MF-SMDF030/33T-2 [BOURNS]
PTC Resettable Fuses; PTC自恢复保险丝
| 型号： | MF-SMDF030/33T-2 |
| 厂家： | 
BOURNS ELECTRONIC SOLUTIONS |
| 描述： | PTC Resettable Fuses |
| 文件： | 总4页 (文件大小：120K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Features
Applications
■ Power Over Ethernet (IEEE 802.3 af) port
■ Very low profile
■ High voltage
protection
■ Firewire and i.Link IEEE 1394 port
protection
■ Automotive electronic control module
protection
■ Telecom equipment low voltage
protection
■ Lead-free construction
■ Symmetrical
■ 2018 footprint
■ Agency recognition pending
MF-SMDF Series - PTC Resettable Fuses
Electrical Characteristics
Tripped
Power
Dissipation
Max. Time
To Trip
I
I
trip
Resistance
hold
V max.
Volts
I max.
Amps
Model
Amperes
at 23 °C
Ohms
Amperes Seconds
Watts
at 23 °C
at 23 °C
at 23 °C
at 23 °C
R
R
Hold
0.30
0.55
1.10
1.50
1.50
2.00
Trip
Min.
1Max.
2.250
0.950
0.390
0.175
0.175
0.095
Typ.
0.7
1.0
1.1
1.2
1.2
1.3
MF-SMDF030
MF-SMDF050
MF-SMDF100
MF-SMDF150
MF-SMDF150/33
MF-SMDF200
60
60
15
15
33
10
20
10
40
40
40
40
0.80
1.20
2.20
3.00
3.00
4.10
0.450
0.200
0.100
0.070
0.070
0.048
1.5
2.5
8.0
8.0
8.0
8.0
1.5
4.0
0.5
0.9
0.9
2.7
Environmental Characteristics
Operating Temperature ......................................-40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State ................................................125 °C
Passive Aging......................................................+85 °C, 1000 hours .................................... 5 ꢀ typical resistance change
Humidity Aging....................................................+85 °C, 85 ꢀ R.H. 1000 hours .................. 5 ꢀ typical resistance change
Thermal Shock....................................................+85 °C to -40 °C, 20 times ........................ 10 ꢀ typical resistance change
Solvent Resistance ............................................MIL-STD-202, Method 215 ........................No change
Vibration..............................................................MIL-STD-883C, Method 2007.1, ................No change
Condition A
Test Procedures And Requirements For Model MF-SMDF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech.....................................Verify dimensions and materials ....................................Per MF physical description
Resistance ......................................In still air @ 23 °C............................................................Rmin ≤ R ≤ R1max
Time to Trip ....................................At specified current, Vmax, 23 °C ..................................T ≤ max. time to trip (seconds)
Hold Current ..................................30 min. at Ihold ..............................................................No trip
Trip Cycle Life ................................Vmax, Imax, 100 cycles..................................................No arcing or burning
Trip Endurance................................Vmax, 48 hours ..............................................................No arcing or burning
Solderability ....................................ANSI/J-STD-002 ............................................................95 ꢀ min. coverage
Thermal Derating Chart - I / I (Amps)
hold trip
Ambient Operating Temperature
23 ˚C 40 ˚C 50 ˚C
Model
-40 ˚C
-20 ˚C
0 ˚C
60 ˚C
70 ˚C
85 ˚C
MF-SMDF030
MF-SMDF050
MF-SMDF100
MF-SMDF150
MF-SMDF150/33
MF-SMDF200
0.48 / 0.96 0.42 / 0.84 0.35 / 0.70 0.30 / 0.60 0.24 / 0.48 0.21 / 0.42 0.17 / 0.34 0.15 / 0.30 0.10 / 0.20
0.86 / 1.72 0.77 / 1.54 0.70 / 1.40 0.55 / 1.10 0.48 / 0.96 0.43 / 0.86 0.38 / 0.76 0.36 / 0.72 0.26 / 0.52
1.59 / 3.18 1.43 / 2.86 1.20 / 2.40 1.10 / 2.20 0.94 / 1.88 0.85 / 1.70 0.72 / 1.44 0.69 / 1.38 0.57 / 1.14
2.21 / 4.42 1.97 / 3.94 1.70 / 3.40 1.50 / 3.00 1.26 / 2.52 1.15 / 2.30 1.00 / 2.00 0.91 / 1.82 0.73 / 1.46
2.21 / 4.42 1.97 / 3.94 1.70 / 3.40 1.50 / 3.00 1.26 / 2.52 1.15 / 2.30 1.00 / 2.00 0.91 / 1.82 0.73 / 1.46
2.81 / 5.62 2.54 / 5.08 2.27 / 4.54 2.00 / 4.00 1.73 / 3.46 1.59 / 3.18 1.46 / 2.92 1.32 / 2.64 1.12 / 2.24
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-SMDF Series - PTC Resettable Fuses
Product Dimensions
A
B
C
D
Min.
0.30
E
Min.
0.25
Model
Min.
4.72
Max.
5.44
Min.
4.22
Max.
4.93
Min.
0.79
Max.
1.09
MF-SMDF030
MF-SMDF050
MF-SMDF100
MF-SMDF150
MF-SMDF150/33
MF-SMDF200
(0.186)
4.72
(0.186)
4.72
(0.186)
4.72
(0.186)
4.72
(0.214)
5.44
(0.214)
5.44
(0.214)
5.44
(0.214)
5.44
(0.166)
4.22
(0.166)
4.22
(0.166)
4.22
(0.166)
4.22
(0.194)
4.93
(0.194)
4.93
(0.194)
4.93
(0.194)
4.93
(0.031)
0.79
(0.031)
0.79
(0.031)
0.79
(0.031)
0.79
(0.043)
1.09
(0.043)
1.09
(0.043)
1.09
(0.043)
1.09
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.012)
0.30
(0.010)
0.25
(0.010)
0.25
(0.010)
0.25
(0.010)
0.25
(0.186)
4.72
(0.186)
(0.214)
5.44
(0.214)
(0.166)
4.22
(0.166)
(0.194)
4.93
(0.194)
(0.031)
0.79
(0.031)
(0.043)
1.09
(0.043)
(0.012)
0.30
(0.012)
(0.010)
0.25
(0.010)
MM
(INCHES)
Packaging: 2000 pcs. per reel.
UNIT =
Recommended Pad Layout
Top and Bottom View
Side View
Terminal material:
Electroless Ni under immersion Au
1.5 0.05
(.059 .002)
1.5 0.05
(.059 .002)
A
C
Termination pad solderability:
Standard Au finish:
4.6 0.1
(.181 .004)
Meets ANSI/J-STD-002 Category 2.
B
E
Optional Sn finish:
Meets ANSI/J-STD-002 Category 3.
3.4 0.1
(.134 .004)
D
Recommended Storage:
40 °C max./70 ꢀ RH max.
Typical Time to Trip at 23 ˚C
100
The Time to Trip curves
represent typical perform-
ance of a device in a
simulated application
environment. Actual
10
performance in specific
customer applications may
differ from these values due
to the influence of other
variables.
MF-SMDF050
MF-SMDF030
1
0.1
MF-SMDF200
0.01
MF-SMDF150
MF-SMDF100
0.001
0.1
1
10
100
Fault Current (Amps)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-SMDF Series - PTC Resettable Fuses
Solder Reflow Recommendations
How to Order
MF - SMDF 150/33 T - 2
Preheating
Soldering
Cooling
Multifuse® Product
Designator
300
250
200
150
100
50
Series
SMDF = 2018 Surface Mount
Component
Hold Current, I
hold
030-200 (0.30 Amps - 2.00 Amps)
Higher Voltage Option
__ = Standard Voltage
/33 = 33 Volt Rated
Optional Terminal Finish
__ = Standard Au Finish
T = Optional Sn Finish
Packaging
Packaged per EIA 481-1
-2 = Tape and Reel
0
160–220
10–20
120
Time (seconds)
Notes:
Typical Part Marking
•
•
MF-SMDF models cannot be wave soldered.
If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements.
Represents total content. Layout may vary.
BI-WEEKLY DATE CODE:
WEEKS 13-14 = G
•
Compatible with Pb and Pb-free solder reflow profiles.
YEAR CODE:
3 = 2003
PART
IDENTIFICATION:
30 = MF-SMDF030
05 = MF-SMDF050
10 = MF-SMDF100
15 = MF-SMDF150
20 = MF-SMDF200
MANUFACTURER'S
TRADEMARK
MF-SMDF SERIES, REV. B, 05/04
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
MF-NSMF & MF-SMDF Series Tape and Reel Specifications
MF-NSMF Series
MF-SMDF Series
per EIA 481-2
Tape Dimensions
per EIA 481-1
8.0 0.ꢀ0
(0.ꢀ15 0.012)
16.0 0.ꢀ
(0.6ꢀ0 0.012)
W
4.0 0.10
(0.157 0.004)
4.0 0.1
(0.157 0.004)
P
0
4.0 0.10
(0.157 0.004)
8.0 0.1
(0.ꢀ15 0.004)
P
1
2.0 0.05
(0.079 0.002)
2.0 0.1
(0.079 0.004)
P
2
1.85 0.10
(0.07ꢀ 0.004)
5.1 0.15
(0.201 0.006)
A
0
ꢀ.45 0.10
(0.1ꢀ6 0.004)
5.6 0.2ꢀ
(0.220 0.009)
B
0
12.1
(0.476)
4.ꢀ5
(0.171)
1.50 + 0.1/-0.0
(0.059 + 0.004/-0)
B
max.
min.
1
1.5 + 0.1/-0.0
(0.059 + 0.004/-0)
7.5 0.10
(0.295 0.004)
1.75 0.10
D
F
E
0
1.75 0.10
(0.069 0.004)
6.25
(0.246)
0.6
(0.069 0.004)
1
2
14.25
(0.561)
0.6
(0.024)
0.1
E
T max.
max.
(0.024)
0.1
(0.004)
T
(0.004)
1
0.74 0.10
(0.029 0.004)
1.0 0.15
(0.0ꢀ9 0.015)
K
0
ꢀ90
(15.ꢀ5)
160
ꢀ90
(15.ꢀ5)
160
(6.ꢀ0)
Leader min.
Trailer min.
Reel Dimensions
A max.
(6.ꢀ0)
185
(7.28)
ꢀꢀ1
(1ꢀ.0ꢀ)
50
(1.97)
50
(1.97)
N min.
8.4 + 1.5/-0.0
(0.ꢀꢀ1 + 0.059/-0.0)
16.4 + 2.0/ -0.0
(0.646 + 0.079/-0.0)
W
1
14.4
(0.567)
22.4
(0.882)
W
max.
2
MM
UNIT =
P
0
(INCHES)
T
D
0
P
2
E
E
1
W (MEASURED
2
AT HUB)
COVER
TAPE
F
A
N(HUB DIA.)
W
2
B
1
B
0
W
(MEASURED
AT HUB)
1
P
1
K
T
0
1
A
0
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
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