CG0402MLC-12GA [BOURNS]
Transient Suppressor, CHIP, 0402;
| 型号： | CG0402MLC-12GA |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | Transient Suppressor, CHIP, 0402 |
| 文件： | 总4页 (文件大小：132K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
■ RoHS compliant*
Applications
■ HDMI 1.4
■ ESD protection >25 kV
■ Low capacitance <0.5 pF
■ Low leakage current <50 nA
■ Digital Visual Interface (DVI)
■ USB 3.0 / USB OTG
■ Memory protection
■ SIM card ports
ChipGuard® MLC Series - ESD Protectors
Device Symbol
General Information
The ChipGuard® MLC Series has been specifically designed to protect sensitive
electronic components from electrostatic discharge damage. The MLC family has been
designed to protect equipment to IEC61000-4-2, Level 4 (±8 kV Contact / ±15 kV Air
Discharge) ESD specifications targeted for high speed USB 3.0/USB OTG, HDMI 1.4,
DVI or IEEE1394 applications.
V
The ChipGuard® MLC Series has been manufactured to provide low 0.5 pF capacitance
and leakage currents less than 5 nA with excellent clamp qualities, making the family
almost transparent under normal working conditions.
Electrical Characteristics @ 25 °C (unless otherwise noted)
CG0402MLC-
Parameter
Symbol
Unit
3.3LG
05LG
12LG
24LG
3.3LGA 05LGA
3.3
12LGA
12
24LGA
Typical Continuous Operating Voltage
Typical Clamping Voltage (Note 1)
Maximum Capacitance @ 1 VRMS 1 MHz
Maximum Leakage Current @ Max. VDC
Typical Trigger Voltage (Note 2)
V
3.3
5
12
24
5
24
V
V
DC
V
25
0.5
5
C
O
L
C
pF
nA
V
I
V
R
250
1
T
T
Maximum Response Time
ns
ESD Protection:
Per IEC 61000-4-2 Level 4
Min. Contact Discharge
Min. Air Discharge
kV
kV
kV
±8
±15 (Note 3)
±25
Min. Air Discharge
Operating Temperature
Storage Temperature
T
-40 to +85
-40 to +125
˚C
˚C
OPR
T
-55 to +150
STG
CG0603MLC-
Parameter
Symbol
Unit
3.3LEA
3.3LE
3.3
05LE
5
12LE
24LE
05LEA
12LEA
12
24LEA
Typical Continuous Operating Voltage
Typical Clamping Voltage (Note 1)
Maximum Capacitance @ 1 VRMS 1 MHz
Maximum Leakage Current @ Max. VDC
Typical Trigger Voltage (Note 2)
V
12
24
3.3
5
24
V
V
DC
V
25
25
25
5
C
O
L
C
0.5
1
pF
nA
V
I
5
5
V
250
250
250
T
T
Maximum Response Time
R
ns
ESD Protection:
Per IEC 61000-4-2 Level 4
Min. Contact Discharge
Min. Air Discharge
kV
kV
kV
±8
±15 (Note 3)
±25
Min. Air Discharge
Operating Temperature
Storage Temperature
T
-40 to +85
-40 to +125
˚C
˚C
OPR
T
-55 to +150
STG
Notes: 1. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement 30 ns after initiation of pulse.
2. Per IEC 61000-4-2, Level 4 8 kV Contact Discharge. Measurement at maximum pulse voltage.
3. IEC 61000-4-2 ESD Performance will meet minimum 1000 reps without degradation in performance.
WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov
*RoHS Directive 2015/863, Mar 31, 2015 and Annex.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
ChipGuard® MLC Series - ESD Protectors
Product Dimensions
Recommended Pad Layout
A
A
W
B
L
MM
(INCHES)
B
C
DIMENSIONS:
D
CG0402
Series
CG0603
Series
CG0402
Series
CG0603
Series
Dimension
Dim.
1.00 ± 0.15
(0.04 ± 0.006)
1.60 ± 0.20
(0.064 ± 0.008)
0.51
(0.020)
0.76
(0.030)
L
A
0.50 ± 0.10
(0.02 ± 0.004)
0.80 ± 0.20
(0.032 ± 0.008)
0.61
(0.024)
1.02
(0.040)
W
A
B
C
D
0.36 ± 0.05
(0.014 ± 0.002)
0.45 ± 0.10
(0.018 ± 0.004)
0.51
(0.020)
0.50
(0.020)
0.25 ± 0.15
(0.10 ± 0.006)
0.30 ± 0.20
(0.012 ± 0.008)
1.70
(0.067)
2.54
(0.100)
B
Preheat Stages 1-3
Soldering
Cooling
300
A
Stage 1 Preheat
Ambient to Preheating
Temperature
30 s to 60 s
250
200
150
100
50
B
C
D
Stage 2 Preheat
Stage 3 Preheat
Main Heating
140 °C to 160 °C
Preheat to 200 °C
60 s to 120 s
20 s to 40 s
200 °C
210 °C
220 °C
230 °C
240 °C
250 °C to 255 °C
60 s to 70 s
55 s to 65 s
50 s to 60 s
40 s to 50 s
30 s to 40 s
5 s
0
E
Cooling
200 °C to 100 °C
1 °C/s to 4 °C/s
110 sec. (min.)
120 sec. (min.)
30-70
sec.
Time (seconds)
•
•
•
•
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.
Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
ChipGuard® MLC Series - ESD Protectors
Packaging Dimensions
13.0 ± 1.0
(0.52 ± 0.04)
8.00 ± 0.30
(0.32 ± 0.012)
4.00 ± 0.10
(0.16 ± 0.004)
C
1.50 ± 0.10
62.0 ± 1.50
(2.48 ± 0.06)
(0.06 ± 0.004)
2.0 ± 0.50
(0.08 ± 0.02)
L
13.0 ± 0.50
(0.52 ± 0.02)
TOP
TAPE
G
D
21.0 ± 0.80
(0.84 ± 0.032)
180.8 ± 2.0
(7.12 ± 0.08)
3.50 ± 0.05
(0.14 ± 0.002)
W
NOTES: TAPE MATERIAL IS PAPER.
0.48 ± 0.03
(0.019 ± 0.0012)
COVER TAPE ADHESION IS 40 ± 15 GRAMS.
TAPE THICKNESS IS
MM
(INCHES)
DIMENSIONS:
9.0 ± 0.50
(0.36 ± 0.02)
How to Order
CG 0n0n MLC - n.n x x x
ChipGuard®
Product Designator
CG0402
Series
CG0603
Series
Dimension
1.75 ± 0.05
(0.04 ± 0.002)
1.75 ± 0.10
(0.04 ± 0.004)
C
Package Option
2.00 ± 0.02
(0.08 ± 0.0008)
2.00 ± 0.05
(0.08 ± 0.002)
D
L
0402 = 0402 Package
0603 = 0603 Package
Multilayer Series Designator
1.12 ± 0.03
(0.045 ± 0.0012)
1.80 ± 0.20
(0.072 ± 0.008)
Operating Voltage**
3.3 = 3.3 V
05 = 5 V
0.62 ± 0.03
(0.025 ± 0.0012)
0.90 ± 0.20
(0.036 ± 0.008)
W
G
12 = 12 V
24 = 24 V
2.0 ± 0.05
(0.08 ± 0.002)
4.0 ± 0.05
(0.16 ± 0.002)
Low Leakage Current Option
L = Low Leakage Current
Blank = Standard Product
Tape & Reel Packaging
E = 5,000 pcs. per reel (0603 Package)
G = 10,000 pcs. per reel (0402 Package)
Operating Temperature Option
A = Higher +125 °C Operating Temperature
Blank = Standard Product
** Only models lower than 10 volts require
decimal point.
Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
REV. T 08/19
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Legal Disclaimer Notice
This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and
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