BL-HGE33-TRB [BRTLED]

Super Yellow Green Suitable for all SMT assembly methods.; 超级黄色绿色适合所有SMT装配方法。


型号：	BL-HGE33-TRB
厂家：	BRTLED
描述：	Super Yellow Green Suitable for all SMT assembly methods. 超级黄色绿色适合所有SMT装配方法。光电
文件：	总7页 (文件大小：215K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

BRIGHT LED ELECTRONICS CORP.

SINCE 1981

BL-HGE33-TRB

● Features:

1. Emitted Color : Super Yellow Green

●Package Dimensions:

2. Lens Appearance : Water Clear

3. 3.2x1.6x1.1mm(1206) standard package

4. Mono-color type.

5. Suitable for all SMT assembly methods.

6. Compatible with infrared and vapor phase

reflow solder process.

7. Compatible with automatic placement

equipment.

8. This product doesn’t contain restriction

Substance, comply ROHS standard.

● Applications:

1. Automotive : Dashboards, stop lamps,

turn signals.

NOTES:

1.All dimensions are in millimeters (inches).

2.Tolerance is ± 0.10mm (0.004”) unless otherwise specified.

3.Specifications are subject to change without notice.

2. Backlighting : LCDs, Key pads advertising.

3. Status indicators : Comsumer & industrial

electronics.

4. General use.

● Absolute Maximum Ratings(Ta=25℃)

Parameter

Power Dissipation

Symbol

Rating

100

Unit

Forward Current

I_F

Peak Forward Current ＊1

Reverse Volage

I_FP

100

V_R

-25℃~80℃

-30℃~85℃

See Page6

Operating Temperature

Storage Temperature

Soldering Temperature

Topr

Tstg

Tsol

＊1 Condition for IFp is pulse of 1/10 duty and 0.1msec width.

Ver.1.0 Page 1 of 7

BRIGHT LED ELECTRONICS CORP.

SINCE 1981

BL-HGE33-TRB

● Electrical and optical characteristics(Ta=25℃)

Parameter Symbol Condition

Forward Voltage

Min.

Typ.

2.0

Max.

Unit

I_F=20mA

2.6

Luminous Intensity

Peak Wave Length

Dominant Wave Length

Spectral Line Half-width

Veiwing Angle

18.5

mcd

deg

λp

λd

Δλ

2θ_1/2

570

566

576

120

● Typical Electro-Optical Characteristics Curves

Fig.2 Forward current derating curve

vs. ambient temperature

Fig.1 Relative intensity vs. wavelength

1.0

0.5

520

570

620

100

Ambient temperature Ta( C)

Wavelength (nm)

Fig.4 Relative luminous intensity vs.

ambient temperature

Fig.3 Forward current vs. forward voltage

3.0

2.5

2.0

1.5

1.0

0.5

-40

-20

AmA bient temperature Ta( C)

Forward voltage(V)

Fig.6 Radiation diagram

Fig.5 Relative luminous intensity vs. forward current

2.0

1.5

1.0

0.9

0.8

0.7

0.5

0.3

0.1

0.2

0.4

0.6

Forward current (mA)

Ver.1.0 Page 2 of 7

BRIGHT LED ELECTRONICS CORP.

SINCE 1981

BL-HGE33-TRB

● Tapping and packaging specifications(Units: mm)

USER DIRECTION OF FEED

13.0± 0.5

1.88± 0.1

1.27± 0.1

START

END

TRAILER

4.0 ±0.1

1.5± 0.1

LEADER

0.3

FIXING TAPE

4.0 ±0.1

2.0± 0.05

NOTE: 3000 pcs PER REEL

●Package Method:(unit:mm)

12 bag/box

3000 pcs/reel

200

Bar Code Label

245

220

187

Aluminum Foil Bag

220

645

6 box/carton

200

470

Ver.1.0 Page 3 of 7

BRIGHT LED ELECTRONICS CORP.

SINCE 1981

BL-HGE33-TRB

● Bin Limits

Intensity Bin Limits (At 20mA)

BIN CODE

Min. (mcd)

16.0

Max. (mcd)

32.0

24.0

48.0

37.0

72.0

55.0

110.0

Color Bin Limits (At 20mA)

BIN CODE

Min. (nm)

565

Max. (nm)

569

567

571

569

573

571

575

573

577

● BIN： x

Color BIN CODE

Intensity BIN CODE

Ver.1.0 Page 4 of 7

BRIGHT LED ELECTRONICS CORP.

SINCE 1981

BL-HGE33-TRB

● Reliability Test

Classification

Test Item

Reference Standard

Test Conditions

Result

Operation Life MIL-STD-750:1026

MIL-STD-883:1005

Connect with a power If=20mA

Ta=Under room temperature

Test time=1,000hrs

0/20

JIS-C-7021

:B-1

Ta=+65℃±5℃

High

Temperature MIL-STD-202:103B

RH=90%-95%

0/20

High Humidity JIS-C-7021

:B-11 Test time=240hrs

Endurance

Test

Storage

High

Temperature

Storage

Low

High Ta=+85℃±5℃

MIL-STD-883:1008

JIS-C-7021 :B-10

Test time=1,000hrs

0/20

Low Ta=-35℃±5℃

Temperature JIS-C-7021

Storage

:B-12 Test time=1,000hrs

-35℃ ~ +25℃ ~ +85℃ ~ +25℃

60min 20min 60min 20min

Test Time=5cycle

Temperature MIL-STD-202:107D

Cycling

MIL-STD-750:1051

MIL-STD-883:1010

0/20

JIS-C-7021

:A-4

-35℃±5℃ ~+85℃±5℃

Thermal Shock MIL-STD-202:107D

MIL-STD-750:1051

Environmental

Test

20min

MIL-STD-883:1011

Test Time=10cycle

Preheating：

140℃-160℃,within 2 minutes.

Operation heating：

260℃(Max.), within 10seconds. (Max.)

Solder

MIL-STD-202:201A

Resistance

MIL-STD-750:2031

JIS-C-7021

:A-1

● Judgment criteria of failure for the reliability

Measuring items

Forward voltage

Reverse current

Luminous intensity

Symbol

V_F( V)

Measuring conditions

I_F=20mA

Judgement criteria for failure

Over Ux1.2

I_R(uA)

V_R=5V

Over Ux2

Iv ( mcd )

I_F=20mA

Below SX0.5

Note: 1.U means the upper limit of specified characteristics. S means initial value.

2.Measurment shall be taken between 2 hours and after the test pieces have been returned to

normal ambient conditions after completion of each test.

Ver.1.0 Page 5 of 7

BRIGHT LED ELECTRONICS CORP.

SINCE 1981

BL-HGE33-TRB

● Soldering :

1. Manual Of Soldering

The temperature of the iron tip should not be higher than 300℃(572℉) and Soldering within 3

seconds per solder-land is to be observed.

2. Reflow Soldering

Preheating : 140℃~160℃±5℃,within 2 minutes.

Operation heating : 260℃(Max.) within 10 seconds.(Max)

Gradual Cooling (Avoid quenching).

10 SEC. MAX.

260℃ MAX.

140~160℃

4℃ /SEC. MAX.

OVER 2 MIN.

Time

3. DIP soldering (Wave Soldering) :

Preheating : 120℃~150℃,within 120~180 sec.

Operation heating : 245℃±5℃ within 5 sec.260℃ (Max)

Gradual Cooling (Avoid quenching).

Soldering heat Max. 260 ℃

245 ±5℃ within 5 sec.

120~150℃

Preheat

120~180 sec.

Time

● Handling :

Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to

high temperature.

Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such

as the sand blast and the metal hook.

Ver.1.0 Page 6 of 7

BRIGHT LED ELECTRONICS CORP.

SINCE 1981

BL-HGE33-TRB

● Notes for designing:

Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT

LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with

instantaneous voltage at the turning ON and OFF of the circuit.

When using the pulse drive care must be taken to keep the average current within the rated figures.

Also, the circuit should be designed so as be subjected to reverse voltage when turning off the

BRIGHT LEDs.

● Storage:

In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as

possible after unpacking the sealed envelope.

If the envelope is still packed, to store it in the environment as following:

(1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪Max.

(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or

equivalent soldering process must be:

a. Completed within 24 hours.

b. Stored at less than 30% RH.

(3) Devices require baking before mounting, if:

(2) a or (2) b is not met.

(4) If baking is required, devices must be baked under below conditions:

12 hours at 60℃±3℃.

● Package and Label of Products:

(1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached

on each bag.

(2) Label:

BRIGHT LED LOGO

Part No.

Quantity

BIN.

Sealing Date

Year Month Day

Manufacture Location

Ver.1.0 Page 7 of 7

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