CG0402MLC-3.3LG [BOURNS]
ChipGuard MLC Series - ESD Protectors; ChipGuard MLC系列 - ESD保护器
| 型号： | CG0402MLC-3.3LG |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | ChipGuard MLC Series - ESD Protectors |
| 文件： | 总3页 (文件大小：206K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
Applications
■ Select models are compliant with
AEC-Q200 Rev-C Stress Test Qualification
for Passive Components in Automotive
Applications (see chart below)
■ HDMI 1.4
■ Digital Visual Interface (DVI)
■ USB 3.0 / USB OTG
■ Memory protection
■ SIM card ports
■ RoHS compliant*
■ ESD protection >25 kV
■ Low capacitance <0.5 pF
■ Low leakage current <50 nA
■ Automotive
ChipGuard® MLC Series - ESD Protectors
General Information
AEC Approved Models
®
The ChipGuard MLC Series has been specifically designed to protect sensitive
electronic components from electrostatic discharge damage. The MLC family has been
designed to protect equipment to IEC61000-4-2, Level 4 (±± kV Contact ꢀ ±15 kV Air
Discharge) ESD specifications targeted for high speed USB 3.0ꢀUSB OTG, HDMI 1.4,
DVI or IEEE1394 applications.
Model
CG0603MLC-05E
CG0603MLC-12E
AEC-Q200
✓ Yes
✓ Yes
Device Symbol
®
The ChipGuard MLC Series has been manufactured to provide low 0.5 pF capacitance
and leakage currents less than 50 nA with excellent clamp qualities, making the family
almost transparent under normal working conditions.
V
Electrical Characteristics @ 25 °C (unless otherwise noted)
CG0402MLC-
Parameter
Symbol
Unit
3.3LG
05LG
12LG
24LG
3.3LGA
05LGA
12LGA
24LGA
24
Typical Continuous Operating Voltage
Typical Clamping Voltage (Note 1)
Maximum Capacitance @ 1 VRMS 1 MHz
Maximum Leakage Current @ Max. VDC
Typical Trigger Voltage (Note 2)
V
3.3
5
12
24
3.3
5
12
V
V
DC
V
25
C
O
L
T
T
C
I
V
R
0.5
5
250
1
pF
nA
V
Maximum Response Time
ns
ESD Protection:
Per IEC 61000-4-2 Level 4
Min. Contact Discharge
Min. Air Discharge
kV
kV
kV
˚C
˚C
±±
±15 (Note 3)
±25
Min. Air Discharge
Operating Temperature
Storage Temperature
T
T
-40 to +±5
-40 to +125
OPR
-55 to +150
STG
CG0603MLC-
Parameter
Symbol
Unit
3.3LEA
3.3LE
3.3
05E
5
05LE
5
12E
12
30
12LE
24LE
05LEA 12LEA 24LEA
12 24
Typical Continuous Operating Voltage
Typical Clamping Voltage (Note 1)
Maximum Capacitance @ 1 VRMS 1 MHz
Maximum Leakage Current @ Max. VDC
Typical Trigger Voltage (Note 2)
V
12
24
3.3
5
V
V
DC
V
25
20
25
25
C
O
L
C
0.5
pF
nA
V
I
5
250
50
150
5
250
50
150
5
V
R
250
T
T
Maximum Response Time
1
ns
ESD Protection:
Per IEC 61000-4-2 Level 4
Min. Contact Discharge
Min. Air Discharge
kV
kV
kV
˚C
˚C
±±
±15 (Note 3)
±25
Min. Air Discharge
Operating Temperature
Storage Temperature
T
T
-40 to +±5
-40 to +125
OPR
-55 to +150
STG
Notes: 1. Per IEC 61000-4-2, Level 4 ± kV Contact Discharge. Measurement 30 ns after initiation of pulse.
2. Per IEC 61000-4-2, Level 4 ± kV Contact Discharge. Measurement at maximum pulse voltage.
3. IEC 61000-4-2 ESD Performance for CG0603MLC-05E and CG0603MLC-12E devices will meet minimum 100 reps.
Some shifting in characteristics may occur when tested over several hundred ESD pulses. All other part numbers listed will meet
IEC 61000-4-2 ESD Performance with minimum 1000 reps without degradation in performance.
*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® MLC Series - ESD Protectors
Product Dimensions
Recommended Pad Layout
A
A
W
MM
(INCHES)
DIMENSIONS:
B
L
B
C
D
CG0402
Series
CG0603
Series
CG0402
Series
CG0603
Series
Dimension
Dim.
1.00 0.1ꢀ
1.60 0.ꢁ0
0.ꢀ1
0.76
L
A
(0.04 0.006ꢂ
(0.064 0.00ꢃꢂ
(0.0ꢁ0ꢂ
(0.030ꢂ
0.ꢀ0 0.10
0.ꢃ0 0.ꢁ0
0.61
1.0ꢁ
W
A
B
C
D
(0.0ꢁ 0.004ꢂ
(0.03ꢁ 0.00ꢃꢂ
(0.0ꢁ4ꢂ
(0.040ꢂ
0.36 0.0ꢀ
0.4ꢀ 0.10
0.ꢀ1
0.ꢀ0
(0.014 0.00ꢁꢂ
(0.01ꢃ 0.004ꢂ
(0.0ꢁ0ꢂ
(0.0ꢁ0ꢂ
0.ꢁꢀ 0.1ꢀ
0.30 0.ꢁ0
1.70
ꢁ.ꢀ4
B
(0.10 0.006ꢂ
(0.01ꢁ 0.00ꢃꢂ
(0.067ꢂ
(0.100ꢂ
Solder Reflow Recommendations
Preheat Stages 1-3
Soldering
Cooling
300
250
200
150
100
50
A
Stage 1 Preheat
Stage ꢁ Preheat
Stage 3 Preheat
Main Heating
Ambient to Preheating
Temperature
140 °C to 160 °C
Preheat to ꢁ00 °C
30 s to 60 s
B
C
D
60 s to 1ꢁ0 s
ꢁ0 s to 40 s
60 s to 70 s
ꢀꢀ s to 6ꢀ s
ꢀ0 s to 60 s
40 s to ꢀ0 s
30 s to 40 s
ꢀ s
ꢁ00 °C
ꢁ10 °C
ꢁꢁ0 °C
ꢁ30 °C
ꢁ40 °C
ꢁꢀ0 °C to ꢁꢀꢀ °C
0
E
Cooling
ꢁ00 °C to 100 °C
1 °C/s to 4 °C/s
110 sec. (min.)
120 sec. (min.)
30-70
sec.
Time (seconds)
•
•
•
•
This product can be damaged by rapid heating, cooling or localized heating.
Heat shocks should be avoided. Preheating and gradual cooling recommended.
Excessive solder can damage the device. Print solder thickness of 1ꢀ0 to ꢁ00 um recommended.
Solder gun tip temperature should be kept below ꢁꢃ0 °C and should not touch the device directly. Contact should be less than 3 seconds.
A solder gun under 30 watts is recommended.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
ChipGuard® MLC Series - ESD Protectors
Packaging Dimensions
13.0 ± 1.0
(0.52 ± 0.04)
8.00 0.30
(0.32 0.012)
4.00 0.10
(0.16 0.004)
C
1.50 0.10
62.0 ± 1.50
(2.48 ± 0.06)
(0.06 0.004)
2.0 ± 0.50
(0.08 ± 0.02)
L
13.0 ± 0.50
(0.52 ± 0.02)
TOP
TAPE
G
D
21.0 ± 0.80
(0.84 ± 0.032)
180.8 ± 2.0
(7.12 ± 0.08)
3.50 0.05
(0.14 0.002)
W
NOTES: TAPE MATERIAL IS PAPER.
0.48 0.03
(0.019 0.0012)
COVER TAPE ADHESION IS 40 15 GRAMS.
TAPE THICKNESS IS
MM
(INCHES)
DIMENSIONS:
9.0 ± 0.50
(0.36 ± 0.02)
How to Order
CG 0n0n MLC - n.n x x x
CG0402
CG0603
Dimension
Series
Series
1.75 0.05
1.75 0.10
®
C
ChipGuard
(0.04 0.002)
(0.04 0.004)
Product Designator
Package Option
2.00 0.02
2.00 0.05
D
L
0402 = 0402 Package
0603 = 0603 Package
(0.08 0.0008)
(0.08 0.002)
Multilayer Series Designator
1.12 0.03
1.80 0.20
Operating Voltage**
3.3 = 3.3 V
05 = 5 V
(0.045 0.0012)
(0.072 0.008)
0.62 0.03
0.90 0.20
W
G
12 = 12 V
(0.025 0.0012)
(0.036 0.008)
24 = 24 V
2.0 0.05
4.0 0.05
Low Leakage Current Option
L = Low Leakage Current
Blank = Standard Product
(0.08 0.002)
(0.16 0.002)
Tape & Reel Packaging
E = 5,000 pcs. per reel (0603 Package)
G = 10,000 pcs. per reel (0402 Package)
Operating Temperature Option
A = Higher +125 °C Operating Temperature
Blank = Standard Product
** Only models lower than 10 volts require
decimal point.
Asia-Pacific: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
REV. S 06/13
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.
Users should verify actual device performance in their specific applications.
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