P-TCO-N350/12 [BOURNS]

Polymeric Thermal Cutoff Device;
P-TCO-N350/12
型号: P-TCO-N350/12
厂家: BOURNS ELECTRONIC SOLUTIONS    BOURNS ELECTRONIC SOLUTIONS
描述:

Polymeric Thermal Cutoff Device

文件: 总5页 (文件大小:658K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
Applications  
n Compact, space-saving 1206 footprint  
n Low profile and symmetrical design  
n Small size promotes fast response time  
to thermal runaway events  
n Ultra-low resistance  
n Thermal protection for USB-C 2.0, 3.0  
and 3.1 cables and ports  
n Mobile device fast charging port protection  
n RoHS compliant*  
n Agency recognition:  
P-TCO-N Series - Polymeric Thermal Cutoff Device  
Electrical Characteristics  
I
Thermal Cutoff  
Max. Time To Trip  
at 23 °C  
Resistance  
Certifications  
hold  
Vmax  
Imax  
Model  
at 23 °C  
Amps  
3.5  
at 3 A  
°C  
at 2 A  
°C  
Ohms at 23 °C  
cUL  
TÜV  
R
R
1Max.  
Volts  
12  
Amps  
50  
Amps  
8.0  
Seconds  
5.0  
E174545  
R50405491  
Min.  
0.002  
0.002  
0.002  
P-TCO-N350/12  
P-TCO-N400/12  
P-TCO-N450/12  
75 ±20  
80 ±15  
90 ±15  
95 ±15  
0.022  
0.018  
0.014  
3
3
3
3
3
3
12  
50  
4.0  
10.0  
22.5  
5.0  
12  
50  
4.5  
85 ±15 100 ±10  
2.0  
Environmental Characteristics  
Operating Temperature......................................... -40 °C to +85 °C  
Storage Condition  
Before Opening ............................................... +40 °C max. / 70 % RH max.  
After Opening................................................... +40 °C max. / 10 % RH max.  
Floor Condition After Opening.............................. Consumption within 4 weeks at floor condition +30 °C max. / 60 % RH max.  
Passive Aging....................................................... +85 °C, 1000 hours............................................... ±10 % typical resistance change  
Humidity Aging...................................................... +85 °C, 85 % R.H. 100 hours ............................... ±15 % typical resistance change  
Thermal Shock ..................................................... +85 °C to -40 °C, 20 times.................................... ±30 % typical resistance change  
Solvent Resistance............................................... MIL-STD-202, Method 215 ................................... No change (marking still legible)  
Vibration ............................................................... MIL-STD-883C, Method 2007.1,........................... No change (R <R<R  
)
min  
1max  
Condition A  
Moisture Sensitivity Level (MSL).......................... See Note  
ESD Classification - HBM..................................... 6  
Test Procedures and Requirements  
Test  
Visual/Mech.......................................................... Verify dimensions and materials........................... Per MF physical description  
Resistance............................................................ In still air @ 23 °C................................................. R R R  
Test Conditions  
Accept/Reject Criteria  
min  
1max  
Time to Trip........................................................... At specified current, Vmax, 23 °C......................... T max. time to trip (seconds)  
Hold Current ......................................................... 30 min. at I ...................................................... No trip  
hold  
Trip Cycle Life....................................................... V  
, I  
, 100 cycles.......................................... No arcing or burning  
max max  
Trip Endurance..................................................... V  
, 48 hours ..................................................... No arcing or burning  
Solderability.......................................................... 245 °C ±5 °C, 5 seconds ...................................... 95 % min. coverage  
max  
Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com  
EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com  
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com  
www.bourns.com  
WARNING Cancer and Reproductive Harm - www.P65Warnings.ca.gov  
*
RoHS Directive 2015/863, Mar 31, 2015 and Annex.  
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br)  
and Chlorine (Cl) content is 1500 ppm or less.  
Specifications are subject to change without notice.  
Users should verify actual device performance in their specific applications.  
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and atwww.bourns.com/docs/legal/disclaimer.pdf.  
P-TCO-N Series - Polymeric Thermal Cutoff Device  
Product Dimensions  
A
B
C
D
E
Model  
Min.  
Max.  
Min.  
Max.  
Min.  
Max.  
Min.  
Min.  
Max.  
P-TCO-N350/12  
P-TCO-N400/12  
P-TCO-N450/12  
0.05  
(0.002)  
3.00  
(0.118)  
3.50  
(0.138)  
1.40  
(0.055)  
1.80  
(0.071)  
0.60  
(0.024)  
1.10  
(0.043)  
0.25  
(0.010)  
0.45  
(0.018)  
MM  
(INCHES)  
DIMENSIONS:  
Side View  
Recommended Pad Layout  
Top View  
Bottom View  
Terminal material:  
ENIG-plated terminals  
A
C
D
E
1.0 0.05  
(.039 .002)  
1.0 0.05  
(.039 .002)  
1.6 0.1  
(.063 .00ꢀ)  
B
2.0 0.1  
(.079 .00ꢀ)  
Packaging Quantity  
3500 pcs. per reel  
Thermal Derating Table - I  
(Amps)  
hold  
Ambient Operating Temperature  
Model  
-40 °C  
-20 °C  
4.66  
0 °C  
4.13  
4.65  
4.70  
23 °C  
3.50  
4.00  
4.50  
40 °C  
2.98  
3.40  
3.60  
50 °C  
2.71  
3.10  
3.15  
60 °C  
70 °C  
85 °C  
1.65  
1.80  
1.85  
P-TCO-N350/12  
P-TCO-N400/12  
P-TCO-N450/12  
5.15  
5.80  
6.10  
2.49  
2.65  
2.70  
2.00  
2.20  
2.25  
5.25  
5.40  
Typical Part Marking  
How to Order  
Represents total content. Layout may vary.  
P-TCO - N 350 / 12 - 2  
Polymeric  
Thermal Cutoff  
Device  
PART IDENTIFICATION:  
P-TCO-N350/12 = S12  
P-TCO-N400/12 = U12  
P-TCO-N450/12 = X12  
N = 1206 footprint  
Surface Mount Component  
S12  
MANUFACTURING DATE CODE IS  
LOCATED ON PACKING LABEL.  
Hold Current, I  
hold  
350 - 450 (3.50 Amps - 4.50 Amps)  
Maximum Voltage, V  
12 = 12 Volts  
max  
Packaging  
-2 = Tape and Reel  
Packaged per EIA 481  
Specifications are subject to change without notice.  
Users should verify actual device performance in their specific applications.  
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and atwww.bourns.com/docs/legal/disclaimer.pdf.  
P-TCO-N Series - Polymeric Thermal Cutoff Device  
Solder Reflow Recommendations  
Notes:  
t
p
T
P-TCO-N models cannot be wave soldered or hand soldered.  
Please contact Bourns for soldering recommendations.  
P
CRITICAL ZONE  
TO  
RAMP-UP  
T
T
P
L
All temperatures refer to topside of the package, measured on the  
package body surface.  
T
L
t
L
If reflow temperatures exceed the recommended profile, devices may  
not meet the published specifications.  
Ts  
Ts  
max  
min  
RAMP-DOWN  
Compatible with Pb and Pb-free solder reflow profiles.  
Excess solder may cause a short circuit, especially during hand  
soldering. Please refer to the Polymeric Thermal Cutoff Soldering  
Recommendation guidelines.  
t
s
PREHEAT  
25  
t
25 °C TO PEAK  
Time  
Profile Feature  
Pb-Free Assembly  
Average Ramp-Up Rate (Ts  
to T )  
3 °C / second max.  
max  
p
PREHEAT:  
Temperature Min. (Ts  
)
150 °C  
min  
Temperature Max. (Ts  
)
200 °C  
max  
Time (Ts  
to Ts  
) (ts)  
max  
60~180 seconds  
min  
TIME MAINTAINED ABOVE:  
Temperature (T )  
217 °C  
L
Time (t )  
60~150 seconds  
L
Peak Temperature (T )  
260 °C  
p
Time within 5 °C of Actual Peak Temperature (t )  
20~40 seconds  
6 °C / second max.  
8 minutes max.  
p
Ramp-Down Rate  
Time 25 °C to Peak Temperature  
Packaging Specifications  
P-TCO-N Series per EIA 481  
0.6  
(.024ꢁ  
1.50 +0.1 / -0  
(.059 +.004 / -0ꢁ  
4.0 0.10  
(.157 .004ꢁ  
2.0 0.05  
(.079 .002ꢁ  
1.75 0.10  
(.069 .004ꢁ  
185  
(7.28ꢀꢁ  
15.4*  
(.606ꢁ  
MAX.  
DIA.  
MAX.  
MAX.  
5.50 0.05  
(.216 .002ꢁ  
12.0 0.ꢀ0  
(.472 .012ꢁ  
4.5  
(.177ꢁ  
MAX.  
COVER  
TAPE  
50  
(1.97ꢁ  
MIN.  
HUB DIA.  
ꢀ.50 0.10  
(.1ꢀ8 .004ꢁ  
1.10 0.10  
(.04ꢀ .004ꢁ  
0.1  
(.004ꢁ  
4.0 0.10  
(.157 .004ꢁ  
1.90 0.10  
(.075 .004ꢁ  
10.25  
(.404ꢁ  
12.4 +1 / -0*  
(.488 +.0ꢀ9 / -0ꢁ  
TYP.  
MAX.  
*MEASURED AT HUB  
LEADER MIN.  
ꢀ90  
TRAILER MIN.  
160  
(15.ꢀ5ꢁ  
(6.ꢀ0ꢁ  
MM  
(INCHES)  
DIMENSIONS:  
P-TCO-N SERIES, REV. A, 02/19  
Specifications are subject to change without notice.  
Users should verify actual device performance in their specific applications.  
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and atwww.bourns.com/docs/legal/disclaimer.pdf.  
Bourns® Polymeric Thermal Cutoff Devices (P-TCO)  
Application Notice  
Users are responsible for independent and adequate evaluation of Bourns® Polymeric Thermal Cutoff (P-TCO) devices in the user’s  
application, including the P-TCO device characteristics stated in the applicable data sheet.  
Polymeric Thermal Cutoff devices must not be allowed to operate beyond their stated maximum ratings. Inadequate adherence  
to such maximum ratings could result in damage to the P-TCO device and lead to electrical arcing and/or fire. Circuits with  
inductance may generate a voltage above the rated voltage of the P-TCO devices and should be thoroughly evaluated within the  
user’s application during the P-TCO selection and qualification process.  
Polymeric Thermal Cutoff devices are intended to protect against adverse effects of temporary overtemperature conditions and  
are not intended to serve as protective devices where such conditions are expected to be repetitive or prolonged.  
As a normal function of operation, Polymeric Thermal Cutoff devices experience thermal expansion under fault conditions.  
Thus, a P-TCO device must be protected against mechanical stress, and must be given adequate clearance within the user’s  
application to accommodate such thermal expansion. Rigid potting materials or fixed housings or coverings that do not provide  
adequate clearance should be thoroughly examined and tested by the user, and may result in the malfunction of P-TCO devices  
if the thermal expansion is inhibited.  
Exposure to lubricants, silicon-based oils, solvents, gels, electrolytes, acids, and other related or similar materials may adversely  
affect the performance of Polymeric Thermal Cutoff devices.  
Aggressive solvents may adversely affect the performance of Polymeric Thermal Cutoff devices. Conformal coating,  
encapsulating, potting, molding, and sealing materials may contain aggressive solvents including but not limited to xylene and  
toluene, which are known to cause adverse effects on the performance of P-TCO devices. Such aggressive solvents must be  
thoroughly cured or baked to ensure complete removal from P-TCO devices to minimize the possible adverse effect on the  
device.  
Recommended storage conditions should be followed at all times. Such conditions can be found on the applicable data sheet  
and on the Polymeric Thermal Cutoff Device Moisture/Reflow Sensitivity Classification (MSL) note: https://www.bourns.com/  
docs/RoHS-MSL/msl_ptco.pdf  
Asia-Pacific: Tel: +886-2 2562-4117 • Email: asiacus@bourns.com  
EMEA: Tel: +36 88 885 877 • Email: eurocus@bourns.com  
The Americas: Tel: +1-951 781-5500 • Email: americus@bourns.com  
www.bourns.com  
Specifications are subject to change without notice.  
Users should verify actual device performance in their specific applications.  
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and atwww.bourns.com/docs/legal/disclaimer.pdf.  
Legal Disclaimer Notice  
This legal disclaimer applies to purchasers and users of Bourns® products manufactured by or on behalf of Bourns, Inc. and  
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Unless otherwise expressly indicated in writing, Bourns® products and data sheets relating thereto are subject to change  
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