362)  
1.0  
(.039)  
13.5 0.5  
(.531 .020)  
DIA.  
9.0  
(.354)  
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  
CE201210 Series - Multi-Layer Chip Inductors  
Electrical Specifications  
Q Characteristics  
DC Bias Characteristics  
1000  
100  
100  
10  
330  
100  
4R7  
1R2  
R12  
1
6N8J  
10  
10NJ  
0.1  
22NJ  
47NJ  
1000  
82NJ  
1
10  
100  
1000  
DC Current (mA)  
1
10  
100  
10000  
Frequency (MHz)  
REV. 09/20/05  
Specifications are subject to change without notice.  
Customers should verify actual device performance in their specific applications.  

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