SF-0603F050 [BOURNS]
Slow Blow Surface Mount Fuses; 慢熔表面贴装保险丝型号: | SF-0603F050 |
厂家: | BOURNS ELECTRONIC SOLUTIONS |
描述: | Slow Blow Surface Mount Fuses |
文件: | 总4页 (文件大小:360K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SinglFuse™ SF-0603S Series Features
■ Thin film chip fuse
■ Surface mount packaging for automated
assembly
■ Single blow fuse for overcurrent
protection
■ 1608 (EIA 0603) miniature footprint
■ Slow blow fuse
■ UL certified
■ RoHS compliant* and
halogen free
SF-0603S Series - Slow Blow Surface Mount Fuses
Electrical Characteristics
Rated Current
Resistance
(mΩ) Typ.*
Typical
I2t (A2s)
Model
Fusing Time
Rated Voltage Breaking Capacity
(Amps)
DC ±0 V
SF-0603S0±0
0.±0
17±
DC ±0 V
±0 A
0.009
SF-0603S063
SF-0603S080
SF-0603S100
SF-0603S12±
SF-0603S1±0
SF-0603S160
SF-0603S200
SF-0603S2±0
SF-0603S300
SF-0603S31±
SF-0603S400
SF-0603S±00
0.63
0.80
1.00
1.2±
1.±0
1.60
2.00
2.±0
3.00
3.1±
4.00
±.00
130
93
6±
47
36
34
26
20
16
1±
12
9
0.017
0.024
0.026
0.0±7
0.081
0.086
0.11±
0.200
0.210
0.279
0.326
0.622
Open within ± sec.
at 2±0 % rated
current
DC 32 V
DC 32 V
±0 A
*Resistance value was measured with less than 10 % of rated current.
Reliability Testing
Parameter
Requirement
Test Method
Carrying Capacity.....................................No fusing....................................................Rated current, 4 hours
Fusing Time..............................................Within 1 minute..........................................200 % of its rated current
Interrupting Ability ....................................No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for
30 seconds again
Bending Test.............................................No mechanical damages ...........................Distance between holding points: 90 mm,
Bending: 3 mm,1time, 30 seconds
Resistance to Solder Heat........................±20 % ........................................................260 °C ±± °C,10 seconds ±1 second
Solderability..............................................9± % coverage minimum...........................23± °C ±± °C, 2 ±0.± second
24± °C ±± °C, 2 ±0.± second ꢀlead free)
Temperature Rise .....................................<7± ° ..........................................................100 % of its rated current, measure of surface
temperature
Resistance to Dry Heat.............................±20 % ........................................................10± °C ±± °C,1000 hours
Resistance to Solvent...............................No evident damage on protective .............23 °C ±± °C of isopropyl alcohol, 90 seconds coating
and marking
Residual Resistance.................................10k W or more ...........................................Measure DC resistance after fusing
Thermal Shock .........................................DR < 10 % .................................................-20 °C / +2± °C /+12± °C /+2± °C, 10 cycles
Typical Part Marking
How to Order
Represents total content. Layout may
vary.
SF - 0603 S 050 - 2
SinglFuse™
Product Designator
SMD Footprint
1608 ꢀEIA 0603) size
Asia-Pacific:
Tel: +886-2 2±62-4117
Fax: +886-2 2±62-4116
Europe:
Tel: +41-41 768 ±±±±
Fax: +41-41 768 ±±10
The Americas:
Tel: +1-9±1 781-±±00
Fax: +1-9±1 781-±700
www.bourns.com
Fuse Blow Type
F = Fast acting
S = Slow blow
RATING CURRENT (A)
F = 0.50
I = 0.63
K = 0.80
L = 1.00
M = 1.25
P = 1.50
N = 1.60
S = 2.00
T = 2.50
3 = 3.00
U = 3.15
W = 4.00
Y = 5.00
Rated Current
0±0-±00 ꢀ±00 mA - ±.00 A)
Packaging Type
- 2 = Tape & Reel ꢀ±,000 pcs./reel)
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
SinglFuse™ SF-0603S Series Applications
■ Portable memory
■ LCD monitors
■ Disk drives
■ PDAs
■ Cell phones
■ Rechargeable battery packs
■ Battery chargers
■ Set top boxes
■ Digital cameras
■ DVDs
■ Industrial controllers
SF-0603S Series - Slow Blow Surface Mount Fuses
Solder Reflow Recommendations
250
Peak: 250 +0/-5 °C
230 °C or higher
200
150
100
PRE-HEATING ZONE
180 °C
150 °C
PEAK: 250 +0/-5 °C, 5 seconds
PRE-HEATING ZONE: 150 to 180 °C, 90 30 seconds
SOLDERING ZONE: 230 °C or higher, 30 10 seconds
90 30 Seconds
30 10 Seconds
SOLDERING ZONE
50
HEATING TIME
Product Dimensions
Recommended Pad Layout
1.6 0.1
(.063 .004)
1.02
(.040)
0.45 0.1
(.018 .004)
0.8 0.1
(.031 .004)
1.09
(.043)
0.35 0.2
(.014 .008)
0.35 0.2
(.014 .008)
0.3 0.2
(.012 .008)
0.3 0.2
(.012 .008)
2.54
(.010)
MM
(INCHES)
DIMENSIONS:
PACKAGING: ±,000 pcs./reel
Thermal Derating Curve
Construction & Material Content
120
OVERCOAT
110
100
90
Sn PLATING
FUSE ELEMENT
CERAMIC SUBSTRATE
Cu / Ni PLATING
80
-20
0
20
40
60
80
100
120
AMBIENT TEMPERATURE (°C)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
SF-0603S Series - Slow Blow Surface Mount Fuses
Average Time Current Curves
Minimum I2T V Clear Time Curves
1.50 A
1.25 A
1.00 A
1.60 A
2.00 A
2.50 A
3.00 A
3.15 A
4.00 A
5.00 A
4.00 A
100
3.15 A
3.00 A
2.50 A
0.80 A
0.63 A
0.50 A
2.00 A
5.00 A
100
10
1
1.60 A
1.50 A
1.25 A
1.00 A
10
0.80 A
0.63 A
0.50 A
1
0.1
0.01
0.1
0.01
0.001
0.001
0.1
1
10
100
0.001
0.01
0.1
1
CURRENT (A)
CLEARING TIME (S)
REV. B 11/08
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
SF-0603S Series Tape and Reel Specifications
SF-0603S Series
per EIA 481-2
Tape Dimensions
8.0 0.ꢀ
(.315 .008ꢁ
W
P
4.0 0.1
(.157 .004ꢁ
0
4.0 0.1
(.157 .004ꢁ
P
P
A
1
2
ꢀ.0 0.05
(.079 .00ꢀꢁ
1.1 0.1
(.043 .004ꢁ
1.9 0.1
(.075 .004ꢁ
B
F
3.5 0.05
(.138 .00ꢀꢁ
1.75 0.1
(.069 .004ꢁ
E
D
1.5 + 0.1/-0
(.059 + .004/-0ꢁ
0
0.64 0.1
(.0ꢀ5 .004ꢁ
T
Reel Dimensions
180 +0/-3.0
(7.087 +0/-.118ꢁ
A
60.0
(ꢀ.36ꢀꢁ
B Min.
13.0 1.0
(.51ꢀ .039ꢁ
C
W
T
9.0 1.0
(.354 .039ꢁ
11.4 ꢀ.0
(.449 .079ꢁ
MM
(INCHESꢁ
DIMENSIONS:
T
W
D
P
O
E
O
BOTTOM
TAPE
A
DIA.
TOP
TAPE
C DIA.
B
B
DIA.
F
W
RESISTOR
TAPE
T
P
P
ꢀ
1
A
PAPER
TAPE
DIRECTION OF UNREELING
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications
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