MF-PSML300/12 [BOURNS]
Low Ohmic PTC Resettable Fuses;
| 型号： | MF-PSML300/12 |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | Low Ohmic PTC Resettable Fuses |
| 文件： | 总7页 (文件大小：760K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
Applications
n USB port protection - USB 2.0, 3.0 & OTG
n HDMI 1.4 Source protection
n Ultra-low resistance, quick response
n 0805 footprint size and low profile for space-
constrained mobile applications
n Surface mount packaging for automated
assembly
n PC motherboards - Plug & Play protection
n Mobile phones - battery & port protection
n PDAs / digital cameras
n RoHS compliant* and halogen free**
n Agency recognition:
n Wireless headphone power protection
n Game console port protection
MF-PSML/X Series - Low Ohmic PTC Resettable Fuses
Electrical Characteristics
Tripped
I
I
Resistance
Max. Time To Trip
at 23 °C
Power
Agency Recognition
hold
trip
Dissipation
V
I
max
max
Model
Watts at
23 °C
at 23 °C
Amps
at 23 °C Ohms
cUL
TÜV
Typ.
0.7
0.7
0.7
0.7
0.7
0.8
0.8
0.8
0.8
0.9
0.9
0.9
0.9
Volts
12
12
12
12
12
12
12
12
12
8
Amps
50
R
R
Amps
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Seconds
0.2
E174545 R50391579
min
1max
MF-PSML075/12
MF-PSML110/12
MF-PSML125/12
MF-PSML150/12
MF-PSML175/12
MF-PSML200/12
MF-PSML250/12
MF-PSML260/12
MF-PSML300/12
MF-PSML350/8
MF-PSML380/8
MF-PSML400/8
MF-PSML450/8
0.75
1.5
2.2
2.5
3.0
3.5
4.0
5.0
5.2
6.0
7.0
7.6
8.0
9.0
0.040
0.030
0.020
0.015
0.010
0.005
0.003
0.003
0.003
0.002
0.001
0.001
0.001
0.300
0.210
0.160
0.080
0.065
0.050
0.040
0.030
0.020
0.018
0.016
0.014
0.012
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
50
1.1
1.25
1.5
1.75
2.0
2.5
2.6
3.0
3.5
3.8
4.0
4.5
0.3
50
0.4
50
0.5
50
1.0
50
2.0
50
2.0
50
4.0
50
5.0
50
5.0
8
50
5.0
8
50
12.5
12.5
8
50
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Storage Condition
Before Opening ............................................ +40 °C max. / 70 % RH max.
After Opening ............................................... +40 °C max. / 10 % RH max.
Floor Condition After Opening.............................. Consumption within 4 weeks at floor condition +30 °C max. / 60 % RH max.
Passive Aging....................................................... +85 °C, 1000 hours............................................... ±10 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 100 hours ............................... ±15 % typical resistance change
Thermal Shock ..................................................... -40 °C to +85 °C, 20 times.................................... ±30 % typical resistance change
Solvent Resistance............................................... MIL-STD-202, Method 215 ................................... No change (marking still legible)
Vibration ............................................................... MIL-STD-883C, Method 2007.1, Condition A ....... No change (R <R<R
Moisture Sensitivity Level (MSL).......................... See Note
)
min
1max
ESD Classification................................................ Class 6 (per AEC-Q200-2 HBM)
Test Procedures and Requirements
Test
Visual/Mech.......................................................... Verify dimensions and materials........................... Per MF physical description
Resistance............................................................ In still air @ 23 °C................................................. R ≤ R ≤ R
Test Conditions
Accept/Reject Criteria
min
1max
Time to Trip........................................................... At specified current, V
, 23 °C.......................... T ≤ max. time to trip (seconds)
max
Hold Current ......................................................... 30 min. at I
...................................................... No trip
, 100 cycles.......................................... No arcing or burning
, 48 hours ..................................................... No arcing or burning
Solderability.......................................................... 245 °C ±5 °C, 5 seconds ...................................... 95 % min. coverage
hold
Trip Cycle Life....................................................... V
, I
max max
Trip Endurance..................................................... V
max
WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov
*
RoHS Directive 2015/863, Mar 31, 2015 and Annex.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br)
and Chlorine (Cl) content is 1500 ppm or less.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and atwww.bourns.com/docs/legal/disclaimer.pdf.
MF-PSML/X Series - Low Ohmic PTC Resettable Fuses
Product Dimensions
A
B
C
D
E
Model
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Min.
Max.
MF-PSML075/12
MF-PSML110/12
MF-PSML125/12
MF-PSML150/12
MF-PSML175/12
MF-PSML200/12
MF-PSML250/12
MF-PSML260/12
MF-PSML300/12
MF-PSML350/8
MF-PSML380/8
MF-PSML400/8
MF-PSML450/8
0.05
(0.002)
2.00
(0.079)
2.30
(0.091)
1.20
(0.047)
1.50
(0.059)
0.30
(0.012)
0.70
(0.028)
0.20
(0.008)
0.45
(0.018)
0.05
(0.002)
2.00
(0.079)
2.30
(0.091)
1.20
(0.047)
1.50
(0.059)
0.60
(0.024)
1.40
(0.055)
0.20
(0.008)
0.45
(0.018)
MM
(INCHES)
DIMENSIONS:
Terminal material:
ENIG-plated terminals
Recommended Pad Layout
Side View
Top View
Bottom View
A
C
D
E
1.0
1.0
(.039)
(.039)
1.50
(.059)
B
1.20
(.047)
Packaging Quantity
MF-PSML075/12 ~ MF-PSML175/12 = 4,500 pcs. per reel
MF-PSML200/12 ~ MF-PSML450/8 = 3,000 pcs. per reel
“Bluetooth” is a registered trademark of Bluetooth SIG.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and atwww.bourns.com/docs/legal/disclaimer.pdf.
MF-PSML/X Series - Low Ohmic PTC Resettable Fuses
Thermal Derating Table - I
(Amps)
hold
Ambient Operating Temperature
Model
-40 °C
-20 °C
1.01
1.48
1.69
2.02
2.36
2.70
3.38
3.51
4.05
4.72
5.12
5.39
6.07
0 °C
0.95
1.40
1.59
1.90
2.22
2.54
3.18
3.30
3.80
4.44
4.82
5.07
5.71
23 °C
0.75
1.10
1.25
1.50
1.75
2.00
2.50
2.60
3.00
3.50
3.80
4.00
4.50
40 °C
0.64
0.94
1.06
1.28
1.49
1.70
2.13
2.21
2.55
2.98
3.24
3.41
3.83
50 °C
0.58
0.85
0.96
1.16
1.35
1.54
1.92
2.01
2.31
2.70
2.93
3.09
3.47
60 °C
0.52
0.77
0.87
1.05
1.22
1.39
1.75
1.81
2.09
2.44
2.65
2.79
3.14
70 °C
0.47
0.69
0.79
0.94
1.10
1.26
1.57
1.63
1.89
2.20
2.39
2.51
2.83
85 °C
0.37
0.55
0.62
0.75
0.87
0.99
1.24
1.29
1.49
1.74
1.89
1.99
2.24
MF-PSML075/12
MF-PSML110/12
MF-PSML125/12
MF-PSML150/12
MF-PSML175/12
MF-PSML200/12
MF-PSML250/12
MF-PSML260/12
MF-PSML300/12
MF-PSML350/8
MF-PSML380/8
MF-PSML400/8
MF-PSML450/8
1.12
1.65
1.87
2.25
2.62
2.99
3.75
3.89
4.49
5.24
5.69
5.99
6.74
Typical Part Marking
Represents total content. Layout may vary.
How to Order
MF - PSML 200 / 12 - 2
Multifuse®
Product Designator
PART IDENTIFICATION:
MF-PSML075/12 = D2
MF-PSML110/12 = E2
MF-PSML125/12 = F2
MF-PSML150/12 = G2
MF-PSML175/12 = H2
MF-PSML200/12 = J2
MF-PSML250/12 = M2
MF-PSML260/12 = N2
MF-PSML300/12 = P2
MF-PSML350/8 = S8
MF-PSML380/8 = V8
MF-PSML400/8 = U8
MF-PSML450/8 = X8
Series
PSML = 0805 Low Ohmic
Surface Mount Component
J2
Hold Current, I
hold
075 ~ 400 (0.75 ~ 4.5 Amps)
Maximum Voltage, V
12 = 12 Volts
max
8 = 8 Volts
Packaging
Manufacturing date code is located on packaging label
-2 = Tape and Reel Packaged per EIA-481
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and atwww.bourns.com/docs/legal/disclaimer.pdf.
MF-PSML/X Series - Low Ohmic PTC Resettable Fuses
Solder Reflow Recommendations
Notes:
t
p
T
•
MF-PSML/X models are intended for reflow soldering (including, but
not limited to heating plate, hot air, IR, nitrogen, and vapor phase).
P
CRITICAL ZONE
TO
RAMP-UP
T
T
P
L
•
Wave soldering is permissible only if the device is on the top of the
PCB, opposite the heat source.
T
L
t
L
•
•
Hand soldering is not recommended for these devices.
Ts
Ts
max
min
All temperatures refer to the topside of the device, measured on the
device body surface.
RAMP-DOWN
•
If reflow temperatures exceed the recommended profile, devices may
not meet the published specifications.
t
s
PREHEAT
•
•
•
Compatible with Pb and Pb-free solder reflow profiles.
Excess solder may cause a short circuit.
Please refer to the Multifuse® Polymer PTC Resettable Fuse Soldering
25
t
25 °C TO PEAK
Recommendations document for more details.
Time
Profile Feature
Pb-Free Assembly
Average Ramp-Up Rate (Ts
to T )
3 °C / second max.
max
p
PREHEAT:
Temperature Min. (Ts
)
150 °C
min
Temperature Max. (Ts
)
200 °C
max
Time (Ts
to Ts
) (ts)
max
60~180 seconds
min
TIME MAINTAINED ABOVE:
Temperature (T )
217 °C
L
Time (t )
60~150 seconds
L
Peak Temperature (T )
260 °C
p
Time within 5 °C of Actual Peak Temperature (t )
20~40 seconds
6 °C / second max.
8 minutes max.
p
Ramp-Down Rate
Time 25 °C to Peak Temperature
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and atwww.bourns.com/docs/legal/disclaimer.pdf.
MF-PSML/X Series - Low Ohmic PTC Resettable Fuses
Packaging Specifications
MF-PSML/X Series per EIA-481
10X =
40.0 0.10
(1.575 .0042
0.60
(.0ꢁ42
1.50 +0.10 / -0
(.059 +.004 / -02
4.00 0.10
(.157 .0042
ꢁ.00 0.05
(.079 .00ꢁ2
1.75 0.10
(.069 .0042
MAX.
DIA.
ꢀ.50 0.05
(.1ꢀ8 .00ꢁ2
8.00 0.ꢀ0
(.ꢀ15 .01ꢁ2
4.ꢀ5
(.1712
MAX.
K0
COVER
TAPE
ꢁ.45 0.10
(.096 .0042
0.10
4.00 0.10
(.157 .0042
1.70 0.10
(.067 .0042
6.ꢁ5
(.ꢁ462
TYP.
MAX.
(.0042
LEADER MIN.
ꢀ90
(15.ꢀ52
TRAILER MIN.
160
(6.ꢀ02
K0
0.95 0.10
(.0ꢀ7 .0042
MF-PSML075/1ꢁ ~ MF-PSML175/1ꢁ
MF-PSMLꢁ00/1ꢁ ~ MF-PSML450/8
1.ꢁ1 0.10
(.048 .0042
185
(7.ꢁ82
14.4*
(.572
MAX.
MAX.
50
(1.972
MIN.
HUB DIA.
MM
(INCHES)
DIMENSIONS:
8.4 +1.5 / -0*
(ꢀꢀ1 +.059 / -02
*MEASURED AT HUB
Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com
EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com
www.bourns.com
MF-PSML/X SERIES, REV. A, 05/19
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and atwww.bourns.com/docs/legal/disclaimer.pdf.
Bourns® Multifuse® PPTC Resettable Fuses
Application Notice
•
•
Users are responsible for independent and adequate evaluation of Bourns® Multifuse® Polymer PTC devices in the user’s
application, including the PPTC device characteristics stated in the applicable data sheet.
Polymer PTC devices must not be allowed to operate beyond their stated maximum ratings. Operation in excess of such
maximum ratings could result in damage to the PTC device and possibly lead to electrical arcing and/or fire. Circuits with
inductance may generate a voltage above the rated voltage of the polymer PTC device and should be thoroughly evaluated
within the user’s application during the PTC selection and qualification process.
•
•
Polymer PTC devices are intended to protect against adverse effects of temporary overcurrent or overtemperature
conditions up to rated limits and are not intended to serve as protective devices where overcurrent or overvoltage conditions
are expected to be repetitive or prolonged.
In normal operation, polymer PTC devices experience thermal expansion under fault conditions. Thus, a polymer PTC
device must be protected against mechanical stress, and must be given adequate clearance within the user’s application to
accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide adequate
clearance should be thoroughly examined and tested by the user, as they may result in the malfunction of polymer PTC
devices if the thermal expansion is inhibited.
•
•
Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may
adversely affect the performance of polymer PTC devices.
Aggressive solvents may adversely affect the performance of polymer PTC devices. Conformal coating, encapsulating,
potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and toluene,
which are known to cause adverse effects on the performance of polymer PTCs. Such aggressive solvents must be
thoroughly cured or baked to ensure their complete removal from polymer PTCs to minimize the possible adverse effect
on the device.
•
Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data
sheet and on the Multifuse® Polymer PTC Moisture/Reflow Sensitivity Classification (MSL) note:
https://www.bourns.com/docs/RoHS-MSL/msl_mf.pdf
MFAN 12/18
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
Legal Disclaimer Notice
This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and
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statements regarding the suitability of products for certain types of applications are based on Bourns’ knowledge of typical
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