SF-1206SP500 [BOURNS]

Time Lag Surface Mount Fuses;
SF-1206SP500
型号: SF-1206SP500
厂家: BOURNS ELECTRONIC SOLUTIONS    BOURNS ELECTRONIC SOLUTIONS
描述:

Time Lag Surface Mount Fuses

文件: 总4页 (文件大小:486K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SinglFuseꢀSF-1206SPꢀSeriesꢀFeatures  
nꢀ Timeꢀlagꢀthinꢀfilmꢀchipꢀfuseꢀforꢀovercurrentꢀꢀ  
protection  
nꢀ 3216ꢀ(EIAꢀ1206)ꢀminiatureꢀfootprint  
nꢀ Surfaceꢀmountꢀpackagingꢀforꢀautomatedꢀꢀ  
assembly  
nꢀ ULꢀlistedꢀ(ULꢀ248-14)  
nꢀ RoHSꢀcompliant*ꢀandꢀhalogenꢀfree**  
SF-1206SPꢀSeriesꢀ-ꢀTimeꢀLagꢀSurfaceꢀMountꢀFuses  
Electrical Characteristics  
Rated Current  
Resistance  
(mΩ) Typ.***  
Typical  
Model  
Fusing Time  
Rated Voltage Breaking Capacity  
(Amps)  
I2t (A2s) ****  
SF-1206SP050  
SF-1206SP080  
SF-1206SP100  
SF-1206SP125  
SF-1206SP150  
0.50  
0.80  
1.00  
1.25  
738.5  
215  
163.5  
100  
0.027  
0.072  
0.134  
0.233  
0.305  
DC 63 V  
DC 63 V  
50 A  
Open within  
1~120 sec.  
at 200 %  
1.50  
68.5  
SF-1206SP200  
2.00  
48.5  
0.509  
SF-1206SP250  
SF-1206SP300  
SF-1206SP400  
SF-1206SP500  
2.50  
3.00  
4.00  
5.00  
35  
27  
14  
11  
0.777  
1.285  
2.374  
5.510  
rated current  
DC 32 V  
DC 32 V  
50 A  
SF-1206SP700  
7.00  
7.5  
10.170  
*** Resistance value measured with less than 10 % of rated current. Resistance tolerance ±25 %.  
2
****Typical I t value measured at 10x rated current.  
Reliability Testing  
Parameter  
Requirement  
Test Method  
Carrying Capacity..................................... No fusing....................................................Rated current, 4 hours  
Fusing Time.............................................. Within 120 seconds....................................200 % of its rated current  
Interrupting Ability..................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for  
30 seconds again  
Bending Test............................................. No mechanical damages ...........................Distance between holding points: 90 mm,  
Bending: 3 mm, 1 time, 30 seconds  
Resistance to Solder Heat........................ ±20 %.........................................................260 °C ±5 °C,10 seconds ±1 second  
Solderability.............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second  
245 °C ±5 °C, 2 ±0.5 second (lead free)  
Temperature Rise..................................... <75 °C........................................................100 % of its rated current, measure of surface  
temperature  
Resistance to Dry Heat............................. ±20 %.........................................................105 °C ±5 °C,1000 hours  
Resistance to Solvent............................... No evident damage on protective..............23 °C ±5 °C of isopropyl alcohol, 90 seconds  
coating and marking  
Residual Resistance................................. 10k ohms or more......................................Measure DC resistance after fusing  
Thermal Shock ......................................... DR < 10 %..................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles  
UL File Number .........................................E198545  
http://www.ul.com/ꢀFollowꢀlinkꢀtoꢀOnlineꢀCertificatesꢀDirectory,ꢀthenꢀenterꢀULꢀFileꢀNo.ꢀE198545,  
or click here  
Environmental Characteristics  
Operating Temperature..................................................................................-20 °C to +105 °C  
Storage Conditions  
Asia-Pacific:  
Tel: +886-2 2562-4117  
Email: asiacus@bourns.com  
Temperature ................................................................................................+5 °C to +35 °C  
Humidity...........................................................................................................40 % to 75 %  
Shelf Life........................................................................... 2 years from manufacturing date  
Moisture Sensitivity Level........................................................................................................1  
ESDꢀClassificationꢀ(HBM)..............................................................................................Class 6  
Europe:  
Tel: +36 88 520 390  
Email: eurocus@bourns.com  
The Americas:  
Tel: +1-951 781-5500  
Email: americus@bourns.com  
*ꢀꢀꢀRoHSꢀDirectiveꢀ2015/863,ꢀMarꢀ31,ꢀ2015ꢀandꢀAnnex.ꢀ  
**ꢀBournsꢀconsidersꢀaꢀproductꢀtoꢀbeꢀ“halogenꢀfree”ꢀifꢀ(a)ꢀtheꢀBromineꢀ(Br)ꢀcontentꢀisꢀ900ꢀppmꢀorꢀless;ꢀ(b)ꢀtheꢀꢀ  
ꢀꢀꢀꢀꢀChlorineꢀ(Cl)ꢀcontentꢀisꢀ900ꢀppmꢀorꢀless;ꢀandꢀ(c)ꢀtheꢀtotalꢀBromineꢀ(Br)ꢀandꢀChlorineꢀ(Cl)ꢀcontentꢀisꢀ1500ꢀppmꢀorꢀless.  
“SinglFuse”ꢀisꢀaꢀtrademarkꢀofꢀBourns,ꢀInc.ꢀ  
www.bourns.com  
Specificationsꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.  
Theꢀdeviceꢀcharacteristicsꢀandꢀparametersꢀinꢀthisꢀdataꢀsheetꢀcanꢀandꢀdoꢀvaryꢀinꢀdifferentꢀapplicationsꢀandꢀactualꢀdeviceꢀperformanceꢀmayꢀvaryꢀoverꢀtime.  
Usersꢀshouldꢀverifyꢀactualꢀdeviceꢀperformanceꢀinꢀtheirꢀspecificꢀapplications.  
SinglFuseꢀSF-1206SPꢀSeriesꢀApplications  
nꢀ Portableꢀmemory  
nꢀ LCDꢀmonitors  
nꢀ Diskꢀdrives  
nꢀ PDAs  
nꢀ Cellꢀphones  
nꢀ Rechargeableꢀbatteryꢀpacks  
nꢀ Batteryꢀchargers  
nꢀ Setꢀtopꢀboxes  
nꢀ Digitalꢀcameras  
nꢀ DVDs  
nꢀ Industrialꢀcontrollers  
ꢀ SF-1206SPꢀSeriesꢀ-ꢀTimeꢀLagꢀSurfaceꢀMountꢀFuses  
Typical Part Marking  
How to Order  
Represents total content. Layout may  
vary.  
SF - 1206 SP 050 - 2  
SinglFuse™ Product Designator  
SMD Footprint  
3216 (EIA 1206) size  
Fuse Blow Type  
SP = Time Lag  
RATED CURRENT (A)  
Rated Current  
F = 0.50  
K = 0.80  
L = 1.00  
M = 1.25  
P = 1.50  
S = 2.00  
T = 2.50  
3 = 3.00  
W = 4.00  
Y = 5.00  
Z = 7.00  
050-700 (500 mA - 7.00 A)  
Packaging Type  
- 2 = Tape & Reel (5,000 pcs./reel)  
Solder Reflow Recommendations  
Construction & Material Content  
OVERCOAT  
250  
200  
Peak: 250 +0/-5 °C  
230 °C or higher  
Sn PLATING  
PRE-HEATING ZONE  
FUSE ELEMENT  
CERAMIC SUBSTRATE  
Cu / Ni PLATING  
180 °C  
150 °C  
150  
100  
90 30 Seconds  
30 10 Seconds  
SOLDERING ZONE  
50  
HEATING TIME  
PEAK: 250 +0/-5 °C, 5 seconds  
PRE-HEATING ZONE: 150 to 180 °C, 90 30 seconds  
SOLDERING ZONE: 230 °C or higher, 30 10 seconds  
Product Dimensions  
Recommended Pad Layout  
3.1 ꢀ.1  
(.122 .ꢀꢀ04  
2.2 ꢀ.2  
(.ꢀꢁ7 .ꢀꢀꢁ4  
ꢀ.6 ꢀ.1  
(.ꢀ20 .ꢀꢀ04  
1.55 ꢀ.1  
(.ꢀ61 .ꢀꢀ04  
1.65 ꢀ.15  
(.ꢀ65 .ꢀꢀ64  
ꢀ.5 ꢀ.2  
ꢀ.5 ꢀ.2  
(.ꢀ2ꢀ .ꢀꢀ84  
(.ꢀ2ꢀ .ꢀꢀ84  
ꢀ.5 ꢀ.3  
(.ꢀ2ꢀ .ꢀ124  
ꢀ.5 ꢀ.3  
(.ꢀ2ꢀ .ꢀ124  
0.7 ꢀ.3  
(.1ꢁ5 .ꢀ124  
MM  
(INCHES)  
DIMENSIONS:  
PACKAGING: 5,000 pcs./reel  
Specificationsꢀareꢀsubjectꢀtoꢀchangeꢀwithoutꢀnotice.  
Theꢀdeviceꢀcharacteristicsꢀandꢀparametersꢀinꢀthisꢀdataꢀsheetꢀcanꢀandꢀdoꢀvaryꢀinꢀdifferentꢀapplicationsꢀandꢀactualꢀdeviceꢀperformanceꢀmayꢀvaryꢀoverꢀtime.  
Usersꢀshouldꢀverifyꢀactualꢀdeviceꢀperformanceꢀinꢀtheirꢀspecificꢀapplications.  
ꢀ SF-1206SPꢀSeriesꢀ-ꢀTimeꢀLagꢀSurfaceꢀMountꢀFuses  
Average Time Current Curves  
Minimum I2T V Clear Time Curves  
2.0 A  
2.5 A  
3.0 A  
1.5 A  
1.25 A  
1.0 A  
4.0 A  
7.00 A  
5.00 A  
4.00 A  
5.0 A  
7.0 A  
0.8 A  
0.5 A  
100  
10  
1
100  
10  
1
3.00 A  
2.50 A  
2.00 A  
1.50 A  
1.25 A  
1.00 A  
0.80 A  
0.50 A  
0.1  
0.1  
0.01  
0.01  
0.001  
0.001  
0.001  
0.01  
0.1  
1
0.1  
1
10  
100  
CURRENT (A)  
CLEARING TIME (S)  
Thermal Derating Curve  
120  
110  
100  
90  
80  
-20  
0
20  
40  
60  
80  
100  
120  
AMBIENT TEMPERATURE (°C)  
REV. C 10/17  
Specifications are subject to change without notice.  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.  
Users should verify actual device performance in their specific applications.  
ꢀ SF-1206SPꢀSeriesꢀTapeꢀandꢀReelꢀSpecifications  
SF-1206SP Series  
per EIA 481-2  
Tape Dimensions  
8.0 0.ꢀ  
(.315 .008ꢁ  
W
4.0 0.1  
(.157 .004ꢁ  
P
0
4.0 0.1  
(.157 .004ꢁ  
P
1
ꢀ.0 0.05  
(.079 .00ꢀꢁ  
P
2
ꢀ.0 0.15  
(.079 .00ꢂꢁ  
A
B
F
E
3.ꢂ 0.ꢀ  
(.14ꢀ .008ꢁ  
3.5 0.05  
(.138 .00ꢀꢁ  
1.75 0.1  
(.0ꢂ9 .004ꢁ  
1.5 + 0.1/-0  
(.059 + .004/-0ꢁ  
D
0
0.84 0.1  
(.033 .004ꢁ  
T
Reel Dimensions  
178 0.ꢀ  
(7.087 .079ꢁ  
A
ꢂ0.0 1.0  
(ꢀ.3ꢂꢀ .039ꢁ  
B Min.  
13.0 1.0  
(.51ꢀ .039ꢁ  
C
W
T
9.0 1.0  
(.354 .039ꢁ  
11.4 ꢀ.0  
(.449 .079ꢁ  
MM  
(INCHESꢁ  
DIMENSIONS:  
T
W
D
O
P
E
O
BOTTOM  
TAPE  
A
DIA.  
TOP  
TAPE  
C DIA.  
B
B
DIA.  
F
W
RESISTOR  
TAPE  
T
P
P
2
1
A
PAPER  
TAPE  
DIRECTION OF UNREELING  
Specifications are subject to change without notice.  
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time.  
Users should verify actual device performance in their specific applications.  

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