CG0402MLE-18G_13 [BOURNS]

ChipGuard MLE Series Varistor ESD Clamp Protectors; ChipGuard MLE系列压敏电阻ESD钳位保护器


型号：	CG0402MLE-18G_13
厂家：	BOURNS ELECTRONIC SOLUTIONS
描述：	ChipGuard MLE Series Varistor ESD Clamp Protectors ChipGuard MLE系列压敏电阻ESD钳位保护器压敏电阻
文件：	总3页 (文件大小：186K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Features

■ 0402 and 0603 package options

■ Rated for IEC 61000-4-2, for applications requiring up to 18 V DC

■ Withstands multiple ESD strikes

■ Low capacitance and leakage currents for invisible load protection

■ Tape and reel packaging

ChipGuard^®MLE Series Varistor ESD Clamp Protectors

Description

The ChipGuard CG0402MLE and CG0603MLE Series have been designed to provide high frequency attenuation, thereby providing

suppression and ﬁltering in a single device. The MLE family also offers protection to ESD standards such as IEC61000-4-2 for applications

requiring up to 18 V DC and is available in the industry standard 0603 and 0402 type leadless surface mount packaging.

Electrical Characteristics @ 25 °C (unless otherwise noted)

Continuous

Clamping

Voltage

Off-state Current

Capacitance

Operating Voltage

rms

(V)

CLAMP

(V)

(µA)

(pF)

Model

Max.

Typ.

Max.

Typ.

1 A

@ 8/20 µs

100

Max.

1 Vrms

@ 1 MHz

3.5 V

5.5 V

9 V

12 V

18 V

CG0402MLE-18G

CG0603MLE-18E

8.5

0.3

0.4

0.5

Surge Withstand Ratings

Model

Environmental Characteristics

Operating Temperature ...-55 °C to +125 °C

Storage Temperature.......-55 °C to +125 °C

Response Time..................................<1 ns

Standard.................IEC 61000-4-2 Level 4

Peak Current

8/20 µs

Peak Current

@ 8 kV

(Max.)

CG0402MLE-18G

CG0603MLE-18E

15 A

20 A

30 A

45 A

These products are RoHS compliant.

There is some lead contained within the

glass of the ceramic. This is acceptable

under exemption no. 5 of the RoHS

directive (DIRECTIVE 2002/95/EC OF

THE EUROPEAN PARLIAMENT AND OF

THE COUNCIL of 27 January 2003 on the

restriction of the use of certain hazardous

substances in electrical and electronic

equipment).

Voltage-Current Characteristics

CG0402MLE-18G

CG0603MLE-18E

Schematic

CG0402MLE-18G

CG0603MLE-18E

*RoHS Directive 2002/95/EC Jan. 27, 2003 including

annex and RoHS Recast 2011/65/EU June 8, 2011.

Speciﬁcations are subject to change without notice.

The device characteristics and parameters in this data

sheet can and do vary in different applications and

actual device performance may vary over time.

Users should verify actual device performance in their

speciﬁc applications.

-8

-7

-6

-5

-4

-3

-2

-1

SOURCE = DC

SOURCE = 8/20 μs PULSE, IPEAK

I Current (Amps)

3Ch3i1p2Gu-a2rdmmMLSEMSeDriTesriVmamrisitnogr EPSoDteCnlatimomp Pertoetrectors

Product Dimensions

Recommended Pad Layout

(INCHES)

DIMENSIONS:

CG0402MLE

Series

CG0603MLE

Series

CG0402MLE

Series

CG0603MLE

Series

Dimension

Dim.

1.00 0.1ꢀ

1.60 0.ꢁ0

0.ꢀ1

0.76

(0.04 0.006ꢂ

(0.064 0.00ꢃꢂ

(0.0ꢁ0ꢂ

(0.030ꢂ

0.ꢀ0 0.10

0.ꢃ0 0.ꢁ0

0.61

1.0ꢁ

(0.0ꢁ 0.004ꢂ

(0.03ꢁ 0.00ꢃꢂ

(0.0ꢁ4ꢂ

(0.040ꢂ

0.ꢀ0 0.10

0.ꢃ0 0.ꢁ0

0.ꢀ1

0.ꢀ0

(0.0ꢁ 0.004ꢂ

(0.03ꢁ 0.00ꢃꢂ

(0.0ꢁ0ꢂ

0.ꢁꢀ 0.1ꢀ

0.30 0.ꢁ0

1.70

ꢁ.ꢀ4

(0.10 0.006ꢂ

(0.01ꢁ 0.00ꢃꢂ

(0.067ꢂ

(0.100ꢂ

Solder Reﬂow Recommendations

Preheat Stages 1-3

Soldering

Cooling

Stage 1 Preheat

Ambient to Preheating

Temperature

140 °C to 160 °C

Preheat to ꢁ00 °C

ꢁ00 °C

ꢁ10 °C

ꢁꢁ0 °C

ꢁ30 °C

ꢁ40 °C

30 s to 60 s

300

250

200

150

100

Stage ꢁ Preheat

Stage 3 Preheat

Main Heating

60 s to 1ꢁ0 s

ꢁ0 s to 40 s

60 s to 70 s

ꢀꢀ s to 6ꢀ s

ꢀ0 s to 60 s

40 s to ꢀ0 s

30 s to 40 s

Cooling

ꢁ00 °C to 100 °C

1 °C/s to 4 °C/s

110 sec. (min.)

120 sec. (min.)

30-70

sec.

Time (seconds)

•

This product can be damaged by rapid heating, cooling or localized heating.

Heat shocks should be avoided. Preheating and gradual cooling recommended.

Excessive solder can damage the device. Print solder thickness of 1ꢀ0 to ꢁ00 um recommended.

Solder gun tip temperature should be kept below ꢁꢃ0 °C and should not touch the device directly. Contact should be less than 3 seconds.

A solder gun under 30 watts is recommended.

How to Order

CG 0n0n MLE - 18 x

ChipGuard Product Designator

Package Option

040ꢁ = 040ꢁ Package

0603 = 0603 Package

Multilayer Series Designator

Operating Voltage

1ꢃ = 1ꢃ V

Tape & Reel Packaging

E = 4,000 pcs. per reel (0603 packageꢂ G = 10,000 pcs. per reel (040ꢁ packageꢂ

Ni barrier terminations are standard on all ChipGuard part numbers.

Speciﬁcations are subject to change without notice.

Customers should verify actual device performance in their speciﬁc applications.

ChipGuard^®MLE Series Varistor ESD Clamp Protectors

Packaging Dimensions

13.0 ± 1.0

(0.52 ± 0.04)

8.00 0.30

(0.32 0.012)

4.00 0.10

(0.16 0.004)

1.50 0.10

62.0 ± 1.50

(2.48 ± 0.06)

(0.06 0.004)

2.0 ± 0.50

(0.08 ± 0.02)

13.0 ± 0.50

(0.52 ± 0.02)

TOP

TAPE

21.0 ± 0.80

(0.84 ± 0.032)

180.8 ± 2.0

(7.12 ± 0.08)

3.50 0.05

(0.14 0.002)

NOTES: TAPE MATERIAL IS PAPER.

0.48 0.03

(0.019 0.0012)

COVER TAPE ADHESION IS 40 15 GRAMS.

TAPE THICKNESS IS

(INCHES)

DIMENSIONS:

9.0 ± 0.50

(0.36 ± 0.02)

CG0402MLE

CG0603MLE

Dimension

Series

1.75 ꢀ.ꢀ5

1.75 ꢀ.1ꢀ

(ꢀ.ꢀ4 ꢀ.ꢀꢀ02

(ꢀ.ꢀ4 ꢀ.ꢀꢀ42

0.ꢀꢀ ꢀ.ꢀ0

0.ꢀꢀ ꢀ.ꢀ5

(ꢀ.ꢀ8 ꢀ.ꢀꢀꢀ82

(ꢀ.ꢀ8 ꢀ.ꢀꢀ02

1.19 ꢀ.ꢀ5

1.8ꢀ ꢀ.0ꢀ

(ꢀ.ꢀ47 ꢀ.ꢀꢀ02

(ꢀ.ꢀ70 ꢀ.ꢀꢀ82

ꢀ.69 ꢀ.ꢀ5

ꢀ.9ꢀ ꢀ.0ꢀ

(ꢀ.ꢀ07 ꢀ.ꢀꢀ02

(ꢀ.ꢀ36 ꢀ.ꢀꢀ82

0.ꢀ ꢀ.ꢀ5

4.ꢀ ꢀ.ꢀ5

(ꢀ.ꢀ8 ꢀ.ꢀꢀ02

(ꢀ.16 ꢀ.ꢀꢀ02

Asia-Paciﬁc: Tel: +886-0 0560-4117 • Fax: +886-0 0560-4116

Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 551ꢀ

The Americas: Tel: +1-951 781-55ꢀꢀ • Fax: +1-951 781-57ꢀꢀ

www.bourns.com

REV. I 09/12

Speciﬁcations are subject to change without notice.

Customers should verify actual device performance in their speciﬁc applications.

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