MF-USMF110-2 [BOURNS]
PTC Resettable Fuse, Surface Mount, CHIP, 1210;型号: | MF-USMF110-2 |
厂家: | BOURNS ELECTRONIC SOLUTIONS |
描述: | PTC Resettable Fuse, Surface Mount, CHIP, 1210 过载保护 电阻器 |
文件: | 总4页 (文件大小:446K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Features
nꢀ RoHSꢀcompliant*ꢀandꢀhalogenꢀfree**
nꢀ Agencyꢀrecognition:
nꢀ CompliantꢀwithꢀAEC-Q200ꢀRev-C-ꢀStressꢀꢀ
ꢀ
ꢀ
TestꢀQualificationꢀforꢀPassiveꢀComponentsꢀꢀ
inꢀAutomotiveꢀApplicationsꢀ
nꢀ Fastꢀtrippingꢀresettableꢀcircuitꢀprotectionꢀ
nꢀ Surfaceꢀmountꢀpackagingꢀforꢀautomatedꢀꢀ
ꢀ
assembly
nꢀ Smallꢀfootprintꢀsizeꢀ(1210)
ꢀꢀMF-USMFꢀSeriesꢀ-ꢀPTCꢀResettableꢀFuses
Electrical Characteristics
Model
Tripped
Power
Max. Time
I
I
Resistance
hold
trip
To Trip
Dissipation
V max.
Volts
I max.
Amps
Amperes
at 23 °C
Ohms
at 23 °C
R
Amperes Seconds
Watts
at 23 °C
at 23 °C
at 23 °C
R
Hold
Trip
0.15
0.30
0.40
0.75
1.00
1.50
2.20
3.00
3.50
3.50
Typ.
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.6
0.7
0.7
Min.
1Max.
MF-USMF005
MF-USMF010
MF-USMF020
MF-USMF035
MF-USMF050
MF-USMF075
MF-USMF110
MF-USMF150
MF-USMF175
MF-USMF175X
30
30
30
6
10
10
10
40
40
40
40
40
40
40
0.05
0.10
0.20
0.35
0.50
0.75
1.10
1.50
1.75
1.75
2.800
0.800
0.400
0.200
0.180
0.070
0.050
0.030
0.020
0.020
50.000
15.000
5.000
1.300
0.900
0.450
0.210
0.110
0.090
0.090
0.25
0.50
8.00
8.00
8.00
8.00
5.00
5.00
8.00
8.00
1.50
0.60
0.02
0.20
0.10
0.10
1.00
5.00
1.00
1.00
13.2
6
6
6
6
6
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Passive Aging....................................................... +85 °C, 1000 hours............................................... ±5 % typical resistance change
Humidity Aging...................................................... +85 °C, 85 % R.H. 1000 hours ............................. ±5 % typical resistance change
Thermal Shock ..................................................... +85 °C to -40 °C, 20 times.................................... ±10 % typical resistance change
Solvent Resistance............................................... MIL-STD-202, Method 215 ................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change
Condition A
Test Procedures And Requirements For Model MF-USMF Series
Test
Test Conditions
Accept/Reject Criteria
Visual/Mech.......................................................... Verify dimensions and materials........................... Per MF physical description
Resistance............................................................ In still air @ 23 °C................................................. Rmin ≤ R ≤ R1max
Time to Trip........................................................... At specified current, Vmax, 23 °C......................... T ≤ max. time to trip (seconds)
Hold Current ......................................................... 30 min. at Ihold ..................................................... No trip
Trip Cycle Life....................................................... Vmax, Imax, 100 cycles........................................ No arcing or burning
Trip Endurance..................................................... Vmax, 48 hours..................................................... No arcing or burning
Solderability.......................................................... ANSI/J-STD-002................................................... 95 % min. coverage
UL File Number .................................................... E174545
http://www.ul.com/ Follow link to Certifications, then UL File No., enter E174545
TÜV Certificate Number ....................................... R 02057213
http://www.tuvdotcom.com/ Follow link to “other certificates”, enter File No. 2057213
*ꢀ RoHSꢀDirectiveꢀ2002/95/ECꢀJan.ꢀ27,ꢀ2003ꢀincludingꢀannexꢀandꢀRoHSꢀRecastꢀ2011/65/EUꢀJuneꢀ8,ꢀ2011.ꢀ
**ꢀ Bournsꢀfollowsꢀtheꢀprevailingꢀdefinitionꢀofꢀ“halogenꢀfree”ꢀinꢀtheꢀindustry.ꢀꢀBournsꢀconsidersꢀaꢀproductꢀtoꢀbeꢀ“halogenꢀfree”ꢀifꢀ(a)ꢀtheꢀBromineꢀ(Br)ꢀcontentꢀisꢀ900ꢀppmꢀorꢀless;ꢀꢀ
ꢀ
(b)ꢀtheꢀChlorineꢀ(Cl)ꢀcontentꢀisꢀ900ꢀppmꢀorꢀless;ꢀandꢀ(c)ꢀtheꢀtotalꢀBromineꢀ(Br)ꢀandꢀChlorineꢀ(Cl)ꢀcontentꢀisꢀ1500ꢀppmꢀorꢀless.Specificationsꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.
Theꢀdeviceꢀcharacteristicsꢀandꢀparametersꢀinꢀthisꢀdataꢀsheetꢀcanꢀandꢀdoꢀvaryꢀinꢀdifferentꢀapplicationsꢀandꢀactualꢀdeviceꢀperformanceꢀmayꢀvaryꢀoverꢀtime.
Usersꢀshouldꢀverifyꢀactualꢀdeviceꢀperformanceꢀinꢀtheirꢀspecificꢀapplications.
Applications
nꢀ IEEEꢀ139ꢁꢀports
nꢀ Mobileꢀphones
nꢀ Digitalꢀcameras
nꢀ Gameꢀconsolesꢀ
nꢀ PCꢀmotherboards
nꢀ USBꢀportꢀprotectionꢀ-ꢀUSBꢀ2.0,ꢀ3.0ꢀ&ꢀOTG
nꢀ HDMIꢀ1.ꢁꢀSourceꢀprotection
ꢀ MF-USMFꢀSeriesꢀ-ꢀPTCꢀResettableꢀFuses
Product Dimensions
A
B
C
D
Model
Min.
Max.
Min.
Max.
Min.
Max.
Min.
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.80
(0.031)
1.1
(0.043)
0.30
(0.012)
MF-USMF005
MF-USMF010
MF-USMF020
MF-USMF035
MF-USMF050
MF-USMF075
MF-USMF110
MF-USMF150
MF-USMF175
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.80
(0.031)
1.1
(0.043)
0.30
(0.012)
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.80
(0.031)
1.1
(0.043)
0.30
(0.012)
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.55
(0.022)
0.85
(0.033)
0.30
(0.012)
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.40
(0.016)
0.85
(0.033)
0.30
(0.012)
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.40
(0.016)
0.85
(0.033)
0.30
(0.012)
3.00
(0.118)
3.43
(0.135)
2.35
(0.093)
2.80
(0.110)
0.40
(0.016)
0.85
(0.033)
0.30
(0.012)
MF-USMF175X
Packaging: 3000 pcs. per reel.
ꢀ
MM
(INCHES)
DIMENSIONS:
ꢀ
Recommended Pad Layout
Top and Bottom View
Side View
Terminal material:
1.0ꢀ ꢀ0.05
(.039ꢀ ꢀ.002)
1.0ꢀ ꢀ0.05
(.039ꢀ ꢀ.002)
A
C
Electroless Ni under immersion Au
Termination pad solderability:
Standard Au finish:
2.5ꢀ ꢀ0.1
(.098ꢀꢀ ꢀ.00ꢁ)
B
Meets ANSI/J-STD-002 Category 2.
2.0ꢀ ꢀ0.1
(.079ꢀ ꢀ.00ꢁ)
Recommended Storage:
40 °C max./70 % RH max.
D
Solder Reflow Recommendations
Preheating
Soldering
Cooling
300
Notes:
•
•
MF-USMF models cannot be wave soldered.
250
200
150
100
50
If reflow temperatures exceed the recommended profile,
devices may not meet the performance requirements.
•
•
Compatible with Pb and Pb-free solder reflow profiles.
Excess solder may cause a short circuit, especially during hand
soldering. Please refer to the Multifuse® Polymer PTC Soldering
Recommendation guidelines.
0
160–220
10–20
120
Timeꢀ(seconds)
Specificationsꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.
Theꢀdeviceꢀcharacteristicsꢀandꢀparametersꢀinꢀthisꢀdataꢀsheetꢀcanꢀandꢀdoꢀvaryꢀinꢀdifferentꢀapplicationsꢀandꢀactualꢀdeviceꢀperformanceꢀmayꢀvaryꢀoverꢀtime.
Usersꢀshouldꢀverifyꢀactualꢀdeviceꢀperformanceꢀinꢀtheirꢀspecificꢀapplications.
ꢀ
MF-USMFꢀSeriesꢀ-ꢀPTCꢀResettableꢀFuses
Thermal Derating Chart - I
hold
(Amps)
Ambient Operating Temperature
Model
-40 ˚C
-20 ˚C
0 ˚C
23 ˚C
40 ˚C
50 ˚C
60 ˚C
70 ˚C
85 ˚C
MF-USMF005
MF-USMF010
MF-USMF020
MF-USMF035
MF-USMF050
MF-USMF075
MF-USMF110
MF-USMF150
MF-USMF175
MF-USMF175X
0.08
0.07
0.06
0.05
0.04
0.04
0.03
0.03
0.02
0.15
0.32
0.51
0.76
1.10
1.60
2.30
2.80
2.80
0.13
0.28
0.46
0.66
0.97
1.42
2.02
2.45
2.45
0.12
0.24
0.40
0.58
0.86
1.26
1.76
2.10
2.10
0.10
0.20
0.34
0.48
0.72
1.10
1.43
1.75
1.75
0.09
0.18
0.30
0.42
0.64
0.94
1.24
1.55
1.55
0.08
0.16
0.27
0.38
0.58
0.86
1.11
1.45
1.45
0.07
0.14
0.24
0.35
0.55
0.80
1.00
1.35
1.35
0.06
0.12
0.22
0.29
0.47
0.70
0.85
1.25
1.25
0.05
0.10
0.18
0.23
0.39
0.58
0.65
1.10
1.10
Typical Time to Trip at 23 ˚C
How to Order
MF - USMF 010 X - 2
100
Multifuse® Product
Designator
MF-USMF075
MF-USMF050
MF-USMF110
MF-USMF150
MF-USMF020
MF-USMF035
MF-USMF175 & MF-USMF175X
MF-USMF010
Series
10
USMF = 1210 Surface Mount
Component
Hold Current, Ihold
005-175 (0.05-1.75 Amps)
Multifuse® freeXpansion™ Design
1
Packaging
MF-USMF005
Packaged per EIA 481-1
-2 = Tape and Reel
0.1
Typical Part Marking
Represents total content. Layout may vary.
UNDERSCOREꢀ
0.01
PARTꢀIDENTIFICATION:
SIGNIFIESꢀ
0.001
0.1
1
10
100
MF-USMF005ꢀꢀꢀ=ꢀ0
MF-USMF010ꢀꢀꢀ=ꢀ1
MF-USMF020ꢀꢀꢀ=ꢀ2
MF-USMF035ꢀꢀꢀ=ꢀ3
MF-USMF050ꢀꢀꢀ=ꢀꢁ
MF-USMF075ꢀꢀꢀ=ꢀ5
MF-USMF110ꢀꢀꢀ=ꢀ6
MF-USMF150ꢀꢀꢀ=ꢀ8
MF-USMF175ꢀꢀꢀ=ꢀ9
MF-USMF175Xꢀ=ꢀ9
HALOGENꢀFREEꢀ
COMPLIANCE
Fault Current (Amps)
6
The Time to Trip curves represent typical performance of a device in a simulated application
environment. Actual performance in specific customer applications may differ from these values
due to the influence of other variables.
A
BIWEEKLYꢀDATEꢀCODE:
WEEKꢀ1ꢀANDꢀ2ꢀ=ꢀA
WEEKꢀ51ꢀANDꢀ52ꢀ=ꢀZ
MF-USMF SERIES, REV. Q, 07/17
“freeXpansionꢀDesign”ꢀisꢀaꢀtrademarkꢀofꢀBourns,ꢀInc.ꢀ
Specificationsꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.
Theꢀdeviceꢀcharacteristicsꢀandꢀparametersꢀinꢀthisꢀdataꢀsheetꢀcanꢀandꢀdoꢀvaryꢀinꢀdifferentꢀapplicationsꢀandꢀactualꢀdeviceꢀperformanceꢀmayꢀvaryꢀoverꢀtime.
Usersꢀshouldꢀverifyꢀactualꢀdeviceꢀperformanceꢀinꢀtheirꢀspecificꢀapplications.
ꢀ
MF-USMFꢀSeriesꢀTapeꢀandꢀReelꢀSpecifications
MF-USMF Series
per EIA 481-2
8.0 ± 0.3
(0.315 ± 0.012)
4.0 ± 0.1
Tape Dimensions
W
P
P
P
A
B
B
0
1
2
0
0
1
(0.157 ± 0.004)
4.0 ± 0.1
(0.157 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
2.76 ± 0.10
(0.109 ± 0.004)
3.50 ± 0.10
(0.138 ± 0.004)
4.35
max.
min.
(0.171)
1.5 + 0.1/-0.0
(0.059 + 0.004/-0)
3.5 ± 0.05
(0.138 + 0.002)
1.75 ± 0.10
(0.069 ± 0.004)
6.25
D
F
0
E
E
1
2
(0.246)
0.6
(0.024)
0.1
(0.004)
T max.
max.
T
1
1.07 ± 0.10
(0.042 ± 0.004)
390
K
0
Leader min.
Trailer min.
Reel Dimensions
A max.
(15.35)
160
(6.30)
185
(7.283)
50
(1.97)
N min.
8.4 + 1.5/ -0.0
(0.331 + 0.059/-0)
14.4
W
W
1
2
max.
(0.567)
ꢀ
MM
(INCHES)
DIMENSIONS:
ꢀ
0
2
1
W (MEASUREDꢀ
2
ATꢀHUB)
COVER
TAPE
F
A
N(HUBꢀDIA.)
E
2
W
B
1
B
0
W
(MEASUREDꢀ
ATꢀHUB)
1
P
1
K
T
0
1
A
0
Specificationsꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.
Theꢀdeviceꢀcharacteristicsꢀandꢀparametersꢀinꢀthisꢀdataꢀsheetꢀcanꢀandꢀdoꢀvaryꢀinꢀdifferentꢀapplicationsꢀandꢀactualꢀdeviceꢀperformanceꢀmayꢀvaryꢀoverꢀtime.
Usersꢀshouldꢀverifyꢀactualꢀdeviceꢀperformanceꢀinꢀtheirꢀspecificꢀapplications.
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